TW200611327A - Pre-process of cutting a wafer and method of cutting a wafer - Google Patents
Pre-process of cutting a wafer and method of cutting a waferInfo
- Publication number
- TW200611327A TW200611327A TW093129542A TW93129542A TW200611327A TW 200611327 A TW200611327 A TW 200611327A TW 093129542 A TW093129542 A TW 093129542A TW 93129542 A TW93129542 A TW 93129542A TW 200611327 A TW200611327 A TW 200611327A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- cutting
- die
- material layer
- removing step
- Prior art date
Links
Landscapes
- Dicing (AREA)
Abstract
A pre-process of cutting a wafer is described. A wafer comprised of a plurality of scribe line and a plurality of die defined by the scribe lines. And there is at least a material layer over the wafer. Then, a removing step is performed to remove the material layer located on the scribe lines corresponding to the die corner. By performing the removing step, the invention can avoid the damages at the die corner during the process of cutting a wafer; therefore, the die can maintain complete after wafer cutting, and the reliability for device and using time can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93129542A TWI241645B (en) | 2004-09-30 | 2004-09-30 | Pre-process of cutting a wafer and method of cutting a wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93129542A TWI241645B (en) | 2004-09-30 | 2004-09-30 | Pre-process of cutting a wafer and method of cutting a wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI241645B TWI241645B (en) | 2005-10-11 |
TW200611327A true TW200611327A (en) | 2006-04-01 |
Family
ID=37014007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93129542A TWI241645B (en) | 2004-09-30 | 2004-09-30 | Pre-process of cutting a wafer and method of cutting a wafer |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI241645B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI622092B (en) * | 2016-07-18 | 2018-04-21 | 南亞科技股份有限公司 | Method of manufacturing chips |
CN112530980A (en) * | 2019-09-17 | 2021-03-19 | 世界先进积体电路股份有限公司 | Semiconductor device and method of forming the same |
TWI825547B (en) * | 2021-10-08 | 2023-12-11 | 南亞科技股份有限公司 | Semiconductor device with re-fill layer and method for fabricating the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103176061A (en) * | 2011-12-26 | 2013-06-26 | 台达电子工业股份有限公司 | Device and method for testing coil |
-
2004
- 2004-09-30 TW TW93129542A patent/TWI241645B/en active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI622092B (en) * | 2016-07-18 | 2018-04-21 | 南亞科技股份有限公司 | Method of manufacturing chips |
CN112530980A (en) * | 2019-09-17 | 2021-03-19 | 世界先进积体电路股份有限公司 | Semiconductor device and method of forming the same |
TWI825547B (en) * | 2021-10-08 | 2023-12-11 | 南亞科技股份有限公司 | Semiconductor device with re-fill layer and method for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
TWI241645B (en) | 2005-10-11 |
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