Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lite On Semiconductor CorpfiledCriticalLite On Semiconductor Corp
Priority to TW093135125ApriorityCriticalpatent/TW200618039A/en
Publication of TW200618039ApublicationCriticalpatent/TW200618039A/en
This invention provides semiconductor vacuum metal sintering apparatus and its process. The semiconductor vacuum metal sintering apparatus comprises a quartz tube, vacuum air-pumping equipment, an oven chamber, and a gas injection tube. For the semiconductor vacuum metal sintering process, it conducts in a vacuum state to perform high temperature metal sintering. By means of this way, it decreases the metal oxidation phenomenon due to low oxygen content in the vacuum state. Further, it promotes the execution of high yield-rate process. After completing the sintering process, by means of a movable oven chamber, the oven chamber is capable of immediately leaving from the quartz tube. Eventually, after sintering, it reduces the cooling time.
TW093135125A2004-11-162004-11-16Semiconductor vacuum metal sintering apparatus and its process
TW200618039A
(en)
Method and apparatus for the recovery of the secondary metallurgy (LF) slag and its recycling in the steel production process by means of electric arc furnace