TW200617339A - Heat pipe and wick structure - Google Patents

Heat pipe and wick structure

Info

Publication number
TW200617339A
TW200617339A TW093135591A TW93135591A TW200617339A TW 200617339 A TW200617339 A TW 200617339A TW 093135591 A TW093135591 A TW 093135591A TW 93135591 A TW93135591 A TW 93135591A TW 200617339 A TW200617339 A TW 200617339A
Authority
TW
Taiwan
Prior art keywords
main body
wick structure
heat pipe
working fluid
wick
Prior art date
Application number
TW093135591A
Other languages
Chinese (zh)
Inventor
Min-Hui Yu
Chi-Feng Lin
Chin-Ming Chen
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW093135591A priority Critical patent/TW200617339A/en
Priority to US11/247,181 priority patent/US20060108103A1/en
Priority to JP2005327007A priority patent/JP2006145196A/en
Publication of TW200617339A publication Critical patent/TW200617339A/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat pipe includes a main body, a wick structure, and a working fluid. The wick structure is formed on an inner surface of the main body and the working fluid is disposed within the main body. Wherein the wick structure using a coil-shaped wire attached on the inner surface forms a plurality of grooves so as to provide capillary attraction for the working fluid. The coil-shaped wire is shaped by winding a copper wire around a frame which has a predetermined shape related to the main body. The heat pipe of the prevent invention not only simplifies conventional manufacturing procedures for wick structures, but also has comprehensive advantages of conventional mesh and groove wick structures, such as high thermal conductivity, high permeability and high capillary attraction.
TW093135591A 2004-11-19 2004-11-19 Heat pipe and wick structure TW200617339A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW093135591A TW200617339A (en) 2004-11-19 2004-11-19 Heat pipe and wick structure
US11/247,181 US20060108103A1 (en) 2004-11-19 2005-10-12 Heat pipe and wick structure thereof
JP2005327007A JP2006145196A (en) 2004-11-19 2005-11-11 Heat pipe and its wick structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093135591A TW200617339A (en) 2004-11-19 2004-11-19 Heat pipe and wick structure

Publications (1)

Publication Number Publication Date
TW200617339A true TW200617339A (en) 2006-06-01

Family

ID=36459888

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093135591A TW200617339A (en) 2004-11-19 2004-11-19 Heat pipe and wick structure

Country Status (3)

Country Link
US (1) US20060108103A1 (en)
JP (1) JP2006145196A (en)
TW (1) TW200617339A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101024056B1 (en) * 2008-11-20 2011-03-22 주식회사 자온지 Manufacturing method of heat pipe type dissipating device
KR101060658B1 (en) * 2008-12-22 2011-08-31 주식회사 자온지 Heat pipe type radiator and its manufacturing method
KR101070842B1 (en) 2009-06-11 2011-10-06 주식회사 자온지 Heat-dissipating device and electronic apparatus having the same
KR101217224B1 (en) 2010-05-24 2012-12-31 아이스파이프 주식회사 Heat-dissipating device for electronic apparatus
KR101215598B1 (en) * 2011-08-08 2012-12-26 아이스파이프 주식회사 Led lighting apparatus
KR20150008974A (en) * 2013-06-28 2015-01-26 (주)우미앤씨 Fluid dynamic pressure heat dissipating device
FR3122547A1 (en) * 2021-04-29 2022-11-04 Valeo Siemens Eautomotive France Sas Cooling module including a cooling structure for heat dissipation

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7115318A (en) * 1971-11-06 1973-05-08
JPS5443218B2 (en) * 1972-08-23 1979-12-19
US4109709A (en) * 1973-09-12 1978-08-29 Suzuki Metal Industrial Co, Ltd. Heat pipes, process and apparatus for manufacturing same
JPS61149682A (en) * 1984-12-21 1986-07-08 住友電気工業株式会社 Composite pipe, manufacture thereof and heat pipe utilizing said manufacture
US5785088A (en) * 1997-05-08 1998-07-28 Wuh Choung Industrial Co., Ltd. Fiber pore structure incorporate with a v-shaped micro-groove for use with heat pipes
US6427765B1 (en) * 1998-09-29 2002-08-06 Korea Electronics Telecomm Heat-pipe having woven-wired wick and method for manufacturing the same
TW452642B (en) * 1999-09-07 2001-09-01 Furukawa Electric Co Ltd Wick, plate type heat pipe and container

Also Published As

Publication number Publication date
JP2006145196A (en) 2006-06-08
US20060108103A1 (en) 2006-05-25

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