TW200629488A - Semiconductor device and electronic circuit - Google Patents
Semiconductor device and electronic circuitInfo
- Publication number
- TW200629488A TW200629488A TW094134824A TW94134824A TW200629488A TW 200629488 A TW200629488 A TW 200629488A TW 094134824 A TW094134824 A TW 094134824A TW 94134824 A TW94134824 A TW 94134824A TW 200629488 A TW200629488 A TW 200629488A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- inductor
- frame portion
- support substrate
- lead frame
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
A semiconductor apparatus comprises a support substrate, a lead frame portion fixed to the support substrate, and a semiconductor device connected to the lead frame portion. The lead frame portion has an inductor having a predetermined pattern at its center and lead components. The inductor has a spiral shape with an opening at its central part. The semiconductor device is fixed to the support substrate in the opening. Since the inductor is not obstructed by the semiconductor device, the position of the connection between the semiconductor device and the inductor is not restricted at all. On this point, the degree of freedom of bonding is attained.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2005/001935 WO2006085363A1 (en) | 2005-02-09 | 2005-02-09 | Semiconductor apparatus and electronic circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200629488A true TW200629488A (en) | 2006-08-16 |
Family
ID=36792938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094134824A TW200629488A (en) | 2005-02-09 | 2005-10-05 | Semiconductor device and electronic circuit |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2006085363A1 (en) |
TW (1) | TW200629488A (en) |
WO (1) | WO2006085363A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574359B (en) * | 2015-01-14 | 2017-03-11 | 聯發科技股份有限公司 | Semiconductor package |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59181046A (en) * | 1983-03-31 | 1984-10-15 | Toshiba Corp | Semiconductor integrated circuit |
JPS59190717A (en) * | 1983-04-13 | 1984-10-29 | Omron Tateisi Electronics Co | Proximity switch |
JPH06104372A (en) * | 1992-09-22 | 1994-04-15 | Matsushita Electric Ind Co Ltd | Semiconductor device |
JPH0888313A (en) * | 1994-09-14 | 1996-04-02 | Oki Electric Ind Co Ltd | Resin-sealed semiconductor device |
JP2970626B2 (en) * | 1997-11-11 | 1999-11-02 | 日本電気株式会社 | Lead frame for semiconductor integrated circuit device and semiconductor integrated circuit device |
US6351033B1 (en) * | 1999-10-06 | 2002-02-26 | Agere Systems Guardian Corp. | Multifunction lead frame and integrated circuit package incorporating the same |
JP3847242B2 (en) * | 2002-10-11 | 2006-11-22 | 松下電器産業株式会社 | Semiconductor device and manufacturing method thereof |
-
2005
- 2005-02-09 JP JP2007502506A patent/JPWO2006085363A1/en not_active Withdrawn
- 2005-02-09 WO PCT/JP2005/001935 patent/WO2006085363A1/en not_active Application Discontinuation
- 2005-10-05 TW TW094134824A patent/TW200629488A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI574359B (en) * | 2015-01-14 | 2017-03-11 | 聯發科技股份有限公司 | Semiconductor package |
US9704785B2 (en) | 2015-01-14 | 2017-07-11 | Mediatek Inc. | Semiconductor package with die paddle |
Also Published As
Publication number | Publication date |
---|---|
WO2006085363A1 (en) | 2006-08-17 |
JPWO2006085363A1 (en) | 2008-06-26 |
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