KR100934440B1 - Radiant heat device - Google Patents

Radiant heat device Download PDF

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Publication number
KR100934440B1
KR100934440B1 KR1020090053957A KR20090053957A KR100934440B1 KR 100934440 B1 KR100934440 B1 KR 100934440B1 KR 1020090053957 A KR1020090053957 A KR 1020090053957A KR 20090053957 A KR20090053957 A KR 20090053957A KR 100934440 B1 KR100934440 B1 KR 100934440B1
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South Korea
Prior art keywords
heat dissipation
tube
band
heat
disposed
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KR1020090053957A
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Korean (ko)
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최연주
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최연주
최창민
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PURPOSE: A radiator is provided to improve radiation efficiency by arranging a plurality of radiation tubes radially around a base cylinder. CONSTITUTION: A radiator(50) includes a base cylinder(60), a radiant tube(70), and a combination pin(80). The radiant tube is formed by aluminum extrusion. The radiant tube has a hollow and is spirally arranged around the base cylinder by the combination pin. The combination has an L shape and is made of aluminum material or piano steel wire. A horizontal unit(81) of a combination pin is fixed in the base cylinder through a hole(71) of the radiant tube. A vertical unit(82) of the combination pin is compressed in the outermost surface of the radiant tube.

Description

방열장치{RADIANT HEAT DEVICE}Heat dissipation device {RADIANT HEAT DEVICE}

본 발명은 LED 램프 등의 조명장치에 장착되는 방열장치에 관한 것으로서, 보다 상세하게는 방열튜브 또는 코루게이트형 방열밴드가 와선형으로 배열되거나 원형으로 여러 겹이 배열된 방열장치에 관한 것이다.The present invention relates to a heat dissipation device mounted on a lighting device such as an LED lamp, and more particularly, to a heat dissipation device in which a heat dissipation tube or a corrugated heat dissipation band is arranged in a spiral line or a plurality of layers in a circle.

대한민국 특허 제10-0879716호(2009년 1월 14일, 등록)에 "선형방열부재를 구비한 방열장치 및 이를 구비한 무팬 엘이디 조명장치"가 소개되어 있다.Korean Patent No. 10-0879716 (registered on Jan. 14, 2009) introduces a heat dissipation device having a linear heat dissipation member and a fanless LED lighting device having the same.

상기 선형방열부재를 구비한 방열장치는 피씨비에 접하는 방열브라켓과 선재(線材)가 나선형태로 연속적으로 감겨 코일형태로 형성된 선형(線型)방열부재를 포함하며, 상기 방열브라켓이 선형방열부재 일부와 면접합되기 위하여 선형방열부재 일부에 대응하는 삽지홈이 형성되고, 상기 선형방열부재가 자연대류 통풍에 의하여 방열이 이루어지도록 방열브라켓의 흡열부 외곽으로 돌출되게 설치된다.The heat dissipation device including the linear heat dissipation member includes a heat dissipation bracket and a wire dissipation member in contact with a PC, and a linear heat dissipation member formed in a coil shape in a spiral shape, the heat dissipation bracket being part of the linear heat dissipation member. An insertion groove corresponding to a portion of the linear heat dissipation member is formed to be face-bonded, and the linear heat dissipation member is installed to protrude outside the heat absorbing portion of the heat dissipation bracket so that heat dissipation is achieved by natural convection ventilation.

그러나, 상기와 같은 종래의 선형방열부재보다 더 표면적을 넓혀 방열 성능을 높일 수 있을 것이다.However, it will be possible to increase the heat dissipation performance by widening the surface area more than the conventional linear heat dissipation member as described above.

따라서, 본 발명의 목적은 베이스 원통의 둘레에 배치되는 와선형의 방열튜브가 다수개의 결합핀에 의해 베이스 원통에 장착됨으로써, 표면적이 넓고 조립이 간편한 방열장치를 제공하는 것이다.Accordingly, an object of the present invention is to provide a heat dissipation device having a large surface area and easy assembly by mounting a spiral heat dissipation tube disposed around the base cylinder to the base cylinder by a plurality of coupling pins.

본 발명의 다른 목적은 베이스 원통의 둘레에 여러개의 방열튜브 그룹이 방사상으로 배치되어, 표면적이 넓고 조립이 간편한 방열장치를 제공하는 것이다.Another object of the present invention is to provide a heat dissipation device having a large surface area and easy assembly by arranging a plurality of heat dissipation tube groups radially around the base cylinder.

본 발명의 또 다른 목적은 코루게이트형 방열밴드(corrugated radiant-heat band)가 와선형으로 감긴 상태에서 결합핀에 의해 고정됨으로써, 표면적이 넓고 조립이 간편한 방열장치를 제공하는 것이다.Still another object of the present invention is to provide a heat dissipation device having a large surface area and easy assembly by being fixed by a coupling pin while a corrugated radiant-heat band is wound in a spiral shape.

본 발명의 또 다른 목적은 환형의 코루게이트형 방열밴드가 여러 겹으로 배열된 상태에서 결합핀에 의해 고정됨으로써, 표면적이 넓고 조립이 간편한 방열장치를 제공하는 것이다.Still another object of the present invention is to provide a heat dissipation device having a large surface area and easy assembly by being fixed by a coupling pin in an annular corrugated heat dissipation band arranged in a plurality of layers.

상기와 같은 목적을 달성하기 위한 본 발명에 따른 방열장치의 일례는 베이스 원통 둘레에 와선형으로 배열된 방열튜브가 배치되고, "ㄴ" 형상으로 형성된 결합핀의 수평부가 방열튜브에 형성된 구멍을 통해 베이스 원통에 끼워져 고정되고, 상기 결합핀의 수직부가 방열튜브의 가장 바깥쪽에 배치되는 최외측면에 압착됨으로써, 상기 결합핀에 의해 와선형의 방열튜브가 베이스 원통 둘레에 장착되는 것을 특징으로 한다.One example of the heat dissipation device according to the present invention for achieving the above object is a heat dissipation tube arranged in a spiral line around the base cylinder, the horizontal portion of the coupling pin formed in the "b" shape through the hole formed in the heat dissipation tube It is inserted into the base cylinder and fixed, and the vertical portion of the coupling pin is pressed to the outermost surface disposed on the outermost side of the heat dissipation tube, it characterized in that the helical heat dissipation tube is mounted around the base cylinder by the coupling pin.

본 발명에 따른 방열장치의 다른 예는 베이스 원통에 "U"형상의 결합핀이 끼워져 고정되고, 결합핀에 다수개의 방열튜브가 끼워짐으로써, 결합핀에 끼워진 다수개의 방열튜브가 방열튜브그룹을 이루고, 베이스 원통 둘레에 다수개의 방열튜브그룹이 배치되는 것을 특징으로 한다.Another example of the heat dissipation device according to the present invention is that the "U" shaped coupling pin is fixed to the base cylinder, and a plurality of heat dissipation tubes are fitted to the coupling pins, so that the plurality of heat dissipation tubes fitted to the coupling fins is a heat dissipation tube group. And a plurality of heat dissipation tube groups are arranged around the base cylinder.

상기 방열튜브그룹은 베이스 원통에 가장 가까운 제 1 방열튜브의 폭보다 제 1 방열튜브 다음에 배치되는 제 2 방열튜브의 폭이 더 크고, 제 2 방열튜브의 폭보다 제 2 방열튜브 다음에 배치되는 제 3 방열튜브의 폭이 더 큰 방식으로 다수개의 방열튜브가 배열되어 가장 외측에 배치되는 방열튜브의 폭이 가장 큰 것을 특징으로 한다.The heat dissipation tube group has a larger width of the second heat dissipation tube disposed after the first heat dissipation tube than the width of the first heat dissipation tube closest to the base cylinder, and is disposed after the second heat dissipation tube than the width of the second heat dissipation tube. A plurality of heat dissipation tubes are arranged in such a manner that the width of the third heat dissipation tube is greater, and the width of the heat dissipation tube disposed on the outermost side is the largest.

위 예들에서, 상기 방열튜브는 결합핀에 끼워진 스페이서에 의해 겹간격이 유지되고, 중공부에 격막이 형성된 튜브 형태인 것을 특징으로 한다.In the above examples, the heat dissipation tube is maintained in the overlap interval by a spacer fitted to the coupling pin, characterized in that the tube form the diaphragm formed in the hollow portion.

본 발명에 따른 방열장치의 또 다른 예는 알루미늄 박판을 지그재그로 절곡한 방열밴드가 와선형으로 감겨, 방열밴드가 다수개의 권선부로 구성되고, 권선부와 권선부 사이에 방열공간이 형성되고, 최외곽 권선부의 단부가 외부로 노출된 일면에 접합되고, 다수개의 결합핀이 방열밴드에 방사상으로 끼워져, 방열밴드의 권선부들이 결합핀에 의해 고정되는 것을 특징으로 한다.Another example of the heat dissipation device according to the present invention is a heat dissipation band bent in a zigzag aluminum thin plate is wound in a spiral, the heat dissipation band is composed of a plurality of windings, a heat dissipation space is formed between the windings and the windings, The end of the outer winding is bonded to one surface exposed to the outside, a plurality of coupling pins are radially fitted to the heat dissipation band, characterized in that the windings of the heat dissipation band is fixed by the coupling pin.

본 발명에 따른 방열장치의 또 다른 예는 알루미늄 박판을 지그재그로 절곡한 방열밴드가 원형으로 형성되어, 다수개의 방열밴드가 여러 겹으로 배열되고, 방열밴드와 방열밴드 사이에 방열공간이 형성되고, 결합핀이 가장 바깥쪽에 배치된 방열밴드에서 중간에 배치된 방열밴드들을 통해 가장 안쪽에 배치된 방열밴드에 끼워짐으로써, 원형의 방열밴드들이 결합핀에 의해 고정되는 것을 특징으로 한다.Another example of the heat dissipation device according to the present invention is a heat dissipation band bent in a zigzag aluminum sheet is formed in a circular shape, a plurality of heat dissipation bands are arranged in multiple layers, a heat dissipation space is formed between the heat dissipation band and the heat dissipation band, The coupling pin is fitted to the innermost heat dissipation band through the heat dissipation band disposed in the middle from the heat dissipation band disposed in the outermost, characterized in that the circular heat dissipation band is fixed by the coupling pins.

상기 방열밴드는 상기 방열밴드는 결합핀에 끼워진 스페이서에 의해 방열공간의 간격이 유지되고, 슬리팅(slitting) 작업에 의해 가로방향으로 많은 절개부가 형성되고, 접는선를 중심으로 지그재그 방향으로 절곡되는 것을 특징으로 한다.The heat dissipation band is a heat dissipation band is maintained by the spacer fitted to the coupling pins, the spacing of the heat dissipation space is maintained, by the slitting (slitting) a large number of cutouts are formed in the transverse direction, bent in a zigzag direction around the fold line It features.

이것에 의해, 본 발명에 따른 방열장치는 기존의 판 형태의 방열핀 보다 방열튜브의 표면적이 상대적으로 많이 넓어 방열효율이 높고, 방열튜브 및 코루게이트 타입의 방열밴드를 와선형으로 배열하거나 원형 타입을 여러 겹으로 배열함으로써, 방열튜브의 표면적이 더 증가되고, 조립이 간편하며, LED 램프 등에 적용할 수 있는 효과가 있다.As a result, the heat dissipation device according to the present invention has a higher heat dissipation efficiency because the surface area of the heat dissipation tube is relatively wider than that of the conventional plate-type heat dissipation fins, and the heat dissipation band of the heat dissipation tube and the corrugated type is arranged in a spiral shape or a circular type. By arranging in multiple layers, the surface area of the heat dissipation tube is further increased, the assembly is easy, there is an effect that can be applied to LED lamps and the like.

이하, 본 발명의 바람직한 실시예를 도면을 참조하여 상세하게 설명하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

도 1 및 도 2를 참조하면, 본 발명의 제 1 실시예에 따른 방열장치(50)는 베이스 원통(60) 둘레에 와선형으로 배열된 방열튜브(70)가 배치되고, "ㄴ" 형상으로 형성된 결합핀(80)의 수평부(81)가 방열튜브(70)에 형성된 구멍(71)을 통해 베이스 원통(60)에 끼워져 고정되고, 상기 결합핀(80)의 수직부(82)가 방열튜브(70)의 가 장 바깥쪽에 배치되는 최외측면(70a)에 압착됨으로써, 상기 결합핀(80)에 의해 와선형의 방열튜브(70)가 베이스 원통(60) 둘레에 장착된다.1 and 2, the heat dissipation device 50 according to the first embodiment of the present invention has a heat dissipation tube 70 arranged in a spiral shape around the base cylinder 60, and has a “b” shape. The horizontal portion 81 of the coupling pin 80 formed is inserted into and fixed to the base cylinder 60 through the hole 71 formed in the heat dissipation tube 70, and the vertical portion 82 of the coupling pin 80 is radiated. By pressing the outermost surface 70a disposed at the outermost side of the tube 70, the helical heat dissipation tube 70 is mounted around the base cylinder 60 by the coupling pin 80.

상기 방열튜브(70)는 알루미늄 압출성형방법으로 성형되며, 도 3a에 도시된 바와같이, 중공부(72)가 형성된 단순한 튜브 형태이거나, 도 3b에 도시된 바와같이, 중공부(72)에 격막(73)이 형성된 튜브 형태일 수 있으며, 공기가 소통될 수 있도록 양 단부가 개방되어 있다. The heat dissipation tube 70 is formed by an aluminum extrusion method, and as shown in FIG. 3A, is a simple tube form having a hollow portion 72 formed therein, or as shown in FIG. 3B, a diaphragm in the hollow portion 72. 73 may be in the form of a tube formed, and both ends are open to allow air to communicate.

상기 결합핀(80)은 알루미늄 소재 또는 피아노 강선 소재로 이루어지며, 도 2에 도시된 바와같이, 베이스 원통(60)에 끼워진 수평부(81)의 단부가 용접에 의해 서로 연결되고, 수평부(81)에 끼워진 스페이서(85)에 의해 와선형으로 배열된 방열튜브(70)의 겹간격(S1)이 유지된다. The coupling pin 80 is made of an aluminum material or a piano steel wire material, as shown in Figure 2, the ends of the horizontal portion 81 fitted to the base cylinder 60 is connected to each other by welding, the horizontal portion ( The lap spacing S1 of the heat dissipation tube 70 arranged in a helical shape is maintained by the spacer 85 fitted in the 81.

상기와 같이 구성된 본 발명의 제 1 실시예에 따른 방열장치(50)는 방열튜브(70) 자체의 표면적이 일반적인 판 형태의 방열핀의 표면적 보다 넓어 방열성능이 우수하고, 방열튜브(70)가 와선형으로 배치되어, 방열튜브의 길이가 증가함으로써, 방열성능을 좌우하는 표면적이 획기적으로 증가하였으며, 격합핀(80)에 끼워진 스페이서(85)에 의해 와선형으로 배열된 방열튜브(70)의 겹간격(S)이 유지되고, 결합핀(80)에 의해 방열튜브(70)를 베이스 원통(60)에 간편하게 조립할 수 있어, 조립작업이 매우 간편하다.The heat dissipation device 50 according to the first embodiment of the present invention configured as described above has a good heat dissipation performance because the surface area of the heat dissipation tube 70 itself is wider than that of a general heat dissipation fin, and the heat dissipation tube 70 has a spiral line. As the length of the heat dissipation tube is increased, the surface area which influences the heat dissipation performance is significantly increased, and the overlap of the heat dissipation tube 70 arranged in a spiral shape by the spacer 85 fitted to the engagement pin 80. The spacing S is maintained, and the heat dissipation tube 70 can be easily assembled to the base cylinder 60 by the coupling pins 80, so that the assembly work is very simple.

상기와 같이 구성된 본 발명의 제 1 실시예에 따른 방열장치(50)는 도 4에 도시된 바와같이 LED 전등에 장착되어 방열기능을 수행할 수 있다. 즉, LED 기판(5)이 장착된 반사갓(10)의 상부면에 열전달판(15)이 부착되고, 상기 열전달 판(15)에 본 발명에 따른 방열장치(50)가 배치되고, 통풍구(21)가 형성된 케이스(20)에 방열장치(50) 및 LED 기판(5)이 장착된 반사갓(10)이 수용되고, 상기 케이스(20)의 클램프(25)가 렌즈(30)를 고정하는 커버(35)에 체결된다.The heat dissipation device 50 according to the first embodiment of the present invention configured as described above may be mounted to an LED lamp as shown in FIG. 4 to perform a heat dissipation function. That is, the heat transfer plate 15 is attached to the upper surface of the reflector 10 on which the LED substrate 5 is mounted, the heat dissipation device 50 according to the present invention is disposed on the heat transfer plate 15, and the ventilation holes 21 ) Is a case 20 formed with a heat sink 50 and the reflector 10 mounted with the LED substrate 5 is accommodated, the cover 25 for clamping the lens 30 of the case (20) ( 35).

이와같이, 본 발명의 제 1 실시예에 따른 방열장치(50)는 LED 전등에 장착되어 LED 모듈(5)에서 발생하는 열을 외부로 방출하는 기능을 한다.As such, the heat dissipation device 50 according to the first embodiment of the present invention is mounted on the LED lamp and functions to discharge heat generated from the LED module 5 to the outside.

도 5 및 도 6을 참조하면, 본 발명의 제 2 실시예에 따른 방열장치(100)는 베이스 원통(110)에 "U" 형상의 결합핀(120)이 끼워져 고정되고, 결합핀(120)에 다수개의 방열튜브(T1, T2, T3, T4, T5)가 끼워짐으로써, 결합핀(120)에 끼워진 다수개의 방열튜브(T1, T2, T3, T4, T5)가 방열튜브그룹(G)을 이루고, 베이스 원통(110) 둘레에 다수개의 방열튜브그룹(G ; G1, G2, G3, G4, G5, G6)이 배치된다.5 and 6, in the heat dissipation device 100 according to the second embodiment of the present invention, a coupling pin 120 having a “U” shape is fitted into and fixed to the base cylinder 110, and the coupling pin 120 is fixed. A plurality of heat dissipation tubes (T1, T2, T3, T4, T5) are inserted into the plurality of heat dissipation tubes (T1, T2, T3, T4, T5) fitted to the coupling pins (120). A plurality of heat dissipation tube groups (G; G1, G2, G3, G4, G5, G6) are disposed around the base cylinder (110).

상기 방열튜브(T1, T2, T3, T4, T5)는 중공부(141)에 격막(142)이 형성된 튜브 형태이고, 중공부(141)가 상하로 배치되고, 공기가 소통될 수 있도록 상단부와 하단부가 개방되어 있으며, 결합핀(120)에 끼워진 스페이서(125)에 의해 방열튜브(T1, T2, T3, T4, T5)의 겹간격(S2)이 유지된다.The heat dissipation tube (T1, T2, T3, T4, T5) is in the form of a tube formed with a diaphragm 142 in the hollow portion 141, the hollow portion 141 is disposed up and down, and the upper end so that air can communicate The lower end part is opened, and the lap spacing S2 of the heat dissipation tubes T1, T2, T3, T4 and T5 is maintained by the spacer 125 fitted to the coupling pin 120.

상기 방열튜브그룹(G)은 베이스 원통(110)에 가장 가까운 제 1 방열튜브(T1)의 폭(W1)보다 제 1 방열튜브 다음에 배치되는 제 2 방열튜브(T2)의 폭(W2)이 더 크고, 제 2 방열튜브(T2)의 폭(W2)보다 제 2 방열튜브 다음에 배치되는 제 3 방열튜브(T3)의 폭(W3)이 더 큰 방식으로 다수개의 방열튜브가 배열되어 가장 외측에 배치되는 방열튜브(T5)의 폭(W5)이 가장 크다.The heat dissipation tube group G has a width W2 of the second heat dissipation tube T2 disposed after the first heat dissipation tube rather than the width W1 of the first heat dissipation tube T1 closest to the base cylinder 110. The plurality of heat dissipation tubes are arranged in such a manner that the width W3 of the third heat dissipation tube T3 disposed next to the second heat dissipation tube is larger than the width W2 of the second heat dissipation tube T2, so that the plurality of heat dissipation tubes are arranged at the outermost side. The width W5 of the heat dissipation tube T5 disposed at the largest.

이것에 의해, 어느 한 방열튜브그룹의 방열튜브는 측면부가 이웃하는 방열튜브그룹의 방열튜브의 측면부와 근접하게 배치된다.As a result, the heat dissipation tube of one of the heat dissipation tube groups is disposed in close proximity to the side part of the heat dissipation tube of the heat dissipation tube group adjacent to the side.

상기 결합핀(120)은 일단이 베이스 원통(110)에 끼워져 고정되고, 타단의 수직부(121)가 가장 바깥쪽에 배치되는 방열튜브(T5)의 외측면에 압착된다.One end of the coupling pin 120 is fitted into the base cylinder 110 and fixed to the outer surface of the heat dissipation tube T5 in which the vertical portion 121 of the other end is disposed at the outermost side.

상기와 같이 구성된 본 발명의 제 2 실시예에 따른 방열장치(100)는 방열튜브(T1, T2, T3, T4, T5)의 중공부(141) 하단에서 가열된 공기가 중공부(141)를 따라 위로 올라감으로써, 대류에 의해 열을 외부로 방출할 수 있어, 열전도에 의한 방열효과와 공기대류에 의한 방열효과를 얻을 수 있어, 방열효율이 높고, 방열튜브가 끼워진 결합핀(120)을 베이스 원통(110)에 끼워 고정함으로써, 조립이 간편한 장점이 있다.In the heat dissipation device 100 according to the second embodiment of the present invention configured as described above, the air heated at the bottom of the hollow part 141 of the heat dissipation tube (T1, T2, T3, T4, T5) has the hollow part 141. By rising up along, the heat can be released to the outside by convection, so that the heat dissipation effect due to heat conduction and the heat dissipation effect due to air convection can be obtained, and the heat dissipation efficiency is high. By fixing to the cylinder 110, there is an advantage of easy assembly.

상기와 같이 구성된 본 발명의 제 2 실시예에 따른 방열장치는 도 4를 참조하여 설명한 본 발명의 제 1 실시예에 따른 방열장치와 같이 LED 전등에 적용할 수 있다.The heat dissipation device according to the second embodiment of the present invention configured as described above may be applied to an LED lamp like the heat dissipation device according to the first embodiment of the present invention described with reference to FIG. 4.

도 7 및 도 8을 참조하면, 본 발명의 제 3 실시예에 따른 방열장치(200)는 알루미늄 박판을 지그재그로 절곡한 방열밴드(210)가 와선형으로 감겨, 방열밴드가 다수개의 권선부(211, 212, 213, 214, 215)로 구성되고, 권선부와 권선부 사이에 방열공간(216, 217, 218, 219)이 형성되고, 최외곽 권선부(215)의 단부(215a)가 외부로 노출된 일면에 접합되고, 다수개의 결합핀(220)이 방열밴드(210)에 방사상으로 끼워져, 방열밴드(210)의 권선부(211, 212, 213, 214, 215)들이 결합핀(220) 에 의해 고정된다.7 and 8, in the heat dissipation device 200 according to the third embodiment of the present invention, a heat dissipation band 210 bent in a zigzag form of a thin aluminum sheet is wound in a spiral shape, and the heat dissipation band has a plurality of windings ( 211, 212, 213, 214, and 215, and a heat dissipation space 216, 217, 218, and 219 is formed between the winding portion and the winding portion, and the end portion 215a of the outermost winding portion 215 is external. Is bonded to one surface exposed to, a plurality of coupling pins 220 are radially fitted to the heat dissipation band 210, the windings 211, 212, 213, 214, 215 of the heat dissipation band 210 are combined pins 220 It is fixed by).

상기 방열밴드(210)는, 도 8에 도시된 바와같이, 결합핀(220)에 끼워진 스페이서(225)에 의해 방열공간(216, 217, 218, 219)의 간격이 유지된다.As shown in FIG. 8, the heat dissipation band 210 is maintained at intervals of the heat dissipation spaces 216, 217, 218, and 219 by spacers 225 fitted to the coupling pins 220.

도 9를 참조하면, 또한, 상기 방열밴드(210)는 슬리팅(slitting) 작업에 의해 가로방향으로 많은 절개부(231)가 형성되고, 접는선(232)을 중심으로 지그재그 방향으로 절곡되어, 코루게이트타입(corrugated)으로 형성된다.Referring to FIG. 9, the heat dissipation band 210 is formed with a large number of cutouts 231 in the horizontal direction by slitting, and is bent in a zigzag direction about the fold line 232. It is formed into a corrugated type.

상기와 같이 구성된 본 발명의 제 3 실시예에 따른 방열장치는 방열밴드(210)가 지그재그로 절곡되어 있어, 열을 방출하는 방열밴드의 표면적이 넓고, 방열밴드(210)에 많은 절개부(213)가 형성되어 방열성능이 향성되고, 결합핀(220)으로 와선형으로 감긴 방열밴드의 권선부들을 고정할 수 있어, 조립작업이 매우 간편하다.In the heat dissipation device according to the third embodiment of the present invention configured as described above, the heat dissipation band 210 is bent in a zigzag manner, and the surface area of the heat dissipation band dissipating heat is wide, and many cutouts 213 are provided in the heat dissipation band 210. ) Is formed and the heat dissipation performance is improved, it is possible to fix the winding portion of the heat dissipation band wound in a spiral with the coupling pin 220, assembly is very easy.

상기와 같은 본 발명의 제 3 실시예에 따른 방열장치는 도 4를 참조하여 설명한 본 발명의 제 1 실시예에 따른 방열장치와 같이 LED 전등에 적용할 수 있다.The heat dissipation device according to the third embodiment of the present invention as described above may be applied to an LED lamp like the heat dissipation device according to the first embodiment of the present invention described with reference to FIG. 4.

도 10을 참조하면, 본 발명의 제 4 실시예에 따른 방열장치(300)는 알루미늄 박판을 지그재그로 절곡한 방열밴드(310 ; 310a, 310b, 310c, 310d, 310e)가 원형으로 형성되어, 다수개의 방열밴드(310a, 310b, 310c, 310d, 310e)가 여러 겹으로 배열되고, 방열밴드와 방열밴드 사이에 방열공간(320)이 형성되고, 결합핀(330)이 가장 바깥쪽에 배치된 방열밴드(310e)에서 중간에 배치된 방열밴드(310d, 310c, 301b)들을 통해 가장 안쪽에 배치된 방열밴드(310a)에 끼워짐으로써, 원형의 방열 밴드(310a, 310b, 310c, 310d, 310e)들이 결합핀(330)에 의해 고정된다.Referring to FIG. 10, in the heat dissipation device 300 according to the fourth embodiment of the present invention, a heat dissipation band 310 (310a, 310b, 310c, 310d, 310e) zigzag bent in a thin aluminum plate is formed in a circular shape. Heat dissipation bands 310a, 310b, 310c, 310d, and 310e are arranged in multiple layers, a heat dissipation space 320 is formed between the heat dissipation band and the heat dissipation band, and the heat dissipation band with the coupling pin 330 disposed at the outermost side. The circular heat dissipation bands 310a, 310b, 310c, 310d, 310e are inserted into the heat dissipation band 310a disposed at the innermost side through the heat dissipation bands 310d, 310c, and 301b disposed in the middle at 310e. It is fixed by the coupling pin 330.

상기 방열밴드(310)는 본 발명의 제 3 실시예에 따른 방열장치의 방열밴드와 같이 스페이서(335)에 의해 방열공간(320)의 간격이 유지되고, 본 발명의 제 3 실시예에 따른 방열장치의 방열밴드와 같이 슬리팅(slitting) 작업에 의해 많은 절개부(도시하지 않음)가 형성된다.The heat dissipation band 310 is maintained in the space of the heat dissipation space 320 by the spacer 335, like the heat dissipation band of the heat dissipation device according to the third embodiment of the present invention, the heat dissipation according to the third embodiment of the present invention Many slits (not shown) are formed by slitting operations, such as the heat dissipation band of the device.

상기와 같이 구성된 본 발명의 제 4 실시예에 따른 방열장치는 본 발명의 제 3 실시예에 따른 방열장치와 같은 특징을 가지며, 위에서 이미 설명한 것처럼 LED 전등에 적용할 수 있다.The heat dissipation device according to the fourth embodiment of the present invention configured as described above has the same characteristics as the heat dissipation device according to the third embodiment of the present invention, and can be applied to the LED lamp as described above.

도 1은 본 발명의 제 1 실시예에 따른 방열장치를 도시한 사시도로써, 결합핀을 분리하여 도시하였다.1 is a perspective view showing a heat dissipation device according to a first embodiment of the present invention, and shows the coupling pins separately.

도 2는 도 1의 방열장치를 도시한 평면도이다.FIG. 2 is a plan view illustrating the heat dissipation device of FIG. 1.

도 3a 및 도 3b는 방열튜브를 도시한 도 1의 A-A선에 따른 단면도이다.3A and 3B are sectional views taken along the line A-A of FIG. 1 showing the heat dissipation tube.

도 4는 본 발명의 제 1 실시예에 따른 방열장치가 LED 전등에 장착되는 예를 도시한 분해 사시도이다.4 is an exploded perspective view showing an example in which the heat dissipation device according to the first embodiment of the present invention is mounted to the LED lamp.

도 5는 본 발명의 제 2 실시예에 따른 방열장치를 도시한 사시도로써, 어느 한 방열튜브그룹을 분리하여 도시하였다.5 is a perspective view showing a heat dissipation device according to a second embodiment of the present invention, in which one heat dissipation tube group is separated and shown.

도 6은 도 5의 방열장치를 도시한 평면도이다.6 is a plan view illustrating the heat dissipation device of FIG. 5.

도 7은 본 발명의 제 3 실시예에 따른 방열장치를 도시한 사시도로써, 방열밴드의 일부를 확대 도시하였고, 어느 한 결합핀을 분리하여 도시하였다.FIG. 7 is a perspective view illustrating a heat dissipation device according to a third embodiment of the present invention, in which a portion of the heat dissipation band is enlarged, and one coupling pin is separated.

도 8은 도 7의 방열장치를 도시한 평면도이다.8 is a plan view illustrating the heat dissipation device of FIG. 7.

도 9는 펼쳐진 상태의 방열밴드를 도시한 측면도이다.9 is a side view showing the heat dissipation band in an unfolded state.

도 10은 본 발명의 제 4 실시예에 따른 방열장치를 도시한 평면도이다.10 is a plan view illustrating a heat dissipation device according to a fourth embodiment of the present invention.

Claims (7)

베이스 원통(60) 둘레에 와선형으로 배열된 방열튜브(70)가 배치되고, "ㄴ" 형상으로 형성된 결합핀(80)의 수평부(81)가 방열튜브(70)에 형성된 구멍(71)을 통해 베이스 원통(60)에 끼워져 고정되고, 상기 결합핀(80)의 수직부(82)가 방열튜브(70)의 가장 바깥쪽에 배치되는 최외측면(70a)에 압착됨으로써, 상기 결합핀(80)에 의해 와선형의 방열튜브(70)가 베이스 원통(60) 둘레에 장착되어 LED모듈에서 발생하는 열을 외부로 방출하는 것을 특징으로 하는 방열장치.Heat dissipation tubes 70 arranged in a spiral line are arranged around the base cylinder 60, and the horizontal portion 81 of the coupling pin 80 formed in a "b" shape is a hole 71 formed in the heat dissipation tube 70. It is inserted into the base cylinder 60 through the fixed through, the vertical portion 82 of the coupling fin 80 is compressed to the outermost surface 70a disposed on the outermost side of the heat dissipation tube 70, the coupling pin 80 Heat dissipation device characterized in that the spiral heat dissipation tube (70) is mounted around the base cylinder (60) to emit heat generated by the LED module to the outside. 베이스 원통(110)에 "U"형상의 결합핀(120)이 끼워져 고정되고, 결합핀(120)에 다수개의 방열튜브(T1, T2, T3, T4, T5)가 끼워짐으로써, 결합핀(120)에 끼워진 다수개의 방열튜브(T1, T2, T3, T4, T5)가 방열튜브그룹(G)을 이루고, 베이스 원통(110) 둘레에 다수개의 방열튜브그룹(G ; G1, G2, G3, G4, G5, G6)이 배치되어 LED모듈에서 발생하는 열을 외부로 방출하는 것을 특징으로 하는 방열장치.The “U” shaped coupling pin 120 is fitted into the base cylinder 110 and fixed thereto, and a plurality of heat dissipation tubes T1, T2, T3, T4, and T5 are fitted to the coupling pin 120, thereby coupling pins ( A plurality of heat dissipation tubes (T1, T2, T3, T4, T5) inserted in 120 form a heat dissipation tube group (G), and a plurality of heat dissipation tube groups (G; G1, G2, G3, G4, G5, G6) is disposed is a heat dissipating device characterized in that it emits heat generated from the LED module to the outside. 제 1 항 또는 제 2 항에 있어서,The method according to claim 1 or 2, 상기 방열튜브는 중공부에 격막이 형성된 튜브 형태이며, 결합핀에 끼워진 스페이서에 의해 겹간격이 유지되는 것을 특징으로 하는 방열장치.The heat dissipation tube is a heat-dissipating device characterized in that the diaphragm is formed in the hollow tube portion, the lap spacing is maintained by a spacer fitted to the coupling pin. 제 2 항에 있어서,The method of claim 2, 상기 방열튜브그룹(G)은 베이스 원통(110)에 가장 가까운 제 1 방열튜브(T1)의 폭(W1)보다 제 1 방열튜브 다음에 배치되는 제 2 방열튜브(T2)의 폭(W2)이 더 크고, 제 2 방열튜브(T2)의 폭(W2)보다 제 2 방열튜브 다음에 배치되는 제 3 방열튜브(T3)의 폭(W3)이 더 큰 방식으로 다수개의 방열튜브가 배열되어 가장 외측에 배치되는 방열튜브(T5)의 폭(W5)이 가장 큰 것을 특징으로 하는 방열장치.The heat dissipation tube group G has a width W2 of the second heat dissipation tube T2 disposed after the first heat dissipation tube rather than the width W1 of the first heat dissipation tube T1 closest to the base cylinder 110. The plurality of heat dissipation tubes are arranged in such a manner that the width W3 of the third heat dissipation tube T3 disposed next to the second heat dissipation tube is larger than the width W2 of the second heat dissipation tube T2, so that the plurality of heat dissipation tubes are arranged at the outermost side. Heat dissipation device, characterized in that the width (W5) of the heat dissipation tube (T5) disposed in the largest. 알루미늄 박판을 지그재그로 절곡한 방열밴드(210)가 와선형으로 감겨, 방열밴드가 다수개의 권선부(211, 212, 213, 214, 215)로 구성되고, 권선부와 권선부 사이에 방열공간(216, 217, 218, 219)이 형성되고, 최외곽 권선부(215)의 단부(215a)가 외부로 노출된 일면에 접합되고, 다수개의 결합핀(220)이 방열밴드(210)에 방사상으로 끼워져, 방열밴드(210)의 권선부(211, 212, 213, 214, 215)들이 결합핀(220)에 의해 고정되어 LED모듈에서 발생하는 열을 외부로 방출하는 것을 특징으로 하는 방열장치.The heat dissipation band 210 bent in a zigzag aluminum sheet is wound in a spiral shape, and the heat dissipation band is composed of a plurality of winding parts 211, 212, 213, 214, and 215, and a heat dissipation space between the winding part and the winding part ( 216, 217, 218, and 219 are formed, and an end portion 215a of the outermost winding portion 215 is joined to one surface exposed to the outside, and a plurality of coupling pins 220 are radially radiated to the heat dissipation band 210. Is inserted, the winding portion (211, 212, 213, 214, 215) of the heat dissipation band 210 is fixed by the coupling pin 220 to radiate heat generated from the LED module to the outside. 알루미늄 박판을 지그재그로 절곡한 방열밴드(310 ; 310a, 310b, 310c, 310d, 310e)가 원형으로 형성되어, 다수개의 방열밴드(310a, 310b, 310c, 310d, 310e)가 여러 겹으로 배열되고, 방열밴드와 방열밴드 사이에 방열공간(320)이 형성되고, 결합핀(330)이 가장 바깥쪽에 배치된 방열밴드(310e)에서 중간에 배치된 방열밴드(310d, 310c, 301b)들을 통해 가장 안쪽에 배치된 방열밴드(310a)에 끼워짐으로써, 원형의 방열밴드(310a, 310b, 310c, 310d, 310e)들이 결합핀(330)에 의해 고정되어 LED모듈에서 발생하는 열을 외부로 방출하는 것을 특징으로 하는 방열장치.The heat dissipation band 310 (310a, 310b, 310c, 310d, 310e) zigzag bending the aluminum thin plate is formed in a circular shape, a plurality of heat dissipation bands (310a, 310b, 310c, 310d, 310e) are arranged in multiple layers, A heat dissipation space 320 is formed between the heat dissipation band and the heat dissipation band, and the innermost through the heat dissipation bands 310d, 310c, and 301b disposed in the middle of the heat dissipation band 310e having the coupling pin 330 disposed at the outermost side. By being fitted to the heat dissipation band 310a disposed in the shape, the circular heat dissipation bands 310a, 310b, 310c, 310d, and 310e are fixed by the coupling pins 330 to release heat generated from the LED module to the outside. Heat sink characterized in that. 제 5 항 또는 제 6 항에 있어서,The method according to claim 5 or 6, 상기 방열밴드는 결합핀에 끼워진 스페이서에 의해 방열공간의 간격이 유지되고, 슬리팅(slitting) 작업에 의해 가로방향으로 많은 절개부가 형성되고, 접는선을 중심으로 지그재그 방향으로 절곡되는 것을 특징으로 하는 방열장치.The heat dissipation band is maintained in the space of the heat dissipation space by the spacer fitted to the coupling pin, a large number of cutouts are formed in the transverse direction by slitting work, and bent in a zigzag direction around the fold line Heat dissipation.
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