TW200623368A - Thermally enhanced flip chip package - Google Patents

Thermally enhanced flip chip package

Info

Publication number
TW200623368A
TW200623368A TW093141895A TW93141895A TW200623368A TW 200623368 A TW200623368 A TW 200623368A TW 093141895 A TW093141895 A TW 093141895A TW 93141895 A TW93141895 A TW 93141895A TW 200623368 A TW200623368 A TW 200623368A
Authority
TW
Taiwan
Prior art keywords
heat
spreading
refrigerant
flip chip
exchanging part
Prior art date
Application number
TW093141895A
Other languages
English (en)
Inventor
John Liu
Yeong-Ching Chao
Yao-Jung Lee
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW093141895A priority Critical patent/TW200623368A/zh
Publication of TW200623368A publication Critical patent/TW200623368A/zh

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW093141895A 2004-12-31 2004-12-31 Thermally enhanced flip chip package TW200623368A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093141895A TW200623368A (en) 2004-12-31 2004-12-31 Thermally enhanced flip chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093141895A TW200623368A (en) 2004-12-31 2004-12-31 Thermally enhanced flip chip package

Publications (1)

Publication Number Publication Date
TW200623368A true TW200623368A (en) 2006-07-01

Family

ID=57808562

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093141895A TW200623368A (en) 2004-12-31 2004-12-31 Thermally enhanced flip chip package

Country Status (1)

Country Link
TW (1) TW200623368A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647802B (zh) * 2016-07-06 2019-01-11 矽品精密工業股份有限公司 散熱型封裝結構
TWI719885B (zh) * 2020-04-13 2021-02-21 建準電機工業股份有限公司 具有均溫散熱結構之晶片裝置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647802B (zh) * 2016-07-06 2019-01-11 矽品精密工業股份有限公司 散熱型封裝結構
TWI719885B (zh) * 2020-04-13 2021-02-21 建準電機工業股份有限公司 具有均溫散熱結構之晶片裝置
CN113539997A (zh) * 2020-04-13 2021-10-22 建准电机工业股份有限公司 具有均温散热结构的芯片装置

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