TW200628973A - Resist composition - Google Patents

Resist composition

Info

Publication number
TW200628973A
TW200628973A TW094142281A TW94142281A TW200628973A TW 200628973 A TW200628973 A TW 200628973A TW 094142281 A TW094142281 A TW 094142281A TW 94142281 A TW94142281 A TW 94142281A TW 200628973 A TW200628973 A TW 200628973A
Authority
TW
Taiwan
Prior art keywords
group
resist
dipropylene glycol
resist composition
hydrogen atom
Prior art date
Application number
TW094142281A
Other languages
Chinese (zh)
Inventor
Katsunori Makizawa
Toru Katayama
Original Assignee
Daicel Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chem filed Critical Daicel Chem
Publication of TW200628973A publication Critical patent/TW200628973A/en

Links

Landscapes

  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

To provide a resist composition which not only improve the properties such as the dissolubility when the resist is prepared and the adhesiveness of the resist film during development but also improve the stability of the resist and has excellent safety. A resist composition comprises a resist component and an organic solvent which is at least one dipropylene glycol derivative selected from the group consisting of dipropylene glycol monoalkyl ether and dipropylene glycol alkyl ether acetate and the like, wherein the dipropylene glycol derivative is a structural isomer mixture comprising the structural isomers represented by formulae (1) to (4), , (wherein R1 represents an alkyl group or an aryl group, R2 represents hydrogen atom, an alkyl group, an aryl group, an acetyl group or a propionyl group, and R2' represents hydrogen atom, an acetyl group or a propionyl group.) wherein 30% by weight or more and less than 100% by weight of the structural isomer represented by formula (1) is contained.
TW094142281A 2004-12-02 2005-12-01 Resist composition TW200628973A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004349853A JP2006162668A (en) 2004-12-02 2004-12-02 Resist composition

Publications (1)

Publication Number Publication Date
TW200628973A true TW200628973A (en) 2006-08-16

Family

ID=36664803

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142281A TW200628973A (en) 2004-12-02 2005-12-01 Resist composition

Country Status (4)

Country Link
JP (1) JP2006162668A (en)
KR (1) KR20060061907A (en)
CN (1) CN1782877A (en)
TW (1) TW200628973A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4593638B2 (en) * 2008-02-18 2010-12-08 ダイセル化学工業株式会社 Method for producing ester solvent
JP2014071373A (en) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp Photosensitive resin composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63307836A (en) * 1987-06-09 1988-12-15 Daicel Chem Ind Ltd Recovery of dipropylene glycol monomethyl ether
JPH10186637A (en) * 1996-12-26 1998-07-14 Clariant Internatl Ltd Radiation sensitive composition for roll coating
JP4204751B2 (en) * 2000-11-24 2009-01-07 ダイセル化学工業株式会社 Photoresist resin composition for printed wiring board
JP4116342B2 (en) * 2001-08-29 2008-07-09 関西ペイント株式会社 Positive photosensitive coating composition, method for producing positive photosensitive resin, and pattern forming method
JP2005234045A (en) * 2004-02-17 2005-09-02 Fujifilm Electronic Materials Co Ltd Color resin composition

Also Published As

Publication number Publication date
JP2006162668A (en) 2006-06-22
CN1782877A (en) 2006-06-07
KR20060061907A (en) 2006-06-08

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