TW200725051A - Thermally enhanced tape carrier package - Google Patents

Thermally enhanced tape carrier package

Info

Publication number
TW200725051A
TW200725051A TW094147734A TW94147734A TW200725051A TW 200725051 A TW200725051 A TW 200725051A TW 094147734 A TW094147734 A TW 094147734A TW 94147734 A TW94147734 A TW 94147734A TW 200725051 A TW200725051 A TW 200725051A
Authority
TW
Taiwan
Prior art keywords
tape carrier
chip
heat
carrier package
thermally enhanced
Prior art date
Application number
TW094147734A
Other languages
Chinese (zh)
Other versions
TWI297539B (en
Inventor
Yeh-Shun Chen
Hou-Chang Kuo
Hsuan-Jui Chang
Hung-Pin Shih
Original Assignee
Int Semiconductor Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Semiconductor Tech Ltd filed Critical Int Semiconductor Tech Ltd
Priority to TW094147734A priority Critical patent/TWI297539B/en
Publication of TW200725051A publication Critical patent/TW200725051A/en
Application granted granted Critical
Publication of TWI297539B publication Critical patent/TWI297539B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A thermally enhanced tape carrier package mainly includes a tape carrier, a chip, a heat spreader and an encapsulant. A plurality of leads of the tape carrier extend to a bonding hole of the tape carrier, the chip is disposed at the bonding hole and has a plurality of bumps, the bumps are connected with the leads, the heat spreader is secured to the tape carrier, a heat-conductive block of the heat spreader is thermally coupled to an active surface of the chip, the encapsulant is formed in the hole. By directly thermal coupling to chip active surface utilizing the heat-conductive block, it increases the heat dissipation and working efficiency of the chip.
TW094147734A 2005-12-30 2005-12-30 Thermally enhanced tape carrier package TWI297539B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094147734A TWI297539B (en) 2005-12-30 2005-12-30 Thermally enhanced tape carrier package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094147734A TWI297539B (en) 2005-12-30 2005-12-30 Thermally enhanced tape carrier package

Publications (2)

Publication Number Publication Date
TW200725051A true TW200725051A (en) 2007-07-01
TWI297539B TWI297539B (en) 2008-06-01

Family

ID=45069134

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094147734A TWI297539B (en) 2005-12-30 2005-12-30 Thermally enhanced tape carrier package

Country Status (1)

Country Link
TW (1) TWI297539B (en)

Also Published As

Publication number Publication date
TWI297539B (en) 2008-06-01

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