TW200617502A - Method for preparing of acryl copolymer resin for TFT-LCD interlayer dielectric - Google Patents

Method for preparing of acryl copolymer resin for TFT-LCD interlayer dielectric

Info

Publication number
TW200617502A
TW200617502A TW094113683A TW94113683A TW200617502A TW 200617502 A TW200617502 A TW 200617502A TW 094113683 A TW094113683 A TW 094113683A TW 94113683 A TW94113683 A TW 94113683A TW 200617502 A TW200617502 A TW 200617502A
Authority
TW
Taiwan
Prior art keywords
tft
copolymer resin
lcd
insulating film
organic insulating
Prior art date
Application number
TW094113683A
Other languages
Chinese (zh)
Other versions
TWI386714B (en
Inventor
Hyoc-Min Youn
Tae-Hoon Yeo
Dong-Min Kim
Byung-Uk Kim
Ki-Hyuk Koo
Joo-Pyo Yun
Ui-Cheol Jeong
Dong-Myung Kim
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200617502A publication Critical patent/TW200617502A/en
Application granted granted Critical
Publication of TWI386714B publication Critical patent/TWI386714B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/04—Polymerisation in solution
    • C08F2/06—Organic solvent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F216/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F216/12—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
    • C08F216/14—Monomers containing only one unsaturated aliphatic radical
    • C08F216/1416—Monomers containing oxygen in addition to the ether oxygen, e.g. allyl glycidyl ether
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Liquid Crystal (AREA)
  • Formation Of Insulating Films (AREA)
  • Materials For Photolithography (AREA)

Abstract

The invention relates to a process for producing acrylic copolymer resin used for an interlayer organic insulating film of TFT-LCD, more particularly to a process for producing acrylic copolymer resin used for an interlayer organic insulating film of TFT-LCD including a stage of refining a copolymer solution produced by polymerizing (i) unsaturated carboxylic acid, unsaturated carboxylic anhydride, or a mixture thereof, (ii) a styrenic monomer, (iii) an epoxy monomer, (iv) an isobornyl monomer, and (v) a dicyclopentadiene monomer in a solvent, acrylic copolymer resin used for an interlayer organic insulating film of TFT-LCD produced by the aforesaid process, and an interlayer organic insulating film of TFT-LCD utilizing the acrylic copolymer resin. The use of the acrylic copolymer resin produced according to this invention for a positive type of an interlayer organic insulating film of TFT-LCD can improve development effect and heat resistance, and has an effect of improving transmittance.
TW094113683A 2004-05-06 2005-04-28 An interlayer organic insulating film for tft-lcd, acrylic copolymer resin used for an interlayer organic insulating film for tft-lcd and the preparation method thereof TWI386714B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20040031832 2004-05-06

Publications (2)

Publication Number Publication Date
TW200617502A true TW200617502A (en) 2006-06-01
TWI386714B TWI386714B (en) 2013-02-21

Family

ID=35352465

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094113683A TWI386714B (en) 2004-05-06 2005-04-28 An interlayer organic insulating film for tft-lcd, acrylic copolymer resin used for an interlayer organic insulating film for tft-lcd and the preparation method thereof

Country Status (4)

Country Link
JP (1) JP5062504B2 (en)
KR (1) KR101215426B1 (en)
CN (1) CN100429248C (en)
TW (1) TWI386714B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101348757B1 (en) * 2006-02-03 2014-01-07 주식회사 동진쎄미켐 A resin composition for organic insulating layer, method for manufacturing thereof and array panel comprising the same
JP4998735B2 (en) * 2006-12-28 2012-08-15 Ｊｓｒ株式会社 Radiation sensitive composition, color filter, black matrix, and liquid crystal display device
KR101482561B1 (en) * 2008-04-25 2015-01-16 주식회사 동진쎄미켐 A producing method for acryl polymer
KR101317601B1 (en) * 2008-08-29 2013-10-11 주식회사 엘지화학 Acrylic based resin and photosensitive composition comprising the same
KR20100099048A (en) * 2009-03-02 2010-09-10 주식회사 동진쎄미켐 Photosensitive resin composition
BR112020008102B1 (en) * 2017-11-03 2022-09-20 Dow Global Technologies Llc PESTICIDE FORMULATION
KR101969151B1 (en) * 2017-11-17 2019-04-16 에스케이씨하이테크앤마케팅(주) Pigment dispersion and colored photosensitive resin composition comprising same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10316721A (en) * 1997-05-15 1998-12-02 Nippon Steel Chem Co Ltd Alkali-soluble resin and image-forming material using the same
JP2000327875A (en) * 1999-05-21 2000-11-28 Jsr Corp Radiation-sensitive resin composition for spacer united with color filter protection film or tft interlayer insulation film
JP2000347397A (en) * 1999-06-04 2000-12-15 Jsr Corp Radiation sensitive resin composition and its use for interlayer dielectric
JP3743490B2 (en) * 2000-02-16 2006-02-08 信越化学工業株式会社 Thermosetting photosensitive material
JP2001254002A (en) * 2000-03-10 2001-09-18 Nippon Kayaku Co Ltd Resin composition, its film and its cured product
JP3965868B2 (en) * 2000-06-12 2007-08-29 Ｊｓｒ株式会社 Interlayer insulation film and microlens
JP4524944B2 (en) * 2001-03-28 2010-08-18 Ｊｓｒ株式会社 Radiation sensitive resin composition, its use for forming interlayer insulating film and microlens, and interlayer insulating film and microlens
TWI266146B (en) * 2001-03-31 2006-11-11 Samyang Ems Co Ltd Resist composition for column spacer of liquid crystal display element
KR100784672B1 (en) * 2001-08-20 2007-12-12 주식회사 동진쎄미켐 Photosensitive resin composition
KR100809544B1 (en) * 2001-10-24 2008-03-04 주식회사 동진쎄미켐 Photosensitive resin composition comprising quinonediazide sulfate ester compound
JP2003307847A (en) * 2002-04-16 2003-10-31 Jsr Corp Composition for forming interlayer insulating film by ink jet system

Also Published As

Publication number Publication date
TWI386714B (en) 2013-02-21
KR20060045923A (en) 2006-05-17
KR101215426B1 (en) 2012-12-26
CN100429248C (en) 2008-10-29
JP5062504B2 (en) 2012-10-31
CN1693322A (en) 2005-11-09
JP2005320542A (en) 2005-11-17

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