TW200610469A - Wired circuit board - Google Patents

Wired circuit board

Info

Publication number
TW200610469A
TW200610469A TW094125737A TW94125737A TW200610469A TW 200610469 A TW200610469 A TW 200610469A TW 094125737 A TW094125737 A TW 094125737A TW 94125737 A TW94125737 A TW 94125737A TW 200610469 A TW200610469 A TW 200610469A
Authority
TW
Taiwan
Prior art keywords
circuit board
insulating layer
wired circuit
metal plating
layer
Prior art date
Application number
TW094125737A
Other languages
Chinese (zh)
Other versions
TWI345437B (en
Inventor
Takashi Oda
Yasufumi Miyake
Tadao Ohkawa
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200610469A publication Critical patent/TW200610469A/en
Application granted granted Critical
Publication of TWI345437B publication Critical patent/TWI345437B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Provided is a wired circuit board capable of improving adhesion between a conductor pattern and an insulating layer even if the conductor pattern is formed by fine pitch, as well as preventing a plating liquid from being remained between a metal plating layer and the insulating layer so as to prevent an ionic impurity from being remained as a residue. As a result, even if the wired circuit board is operated for a long period under a state of high temperature and high humidity, a short circuit caused by ion migration can be suppressed, thereby reducing insulation failure. For providing the wired circuit board, at one end of a flexible wired circuit board 1 in a longitudinal direction which exposes from a cover insulating layer 4, a lower end portion of a terminal section 5 formed on a base insulating layer 2 and a lower end portion of each side surface of a metal plating layer 6 for covering each of the terminal sections 5 are embedded in the base insulating layer 2. Thereby, during formation of the metal plating layer 6, it is possible to prevent the plating liquid from being permeating therebetween.
TW094125737A 2004-09-01 2005-07-29 Wired circuit board TWI345437B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004254852A JP4351129B2 (en) 2004-09-01 2004-09-01 Printed circuit board

Publications (2)

Publication Number Publication Date
TW200610469A true TW200610469A (en) 2006-03-16
TWI345437B TWI345437B (en) 2011-07-11

Family

ID=35431116

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125737A TWI345437B (en) 2004-09-01 2005-07-29 Wired circuit board

Country Status (6)

Country Link
US (2) US7355128B2 (en)
EP (1) EP1633174B1 (en)
JP (1) JP4351129B2 (en)
CN (1) CN100553409C (en)
DE (1) DE602005017543D1 (en)
TW (1) TWI345437B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7595553B2 (en) 2006-11-08 2009-09-29 Sanyo Electric Co., Ltd. Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
KR20080042012A (en) * 2006-11-08 2008-05-14 산요덴키가부시키가이샤 Substrate for mounting device, manufacturing method thereof, semiconductor module and portable equipment
CN101312620B (en) * 2007-05-24 2011-06-22 巨擘科技股份有限公司 Manufacturing process for metal circuit of multi-layer substrate and construction thereof
KR101159514B1 (en) * 2007-05-24 2012-06-26 프린코 코포레이션 A Structure and Manufacturing Method of Metal Wiring on Multilayered Board
TWI354523B (en) 2007-05-25 2011-12-11 Princo Corp Method for manufacturing metal lines in multi-laye
US8815333B2 (en) 2007-12-05 2014-08-26 Princo Middle East Fze Manufacturing method of metal structure in multi-layer substrate
KR100902928B1 (en) * 2007-12-06 2009-06-15 엘지전자 주식회사 Flexible film, display device comprising the same and method of fabricating the display device
JP5703525B2 (en) * 2011-08-23 2015-04-22 住友電工プリントサーキット株式会社 Flexible printed wiring board and method for manufacturing the flexible printed wiring board
JP5348234B2 (en) * 2011-12-21 2013-11-20 大日本印刷株式会社 Suspension substrate, suspension, suspension with element, hard disk drive, and method for manufacturing suspension substrate
JP5214038B1 (en) * 2012-01-12 2013-06-19 島田理化工業株式会社 Printed wiring board and manufacturing method thereof
JP5714526B2 (en) * 2012-03-08 2015-05-07 日本写真印刷株式会社 Flexible touch panel
US8702998B1 (en) 2012-03-09 2014-04-22 Western Digital Technologies, Inc. Method to manufacture a flexible cable for a disk drive
JP5897495B2 (en) * 2012-09-19 2016-03-30 富士フイルム株式会社 Wiring board
CN103338600A (en) * 2013-05-10 2013-10-02 华为技术有限公司 PCB structure and production method thereof, and embedded device PCB production method
US9824797B2 (en) 2014-12-19 2017-11-21 General Electric Company Resistive grid elements having a thermosetting polymer
CN110915307B (en) * 2017-05-19 2023-02-03 佐佐木贝慈 Substrate for mounting electronic component and method for manufacturing the same
CN108241240B (en) * 2018-02-08 2021-05-14 上海天马微电子有限公司 Display panel and display device
CN110662361A (en) * 2019-10-11 2020-01-07 广州添利电子科技有限公司 Embedded radar antenna PCB manufacturing process

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58175222A (en) 1982-04-07 1983-10-14 シャープ株式会社 Method of producing smooth circuit board
US4797508A (en) 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4707394A (en) * 1986-09-19 1987-11-17 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US5311404A (en) * 1992-06-30 1994-05-10 Hughes Aircraft Company Electrical interconnection substrate with both wire bond and solder contacts
JP3361556B2 (en) * 1992-09-25 2003-01-07 日本メクトロン株式会社 Method of forming circuit wiring pattern
JPH06216487A (en) * 1993-01-18 1994-08-05 Matsushita Electric Ind Co Ltd Connecting terminal part of flexible pattern
FR2708170B1 (en) * 1993-07-19 1995-09-08 Innovation Dev Cie Gle Electronic circuits with very high conductivity and great finesse, their manufacturing processes, and devices comprising them.
JP2665134B2 (en) * 1993-09-03 1997-10-22 日本黒鉛工業株式会社 Flexible circuit board and method of manufacturing the same
US5886877A (en) * 1995-10-13 1999-03-23 Meiko Electronics Co., Ltd. Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
JP3794792B2 (en) * 1997-07-22 2006-07-12 Ｔｄｋ株式会社 Circuit board
JP3226489B2 (en) * 1998-02-19 2001-11-05 日東電工株式会社 Suspension board with circuit
US6108212A (en) * 1998-06-05 2000-08-22 Motorola, Inc. Surface-mount device package having an integral passive component
JP4066522B2 (en) * 1998-07-22 2008-03-26 イビデン株式会社 Printed wiring board
SE512130C2 (en) * 1999-01-19 2000-01-31 Prisma Sign Technology Ab Drive device for driving sign at image changing signs
JP3205548B2 (en) * 1999-10-01 2001-09-04 ソニーケミカル株式会社 Multi-layer flexible wiring board
JP2002185133A (en) * 2000-12-14 2002-06-28 Nitto Denko Corp Flexible wiring circuit board and method for manufacturing the same
JP4211246B2 (en) 2001-07-23 2009-01-21 日立電線株式会社 Wiring board manufacturing method
JP2004179341A (en) * 2002-11-26 2004-06-24 Matsushita Electric Works Ltd Method for manufacturing printed wiring material
KR100541394B1 (en) * 2003-08-23 2006-01-10 삼성전자주식회사 NSMD type substrate for ball grid array package and manufacturing method thereof

Also Published As

Publication number Publication date
CN100553409C (en) 2009-10-21
TWI345437B (en) 2011-07-11
EP1633174A2 (en) 2006-03-08
US7937832B2 (en) 2011-05-10
JP4351129B2 (en) 2009-10-28
DE602005017543D1 (en) 2009-12-24
US7355128B2 (en) 2008-04-08
CN1744799A (en) 2006-03-08
US20060042823A1 (en) 2006-03-02
EP1633174A3 (en) 2006-08-30
US20080135280A1 (en) 2008-06-12
JP2006073761A (en) 2006-03-16
EP1633174B1 (en) 2009-11-11

Similar Documents

Publication Publication Date Title
TW200610469A (en) Wired circuit board
GB2429848A (en) Electronics module and method for manufacturing the same
WO2006056648A3 (en) Electronics module and method for manufacturing the same
EP2315510A3 (en) Wiring board provided with passive element
TW200731908A (en) Multilayer printed wiring board and method for manufacturing same
EP1956875A3 (en) Wired circuit board and method for producing the same
EP1951015A4 (en) Printed wiring board and method for manufacturing printed wiring board
EP1869700A4 (en) Interconnect structure and method of fabrication of same
TW200637448A (en) Method for fabricating conducting bump structures of circuit board
EP1909544A3 (en) Wired circuit board
EP1991040A3 (en) Wired Circuit Board
TW200718299A (en) Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method
MY149115A (en) Method of forming a circuit board with improved via design
WO2006077164A3 (en) Method for producing an angled printed circuit board structure from at least two circuit board sections
SG170744A1 (en) Circuit board and connection substrate
WO2004093185A3 (en) Electrical interconnect structures for integrated circuits and methods of manufacturing the same
WO2008155967A1 (en) Board with built-in component and its manufacturing method
WO2008074041A3 (en) Heatable element
EP1784065A4 (en) Electrode substrate
EP1335643A3 (en) Method for manufacturing double-sided circuit board
TW200710280A (en) Usage of a coating for electrical contacting
TW200739769A (en) Method of manufacturing wiring board
TW200739859A (en) Semiconductor device and method of manufacturing the same
DE202006019817U1 (en) Method for producing angled printed circuit board structure involves production of level printed circuit board comprising at least one conductor, which is embedded to great extent in printed circuit board
EP1173051A4 (en) Flexible printed wiring board and its production method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees