TW200613359A - Epoxy resin composition, novel phenol resin, novel epoxy resin, manufacturing method for phenol resin, manufacturing method for epoxy resin, and cured epoxy resin composition - Google Patents
Epoxy resin composition, novel phenol resin, novel epoxy resin, manufacturing method for phenol resin, manufacturing method for epoxy resin, and cured epoxy resin compositionInfo
- Publication number
- TW200613359A TW200613359A TW094128679A TW94128679A TW200613359A TW 200613359 A TW200613359 A TW 200613359A TW 094128679 A TW094128679 A TW 094128679A TW 94128679 A TW94128679 A TW 94128679A TW 200613359 A TW200613359 A TW 200613359A
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- phenol
- manufacturing
- novel
- resin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C37/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
- C07C37/11—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms
- C07C37/20—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring by reactions increasing the number of carbon atoms using aldehydes or ketones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004242210 | 2004-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200613359A true TW200613359A (en) | 2006-05-01 |
Family
ID=35967463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094128679A TW200613359A (en) | 2004-08-23 | 2005-08-23 | Epoxy resin composition, novel phenol resin, novel epoxy resin, manufacturing method for phenol resin, manufacturing method for epoxy resin, and cured epoxy resin composition |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200613359A (fr) |
WO (1) | WO2006022251A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI486408B (zh) * | 2009-10-20 | 2015-06-01 | Nippon Kayaku Kk | 紫外線硬化型硬塗層樹脂組成物、使用該組成物之硬塗層膜及硬塗層成形物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03221516A (ja) * | 1990-01-29 | 1991-09-30 | Dainippon Ink & Chem Inc | エポキシ樹脂の製造方法とエポキシ樹脂組成物 |
JPH08193110A (ja) * | 1995-01-13 | 1996-07-30 | Nippon Kayaku Co Ltd | ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
JPH10237158A (ja) * | 1997-02-28 | 1998-09-08 | Nippon Kayaku Co Ltd | エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
JP3944765B2 (ja) * | 2001-01-30 | 2007-07-18 | 大日本インキ化学工業株式会社 | エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
-
2005
- 2005-08-23 TW TW094128679A patent/TW200613359A/zh unknown
- 2005-08-23 WO PCT/JP2005/015258 patent/WO2006022251A1/fr active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI486408B (zh) * | 2009-10-20 | 2015-06-01 | Nippon Kayaku Kk | 紫外線硬化型硬塗層樹脂組成物、使用該組成物之硬塗層膜及硬塗層成形物 |
Also Published As
Publication number | Publication date |
---|---|
WO2006022251A1 (fr) | 2006-03-02 |
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