TW200610469A - Wired circuit board - Google Patents

Wired circuit board

Info

Publication number
TW200610469A
TW200610469A TW094125737A TW94125737A TW200610469A TW 200610469 A TW200610469 A TW 200610469A TW 094125737 A TW094125737 A TW 094125737A TW 94125737 A TW94125737 A TW 94125737A TW 200610469 A TW200610469 A TW 200610469A
Authority
TW
Taiwan
Prior art keywords
circuit board
insulating layer
wired circuit
metal plating
layer
Prior art date
Application number
TW094125737A
Other languages
Chinese (zh)
Other versions
TWI345437B (en
Inventor
Takashi Oda
Yasufumi Miyake
Tadao Ohkawa
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200610469A publication Critical patent/TW200610469A/en
Application granted granted Critical
Publication of TWI345437B publication Critical patent/TWI345437B/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0753Insulation
    • H05K2201/0769Anti metal-migration, e.g. avoiding tin whisker growth
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126Assembling bases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49151Assembling terminal to base by deforming or shaping
    • Y10T29/49153Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49156Manufacturing circuit on or in base with selective destruction of conductive paths
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49165Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Provided is a wired circuit board capable of improving adhesion between a conductor pattern and an insulating layer even if the conductor pattern is formed by fine pitch, as well as preventing a plating liquid from being remained between a metal plating layer and the insulating layer so as to prevent an ionic impurity from being remained as a residue. As a result, even if the wired circuit board is operated for a long period under a state of high temperature and high humidity, a short circuit caused by ion migration can be suppressed, thereby reducing insulation failure. For providing the wired circuit board, at one end of a flexible wired circuit board 1 in a longitudinal direction which exposes from a cover insulating layer 4, a lower end portion of a terminal section 5 formed on a base insulating layer 2 and a lower end portion of each side surface of a metal plating layer 6 for covering each of the terminal sections 5 are embedded in the base insulating layer 2. Thereby, during formation of the metal plating layer 6, it is possible to prevent the plating liquid from being permeating therebetween.
TW094125737A 2004-09-01 2005-07-29 Wired circuit board TWI345437B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004254852A JP4351129B2 (en) 2004-09-01 2004-09-01 Printed circuit board

Publications (2)

Publication Number Publication Date
TW200610469A true TW200610469A (en) 2006-03-16
TWI345437B TWI345437B (en) 2011-07-11

Family

ID=35431116

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125737A TWI345437B (en) 2004-09-01 2005-07-29 Wired circuit board

Country Status (6)

Country Link
US (2) US7355128B2 (en)
EP (1) EP1633174B1 (en)
JP (1) JP4351129B2 (en)
CN (1) CN100553409C (en)
DE (1) DE602005017543D1 (en)
TW (1) TWI345437B (en)

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* Cited by examiner, † Cited by third party
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US7595553B2 (en) 2006-11-08 2009-09-29 Sanyo Electric Co., Ltd. Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus
KR20080042012A (en) * 2006-11-08 2008-05-14 산요덴키가부시키가이샤 Substrate for mounting device, manufacturing method thereof, semiconductor module and portable equipment
KR101159514B1 (en) * 2007-05-24 2012-06-26 프린코 코포레이션 A Structure and Manufacturing Method of Metal Wiring on Multilayered Board
CN101312620B (en) * 2007-05-24 2011-06-22 巨擘科技股份有限公司 Manufacturing process for metal circuit of multi-layer substrate and construction thereof
TWI354523B (en) 2007-05-25 2011-12-11 Princo Corp Method for manufacturing metal lines in multi-laye
US8815333B2 (en) 2007-12-05 2014-08-26 Princo Middle East Fze Manufacturing method of metal structure in multi-layer substrate
KR100902928B1 (en) * 2007-12-06 2009-06-15 엘지전자 주식회사 Flexible film, display device comprising the same and method of fabricating the display device
JP5703525B2 (en) * 2011-08-23 2015-04-22 住友電工プリントサーキット株式会社 Flexible printed wiring board and method for manufacturing the flexible printed wiring board
JP5348234B2 (en) * 2011-12-21 2013-11-20 大日本印刷株式会社 Suspension substrate, suspension, suspension with element, hard disk drive, and method for manufacturing suspension substrate
JP5214038B1 (en) * 2012-01-12 2013-06-19 島田理化工業株式会社 Printed wiring board and manufacturing method thereof
JP5714526B2 (en) * 2012-03-08 2015-05-07 日本写真印刷株式会社 Flexible touch panel
US8702998B1 (en) 2012-03-09 2014-04-22 Western Digital Technologies, Inc. Method to manufacture a flexible cable for a disk drive
JP5897495B2 (en) * 2012-09-19 2016-03-30 富士フイルム株式会社 Wiring board
CN103338600A (en) * 2013-05-10 2013-10-02 华为技术有限公司 PCB structure and production method thereof, and embedded device PCB production method
US9824797B2 (en) 2014-12-19 2017-11-21 General Electric Company Resistive grid elements having a thermosetting polymer
WO2018211991A1 (en) * 2017-05-19 2018-11-22 フリージア・マクロス株式会社 Board for mounting electronic component, and manufacturing method therefor
CN108241240B (en) * 2018-02-08 2021-05-14 上海天马微电子有限公司 Display panel and display device
CN110662361A (en) * 2019-10-11 2020-01-07 广州添利电子科技有限公司 Embedded radar antenna PCB manufacturing process

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JPS58175222A (en) 1982-04-07 1983-10-14 シャープ株式会社 Method of producing smooth circuit board
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US4707394A (en) * 1986-09-19 1987-11-17 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
US5311404A (en) * 1992-06-30 1994-05-10 Hughes Aircraft Company Electrical interconnection substrate with both wire bond and solder contacts
JP3361556B2 (en) * 1992-09-25 2003-01-07 日本メクトロン株式会社 Method of forming circuit wiring pattern
JPH06216487A (en) * 1993-01-18 1994-08-05 Matsushita Electric Ind Co Ltd Connecting terminal part of flexible pattern
FR2708170B1 (en) * 1993-07-19 1995-09-08 Innovation Dev Cie Gle Electronic circuits with very high conductivity and great finesse, their manufacturing processes, and devices comprising them.
JP2665134B2 (en) * 1993-09-03 1997-10-22 日本黒鉛工業株式会社 Flexible circuit board and method of manufacturing the same
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Also Published As

Publication number Publication date
EP1633174A3 (en) 2006-08-30
CN100553409C (en) 2009-10-21
US7355128B2 (en) 2008-04-08
DE602005017543D1 (en) 2009-12-24
US20080135280A1 (en) 2008-06-12
US7937832B2 (en) 2011-05-10
JP4351129B2 (en) 2009-10-28
JP2006073761A (en) 2006-03-16
EP1633174A2 (en) 2006-03-08
CN1744799A (en) 2006-03-08
EP1633174B1 (en) 2009-11-11
US20060042823A1 (en) 2006-03-02
TWI345437B (en) 2011-07-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees