TW200625387A - System for cleaning a surface using cryogenic aerosol and fluid reactant - Google Patents
System for cleaning a surface using cryogenic aerosol and fluid reactantInfo
- Publication number
- TW200625387A TW200625387A TW094112610A TW94112610A TW200625387A TW 200625387 A TW200625387 A TW 200625387A TW 094112610 A TW094112610 A TW 094112610A TW 94112610 A TW94112610 A TW 94112610A TW 200625387 A TW200625387 A TW 200625387A
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- substrate
- cleaning
- fluid reactant
- cryogenic aerosol
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title abstract 2
- 239000012530 fluid Substances 0.000 title abstract 2
- 239000000376 reactant Substances 0.000 title abstract 2
- 239000000443 aerosol Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
- B08B7/0092—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64320105P | 2005-01-12 | 2005-01-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200625387A true TW200625387A (en) | 2006-07-16 |
Family
ID=36677944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094112610A TW200625387A (en) | 2005-01-12 | 2005-04-20 | System for cleaning a surface using cryogenic aerosol and fluid reactant |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090126760A1 (zh) |
TW (1) | TW200625387A (zh) |
WO (1) | WO2006076005A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103824757A (zh) * | 2007-05-23 | 2014-05-28 | 细美事有限公司 | 基板干燥的装置与方法 |
TWI560792B (zh) * | 2014-07-04 | 2016-12-01 | Hitachi Int Electric Inc | |
TWI625818B (zh) * | 2011-09-09 | 2018-06-01 | 蘭姆研究股份公司 | 晶圓形物件之液體處理方法與設備 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9646859B2 (en) * | 2010-04-30 | 2017-05-09 | Applied Materials, Inc. | Disk-brush cleaner module with fluid jet |
US9937536B2 (en) * | 2012-07-12 | 2018-04-10 | Taiwan Semiconductor Manufacturing Company Limited | Air purge cleaning for semiconductor polishing apparatus |
WO2016033612A1 (en) * | 2014-08-29 | 2016-03-03 | Hzo, Inc. | Equipment for removing protective coatings from substrates |
JP6886771B2 (ja) * | 2014-10-06 | 2021-06-16 | ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ,インコーポレイテッド | 極低温流体混合物で基板を処理するシステムおよび方法 |
US10014191B2 (en) | 2014-10-06 | 2018-07-03 | Tel Fsi, Inc. | Systems and methods for treating substrates with cryogenic fluid mixtures |
KR102358693B1 (ko) * | 2015-01-06 | 2022-02-04 | 삼성전자주식회사 | 매엽식 웨이퍼 세정 설비 |
JP6738235B2 (ja) * | 2016-08-09 | 2020-08-12 | 芝浦メカトロニクス株式会社 | 基板処理装置、および基板処理方法 |
EP3618926A1 (en) | 2017-05-04 | 2020-03-11 | Intraop Medical Corporation | Machine vision alignment and positioning system for electron beam treatment systems |
US11033930B2 (en) * | 2018-01-08 | 2021-06-15 | Applied Materials, Inc. | Methods and apparatus for cryogenic gas stream assisted SAM-based selective deposition |
CN113414045A (zh) * | 2021-06-22 | 2021-09-21 | 中国核动力研究设计院 | 一种水泥固化体清洁装置 |
US11769660B2 (en) * | 2021-12-03 | 2023-09-26 | Pulseforge, Inc. | Method and apparatus for removing particles from the surface of a semiconductor wafer |
US11688600B1 (en) * | 2021-12-03 | 2023-06-27 | Pulseforge, Inc. | Method and apparatus for removing particles from the surface of a semiconductor wafer |
CN116408295B (zh) * | 2023-06-12 | 2023-08-18 | 山西睿钒科技有限公司 | 一种磷酸钒锂正极材料水洗装置 |
Family Cites Families (63)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3795975A (en) * | 1971-12-17 | 1974-03-12 | Hughes Aircraft Co | Multi-level large scale complex integrated circuit having functional interconnected circuit routed to master patterns |
US4050954A (en) * | 1976-03-25 | 1977-09-27 | International Business Machines Corporation | Surface treatment of semiconductor substrates |
US4264641A (en) * | 1977-03-17 | 1981-04-28 | Phrasor Technology Inc. | Electrohydrodynamic spraying to produce ultrafine particles |
JP3009438B2 (ja) * | 1989-08-14 | 2000-02-14 | 株式会社日立製作所 | 液晶表示装置 |
US5315793A (en) * | 1991-10-01 | 1994-05-31 | Hughes Aircraft Company | System for precision cleaning by jet spray |
DE69328683D1 (de) * | 1992-06-22 | 2000-06-21 | Minnesota Mining & Mfg | Verfahren und vorrichtung zum entfernen von abfallstoffen von optischen floppy-disk-medien |
US5409418A (en) * | 1992-09-28 | 1995-04-25 | Hughes Aircraft Company | Electrostatic discharge control during jet spray |
US5344494A (en) * | 1993-01-21 | 1994-09-06 | Smith & Nephew Richards, Inc. | Method for cleaning porous and roughened surfaces on medical implants |
US5316560A (en) * | 1993-03-19 | 1994-05-31 | Hughes Aircraft Company | Environment control apparatus |
US5354384A (en) * | 1993-04-30 | 1994-10-11 | Hughes Aircraft Company | Method for cleaning surface by heating and a stream of snow |
US5377705A (en) * | 1993-09-16 | 1995-01-03 | Autoclave Engineers, Inc. | Precision cleaning system |
US5637027A (en) * | 1993-12-23 | 1997-06-10 | Hughes Aircraft Company | CO2 jet spray system employing a thermal CO2 snow plume sensor |
US5651723A (en) * | 1994-04-13 | 1997-07-29 | Viratec Thin Films, Inc. | Method and apparatus for cleaning substrates in preparation for deposition of thin film coatings |
DE19522525A1 (de) * | 1994-10-04 | 1996-04-11 | Kunze Concewitz Horst Dipl Phy | Verfahren und Vorrichtung zum Feinstreinigen von Oberflächen |
US5931721A (en) * | 1994-11-07 | 1999-08-03 | Sumitomo Heavy Industries, Ltd. | Aerosol surface processing |
US5967156A (en) * | 1994-11-07 | 1999-10-19 | Krytek Corporation | Processing a surface |
US6173916B1 (en) * | 1994-12-15 | 2001-01-16 | Eco-Snow Systems, Inc. | CO2jet spray nozzles with multiple orifices |
US5611491A (en) * | 1995-02-27 | 1997-03-18 | Hughes Aircraft Company | Modular CO2 jet spray device |
US5561527A (en) * | 1995-03-13 | 1996-10-01 | Hughes Aircraft Company | Optical sensing apparatus for CO2 jet spray devices |
US5792275A (en) * | 1995-06-06 | 1998-08-11 | International Business Machines Corporation | Film removal by chemical transformation and aerosol clean |
US5613293A (en) * | 1995-06-07 | 1997-03-25 | Seagate Technology, Inc. | Method of making a smooth topography head/disk interface surface on a head with patterned pole |
US5999380A (en) * | 1995-06-07 | 1999-12-07 | Seagate Technology, Inc. | Smooth topography head surface on a head with patterned pole |
US5796111A (en) * | 1995-10-30 | 1998-08-18 | Phrasor Scientific, Inc. | Apparatus for cleaning contaminated surfaces using energetic cluster beams |
US6039059A (en) * | 1996-09-30 | 2000-03-21 | Verteq, Inc. | Wafer cleaning system |
US5766061A (en) * | 1996-10-04 | 1998-06-16 | Eco-Snow Systems, Inc. | Wafer cassette cleaning using carbon dioxide jet spray |
US5853962A (en) * | 1996-10-04 | 1998-12-29 | Eco-Snow Systems, Inc. | Photoresist and redeposition removal using carbon dioxide jet spray |
US5837064A (en) * | 1996-10-04 | 1998-11-17 | Eco-Snow Systems, Inc. | Electrostatic discharge protection of static sensitive devices cleaned with carbon dioxide spray |
US5836809A (en) * | 1996-10-07 | 1998-11-17 | Eco-Snow Systems, Inc. | Apparatus and method for cleaning large glass plates using linear arrays of carbon dioxide (CO2) jet spray nozzles |
US5908510A (en) * | 1996-10-16 | 1999-06-01 | International Business Machines Corporation | Residue removal by supercritical fluids |
US5806544A (en) * | 1997-02-11 | 1998-09-15 | Eco-Snow Systems, Inc. | Carbon dioxide jet spray disk cleaning system |
US5766368A (en) * | 1997-02-14 | 1998-06-16 | Eco-Snow Systems, Inc. | Integrated circuit chip module cleaning using a carbon dioxide jet spray |
US6146466A (en) * | 1997-02-14 | 2000-11-14 | Eco-Snow Systems, Inc. | Use of electrostatic bias to clean non-electrostatically sensitive components with a carbon dioxide spray |
US5989355A (en) * | 1997-02-26 | 1999-11-23 | Eco-Snow Systems, Inc. | Apparatus for cleaning and testing precision components of hard drives and the like |
US6099396A (en) * | 1997-03-14 | 2000-08-08 | Eco-Snow Systems, Inc. | Carbon dioxide jet spray pallet cleaning system |
US5922136A (en) * | 1997-03-28 | 1999-07-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP cleaner apparatus and method |
US5804826A (en) * | 1997-05-02 | 1998-09-08 | Eco-Snow Systems, Inc. | Carbon dioxide liquid and gas sensor apparatus for use with jet spray cleaning systems |
US6066032A (en) * | 1997-05-02 | 2000-05-23 | Eco Snow Systems, Inc. | Wafer cleaning using a laser and carbon dioxide snow |
US5775127A (en) * | 1997-05-23 | 1998-07-07 | Zito; Richard R. | High dispersion carbon dioxide snow apparatus |
JP3183214B2 (ja) * | 1997-05-26 | 2001-07-09 | 日本電気株式会社 | 洗浄方法および洗浄装置 |
US6306564B1 (en) * | 1997-05-27 | 2001-10-23 | Tokyo Electron Limited | Removal of resist or residue from semiconductors using supercritical carbon dioxide |
US5961732A (en) * | 1997-06-11 | 1999-10-05 | Fsi International, Inc | Treating substrates by producing and controlling a cryogenic aerosol |
US6004400A (en) * | 1997-07-09 | 1999-12-21 | Phillip W. Bishop | Carbon dioxide cleaning process |
US6332470B1 (en) * | 1997-12-30 | 2001-12-25 | Boris Fishkin | Aerosol substrate cleaner |
US6231775B1 (en) * | 1998-01-28 | 2001-05-15 | Anon, Inc. | Process for ashing organic materials from substrates |
US5928434A (en) * | 1998-07-13 | 1999-07-27 | Ford Motor Company | Method of mitigating electrostatic charge during cleaning of electronic circuit boards |
GB2344933B (en) * | 1998-12-14 | 2001-08-29 | Bookham Technology Ltd | Process for making optical waveguides |
DE19916345A1 (de) * | 1999-04-12 | 2000-10-26 | Steag Electronic Systems Gmbh | Verfahren und Vorrichtung zum Reinigen von Substraten |
US6361929B1 (en) * | 1999-08-13 | 2002-03-26 | United Microelectronics Corp. | Method of removing a photo-resist layer on a semiconductor wafer |
US6230720B1 (en) * | 1999-08-16 | 2001-05-15 | Memc Electronic Materials, Inc. | Single-operation method of cleaning semiconductors after final polishing |
US6296716B1 (en) * | 1999-10-01 | 2001-10-02 | Saint-Gobain Ceramics And Plastics, Inc. | Process for cleaning ceramic articles |
US6404615B1 (en) * | 2000-02-16 | 2002-06-11 | Intarsia Corporation | Thin film capacitors |
US6565920B1 (en) * | 2000-06-08 | 2003-05-20 | Honeywell International Inc. | Edge bead removal for spin-on materials containing low volatility solvents fusing carbon dioxide cleaning |
US6530823B1 (en) * | 2000-08-10 | 2003-03-11 | Nanoclean Technologies Inc | Methods for cleaning surfaces substantially free of contaminants |
US6500758B1 (en) * | 2000-09-12 | 2002-12-31 | Eco-Snow Systems, Inc. | Method for selective metal film layer removal using carbon dioxide jet spray |
US6425956B1 (en) * | 2001-01-05 | 2002-07-30 | International Business Machines Corporation | Process for removing chemical mechanical polishing residual slurry |
KR100421038B1 (ko) * | 2001-03-28 | 2004-03-03 | 삼성전자주식회사 | 표면으로부터 오염물을 제거하는 세정 장비 및 이를이용한 세정 방법 |
US6554909B1 (en) * | 2001-11-08 | 2003-04-29 | Saint-Gobain Ceramics & Plastics, Inc. | Process for cleaning components using cleaning media |
JP3958080B2 (ja) * | 2002-03-18 | 2007-08-15 | 東京エレクトロン株式会社 | プラズマ処理装置内の被洗浄部材の洗浄方法 |
US6852173B2 (en) * | 2002-04-05 | 2005-02-08 | Boc, Inc. | Liquid-assisted cryogenic cleaning |
US6949145B2 (en) * | 2002-04-05 | 2005-09-27 | Boc, Inc. | Vapor-assisted cryogenic cleaning |
US20030221702A1 (en) * | 2002-05-28 | 2003-12-04 | Peebles Henry C. | Process for cleaning and repassivating semiconductor equipment parts |
US6764385B2 (en) * | 2002-07-29 | 2004-07-20 | Nanoclean Technologies, Inc. | Methods for resist stripping and cleaning surfaces substantially free of contaminants |
KR100505693B1 (ko) * | 2003-06-26 | 2005-08-03 | 삼성전자주식회사 | 미세 전자 소자 기판으로부터 포토레지스트 또는 유기물을세정하는 방법 |
-
2005
- 2005-04-19 US US11/793,647 patent/US20090126760A1/en not_active Abandoned
- 2005-04-19 WO PCT/US2005/013431 patent/WO2006076005A1/en active Application Filing
- 2005-04-20 TW TW094112610A patent/TW200625387A/zh unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103824757A (zh) * | 2007-05-23 | 2014-05-28 | 细美事有限公司 | 基板干燥的装置与方法 |
US8793898B2 (en) | 2007-05-23 | 2014-08-05 | Semes Co., Ltd. | Apparatus and method for drying substrates |
TWI490930B (zh) * | 2007-05-23 | 2015-07-01 | Semes Co Ltd | 乾燥基板的裝置及方法 |
TWI625818B (zh) * | 2011-09-09 | 2018-06-01 | 蘭姆研究股份公司 | 晶圓形物件之液體處理方法與設備 |
TWI560792B (zh) * | 2014-07-04 | 2016-12-01 | Hitachi Int Electric Inc |
Also Published As
Publication number | Publication date |
---|---|
WO2006076005A1 (en) | 2006-07-20 |
US20090126760A1 (en) | 2009-05-21 |
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