TW200731523A - Image sensor package apparauts - Google Patents

Image sensor package apparauts

Info

Publication number
TW200731523A
TW200731523A TW095104455A TW95104455A TW200731523A TW 200731523 A TW200731523 A TW 200731523A TW 095104455 A TW095104455 A TW 095104455A TW 95104455 A TW95104455 A TW 95104455A TW 200731523 A TW200731523 A TW 200731523A
Authority
TW
Taiwan
Prior art keywords
substrate
image sensor
frame structure
sensor package
recess
Prior art date
Application number
TW095104455A
Other languages
Chinese (zh)
Other versions
TWI293507B (en
Inventor
Chun-Nan Liao
Original Assignee
Foxlink Image Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxlink Image Tech Co Ltd filed Critical Foxlink Image Tech Co Ltd
Priority to TW95104455A priority Critical patent/TWI293507B/en
Publication of TW200731523A publication Critical patent/TW200731523A/en
Application granted granted Critical
Publication of TWI293507B publication Critical patent/TWI293507B/en

Links

Abstract

An image sensor package apparatus includes a substrate, a photosensitive chip adhering to the front surface of the substrate, a frame structure encapsulating and packaging the substrate, and a light-transmissible board arranging on the surface of the frame structure to cover the photosensitive chip. The frame structure has a dam. The bottom surface of the dam has a recess extending upward in the bottom surface. The recess goes through the dam from left side to right side. The substrate region corresponding to the recess includes a pad and a bonding-wire electrically connected with the pad. The recess is filled with an adhesive so that the frame structure can be firmly adjacent to the substrate and the image sensor package apparatus has a compact body.
TW95104455A 2006-02-10 2006-02-10 Image sensor package apparatus TWI293507B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95104455A TWI293507B (en) 2006-02-10 2006-02-10 Image sensor package apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95104455A TWI293507B (en) 2006-02-10 2006-02-10 Image sensor package apparatus

Publications (2)

Publication Number Publication Date
TW200731523A true TW200731523A (en) 2007-08-16
TWI293507B TWI293507B (en) 2008-02-11

Family

ID=45067861

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95104455A TWI293507B (en) 2006-02-10 2006-02-10 Image sensor package apparatus

Country Status (1)

Country Link
TW (1) TWI293507B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422018B (en) * 2008-08-20 2014-01-01 Pixart Imaging Inc Sensing module
CN111370431A (en) * 2018-12-26 2020-07-03 中芯集成电路（宁波）有限公司 Packaging method of photoelectric sensing integrated system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422018B (en) * 2008-08-20 2014-01-01 Pixart Imaging Inc Sensing module
CN111370431A (en) * 2018-12-26 2020-07-03 中芯集成电路（宁波）有限公司 Packaging method of photoelectric sensing integrated system
CN111370431B (en) * 2018-12-26 2023-04-18 中芯集成电路（宁波）有限公司 Packaging method of photoelectric sensing integrated system

Also Published As

Publication number Publication date
TWI293507B (en) 2008-02-11

Similar Documents

Publication Publication Date Title
GB0426929D0 (en) Image sensor module and camera module package including the same
SG148130A1 (en) Cmos image sensor chip scale package with die receiving through-hole and method of the same
SG148133A1 (en) Cmos image sensor chip scale package with die receiving opening and method of the same
EP2354630A3 (en) LED module
SG144128A1 (en) Semiconductor image device package with die receiving through-hole and method of the same
TW200703531A (en) Methods for packaging an image sensor and a packaged image sensor
EP1861880A4 (en) Method of manufacturing solid state imaging device
EP2396820A4 (en) Image and light sensor chip packages
TW200608499A (en) Sensor package
WO2010048102A3 (en) Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
WO2007038144A3 (en) Radiation sensor device and method
HK1103166A1 (en) Encapsulated chip scale package having flip-chip on lead frame structure and method
TW200947638A (en) Image-sensing chip package module with reduced thickness
SG122016A1 (en) Semiconductor chip package and method of manufacture
EA200602118A1 (en) FACIAL INSTALLATION
TW200608277A (en) Integrated ball grid array optical mouse sensor packaging
TW200731523A (en) Image sensor package apparauts
TW200639991A (en) A method and package for packaging an image sensor
TW200732827A (en) An image sensor package
TW200635052A (en) Package of image sensor device and formation thereof
TW200514243A (en) Image sensor adapted for reduced component chip scale packaging
TW200701482A (en) Dispensing package of image sensor and its method
TW200723512A (en) An image sensor package
TW200723551A (en) Image sensor chip package
WO2009031541A1 (en) Device mounting module and its manufacturing method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees