TW200608012A - Method for evaluating quality of abrasive particles, method for polishing glass and abrasive composition for polishing glass - Google Patents

Method for evaluating quality of abrasive particles, method for polishing glass and abrasive composition for polishing glass

Info

Publication number
TW200608012A
TW200608012A TW094116236A TW94116236A TW200608012A TW 200608012 A TW200608012 A TW 200608012A TW 094116236 A TW094116236 A TW 094116236A TW 94116236 A TW94116236 A TW 94116236A TW 200608012 A TW200608012 A TW 200608012A
Authority
TW
Taiwan
Prior art keywords
particles
polishing glass
abrasive
specific value
abrasive particles
Prior art date
Application number
TW094116236A
Other languages
Chinese (zh)
Other versions
TWI297074B (en
Inventor
Hirotsugu Komiya
Tetsuya Ichisugi
Takahiro Shinozuka
Kazuaki Endo
Original Assignee
Seimi Chem Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seimi Chem Kk filed Critical Seimi Chem Kk
Publication of TW200608012A publication Critical patent/TW200608012A/en
Application granted granted Critical
Publication of TWI297074B publication Critical patent/TWI297074B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/40—Grinding-materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Medicinal Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

Abrasive particles which is reduced to an utmost limit in the occurrence of the latent flaw in an article to be polished, with the retention of the polishing rate at a substantially high level, and a method for the evaluation thereof are provided. An aqueous dispersion of an abrasive material formed by adding abrasive particles to be measured to an aqueous medium is irradiated with an ultrasonic wave, and then a ratio (which is defined as a dispersion ratio (xi)) of the disappearance of the particles having a particle diameter of a specific value or more before the irradiation, due to the ultrasonic wave irradiation, is measured, wherein xi is represented by the formula (1): xi = [(V0-Vt)/V0] X 100 (%) (1) [wherein V0 represents the amount of particles having a particle diameter of a specific value or more being present before the ultrasonic irradiation, and Vt represents the amount of particles having a particle diameter of the specific value or more being present after the ultrasonic irradiation]. Use is made of the abrasive particles exhibiting a dispersion ratio of a specific value or higher.
TW094116236A 2004-05-20 2005-05-19 Method for evaluating quality of abrasive particles, method for polishing glass and abrasive composition for polishing glass TW200608012A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004150884 2004-05-20

Publications (2)

Publication Number Publication Date
TW200608012A true TW200608012A (en) 2006-03-01
TWI297074B TWI297074B (en) 2008-05-21

Family

ID=35428486

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116236A TW200608012A (en) 2004-05-20 2005-05-19 Method for evaluating quality of abrasive particles, method for polishing glass and abrasive composition for polishing glass

Country Status (4)

Country Link
JP (1) JP4131870B2 (en)
CN (2) CN101813692B (en)
TW (1) TW200608012A (en)
WO (1) WO2005114177A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7991216B2 (en) 2007-06-15 2011-08-02 National Taiwan University Of Science And Technology Method of analyzing effective polishing frequency and number of polishing times on polishing pads having different patterns and profiles

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0531140U (en) * 1991-09-27 1993-04-23 ミツミ電機株式会社 Storing AC plug structure
JPWO2013118648A1 (en) * 2012-02-06 2015-05-11 旭硝子株式会社 Manufacturing method of glass product and manufacturing method of magnetic disk
CN104897529B (en) * 2015-06-16 2018-01-12 神华集团有限责任公司 A kind of method for evaluating Fischer-Tropsch synthesis catalyst abrasion resistance
CN107553203A (en) * 2017-10-10 2018-01-09 无锡华美钼业有限公司 The molybdenum alloy sheet cutting machine of cutter cleaning case is set

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000273443A (en) * 1999-03-23 2000-10-03 Asahi Glass Co Ltd Abrasive material for polishing glass substrate for display, polishing and evaluation of quality of abrasive material
TW528796B (en) * 2000-12-13 2003-04-21 Mitsui Mining & Amp Smelting C Cerium-based abrasive and method of evaluating the same
JP3622696B2 (en) * 2001-07-17 2005-02-23 株式会社島津製作所 Method and apparatus for measuring suspended particulate matter
CN1419955A (en) * 2001-11-15 2003-05-28 浣石 Process for dispersion of nanodiamond
JP2003261861A (en) * 2002-03-07 2003-09-19 Mitsui Mining & Smelting Co Ltd Cerium-based abrasive material and evaluation method for dispersibility thereof
CN1203915C (en) * 2002-11-18 2005-06-01 长沙矿冶研究院 Nano-diamond deagglomeration and grading method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7991216B2 (en) 2007-06-15 2011-08-02 National Taiwan University Of Science And Technology Method of analyzing effective polishing frequency and number of polishing times on polishing pads having different patterns and profiles

Also Published As

Publication number Publication date
TWI297074B (en) 2008-05-21
JPWO2005114177A1 (en) 2008-03-27
CN101813692A (en) 2010-08-25
CN1957253B (en) 2011-06-01
CN1957253A (en) 2007-05-02
JP4131870B2 (en) 2008-08-13
CN101813692B (en) 2012-08-29
WO2005114177A1 (en) 2005-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees