TW200633096A - Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby - Google Patents
Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured therebyInfo
- Publication number
- TW200633096A TW200633096A TW094142209A TW94142209A TW200633096A TW 200633096 A TW200633096 A TW 200633096A TW 094142209 A TW094142209 A TW 094142209A TW 94142209 A TW94142209 A TW 94142209A TW 200633096 A TW200633096 A TW 200633096A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- integrated
- integrated circuit
- producing
- contact pad
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2401—Structure
- H01L2224/24011—Deposited, e.g. MCM-D type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/024,237 US20060141666A1 (en) | 2004-12-29 | 2004-12-29 | Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200633096A true TW200633096A (en) | 2006-09-16 |
Family
ID=36599542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094142209A TW200633096A (en) | 2004-12-29 | 2005-11-30 | Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060141666A1 (zh) |
CN (1) | CN1819131A (zh) |
DE (1) | DE102005057256A1 (zh) |
TW (1) | TW200633096A (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009065118A (ja) * | 2007-08-09 | 2009-03-26 | Panasonic Corp | 固体撮像装置 |
US8076180B2 (en) * | 2008-07-07 | 2011-12-13 | Infineon Technologies Ag | Repairable semiconductor device and method |
CN109920763A (zh) * | 2019-03-04 | 2019-06-21 | 积高电子(无锡)有限公司 | 一种表面安装型半导体电阻桥封装基板及封装工艺 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2701802B2 (ja) * | 1995-07-17 | 1998-01-21 | 日本電気株式会社 | ベアチップ実装用プリント基板 |
US5798566A (en) * | 1996-01-11 | 1998-08-25 | Ngk Spark Plug Co., Ltd. | Ceramic IC package base and ceramic cover |
US6144101A (en) * | 1996-12-03 | 2000-11-07 | Micron Technology, Inc. | Flip chip down-bond: method and apparatus |
US6191487B1 (en) * | 1998-04-23 | 2001-02-20 | Minco Technology Labs, Inc. | Semiconductor and flip chip packages and method having a back-side connection |
US6251705B1 (en) * | 1999-10-22 | 2001-06-26 | Agere Systems Inc. | Low profile integrated circuit packages |
US6841862B2 (en) * | 2000-06-30 | 2005-01-11 | Nec Corporation | Semiconductor package board using a metal base |
US7009297B1 (en) * | 2000-10-13 | 2006-03-07 | Bridge Semiconductor Corporation | Semiconductor chip assembly with embedded metal particle |
EP1263043A1 (en) * | 2001-05-30 | 2002-12-04 | Alcatel | Electronic element with a shielding |
US20040016995A1 (en) * | 2002-07-25 | 2004-01-29 | Kuo Shun Meen | MEMS control chip integration |
JP3938742B2 (ja) * | 2002-11-18 | 2007-06-27 | Necエレクトロニクス株式会社 | 電子部品装置及びその製造方法 |
US7312101B2 (en) * | 2003-04-22 | 2007-12-25 | Micron Technology, Inc. | Packaged microelectronic devices and methods for packaging microelectronic devices |
US7393771B2 (en) * | 2004-06-29 | 2008-07-01 | Hitachi, Ltd. | Method for mounting an electronic part on a substrate using a liquid containing metal particles |
-
2004
- 2004-12-29 US US11/024,237 patent/US20060141666A1/en not_active Abandoned
-
2005
- 2005-11-30 TW TW094142209A patent/TW200633096A/zh unknown
- 2005-12-01 DE DE102005057256A patent/DE102005057256A1/de not_active Ceased
- 2005-12-29 CN CN200510135795.8A patent/CN1819131A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1819131A (zh) | 2006-08-16 |
US20060141666A1 (en) | 2006-06-29 |
DE102005057256A1 (de) | 2006-07-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DK1772900T3 (da) | Fabrikationsfremgangsmåde for en indretning med effekthalvlederkomponenter omfattende et tryksintringstrin | |
TW200737383A (en) | Substrate with built-in chip and method for manufacturing substrate with built-in chip | |
TW200703590A (en) | Method of fabricating wiring board and method of fabricating semiconductor device | |
TW200711018A (en) | Microfeature assemblies including interconnect structures and methods for forming such interconnect structures | |
TW200742249A (en) | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus | |
SG95637A1 (en) | Semiconductor/printed circuit board assembly, and computer system | |
SG170113A1 (en) | Integrated circuit package with open substrate | |
TW200640325A (en) | Wiring board manufacturing method | |
HK1089328A1 (en) | Method for manufacturing an electronic module and an electronic module | |
TW200616128A (en) | Semiconductor device and process for manufacturing the same and kit | |
TW200627562A (en) | Chip electrical connection structure and fabrication method thereof | |
MY147005A (en) | Method for bonding a semiconductor substrate to a metal subtrate | |
TW200509331A (en) | Semiconductor chip package and method for making the same | |
MY142623A (en) | Method for manufacturing circuit member | |
TW200644187A (en) | Semiconductor device and method for manufacturing semiconductor device | |
WO2005091366A3 (de) | Halbleitermodul mit einem kopplungssubstrat und verfahren zur herstellung desselben | |
TW200802647A (en) | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device | |
TW200713527A (en) | Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same | |
TW200640315A (en) | Electrically connecting structure of circuit board and method for fabricating same | |
TW200746330A (en) | Microelectronic assembly with back side metallization and method for forming the same | |
TW200503111A (en) | Semiconductor device and method of manufacturing the same | |
TW200721418A (en) | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronlc device | |
TW200618289A (en) | Integrated circuit and method for manufacturing | |
WO2007043972A8 (en) | Device carrying an integrated circuit/components and method of producing the same | |
TW200715424A (en) | Semiconductor device and method of manufacturing the same |