TW200614503A - - Google Patents
Info
- Publication number
- TW200614503A TW200614503A TW93132377A TW93132377A TW200614503A TW 200614503 A TW200614503 A TW 200614503A TW 93132377 A TW93132377 A TW 93132377A TW 93132377 A TW93132377 A TW 93132377A TW 200614503 A TW200614503 A TW 200614503A
- Authority
- TW
- Taiwan
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/751—Insulated-gate field-effect transistors [IGFET] having composition variations in the channel regions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/213—Channel regions of field-effect devices
- H10D62/221—Channel regions of field-effect devices of FETs
- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
- H10D62/314—Channel regions of field-effect devices of FETs of IGFETs having vertical doping variations
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2004/015532 WO2006043323A1 (ja) | 2004-10-20 | 2004-10-20 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200614503A true TW200614503A (en:Method) | 2006-05-01 |
| TWI260092B TWI260092B (en) | 2006-08-11 |
Family
ID=36202748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093132377A TWI260092B (en) | 2004-10-20 | 2004-10-26 | Semiconductor device and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TWI260092B (en:Method) |
| WO (1) | WO2006043323A1 (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545210B (zh) * | 2012-07-13 | 2015-12-02 | 中芯国际集成电路制造(上海)有限公司 | 深度耗尽沟道场效应晶体管及其制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62219636A (ja) * | 1986-03-20 | 1987-09-26 | Hitachi Ltd | 半導体装置 |
| JP2700320B2 (ja) * | 1988-02-23 | 1998-01-21 | 日本電信電話株式会社 | 半導体装置の製造方法 |
| JPH0282576A (ja) * | 1988-09-19 | 1990-03-23 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
| JPH05343666A (ja) * | 1991-08-30 | 1993-12-24 | Sgs Thomson Microelectron Inc | 集積回路トランジスタ |
| JP3142614B2 (ja) * | 1991-10-16 | 2001-03-07 | 沖電気工業株式会社 | Nチャネルmosfetの製造方法 |
| JPH1041240A (ja) * | 1996-07-25 | 1998-02-13 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP2002025972A (ja) * | 2000-07-04 | 2002-01-25 | Asahi Kasei Microsystems Kk | 半導体装置の製造方法 |
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2004
- 2004-10-20 WO PCT/JP2004/015532 patent/WO2006043323A1/ja not_active Ceased
- 2004-10-26 TW TW093132377A patent/TWI260092B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI260092B (en) | 2006-08-11 |
| WO2006043323A1 (ja) | 2006-04-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |