TW200623983A - Method for cutting printed circuit board - Google Patents

Method for cutting printed circuit board

Info

Publication number
TW200623983A
TW200623983A TW093139704A TW93139704A TW200623983A TW 200623983 A TW200623983 A TW 200623983A TW 093139704 A TW093139704 A TW 093139704A TW 93139704 A TW93139704 A TW 93139704A TW 200623983 A TW200623983 A TW 200623983A
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
cutting
cutting region
protection layer
Prior art date
Application number
TW093139704A
Other languages
English (en)
Other versions
TWI262042B (en
Inventor
Tung-Zung Wu
Kuo-Feng Yang
Chun-Chieh Huang
Original Assignee
Nan Ya Printed Circuit Board Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Printed Circuit Board Corp filed Critical Nan Ya Printed Circuit Board Corp
Priority to TW093139704A priority Critical patent/TWI262042B/zh
Priority to US11/161,987 priority patent/US7482250B2/en
Publication of TW200623983A publication Critical patent/TW200623983A/zh
Application granted granted Critical
Publication of TWI262042B publication Critical patent/TWI262042B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
TW093139704A 2004-12-20 2004-12-20 Method for cutting printed circuit board TWI262042B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW093139704A TWI262042B (en) 2004-12-20 2004-12-20 Method for cutting printed circuit board
US11/161,987 US7482250B2 (en) 2004-12-20 2005-08-24 Method for cutting printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093139704A TWI262042B (en) 2004-12-20 2004-12-20 Method for cutting printed circuit board

Publications (2)

Publication Number Publication Date
TW200623983A true TW200623983A (en) 2006-07-01
TWI262042B TWI262042B (en) 2006-09-11

Family

ID=36596511

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139704A TWI262042B (en) 2004-12-20 2004-12-20 Method for cutting printed circuit board

Country Status (2)

Country Link
US (1) US7482250B2 (zh)
TW (1) TWI262042B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104869761A (zh) * 2015-05-08 2015-08-26 深圳崇达多层线路板有限公司 一种挠性板在外层的刚挠结合线路板的制作方法
CN105050325A (zh) * 2015-07-03 2015-11-11 深圳市景旺电子股份有限公司 一种刚挠结合板铣板的方法
CN105338751A (zh) * 2014-08-12 2016-02-17 富葵精密组件(深圳)有限公司 电路板及其制作方法
CN110379771A (zh) * 2019-07-19 2019-10-25 苏州长瑞光电有限公司 晶圆分离方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI275186B (en) * 2005-10-17 2007-03-01 Phoenix Prec Technology Corp Method for manufacturing semiconductor package
JP2009146988A (ja) * 2007-12-12 2009-07-02 Fujitsu Ltd 配線基板の個片化方法およびパッケージ用基板
CN104625584A (zh) * 2013-11-11 2015-05-20 江苏苏杭电子有限公司 印制板外形加工方法
CN110996517A (zh) * 2019-12-06 2020-04-10 深圳市兴森快捷电路科技股份有限公司 一种线路板加工方法
CN111987007A (zh) * 2020-08-31 2020-11-24 维信诺科技股份有限公司 显示装置的压合方法和显示装置
CN112714555A (zh) * 2020-10-21 2021-04-27 珠海杰赛科技有限公司 一种裸铜pcb的制作方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06170822A (ja) 1992-12-02 1994-06-21 Ngk Spark Plug Co Ltd シート加工品及びその製造方法
JPH07111254A (ja) * 1993-10-12 1995-04-25 Sumitomo Electric Ind Ltd 半導体装置の製造方法
US7781850B2 (en) * 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
TWI221755B (en) * 2003-10-07 2004-10-01 Lite On Technology Corp Printed circuit board for avoiding producing burr
JP2005191148A (ja) * 2003-12-24 2005-07-14 Sanyo Electric Co Ltd 混成集積回路装置およびその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105338751A (zh) * 2014-08-12 2016-02-17 富葵精密组件(深圳)有限公司 电路板及其制作方法
CN105338751B (zh) * 2014-08-12 2018-02-02 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法
CN104869761A (zh) * 2015-05-08 2015-08-26 深圳崇达多层线路板有限公司 一种挠性板在外层的刚挠结合线路板的制作方法
CN104869761B (zh) * 2015-05-08 2018-03-02 深圳崇达多层线路板有限公司 一种挠性板在外层的刚挠结合线路板的制作方法
CN105050325A (zh) * 2015-07-03 2015-11-11 深圳市景旺电子股份有限公司 一种刚挠结合板铣板的方法
CN110379771A (zh) * 2019-07-19 2019-10-25 苏州长瑞光电有限公司 晶圆分离方法

Also Published As

Publication number Publication date
US20060134888A1 (en) 2006-06-22
US7482250B2 (en) 2009-01-27
TWI262042B (en) 2006-09-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees