TW200628808A - Current measuring apparatus and current measuring method - Google Patents

Current measuring apparatus and current measuring method

Info

Publication number
TW200628808A
TW200628808A TW094146012A TW94146012A TW200628808A TW 200628808 A TW200628808 A TW 200628808A TW 094146012 A TW094146012 A TW 094146012A TW 94146012 A TW94146012 A TW 94146012A TW 200628808 A TW200628808 A TW 200628808A
Authority
TW
Taiwan
Prior art keywords
current measuring
electron beam
measured sample
measuring apparatus
current
Prior art date
Application number
TW094146012A
Other languages
English (en)
Inventor
Keizo Yamada
Original Assignee
Fab Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fab Solutions Inc filed Critical Fab Solutions Inc
Publication of TW200628808A publication Critical patent/TW200628808A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G01R31/307—Contactless testing using electron beams of integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24564—Measurements of electric or magnetic variables, e.g. voltage, current, frequency

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
TW094146012A 2004-12-27 2005-12-23 Current measuring apparatus and current measuring method TW200628808A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004378122A JP4954470B2 (ja) 2004-12-27 2004-12-27 電流測定装置

Publications (1)

Publication Number Publication Date
TW200628808A true TW200628808A (en) 2006-08-16

Family

ID=36614808

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146012A TW200628808A (en) 2004-12-27 2005-12-23 Current measuring apparatus and current measuring method

Country Status (3)

Country Link
JP (1) JP4954470B2 (zh)
TW (1) TW200628808A (zh)
WO (1) WO2006070691A1 (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635016B2 (ja) * 1994-09-05 1997-07-30 株式会社日立製作所 薄膜の観察方法
JPH10125271A (ja) * 1996-10-16 1998-05-15 Hitachi Ltd 走査型電子顕微鏡
JP3334750B2 (ja) * 1998-10-21 2002-10-15 日本電気株式会社 試料検査装置および方法
JP4060143B2 (ja) * 2002-07-31 2008-03-12 株式会社トプコン 非破壊測定装置および半導体装置製造方法
JP4229783B2 (ja) * 2002-10-02 2009-02-25 日本電子株式会社 半導体ウェハ試料の検査方法および装置

Also Published As

Publication number Publication date
WO2006070691A1 (ja) 2006-07-06
JP2006186103A (ja) 2006-07-13
JP4954470B2 (ja) 2012-06-13

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