TW200607409A - Electronic component and manufacturing method thereof - Google Patents

Electronic component and manufacturing method thereof

Info

Publication number
TW200607409A
TW200607409A TW094120943A TW94120943A TW200607409A TW 200607409 A TW200607409 A TW 200607409A TW 094120943 A TW094120943 A TW 094120943A TW 94120943 A TW94120943 A TW 94120943A TW 200607409 A TW200607409 A TW 200607409A
Authority
TW
Taiwan
Prior art keywords
receiving recess
resin
electronic component
sealing resin
sealing
Prior art date
Application number
TW094120943A
Other languages
English (en)
Other versions
TWI265757B (en
Inventor
Kazuya Nakagawa
Yutaka Abe
Toshiyuki Suzuki
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of TW200607409A publication Critical patent/TW200607409A/zh
Application granted granted Critical
Publication of TWI265757B publication Critical patent/TWI265757B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW094120943A 2004-06-25 2005-06-23 Electronic component and manufacturing method thereof TWI265757B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004188781A JP2006013170A (ja) 2004-06-25 2004-06-25 電子部品並びに電子部品の製造方法

Publications (2)

Publication Number Publication Date
TW200607409A true TW200607409A (en) 2006-02-16
TWI265757B TWI265757B (en) 2006-11-01

Family

ID=35780038

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120943A TWI265757B (en) 2004-06-25 2005-06-23 Electronic component and manufacturing method thereof

Country Status (7)

Country Link
US (1) US7348681B2 (zh)
EP (1) EP1760779A1 (zh)
JP (1) JP2006013170A (zh)
KR (1) KR100791166B1 (zh)
CN (1) CN100444359C (zh)
TW (1) TWI265757B (zh)
WO (1) WO2006001211A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089412A (ja) * 2006-10-02 2008-04-17 Matsushita Electric Works Ltd 圧力センサ
WO2008041607A1 (fr) 2006-10-02 2008-04-10 Panasonic Electric Works Co., Ltd. Capteur de pression
TW200930948A (en) * 2007-10-09 2009-07-16 Koninkl Philips Electronics Nv Light emitting device package, light output system and light output method
US9252336B2 (en) 2008-09-26 2016-02-02 Bridgelux, Inc. Multi-cup LED assembly
US8049236B2 (en) * 2008-09-26 2011-11-01 Bridgelux, Inc. Non-global solder mask LED assembly
US10388584B2 (en) * 2011-09-06 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die
CN104080585B (zh) * 2012-01-30 2017-04-12 旭硝子株式会社 脱模膜和使用该脱模膜的半导体器件的制造方法
US9426914B2 (en) * 2012-05-17 2016-08-23 Intel Corporation Film insert molding for device manufacture
CN110050338B (zh) * 2016-12-07 2023-02-28 株式会社村田制作所 电子部件及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153896A (ja) * 1993-11-29 1995-06-16 Toshiba Corp 樹脂封止型半導体装置及びその製造方法
JPH0823042A (ja) * 1994-07-07 1996-01-23 Fujitsu Ltd 半導体装置及びその製造方法及びこれに使用される金型
JP3900613B2 (ja) 1997-08-28 2007-04-04 シチズン電子株式会社 表面実装型チップ部品及びその製造方法
JP3406270B2 (ja) * 2000-02-17 2003-05-12 沖電気工業株式会社 半導体装置及びその製造方法
WO2002089221A1 (en) * 2001-04-23 2002-11-07 Matsushita Electric Works, Ltd. Light emitting device comprising led chip
US6753196B2 (en) * 2001-06-26 2004-06-22 Matsushita Electric Works, Ltd. Method of and apparatus for manufacturing field emission-type electron source
JP4122784B2 (ja) * 2001-09-19 2008-07-23 松下電工株式会社 発光装置
JP3920672B2 (ja) * 2002-03-15 2007-05-30 三菱樹脂株式会社 封止枠部材及び封止枠部材用のシリコーンエラストマーシート

Also Published As

Publication number Publication date
KR100791166B1 (ko) 2008-01-03
US7348681B2 (en) 2008-03-25
CN100444359C (zh) 2008-12-17
EP1760779A1 (en) 2007-03-07
WO2006001211A1 (ja) 2006-01-05
US20070120272A1 (en) 2007-05-31
TWI265757B (en) 2006-11-01
CN1842913A (zh) 2006-10-04
KR20060054480A (ko) 2006-05-22
JP2006013170A (ja) 2006-01-12

Similar Documents

Publication Publication Date Title
TWI265757B (en) Electronic component and manufacturing method thereof
HK1149631A1 (en) Wafer level packaging using flip chip mounting
FI20075088A0 (fi) Piirilevy, johon on upotettu paljas mikrosiru ja menetelmä sitä varten
TW200616257A (en) White light emitting diode package and method of manufacturing the same
CN106684262B (zh) 有机发光显示装置及其封装方法
WO2006131843A3 (en) Method of removing the growth substrate of a semiconductor light-emitting device
EP1871153A3 (en) Wiring substrate and manufacturing method thereof, and semiconductor apparatus
EP1748479A3 (en) Method of making an electronic assembly
EP2672531A3 (en) Light emitting device package and method of manufacturing the same
TW200623382A (en) Electronic package having down-set leads and method
TW200629497A (en) Substrate structure embedded method with semiconductor chip and the method for making the same
KR20170053131A (ko) 패키지 구조체 및 이의 제조 방법
TW200636706A (en) Functional device packaging module and mounting method of functional device packaging module
WO2006132795A3 (en) A light-emitting device module with a substrate and methods of forming it
TW200607418A (en) Method of manufacturing circuit device, method of manufacturing electronic device, and circuit board, electronic apparatus, and photoelectric device
TW201916289A (zh) 形成有陰刻圖案的半導體封裝用夾具、引線框架、基板及包括其的半導體封裝體
KR100721151B1 (ko) 렌즈를 구비한 발광 다이오드 패키지
KR20140084801A (ko) 인쇄회로기판 및 인쇄회로기판 제조 방법
JP2007173561A (ja) 発光装置の製造方法
CN203690294U (zh) 电子元件组件
US20150091025A1 (en) Light-emitting device and method of manufacturing the same
KR101258398B1 (ko) 계면박리를 줄인 ｌｅｄ 패키지
CN106486584B (zh) 一种led阵列器件的防水封装结构及其封装工艺
JP2014157951A (ja) 保護被膜形成方法および実装構造体
KR101974088B1 (ko) 발광 다이오드

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees