TW200616172A - Contact type image intercepting structure - Google Patents

Contact type image intercepting structure

Info

Publication number
TW200616172A
TW200616172A TW093134660A TW93134660A TW200616172A TW 200616172 A TW200616172 A TW 200616172A TW 093134660 A TW093134660 A TW 093134660A TW 93134660 A TW93134660 A TW 93134660A TW 200616172 A TW200616172 A TW 200616172A
Authority
TW
Taiwan
Prior art keywords
sensor chip
contact type
frame
substrate
type image
Prior art date
Application number
TW093134660A
Other languages
Chinese (zh)
Other versions
TWI265610B (en
Inventor
neng-qin Chen
Original Assignee
Elecvision Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elecvision Inc filed Critical Elecvision Inc
Priority to TW093134660A priority Critical patent/TWI265610B/en
Priority to US11/107,773 priority patent/US20060102974A1/en
Priority to JP2005266332A priority patent/JP2006065876A/en
Publication of TW200616172A publication Critical patent/TW200616172A/en
Application granted granted Critical
Publication of TWI265610B publication Critical patent/TWI265610B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

This invention provides a kind of contact type image intercepting structure, which comprises a substrate, a circuit layer formed on the substrate, a sensor chip installed on the substrate and electrically connected with the circuit layer, a frame installed on the substrate surrounding the sensor chip to form an accommodation space between the frame and the sensor chip, and a transparent layer installed in the frame for encapsulating the sensor chip and the circuit layer in the frame, in which the transparent layer on top of the sensor chip is in flat shape, while the transparent layer on top of the accommodation space is in inclined shape. Therefore, this invention does not require the optical mechanism of the conventional technique so that the volume of the chip package structure can be greatly reduced. Moreover, through a contact type sensing method, the sensed image can be directly displayed.
TW093134660A 2004-11-12 2004-11-12 Contact type image intercepting structure TWI265610B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW093134660A TWI265610B (en) 2004-11-12 2004-11-12 Contact type image intercepting structure
US11/107,773 US20060102974A1 (en) 2004-11-12 2005-04-18 Contact image capturing structure
JP2005266332A JP2006065876A (en) 2004-11-12 2005-09-14 Contact type image acquisition structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093134660A TWI265610B (en) 2004-11-12 2004-11-12 Contact type image intercepting structure

Publications (2)

Publication Number Publication Date
TW200616172A true TW200616172A (en) 2006-05-16
TWI265610B TWI265610B (en) 2006-11-01

Family

ID=36112253

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093134660A TWI265610B (en) 2004-11-12 2004-11-12 Contact type image intercepting structure

Country Status (2)

Country Link
JP (1) JP2006065876A (en)
TW (1) TWI265610B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI575687B (en) * 2016-05-19 2017-03-21 茂丞科技股份有限公司 Fingerprint identification packaging unit and manufacation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI575687B (en) * 2016-05-19 2017-03-21 茂丞科技股份有限公司 Fingerprint identification packaging unit and manufacation method thereof

Also Published As

Publication number Publication date
TWI265610B (en) 2006-11-01
JP2006065876A (en) 2006-03-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees