KR101060658B1 - Heat pipe type radiator and its manufacturing method - Google Patents

Abstract

A heat pipe type heat radiating device and a method of manufacturing the same are disclosed. The manufacturing method of the heat pipe type heat dissipation apparatus includes the steps of: winding a pipe in a spiral structure in a first mold to form a spiral pipe loop; Radially arranging a spiral pipe loop inside the second mold having an inner circumference to form a cylindrical shape; Attaching a heat absorbing plate to at least one end of the cylindrically formed pipe loop.

Description

Heat pipe type heat dissipation device and its manufacturing method {HEAT PIPE TYPE DISSIPATING DEVICE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a heat pipe type heat dissipation device and a manufacturing method thereof, and more particularly, to a heat pipe type heat dissipation device having a spiral pipe loop structure and a heat pipe type heat dissipation device capable of easily forming a spiral pipe loop structure into a predetermined shape. It relates to a manufacturing method.

In general, electronic components such as light emitting diodes (LEDs), central processing units (CPUs) of computers, chipsets of video cards, and power transistors generate heat during operation. If the electronic component is overheated, an operation error may occur or be damaged. Therefore, a heat dissipation device is necessary to prevent overheating.

As an example of a heat dissipation device, a heat pipe type heat dissipation device has been disclosed. The heat pipe type heat dissipation device has an advantage of good heat dissipation efficiency because it has a heat transfer mechanism for transporting a large amount of heat in latent heat by the volume expansion and contraction of bubbles and working fluid injected into the pipe.

On the other hand, the heat pipe type heat dissipation device using a fluid dynamic pressure (FDP) as proposed in the unpublished Korean Patent Application No. 10-2008-0054549 by the applicant includes a spiral pipe loop having a plurality of tubular pipe windings It is composed. However, radially arranging the spiral pipe loops and forming them into a cylindrical shape is difficult and requires a lot of time and effort.

An object of the present invention is to provide a heat pipe type heat dissipation device capable of easily forming a cylindrical pipe by radially arranging a spiral pipe loop and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a method for manufacturing a heat pipe type heat dissipation apparatus, comprising: forming a spiral pipe loop by winding a pipe in a spiral structure in a first mold; Radially placing the spiral pipe loop in a second mold having an inner circumference to form a cylinder; And attaching a heat absorbing plate to at least one end of the pipe loop formed in the cylindrical shape.

The outer circumferential shape of the first mold is polygonal, and in the forming of the spiral pipe loop, the inner circumferential shape of the spiral pipe loop may be formed into a polygon by winding the pipe in a spiral structure in the first mold.

The first mold has a cylindrical structure, and the forming of the spiral pipe loop may include: forming a spiral pipe loop having a circular or elliptical inner circumferential shape by winding the pipe in a spiral structure in the first mold; Deforming the pipe loop into a polygon by a processing mold.

The processing frame includes a main body in which at least one guide slit is formed in a radial direction, a hollow is formed in an axial direction, and the spiral pipe loop is disposed on an outer circumference thereof; An operating knob installed axially in the hollow of the main body and having a tapered shape; The movable knob may include a movable member which is installed to be movable in the radial direction within the guide slit and deforms the spiral pipe loop disposed on the outer circumference of the main body into a polygon.

The second mold may include at least one of a support mold supporting the outer circumference of the radially arranged pipe loop and an interval mold for radially arranging the pipe loop at a predetermined interval.

The spacing may be disposed at one end of the radially arranged pipe loop.

The manufacturing method may further include supporting an inner circumference of the pipe loop disposed radially by the columnar third frame.

In addition, the manufacturing method may further include a step of arranging the plurality of pipe loops formed in a cylindrical shape via the heat absorbing plate in a stacked manner.

In addition, the manufacturing method comprises the steps of injecting a working fluid inside the pipe loop; The method may further include sealing the pipe loop, and the method may further include forming a closed loop by mutually communicating open ends of the pipe loop.

Heat pipe type heat dissipation device according to an embodiment of the present invention, is configured to be injected into the working fluid therein, the cylindrical first pipe loop disposed radially around the heating source; A working fluid is configured to be injected therein and includes at least one cylindrical second pipe loop radially stacked on an upper layer of the first pipe loop.

The heat dissipation device includes a first heat sink disposed at one end of the first pipe loop adjacent to the heat generating source; It may further include a second heat absorbing plate disposed between the laminated pipe loops.

In addition, the heat dissipation device may further include a heat dissipation fan installed inside the second pipe loop.

The heat pipe type heat dissipation device and its manufacturing method according to the present invention has the following effects.

First, the spiral pipe loops can be arranged radially and easily formed into a cylindrical shape, thereby saving manufacturing time and costs.

Second, it is possible to form a spiral pipe loop having a circular or oval inner circumferential shape at high speed by using a cylindrical frame, and to form a spiral pipe by forming the inner circumferential shape of the spiral pipe loop into a polygon using a processing frame. It can effectively cope with the phenomenon that the winding state of the loop is loosened.

Third, by arranging a plurality of cylindrical pipe loops in a lamination, a heat pipe type heat dissipation device having an appropriate size can be manufactured according to the heat dissipation space.

Hereinafter, a heat pipe type heat dissipation device and a method of manufacturing the same according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

First, a method of manufacturing a heat pipe type heat dissipation device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 8.

As shown in FIG. 1, the first mold 1 and the tubular pipe 11 having a predetermined shape are prepared, and the pipe 11 is wound around the prepared first mold 1 in a spiral structure. To form a spiral pipe loop 10 with a winding of the pipe. The spiral pipe loop 10 may be formed by winding the pipe 11 by rotating the rotation shaft 1a of the first mold 1. The spiral pipe loop 10 may also be formed by fixing the first die 1 and winding the pipe 11 to the first die 1 using a separate winding machine (not shown). In this manner, the spiral pipe loop 10 can be formed at high speed by winding the pipe 11 using the first mold 1.

The spiral pipe loop 10 thus formed has an inner circumferential shape corresponding to the outer shape of the first mold 1, and both ends thereof are open. The inner circumferential shape of the helical pipe loop 10 can be variously modified according to the outer shape of the first mold 1. That is, when the first mold 1 of the polyhedron structure is used, the inner circumferential shape of the spiral pipe loop 10 may form a polygon. For example, as shown in FIG. 1, when the first mold 1 having a rectangular parallelepiped shape is used, a spiral pipe loop 10 having a rectangular inner circumferential shape may be formed. In addition, the inner circumferential shape of the spiral pipe loop 10 may take various shapes such as 'b' type, 'c' type, and 'T' type.

Hereinafter, in the present specification, including the claims, the term 'polygon' is intended to be used to include all shapes other than 'circular' and 'oval' in addition to the dictionary meaning of the term.

The helical pipe loop 10 has a length approximately corresponding to the axial length of the first mold 1, and may have various lengths depending on the size of the desired heat pipe type heat sink.

Pipe loop 10 is made of a metal material such as copper, aluminum having high thermal conductivity so that the heat generated from the heat generating source (50 in FIG. 4) can be conducted at a high speed and cause a volume change of bubbles in the working fluid. It can be configured to include.

On the other hand, in forming the spiral pipe loop 10 into a polygon, the inner circumferential shape of the spiral pipe loop 10 may be primarily formed in a circular or elliptical shape, and finally formed into a polygon by a working mold. This will be described in detail with reference to FIGS. 2 to 4.

Referring to FIG. 2, a spiral having a plurality of pipe windings is prepared by preparing a first mold 3 and a pipe of a cylinder structure having a predetermined diameter D1, and winding the pipe in a spiral structure in the prepared first mold 3. The pipe loop 10 is formed. The spiral pipe loop 10 may be formed by winding the pipe by rotating the rotation shaft 3a of the first mold 3. The spiral pipe loop 10 may also be formed by fixing the first die 3 and winding the pipe into the first die 3 using a separate winding machine (not shown). Here, when the first mold 3 is removed, the spiral pipe loop 10 has a larger diameter than the diameter D1 of the first mold 3 while the coiled state is partially unwound (see D2 in FIG. 3). Will change.

As such, by forming the inner circumferential shape of the pipe loop 10 in a circular or elliptical shape using the first mold 1 of the cylinder structure, the spiral pipe loop 10 can be formed at high speed while preventing damage to the pipe 11. Can be.

3 and 4 are views illustrating a process of transforming a spiral pipe loop having a circular or elliptical inner circumferential shape into a polygon by a working mold.

Referring to FIG. 3, the processing mold 5 includes a main body 7 having at least one guide slit 7a formed therein, an operating knob 8 movably installed in the main body 7, and a spiral pipe loop 10. It includes a movable member (9) to deform. The main body 7 may be composed of a plurality of blocks arranged to form the guide slit 7a. In this case, each block is fixed by the base 6. In addition, the main body 7 is formed with a hollow 7b into which the operating knob 8 is slidably inserted.

The operating knob 8 is installed to be movable in the axial direction in the hollow 7b to operate the movable member 9. For this purpose, the operating knob 8 has a tapered shape. 3 shows a tapered structure in which the diameter increases from the inner end 8a to the outer end 8b of the operating knob 8 as an example.

The movable member 9 is installed in the guide slit 7a and is reciprocated in the radial direction in association with the movement of the operating knob 8. As shown in FIG. 3, the movable member 9 is not operated by the operating knob 8 until the operating knob 8 is inserted into the hollow 7b. Next, when the operating knob 8 is inserted into the hollow 7b, the operating knob 8 contacts the inside of the movable member 9 and presses the movable member 9 radially outward. Accordingly, the movable member 9 contacts the pipe loop 10 in the guide slit 7a, thereby deforming the pipe loop 10 to the structure as shown in FIG.

As described above, the shape of the pipe loop 10 is changed by using the processing frame 5 as compared with the case of forming the pipe loop 10 by using a mold having a polygonal structure as shown in FIG. 1. The phenomenon of unwinding of the wound state of (10) can be effectively coped with.

Subsequently, the first mold 1 or the processing mold 5 is removed, and the spiral pipe loop 10 is radially disposed inside the second mold 20 having an inner circumference as shown in FIG. 10) is molded into a cylindrical shape. The inner circumferential shape of the second mold 20 is preferably circular, but is not necessarily limited thereto, and may be, for example, elliptical or polygonal.

The second mold 20 may include a support mold 21 and a spacing mold 25. Although one support frame 21 and one spacing frame 25 are illustrated in FIG. 5, this is merely an example, and at least one of the support frame 21 and the spacing frame 25 may be provided in plural. In addition, the support frame 21 and the spacing frame 25 may be provided as a separate type, as shown in Figure 5, it may be provided in one piece. In addition, any one of the support mold 21 and the spacing mold 25 may be omitted depending on the design needs.

The support frame 21 has an annular shape or a cylinder shape, and supports the outer circumference of the pipe loop 10 so that the pipe loop 10 has a radial shape.

The spacing 25 has an annular or cylindrical shape and allows the pipe loops 10 to be radially arranged at predetermined intervals, for example at equal intervals. To this end, a plurality of coupling grooves 25a are formed at predetermined intervals on the inner circumference of the spacing frame 25. The spacing 25 is preferably disposed at one end of the pipe loop 10 disposed radially as shown in FIG. 5, but may be disposed on the outer circumference of the pipe loop 10. Accordingly, a plurality of pipe windings constituting the pipe loop 10 may be inserted into the coupling groove 25a of the spacing frame 25 to maintain a predetermined interval.

As such, when the pipe loop 10 is radially disposed by the second mold 20, the inner circumference of the pipe loop 10 may be supported by the cylindrical third mold 30 as shown in FIG. 5. Can be. In this way, the cylindrical cylindrical pipe loop 10 can be formed by supporting the outer and inner circumferences of the spiral pipe loop 10 by the second mold 20 and the third mold 30.

Subsequently, the heat absorbing plate 40 is attached to at least one end of the pipe loop 10 formed in a cylindrical shape as shown in FIG. 6. Preferably, the heat absorbing plate 40 is attached to the end side of the pipe loop 10 in which the spacing frame 25 is disposed. By attaching the heat absorbing plate 40 to the pipe loop 10 in this manner, the pipe loop 10 can maintain the cylinder shape without the help of the second mold 20 and the third mold 30.

Then, the second mold 20 and the third mold 30 are removed to obtain a cylindrical pipe loop having a single layer structure as shown in FIG.

Next, the working fluid 13 is injected into the pipe 11 constituting the pipe loop 10 so that the bubbles 17 are mixed at an appropriate ratio, and the pipe loop 10 is sealed from the outside to form a heat pipe. Complete the heat shield. Pipe loop 10 may be sealed using a connecting pipe 19 and an adhesive member (not shown). That is, the two open ends of the pipe loop 10 communicate with each other to form one closed loop and seal the internal space. Here, the pipe loop 10 may be sealed by expanding the opened one end portion, and inserting the other end portion to the enlarged one end portion and then joining the same by an adhesive member. The pipe loop 10 may be configured as an open loop by individually sealing both ends.

When installing the heat dissipation device, as shown in FIG. 7, the heat absorbing plate 40 may directly contact the heat generating source 50. Examples of the heating source 50 include an electronic component such as a CPU, a chipset of a video card, a power transistor, and an LED.

When the heat absorbing plate 40 and the heat generating source 50 are provided on the lower surface of the cylindrical pipe loop 10 in this manner, the lower surface of the pipe loop 10 becomes the heat absorbing portion, and the remaining portion becomes the heat dissipating portion. Therefore, the heat generated from the heat generating source 50 is absorbed into the heat absorbing portion through the heat absorbing plate 40 and is discharged to the outside through the heat radiating portion. The heat pipe type heat dissipation device configured as described above has a heat transfer mechanism for transporting a large amount of heat in a latent heat form by volume expansion and contraction of the working fluid 13 and the bubble 17. Will be omitted.

As shown in FIG. 8, the plurality of cylindrical pipe loops 10 and 60 manufactured by the manufacturing process according to FIGS. 1 to 7 may be stacked on each other. As an example, two pipe loops 10 and 60 are stacked in FIG. 8, but the number of pipe loops stacked is not limited thereto.

The lower pipe loop 60 is preferably smaller in size than the upper pipe loop 10 so as to be easily coupled to a relatively small heat generating source 50 and has a shape in which the outer circumference becomes smaller in size. This is exemplary and various variations are possible.

Both pipe loops 10 and 60 are connected to each other by a heat absorbing plate 40. In the heat absorbing plate 40, openings (not shown) may be formed in the center of the heat absorbing plate 40 so that the central areas of the pipes 10 and 60 communicate with each other. The heat absorbing plate 70 attached to the lower pipe loop 60 absorbs heat directly from the heat generating source 50, while the heat absorbing plate 40 disposed between both pipe loops 10 and 60 is the lower pipe loop. Absorbs heat indirectly through 60.

By arranging the cylindrical pipe loops in this way, the size of the heat dissipation device can be expanded according to the size or shape of the heat generating source and the heat dissipation space, thereby improving heat dissipation efficiency.

9 is a perspective view showing a heat pipe type heat dissipation device according to an embodiment of the present invention. This heat dissipation device may be manufactured by, for example, the heat pipe type heat dissipation device manufacturing method described with reference to FIGS. 1 to 8. Therefore, unless otherwise stated, the above description may be applied to the heat dissipation device according to the present embodiment.

Referring to FIG. 9, the heat dissipation device is disposed radially on a heat generating source 100 and formed in a cylindrical shape, and a spiral first pipe loop 110 and radially stacked on a first layer of the first pipe loop 110. And a helical second pipe loop 120 formed in the shape. Although two pipe loops 110 and 120 are stacked in FIG. 9, the number of pipe loops stacked is not limited thereto.

A working fluid is injected into the first and second pipe loops 110 and 120, and both ends of each of the first and second pipe loops 110 and 120 are sealed after the working fluid is injected.

At the lower end of the first pipe loop 110 adjacent to the heat generating source 100, a first heat absorbing plate 130 is disposed in contact with the heat generating source 100 to receive heat directly from the heat generating source 100. Between the first and second pipe loops 110 and 120, a second heat absorbing plate 140 is disposed to connect both pipe loops 110 and 120 and receive heat indirectly from the first pipe loop 110. have. The third heat absorbing plate 170 is attached to the upper end of the second pipe loop 120. The third heat absorbing plate 170 may fix the shape of the second pipe loop 120 and may be used when another pipe loop is stacked on the top, but may be omitted.

As shown in FIG. 10, the heat dissipation device may further include a heat dissipation fan 150 installed inside the second pipe loop 120. The heat dissipation fan 150 may be driven by a motor (not shown) to promote heat dissipation.

The above embodiments are merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the invention described in the claims below.

1 to 8 are views for explaining a method for manufacturing a heat pipe type heat dissipation device according to an embodiment of the present invention, respectively.

Figure 9 is an exploded perspective view showing a heat pipe type heat dissipation device according to an embodiment of the present invention.

Figure 10 is an exploded perspective view showing a heat pipe type heat dissipation device according to another embodiment of the present invention.

* List of Reference Numbers in Drawings

1, 3: first mold 5: processing mold

7: Body 8: Operation knob

9: movable member 10: pipe loop

15: working fluid 17: bubble

19: connector 20: frame 2

21: support frame 25: spacing frame

30: third mold 40: heat absorbing plate

50, 100: heating source 60, 110, 120: pipe loop

70, 130, 140: heat absorbing plate 150: heat dissipation fan

Claims (13)

In the manufacturing method of the heat pipe type heat radiation device, Winding a pipe in a first frame into a spiral structure to form a spiral pipe loop; Radially placing the spiral pipe loop in a second mold having an inner circumference to form a cylinder; Attaching a heat absorbing plate to at least one end of the cylindrically formed pipe loop, The first mold has a cylinder structure, The spiral pipe loop forming step may include forming a spiral pipe loop having a circular or elliptical inner circumferential shape by winding a pipe in a spiral structure in the first mold; And a step of transforming the inner circumferential shape of the spiral pipe loop into a polygon by a working mold. delete delete The method of claim 1, The processing frame, A main body in which at least one guide slit is formed in a radial direction, a hollow is formed in an axial direction, and the spiral pipe loop is disposed on an outer circumference; An operating knob installed axially in the hollow of the main body and having a tapered shape; Heat pipe type heat dissipation, characterized in that it comprises a movable member which is installed to be movable in the radial direction in the guide slit in accordance with the movement of the operating knob, the deformation of the spiral pipe loop disposed on the outer periphery of the body into a polygon Method of manufacturing the device. The method of claim 1, The second mold includes at least one of a support mold supporting the outer circumference of the radially arranged pipe loop and at least one of a spacing mold radially disposing the pipe loop at a predetermined interval. Manufacturing method. The method of claim 5, The spacing frame is a method of manufacturing a heat pipe type heat dissipation device, characterized in that disposed on one end of the radially arranged pipe loop. The method of claim 6, And supporting the inner circumference of the pipe loop disposed radially by the column-shaped third mold. The method according to any one of claims 1 and 4 to 7, The forming of the spiral pipe loop and the radial arrangement of the spiral pipe loop may include forming a plurality of pipe loops formed in the cylindrical shape, And arranging the plurality of cylindrical pipe loops in a stacked manner via the heat absorbing plate. The method according to any one of claims 1 and 4 to 7, Injecting a working fluid into the pipe loop; The method of manufacturing a heat pipe type heat sink comprising the step of sealing the pipe loop. 10. The method of claim 9, And forming one closed loop by communicating the opened ends of the pipe loops with each other. delete delete delete

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