TW200636202A - Heat pipe and methode of making the same - Google Patents

Heat pipe and methode of making the same

Info

Publication number
TW200636202A
TW200636202A TW094112040A TW94112040A TW200636202A TW 200636202 A TW200636202 A TW 200636202A TW 094112040 A TW094112040 A TW 094112040A TW 94112040 A TW94112040 A TW 94112040A TW 200636202 A TW200636202 A TW 200636202A
Authority
TW
Taiwan
Prior art keywords
heat
conducting
heat pipe
pipe
making
Prior art date
Application number
TW094112040A
Other languages
Chinese (zh)
Other versions
TWI330250B (en
Inventor
Shih-Che Chien
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW94112040A priority Critical patent/TWI330250B/en
Publication of TW200636202A publication Critical patent/TW200636202A/en
Application granted granted Critical
Publication of TWI330250B publication Critical patent/TWI330250B/en

Links

Abstract

The present invention discloses a heat pipe and a method of making the same. The heat pipe includes a hollow pipe shell, a wick structure formed on a surface of inside wall and a working fluid enveloped inside the pipe shell. The wick structure includes a heat-conducting mesh, heat-conducting particles with a micron dimension diameter formed on the mesh and heat-conducting fibres with a nanometer dimension diameter formed on the particles. The heat-conducting particles with a micron dimension diameter and the heat-conducting fibres with a nanometer dimension can increase a surface area of heat dissipation, and enhance heat-conducting efficiency of the heat pipe. Furthermore, they also can improve denseness of wick structure and accelerate the transportation of working fluid so as to avoid the appearance of wick limition.
TW94112040A 2005-04-15 2005-04-15 Heat pipe and methode of making the same TWI330250B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94112040A TWI330250B (en) 2005-04-15 2005-04-15 Heat pipe and methode of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94112040A TWI330250B (en) 2005-04-15 2005-04-15 Heat pipe and methode of making the same

Publications (2)

Publication Number Publication Date
TW200636202A true TW200636202A (en) 2006-10-16
TWI330250B TWI330250B (en) 2010-09-11

Family

ID=45074551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94112040A TWI330250B (en) 2005-04-15 2005-04-15 Heat pipe and methode of making the same

Country Status (1)

Country Link
TW (1) TWI330250B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112378283A (en) * 2020-10-16 2021-02-19 桂林电子科技大学 Cylindrical high-temperature quartz heat pipe wire mesh capillary core fixing device and method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477730B (en) * 2011-10-28 2015-03-21 Celsia Technologies Taiwan Inc Heat pipe and the composition of the capillary wick thereof
TWI479114B (en) * 2012-04-09 2015-04-01 Heat transfer structure, method of manufacturing heat transfer structure and heat dissipating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112378283A (en) * 2020-10-16 2021-02-19 桂林电子科技大学 Cylindrical high-temperature quartz heat pipe wire mesh capillary core fixing device and method
CN112378283B (en) * 2020-10-16 2022-02-11 桂林电子科技大学 Cylindrical high-temperature quartz heat pipe wire mesh capillary core fixing device and method

Also Published As

Publication number Publication date
TWI330250B (en) 2010-09-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees