TW200615107A - Release film for encapsulation of semiconductor chip - Google Patents

Release film for encapsulation of semiconductor chip

Info

Publication number
TW200615107A
TW200615107A TW094121653A TW94121653A TW200615107A TW 200615107 A TW200615107 A TW 200615107A TW 094121653 A TW094121653 A TW 094121653A TW 94121653 A TW94121653 A TW 94121653A TW 200615107 A TW200615107 A TW 200615107A
Authority
TW
Taiwan
Prior art keywords
encapsulation
semiconductor chip
film
release film
laminated
Prior art date
Application number
TW094121653A
Other languages
English (en)
Other versions
TWI393621B (zh
Inventor
Seitoku Kaya
Yuki Fujimoto
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW200615107A publication Critical patent/TW200615107A/zh
Application granted granted Critical
Publication of TWI393621B publication Critical patent/TWI393621B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
    • B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2067/00—Use of polyesters or derivatives thereof, as moulding material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
TW94121653A 2004-06-29 2005-06-28 半導體晶片封裝用之脫模膜 TWI393621B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191258 2004-06-29

Publications (2)

Publication Number Publication Date
TW200615107A true TW200615107A (en) 2006-05-16
TWI393621B TWI393621B (zh) 2013-04-21

Family

ID=35057114

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94121653A TWI393621B (zh) 2004-06-29 2005-06-28 半導體晶片封裝用之脫模膜

Country Status (5)

Country Link
EP (1) EP1612021B1 (zh)
CN (1) CN100471672C (zh)
DE (1) DE602005016337D1 (zh)
SG (1) SG118414A1 (zh)
TW (1) TWI393621B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101427358B (zh) * 2006-04-25 2012-07-18 旭硝子株式会社 半导体树脂模塑用脱模膜
KR20140106691A (ko) * 2011-12-22 2014-09-03 다이킨 고교 가부시키가이샤 이형 필름
US9455160B2 (en) * 2013-01-14 2016-09-27 Infineon Technologies Ag Method for fabricating a semiconductor chip panel
US9287472B2 (en) 2013-06-27 2016-03-15 Nichia Corporation Light emitting device and method of manufacturing the same
TWI656972B (zh) * 2014-03-07 2019-04-21 日商Ａｇｃ股份有限公司 脫模膜及密封體之製造方法
US10196576B2 (en) * 2015-01-17 2019-02-05 Eagle Industry Co., Ltd. Water lubrication type bearing material
CN105172292A (zh) * 2015-09-15 2015-12-23 蚌埠冠宜型材科技有限公司 一种铸造用薄膜
MX2020013660A (es) 2018-06-22 2021-03-02 Kobayashi & Co Ltd Pelicula de liberacion y metodo para fabricar la pelicula de liberacion.
CN109591232B (zh) * 2018-11-23 2020-04-07 中国科学院大连化学物理研究所 一种燃料电池用双极板的脱模方法及其应用
WO2020196497A1 (ja) * 2019-03-28 2020-10-01 三井化学東セロ株式会社 プリント配線基板製造プロセス用離型フィルム、プリント基板の製造方法、プリント基板製造装置、及びプリント基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1375134B1 (en) 1999-08-31 2004-10-20 Mitsubishi Plastics Inc. Releasing laminated film
JP2001168117A (ja) * 1999-12-06 2001-06-22 Idemitsu Petrochem Co Ltd 半導体素子の封止用離型フィルム及びそれを用いる半導体素子の封止方法
JP4443715B2 (ja) * 1999-12-27 2010-03-31 日東電工株式会社 半導体の樹脂封止方法及び半導体樹脂封止用離型フィルム
JP3935314B2 (ja) 2000-10-18 2007-06-20 三菱樹脂株式会社 転写用フッ素樹脂積層フィルム
JP3791458B2 (ja) 2002-05-23 2006-06-28 旭硝子株式会社 離型フィルム

Also Published As

Publication number Publication date
CN1715046A (zh) 2006-01-04
EP1612021B1 (en) 2009-09-02
SG118414A1 (en) 2006-01-27
CN100471672C (zh) 2009-03-25
EP1612021A1 (en) 2006-01-04
DE602005016337D1 (de) 2009-10-15
TWI393621B (zh) 2013-04-21

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