TW200632572A - Latent overlay metrology - Google Patents
Latent overlay metrologyInfo
- Publication number
- TW200632572A TW200632572A TW094139280A TW94139280A TW200632572A TW 200632572 A TW200632572 A TW 200632572A TW 094139280 A TW094139280 A TW 094139280A TW 94139280 A TW94139280 A TW 94139280A TW 200632572 A TW200632572 A TW 200632572A
- Authority
- TW
- Taiwan
- Prior art keywords
- overlay metrology
- overlay
- latent
- latent overlay
- metrology
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/708—Mark formation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70653—Metrology techniques
- G03F7/70675—Latent image, i.e. measuring the image of the exposed resist prior to development
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/993,416 US20060109463A1 (en) | 2004-11-22 | 2004-11-22 | Latent overlay metrology |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200632572A true TW200632572A (en) | 2006-09-16 |
Family
ID=35809636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094139280A TW200632572A (en) | 2004-11-22 | 2005-11-09 | Latent overlay metrology |
Country Status (7)
Country | Link |
---|---|
US (2) | US20060109463A1 (zh) |
EP (1) | EP1659452A1 (zh) |
JP (1) | JP2006148121A (zh) |
KR (1) | KR100674225B1 (zh) |
CN (1) | CN1920670A (zh) |
SG (1) | SG122952A1 (zh) |
TW (1) | TW200632572A (zh) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7791727B2 (en) | 2004-08-16 | 2010-09-07 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US20080144036A1 (en) * | 2006-12-19 | 2008-06-19 | Asml Netherlands B.V. | Method of measurement, an inspection apparatus and a lithographic apparatus |
US20060109463A1 (en) * | 2004-11-22 | 2006-05-25 | Asml Netherlands B.V. | Latent overlay metrology |
US7453577B2 (en) * | 2004-12-14 | 2008-11-18 | Asml Netherlands B.V. | Apparatus and method for inspecting a patterned part of a sample |
US7443486B2 (en) * | 2005-02-25 | 2008-10-28 | Asml Netherlands B.V. | Method for predicting a critical dimension of a feature imaged by a lithographic apparatus |
US7315384B2 (en) * | 2005-05-10 | 2008-01-01 | Asml Netherlands B.V. | Inspection apparatus and method of inspection |
JP4792833B2 (ja) * | 2005-06-24 | 2011-10-12 | 株式会社ニコン | 重ね合わせ測定装置 |
US7532307B2 (en) * | 2005-06-30 | 2009-05-12 | Asml Netherlands B.V. | Focus determination method, device manufacturing method, and mask |
US20070002336A1 (en) * | 2005-06-30 | 2007-01-04 | Asml Netherlands B.V. | Metrology apparatus, lithographic apparatus, process apparatus, metrology method and device manufacturing method |
US20070093044A1 (en) * | 2005-10-25 | 2007-04-26 | Asml Netherlands B.V. | Method of depositing a metal layer onto a substrate and a method for measuring in three dimensions the topographical features of a substrate |
US20070115452A1 (en) * | 2005-11-23 | 2007-05-24 | Asml Netherlands B.V. | Method of measuring the magnification of a projection system, device manufacturing method and computer program product |
US20070153274A1 (en) * | 2005-12-30 | 2007-07-05 | Asml Netherlands B.V. | Optical metrology system and metrology mark characterization device |
US7480050B2 (en) * | 2006-02-09 | 2009-01-20 | Asml Netherlands B.V. | Lithographic system, sensor, and method of measuring properties of a substrate |
US7821650B2 (en) * | 2006-03-21 | 2010-10-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method with reduced scribe lane usage for substrate measurement |
US7486408B2 (en) * | 2006-03-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method with reduced scribe lane usage for substrate measurement |
US7532305B2 (en) * | 2006-03-28 | 2009-05-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using overlay measurement |
US7391513B2 (en) * | 2006-03-29 | 2008-06-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method using overlay measurement quality indication |
US7502103B2 (en) * | 2006-05-31 | 2009-03-10 | Asml Netherlands B.V. | Metrology tool, system comprising a lithographic apparatus and a metrology tool, and a method for determining a parameter of a substrate |
US7791724B2 (en) * | 2006-06-13 | 2010-09-07 | Asml Netherlands B.V. | Characterization of transmission losses in an optical system |
US7898662B2 (en) * | 2006-06-20 | 2011-03-01 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7692792B2 (en) * | 2006-06-22 | 2010-04-06 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7659988B2 (en) * | 2006-06-30 | 2010-02-09 | Asml Netherlands B.V. | Apparatus for angular-resolved spectroscopic lithography characterization and device manufacturing method |
US7999940B2 (en) | 2006-06-30 | 2011-08-16 | Asml Netherlands B.V. | Apparatus for angular-resolved spectroscopic lithography characterization |
US7916284B2 (en) | 2006-07-18 | 2011-03-29 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7808613B2 (en) * | 2006-08-03 | 2010-10-05 | Asml Netherlands B.V. | Individual wafer history storage for overlay corrections |
US20080036984A1 (en) * | 2006-08-08 | 2008-02-14 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7643666B2 (en) | 2006-08-08 | 2010-01-05 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7589832B2 (en) * | 2006-08-10 | 2009-09-15 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device method |
US7564555B2 (en) * | 2006-08-15 | 2009-07-21 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7969577B2 (en) * | 2006-09-14 | 2011-06-28 | Asml Netherlands B.V. | Inspection apparatus, an apparatus for projecting an image and a method of measuring a property of a substrate |
US7532331B2 (en) | 2006-09-14 | 2009-05-12 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7573584B2 (en) * | 2006-09-25 | 2009-08-11 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7763404B2 (en) * | 2006-09-26 | 2010-07-27 | Tokyo Electron Limited | Methods and apparatus for changing the optical properties of resists |
US8294907B2 (en) | 2006-10-13 | 2012-10-23 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US8233155B2 (en) * | 2006-10-13 | 2012-07-31 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7630087B2 (en) * | 2006-11-22 | 2009-12-08 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7710572B2 (en) * | 2006-11-30 | 2010-05-04 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7557934B2 (en) * | 2006-12-07 | 2009-07-07 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US20080135774A1 (en) | 2006-12-08 | 2008-06-12 | Asml Netherlands B.V. | Scatterometer, a lithographic apparatus and a focus analysis method |
US20080148875A1 (en) * | 2006-12-20 | 2008-06-26 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7916927B2 (en) * | 2007-01-16 | 2011-03-29 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7619737B2 (en) * | 2007-01-22 | 2009-11-17 | Asml Netherlands B.V | Method of measurement, an inspection apparatus and a lithographic apparatus |
US7852459B2 (en) | 2007-02-02 | 2010-12-14 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7701577B2 (en) * | 2007-02-21 | 2010-04-20 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7724370B2 (en) * | 2007-03-01 | 2010-05-25 | Asml Netherlands B.V. | Method of inspection, a method of manufacturing, an inspection apparatus, a substrate, a mask, a lithography apparatus and a lithographic cell |
US7599064B2 (en) | 2007-03-07 | 2009-10-06 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method, substrate for use in the methods |
US7605907B2 (en) * | 2007-03-27 | 2009-10-20 | Asml Netherlands B.V. | Method of forming a substrate for use in calibrating a metrology tool, calibration substrate and metrology tool calibration method |
US7656518B2 (en) * | 2007-03-30 | 2010-02-02 | Asml Netherlands B.V. | Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus |
US7570358B2 (en) * | 2007-03-30 | 2009-08-04 | Asml Netherlands Bv | Angularly resolved scatterometer, inspection method, lithographic apparatus, lithographic processing cell device manufacturing method and alignment sensor |
US8189195B2 (en) * | 2007-05-09 | 2012-05-29 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7911612B2 (en) | 2007-06-13 | 2011-03-22 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
US7460237B1 (en) | 2007-08-02 | 2008-12-02 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
CN101614908B (zh) | 2008-06-24 | 2011-09-28 | 鸿富锦精密工业(深圳)有限公司 | 液晶显示屏 |
NL2009004A (en) * | 2011-07-20 | 2013-01-22 | Asml Netherlands Bv | Inspection method and apparatus, and lithographic apparatus. |
WO2013070980A1 (en) * | 2011-11-09 | 2013-05-16 | Zygo Corporation | Fiber delivery for metrology systems used in lithography tools |
US9760020B2 (en) | 2012-11-21 | 2017-09-12 | Kla-Tencor Corporation | In-situ metrology |
NL2015160A (en) | 2014-07-28 | 2016-07-07 | Asml Netherlands Bv | Illumination system, inspection apparatus including such an illumination system, inspection method and manufacturing method. |
EP3221897A1 (en) | 2014-09-08 | 2017-09-27 | The Research Foundation Of State University Of New York | Metallic gratings and measurement methods thereof |
US11112369B2 (en) * | 2017-06-19 | 2021-09-07 | Kla-Tencor Corporation | Hybrid overlay target design for imaging-based overlay and scatterometry-based overlay |
CN111600198B (zh) * | 2020-05-26 | 2021-05-04 | 陕西源杰半导体科技股份有限公司 | 一种通讯用超大功率激光器及其制备方法 |
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GB2257504B (en) * | 1991-06-25 | 1995-10-25 | Nec Semiconductors | Method of measuring relative positioning accuracy of a pattern to be formed on a semiconductor wafer |
BE1006067A3 (nl) * | 1992-07-01 | 1994-05-03 | Imec Inter Uni Micro Electr | Optisch systeem voor het afbeelden van een maskerpatroon in een fotogevoelige laag. |
KR100197191B1 (ko) * | 1994-11-14 | 1999-06-15 | 모리시다 요이치 | 레지스트 패턴 형성방법 |
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KR970016827A (ko) * | 1995-09-13 | 1997-04-28 | 오노 시게오 | 노광 방법 및 노광 장치 |
US5880838A (en) * | 1996-06-05 | 1999-03-09 | California Institute Of California | System and method for optically measuring a structure |
US5963329A (en) * | 1997-10-31 | 1999-10-05 | International Business Machines Corporation | Method and apparatus for measuring the profile of small repeating lines |
JPH11307449A (ja) * | 1998-02-20 | 1999-11-05 | Canon Inc | 露光装置及びデバイスの製造方法 |
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IL138552A (en) * | 2000-09-19 | 2006-08-01 | Nova Measuring Instr Ltd | Measurement of transverse displacement by optical method |
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WO2002065545A2 (en) * | 2001-02-12 | 2002-08-22 | Sensys Instruments Corporation | Overlay alignment metrology using diffraction gratings |
US6699624B2 (en) * | 2001-02-27 | 2004-03-02 | Timbre Technologies, Inc. | Grating test patterns and methods for overlay metrology |
JP2004529330A (ja) * | 2001-03-02 | 2004-09-24 | アクセント オプティカル テクノロジーズ,インク. | スキャタロメトリを使用するライン・プロファイルの非対称測定 |
US20020192577A1 (en) * | 2001-06-15 | 2002-12-19 | Bernard Fay | Automated overlay metrology system |
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US7061615B1 (en) * | 2001-09-20 | 2006-06-13 | Nanometrics Incorporated | Spectroscopically measured overlay target |
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JP2003257834A (ja) * | 2002-03-04 | 2003-09-12 | Toshiba Corp | 半導体装置の製造方法及び半導体装置の製造装置 |
US7061627B2 (en) * | 2002-03-13 | 2006-06-13 | Therma-Wave, Inc. | Optical scatterometry of asymmetric lines and structures |
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US6795168B2 (en) * | 2002-04-08 | 2004-09-21 | Numerical Technologies, Inc. | Method and apparatus for exposing a wafer using multiple masks during an integrated circuit manufacturing process |
US6928628B2 (en) * | 2002-06-05 | 2005-08-09 | Kla-Tencor Technologies Corporation | Use of overlay diagnostics for enhanced automatic process control |
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SG120958A1 (en) * | 2002-11-01 | 2006-04-26 | Asml Netherlands Bv | Inspection method and device manufacturing method |
US7068363B2 (en) * | 2003-06-06 | 2006-06-27 | Kla-Tencor Technologies Corp. | Systems for inspection of patterned or unpatterned wafers and other specimen |
US7061623B2 (en) * | 2003-08-25 | 2006-06-13 | Spectel Research Corporation | Interferometric back focal plane scatterometry with Koehler illumination |
DE102004013886A1 (de) * | 2004-03-16 | 2005-10-06 | Carl Zeiss Smt Ag | Verfahren zur Mehrfachbelichtung, Mikrolithografie-Projektionsbelichtungsanlage und Projektionssystem |
US7476490B2 (en) * | 2004-06-25 | 2009-01-13 | Asml Netherlands B.V. | Method for producing a marker on a substrate, lithographic apparatus and device manufacturing method |
US7245352B2 (en) * | 2004-07-20 | 2007-07-17 | Intel Corporation | Alignment using latent images |
US7791727B2 (en) * | 2004-08-16 | 2010-09-07 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US20060109463A1 (en) * | 2004-11-22 | 2006-05-25 | Asml Netherlands B.V. | Latent overlay metrology |
US7453577B2 (en) * | 2004-12-14 | 2008-11-18 | Asml Netherlands B.V. | Apparatus and method for inspecting a patterned part of a sample |
-
2004
- 2004-11-22 US US10/993,416 patent/US20060109463A1/en not_active Abandoned
-
2005
- 2005-10-27 SG SG200508421A patent/SG122952A1/en unknown
- 2005-11-09 US US11/269,881 patent/US20060139592A1/en not_active Abandoned
- 2005-11-09 TW TW094139280A patent/TW200632572A/zh unknown
- 2005-11-21 JP JP2005335420A patent/JP2006148121A/ja active Pending
- 2005-11-21 CN CNA2005101271124A patent/CN1920670A/zh active Pending
- 2005-11-21 EP EP05257154A patent/EP1659452A1/en not_active Withdrawn
- 2005-11-22 KR KR1020050111771A patent/KR100674225B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1920670A (zh) | 2007-02-28 |
JP2006148121A (ja) | 2006-06-08 |
KR100674225B1 (ko) | 2007-01-25 |
KR20060056874A (ko) | 2006-05-25 |
SG122952A1 (en) | 2006-06-29 |
US20060109463A1 (en) | 2006-05-25 |
EP1659452A1 (en) | 2006-05-24 |
US20060139592A1 (en) | 2006-06-29 |
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