TW200617595A - Radiation-sensitive composition, microlens, method for forming the same, radiation-sensitive dry film, and liquid crystal display - Google Patents

Radiation-sensitive composition, microlens, method for forming the same, radiation-sensitive dry film, and liquid crystal display

Info

Publication number
TW200617595A
TW200617595A TW094135052A TW94135052A TW200617595A TW 200617595 A TW200617595 A TW 200617595A TW 094135052 A TW094135052 A TW 094135052A TW 94135052 A TW94135052 A TW 94135052A TW 200617595 A TW200617595 A TW 200617595A
Authority
TW
Taiwan
Prior art keywords
radiation
poly
sensitive
unsaturated compound
microlens
Prior art date
Application number
TW094135052A
Other languages
Chinese (zh)
Inventor
Masayoshi Ishikawa
Masaaki Hanamura
Shinji Shiraki
Toru Kajita
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200617595A publication Critical patent/TW200617595A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

To provide a radiation-sensitive resin composition excellent in storage stability and capable of forming microlens excellent in film thickness, resolution, pattern sharp, heat resistance, transparency, heat discoloration resistance and solvent resistance. The radiation-sensitive resin composition contains: (A) a alkali soluble copolymer polymerized from (a) 10~50wt/% of poly-unsaturated compound having acidic functional group, (b) 20~60wt.% of poly-unsaturated compound having alicyclic carbohydrate group without acidic functional group, and (c) 5~40wt.% of other poly-unsaturated compound, in the provided that (a)+(b)+(c)=100wt. %; (B); poly-unsaturated compound having the essential components comprising the compound with alicyclic carbohydrates group without acidic functional group and (C) a photopolymerization initiator.
TW094135052A 2004-10-07 2005-10-07 Radiation-sensitive composition, microlens, method for forming the same, radiation-sensitive dry film, and liquid crystal display TW200617595A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004294398 2004-10-07
JP2005137320 2005-05-10

Publications (1)

Publication Number Publication Date
TW200617595A true TW200617595A (en) 2006-06-01

Family

ID=37150115

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094135052A TW200617595A (en) 2004-10-07 2005-10-07 Radiation-sensitive composition, microlens, method for forming the same, radiation-sensitive dry film, and liquid crystal display

Country Status (3)

Country Link
KR (1) KR101213274B1 (en)
CN (1) CN1757670B (en)
TW (1) TW200617595A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8586284B2 (en) 2008-03-21 2013-11-19 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
TWI425313B (en) * 2007-03-30 2014-02-01 Hitachi Chemical Co Ltd A photosensitive resin composition, a photosensitive member, a method for forming a resist pattern, and a method for manufacturing a printed wiring board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102059430B1 (en) * 2011-08-09 2019-12-26 제이에스알 가부시끼가이샤 Microlens array, and stereoscopic image display device
KR102517695B1 (en) * 2017-01-20 2023-04-03 제이에스알 가부시끼가이샤 Photosensitive composition, cured film and method for producing same, display device, light emitting element, and light receiving element

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3575109B2 (en) * 1995-05-10 2004-10-13 Ｊｓｒ株式会社 Bump forming material
JP3832099B2 (en) * 1998-07-24 2006-10-11 Ｊｓｒ株式会社 Bump forming material and wiring forming material
JP3467488B2 (en) * 2001-03-31 2003-11-17 アダムス テクノロジー カンパニー リミテッド Resist composition for column spacer of liquid crystal display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425313B (en) * 2007-03-30 2014-02-01 Hitachi Chemical Co Ltd A photosensitive resin composition, a photosensitive member, a method for forming a resist pattern, and a method for manufacturing a printed wiring board
US8586284B2 (en) 2008-03-21 2013-11-19 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board

Also Published As

Publication number Publication date
CN1757670A (en) 2006-04-12
CN1757670B (en) 2011-07-06
KR101213274B1 (en) 2012-12-17
KR20060052059A (en) 2006-05-19

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