TW200627619A - Anti-static circuit board structure and fabrication method thereof - Google Patents

Anti-static circuit board structure and fabrication method thereof

Info

Publication number
TW200627619A
TW200627619A TW094101974A TW94101974A TW200627619A TW 200627619 A TW200627619 A TW 200627619A TW 094101974 A TW094101974 A TW 094101974A TW 94101974 A TW94101974 A TW 94101974A TW 200627619 A TW200627619 A TW 200627619A
Authority
TW
Taiwan
Prior art keywords
circuit board
electrical connection
connection pads
layer
static
Prior art date
Application number
TW094101974A
Other languages
Chinese (zh)
Other versions
TWI281247B (en
Inventor
Shih-Ping Hsu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW94101974A priority Critical patent/TWI281247B/en
Publication of TW200627619A publication Critical patent/TW200627619A/en
Application granted granted Critical
Publication of TWI281247B publication Critical patent/TWI281247B/en

Links

Landscapes

  • Elimination Of Static Electricity (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

An anti-static circuit board structure and a fabrication method thereof are proposed. The circuit board structure includes: a circuit board having at least one circuit layer thereon, wherein the circuit layer has a plurality of electrical connection pads; a dielectric layer formed on at least one surface of the circuit board to cover the circuit layer, and having a plurality of first openings corresponding to the electrical connection pads such that the electrical connection pads are exposed; a protection layer formed on the dielectric layer, and having a plurality of second openings corresponding to the electrical connection pads such that the electrical connection pads are exposed; and a solder mask layer formed on the protection layer and the dielectric layer, wherein the solder mask layer has a plurality of third openings corresponding to the electrical connection pads of the circuit board such that the electrical connection pads are exposed, and the solder mask layer further has at least one fourth opening for exposing a portion of the protection layer, such that static on the protection layer can be connected to an external structure and grounded. Therefore, the protection layer can attract static and direct the static to the external structure so as to release the static and prevent damage to a semiconductor chip mounted on the circuit board.
TW94101974A 2005-01-24 2005-01-24 Anti-static circuit board structure and fabrication method thereof TWI281247B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94101974A TWI281247B (en) 2005-01-24 2005-01-24 Anti-static circuit board structure and fabrication method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94101974A TWI281247B (en) 2005-01-24 2005-01-24 Anti-static circuit board structure and fabrication method thereof

Publications (2)

Publication Number Publication Date
TW200627619A true TW200627619A (en) 2006-08-01
TWI281247B TWI281247B (en) 2007-05-11

Family

ID=38741669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94101974A TWI281247B (en) 2005-01-24 2005-01-24 Anti-static circuit board structure and fabrication method thereof

Country Status (1)

Country Link
TW (1) TWI281247B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399135B (en) * 2009-12-30 2013-06-11 Unimicron Technology Corp Anti-esd structure and method for making the same

Also Published As

Publication number Publication date
TWI281247B (en) 2007-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees