TW200611327A - Pre-process of cutting a wafer and method of cutting a wafer - Google Patents

Pre-process of cutting a wafer and method of cutting a wafer

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Publication number
TW200611327A
TW200611327A TW093129542A TW93129542A TW200611327A TW 200611327 A TW200611327 A TW 200611327A TW 093129542 A TW093129542 A TW 093129542A TW 93129542 A TW93129542 A TW 93129542A TW 200611327 A TW200611327 A TW 200611327A
Authority
TW
Taiwan
Prior art keywords
wafer
cutting
die
material layer
removing step
Prior art date
Application number
TW093129542A
Other languages
Chinese (zh)
Other versions
TWI241645B (en
Inventor
Kuo-Ming Chen
Kun-Chih Wang
Hermen Liu
Paul Chen
Kai-Kuang Ho
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW93129542A priority Critical patent/TWI241645B/en
Application granted granted Critical
Publication of TWI241645B publication Critical patent/TWI241645B/en
Publication of TW200611327A publication Critical patent/TW200611327A/en

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  • Dicing (AREA)

Abstract

A pre-process of cutting a wafer is described. A wafer comprised of a plurality of scribe line and a plurality of die defined by the scribe lines. And there is at least a material layer over the wafer. Then, a removing step is performed to remove the material layer located on the scribe lines corresponding to the die corner. By performing the removing step, the invention can avoid the damages at the die corner during the process of cutting a wafer; therefore, the die can maintain complete after wafer cutting, and the reliability for device and using time can be improved.
TW93129542A 2004-09-30 2004-09-30 Pre-process of cutting a wafer and method of cutting a wafer TWI241645B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93129542A TWI241645B (en) 2004-09-30 2004-09-30 Pre-process of cutting a wafer and method of cutting a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93129542A TWI241645B (en) 2004-09-30 2004-09-30 Pre-process of cutting a wafer and method of cutting a wafer

Publications (2)

Publication Number Publication Date
TWI241645B TWI241645B (en) 2005-10-11
TW200611327A true TW200611327A (en) 2006-04-01

Family

ID=37014007

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93129542A TWI241645B (en) 2004-09-30 2004-09-30 Pre-process of cutting a wafer and method of cutting a wafer

Country Status (1)

Country Link
TW (1) TWI241645B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI622092B (en) * 2016-07-18 2018-04-21 南亞科技股份有限公司 Method of manufacturing chips
CN112530980A (en) * 2019-09-17 2021-03-19 世界先进积体电路股份有限公司 Semiconductor device and method of forming the same
TWI825547B (en) * 2021-10-08 2023-12-11 南亞科技股份有限公司 Semiconductor device with re-fill layer and method for fabricating the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103176061A (en) * 2011-12-26 2013-06-26 台达电子工业股份有限公司 Device and method for testing coil

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI622092B (en) * 2016-07-18 2018-04-21 南亞科技股份有限公司 Method of manufacturing chips
CN112530980A (en) * 2019-09-17 2021-03-19 世界先进积体电路股份有限公司 Semiconductor device and method of forming the same
TWI825547B (en) * 2021-10-08 2023-12-11 南亞科技股份有限公司 Semiconductor device with re-fill layer and method for fabricating the same

Also Published As

Publication number Publication date
TWI241645B (en) 2005-10-11

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