TW200627070A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200627070A
TW200627070A TW094141060A TW94141060A TW200627070A TW 200627070 A TW200627070 A TW 200627070A TW 094141060 A TW094141060 A TW 094141060A TW 94141060 A TW94141060 A TW 94141060A TW 200627070 A TW200627070 A TW 200627070A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
group
phenolic hydroxyl
relates
Prior art date
Application number
TW094141060A
Other languages
English (en)
Other versions
TWI381248B (zh
Inventor
Ryuichiro Taniguchi
Tomoyuki Yuba
Masao Tomikawa
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of TW200627070A publication Critical patent/TW200627070A/zh
Application granted granted Critical
Publication of TWI381248B publication Critical patent/TWI381248B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
TW094141060A 2004-11-24 2005-11-23 感光性樹脂組成物 TWI381248B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004338702 2004-11-24

Publications (2)

Publication Number Publication Date
TW200627070A true TW200627070A (en) 2006-08-01
TWI381248B TWI381248B (zh) 2013-01-01

Family

ID=36095887

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141060A TWI381248B (zh) 2004-11-24 2005-11-23 感光性樹脂組成物

Country Status (6)

Country Link
US (1) US7455948B2 (zh)
EP (1) EP1662319A3 (zh)
KR (1) KR101251650B1 (zh)
CN (1) CN1782875B (zh)
SG (1) SG122900A1 (zh)
TW (1) TWI381248B (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI360565B (en) * 2003-07-09 2012-03-21 Toray Industries Photosensitive resin precursor composition
KR100981830B1 (ko) 2005-09-22 2010-09-13 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 네거티브형 감광성 수지 조성물, 패턴 형성방법 및전자부품
US20100159217A1 (en) * 2006-06-20 2010-06-24 Hitachi Chemical Dupont Microsystems, Ltd Negative-type photosensitive resin composition, method for forming patterns, and electronic parts
EP2056163A4 (en) * 2006-08-15 2009-11-11 Asahi Kasei Emd Corp POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
CN101178541B (zh) * 2006-10-31 2012-04-25 三洋化成工业株式会社 感光性树脂组合物
CN101611350B (zh) * 2007-02-13 2012-08-08 东丽株式会社 正型感光性树脂组合物
US8158324B2 (en) * 2007-02-13 2012-04-17 Toray Industries, Inc. Positive-type photosensitive resin composition
US8298747B2 (en) * 2007-03-12 2012-10-30 Hitachi Chemical Dupont Microsystems, Ltd. Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
ATE547743T1 (de) 2007-03-14 2012-03-15 Fujifilm Corp Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster
AU2014240314B2 (en) * 2007-06-04 2016-09-01 Ben Gurion University Of The Negev Research And Development Authority Tri-aryl compounds and compositions comprising the same
TW200927832A (en) * 2007-10-16 2009-07-01 Fujifilm Electronic Materials Novel photosensitive resin compositions
US8420291B2 (en) * 2007-10-29 2013-04-16 Hitachi Chemical Dupont Microsystems, Ltd. Positive photosensitive resin composition, method for forming pattern, electronic component
TWI437025B (zh) * 2009-08-14 2014-05-11 Asahi Kasei E Materials Corp An alkali-soluble polymer, a photosensitive resin composition comprising the same, and a use thereof
SG181979A1 (en) * 2009-12-28 2012-08-30 Toray Industries Positive-type photosensitive resin composition
US8871423B2 (en) * 2010-01-29 2014-10-28 Samsung Electronics Co., Ltd. Photoresist composition for fabricating probe array, method of fabricating probe array using the photoresist composition, composition for photosensitive type developed bottom anti-reflective coating, fabricating method of patterns using the same and fabricating method of semiconductor device using the same
WO2012008736A2 (ko) 2010-07-14 2012-01-19 주식회사 엘지화학 파지티브 타입 감광성 수지 조성물 및 이를 포함하는 유기 발광 소자 블랙 뱅크
KR101229312B1 (ko) 2011-01-03 2013-02-04 금호석유화학 주식회사 술포늄 화합물, 광산발생제 및 이의 제조방법
KR101882217B1 (ko) * 2011-10-18 2018-07-26 주식회사 동진쎄미켐 오엘이디용 폴리이미드 감광성 수지 조성물
TWI444774B (zh) * 2011-12-22 2014-07-11 Chi Mei Corp Positive photosensitive resin composition and its application
US9416229B2 (en) 2014-05-28 2016-08-16 Industrial Technology Research Institute Dianhydride and polyimide
WO2016084694A1 (ja) * 2014-11-27 2016-06-02 東レ株式会社 樹脂および感光性樹脂組成物
WO2017038828A1 (ja) * 2015-09-03 2017-03-09 東レ株式会社 ポジ型感光性樹脂組成物、その樹脂組成物により形成された未硬化の樹脂パターン、硬化樹脂パターン、およびそれを用いた半導体装置とその製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2711590B2 (ja) 1990-09-13 1998-02-10 富士写真フイルム株式会社 ポジ型フオトレジスト組成物
US5550004A (en) * 1992-05-06 1996-08-27 Ocg Microelectronic Materials, Inc. Chemically amplified radiation-sensitive composition
US6190833B1 (en) * 1997-03-30 2001-02-20 Jsr Corporation Radiation-sensitive resin composition
JP3426531B2 (ja) 1998-10-30 2003-07-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
JP4154086B2 (ja) 1999-07-29 2008-09-24 日立化成工業株式会社 感光性重合体組成物、パターンの製造法及び電子部品
JP4449159B2 (ja) 2000-04-28 2010-04-14 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物及びパターンの製造方法並びに電子部品
JP3972568B2 (ja) * 2000-05-09 2007-09-05 住友化学株式会社 化学増幅型ポジ型レジスト組成物及びスルホニウム塩
TW525407B (en) * 2000-06-28 2003-03-21 Toray Industries Display
JP2002122993A (ja) 2000-10-19 2002-04-26 Toshiba Chem Corp 感光性樹脂組成物およびポジ型パターン形成方法
JP4665333B2 (ja) * 2000-11-27 2011-04-06 東レ株式会社 ポジ型感光性樹脂前駆体組成物
JP2002169283A (ja) 2000-11-30 2002-06-14 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物、パターンの製造法及び電子部品
JP3773845B2 (ja) 2000-12-29 2006-05-10 三星電子株式会社 ポジティブ型感光性ポリイミド前駆体およびこれを含む組成物
TW574620B (en) * 2001-02-26 2004-02-01 Toray Industries Precursor composition of positive photosensitive resin and display device using it
JP2003121998A (ja) 2001-10-11 2003-04-23 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物及びパターン製造法及び電子部品
JP2004239947A (ja) 2003-02-03 2004-08-26 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物
EP1609024B1 (en) * 2003-03-11 2015-09-30 Fujifilm Electronic Materials USA, Inc. Photosensitive resin compositions
EP1636648B1 (en) * 2003-06-05 2015-08-12 FujiFilm Electronic Materials USA, Inc. Novel positive photosensitive resin compositions

Also Published As

Publication number Publication date
US20060110680A1 (en) 2006-05-25
EP1662319A2 (en) 2006-05-31
US7455948B2 (en) 2008-11-25
SG122900A1 (en) 2006-06-29
KR20060058026A (ko) 2006-05-29
KR101251650B1 (ko) 2013-04-05
TWI381248B (zh) 2013-01-01
CN1782875A (zh) 2006-06-07
CN1782875B (zh) 2012-05-23
EP1662319A3 (en) 2009-05-27

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees