TW200628822A - Manufacturing method for physical amount sensors - Google Patents
Manufacturing method for physical amount sensorsInfo
- Publication number
- TW200628822A TW200628822A TW094134803A TW94134803A TW200628822A TW 200628822 A TW200628822 A TW 200628822A TW 094134803 A TW094134803 A TW 094134803A TW 94134803 A TW94134803 A TW 94134803A TW 200628822 A TW200628822 A TW 200628822A
- Authority
- TW
- Taiwan
- Prior art keywords
- physical amount
- stage portion
- sensor chip
- rectangular frame
- amount sensor
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004296372A JP2006108561A (ja) | 2004-10-08 | 2004-10-08 | 物理量センサの製造方法 |
JP2005045296A JP4579003B2 (ja) | 2005-02-22 | 2005-02-22 | 物理量センサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200628822A true TW200628822A (en) | 2006-08-16 |
TWI280400B TWI280400B (en) | 2007-05-01 |
Family
ID=36148282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94134803A TWI280400B (en) | 2004-10-08 | 2005-10-05 | Manufacturing method for physical amount sensors |
Country Status (4)
Country | Link |
---|---|
US (1) | US7754130B2 (zh) |
KR (1) | KR20070049687A (zh) |
TW (1) | TWI280400B (zh) |
WO (1) | WO2006040987A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5622347B2 (ja) * | 2006-08-09 | 2014-11-12 | セイコーエプソン株式会社 | 慣性センサ装置 |
US20100282860A1 (en) * | 2007-11-15 | 2010-11-11 | Field Leslie A | Systems for environmental modification with climate control materials and coverings |
US8322207B2 (en) * | 2008-09-25 | 2012-12-04 | Silverbrook Research Pty Ltd | Tack adhesion testing device |
US8017450B2 (en) * | 2008-09-25 | 2011-09-13 | Silverbrook Research Pty Ltd | Method of forming assymetrical encapsulant bead |
US20100075446A1 (en) * | 2008-09-25 | 2010-03-25 | Silverbrook Research Pty Ltd | Method of forming assymetrical encapsulant bead |
US20100075465A1 (en) * | 2008-09-25 | 2010-03-25 | Silverbrook Research Pty Ltd | Method of reducing voids in encapsulant |
DE102018130723A1 (de) * | 2018-12-03 | 2020-06-04 | Infineon Technologies Ag | Erfassung eines Drehwinkels |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8902849D0 (en) * | 1989-02-09 | 1989-03-30 | Bonas Machine Co | Heald rod retention system for use with an electronic jacquard system |
JP3077504B2 (ja) * | 1994-04-21 | 2000-08-14 | 日立電線株式会社 | リードフレームの製造方法およびその製造装置 |
JPH098195A (ja) * | 1995-06-16 | 1997-01-10 | Hitachi Cable Ltd | リードフレームのダウンセット加工方法および装置 |
JPH09257511A (ja) * | 1996-03-22 | 1997-10-03 | Nissan Motor Co Ltd | 多次元実装構造と製造法 |
JP2000243889A (ja) * | 1999-02-22 | 2000-09-08 | Sony Corp | 半導体装置用リードフレームの形状加工装置及び形状加工方法並びに半導体装置用リードフレーム |
JP3823955B2 (ja) * | 2002-07-29 | 2006-09-20 | ヤマハ株式会社 | 磁気センサの製造方法およびリードフレーム |
JP3823954B2 (ja) * | 2002-07-29 | 2006-09-20 | ヤマハ株式会社 | 磁気センサの製造方法およびリードフレーム |
US7187063B2 (en) * | 2002-07-29 | 2007-03-06 | Yamaha Corporation | Manufacturing method for magnetic sensor and lead frame therefor |
JP3823956B2 (ja) * | 2002-07-29 | 2006-09-20 | ヤマハ株式会社 | 磁気センサの製造方法およびリードフレーム |
JP4579003B2 (ja) * | 2005-02-22 | 2010-11-10 | ヤマハ株式会社 | 物理量センサの製造方法 |
US20060211176A1 (en) * | 2005-03-09 | 2006-09-21 | Shiga International | Manufacturing method for physical quantity sensor using lead frame and bonding device therefor |
-
2005
- 2005-10-05 KR KR20077008902A patent/KR20070049687A/ko not_active Application Discontinuation
- 2005-10-05 WO PCT/JP2005/018470 patent/WO2006040987A1/ja active Application Filing
- 2005-10-05 TW TW94134803A patent/TWI280400B/zh not_active IP Right Cessation
-
2007
- 2007-04-05 US US11/696,949 patent/US7754130B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20070184584A1 (en) | 2007-08-09 |
TWI280400B (en) | 2007-05-01 |
WO2006040987A1 (ja) | 2006-04-20 |
US7754130B2 (en) | 2010-07-13 |
KR20070049687A (ko) | 2007-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |