TW200606583A - Photosensitive composition, photosensitive film, and permanent pattern and process for forming the same - Google Patents

Photosensitive composition, photosensitive film, and permanent pattern and process for forming the same

Info

Publication number
TW200606583A
TW200606583A TW094109725A TW94109725A TW200606583A TW 200606583 A TW200606583 A TW 200606583A TW 094109725 A TW094109725 A TW 094109725A TW 94109725 A TW94109725 A TW 94109725A TW 200606583 A TW200606583 A TW 200606583A
Authority
TW
Taiwan
Prior art keywords
photosensitive
copolymer
photosensitive composition
objects
equivalent
Prior art date
Application number
TW094109725A
Other languages
Chinese (zh)
Inventor
Takashi Takayanagi
Yuichi Wakata
Hiromi Ishikawa
Yuji Shimoyama
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200606583A publication Critical patent/TW200606583A/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2051Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser

Abstract

The objects of the present invention are to provide photosensitive compositions and hotosensitive films that may represent little surface tackiness, proper laminating ability, appropriate handling property, and superior shelf stability, and also may display superior chemical resistance, higher surface hardness, and sufficient thermal resistance after developing; in addition, to provide highly fine and precise permanent patterns such as protective layers, interlayer insulating films, and solder resist patterns and the like. These objects may be attained by the photosensitive composition that comprises (A) a copolymer, (B) a polymerizable compound, and (C) a photopolymerization initiator, wherein the copolymer (A) is synthesized from a precursor copolymer containing at least a monomer unit of maleic anhydride and a primary amine compound, by reacting one equivalent of anhydride group of the precursor copolymer with 0.1 to 1.2 equivalent of the primary amine compound; and the photosensitive film that utilizes the photosensitive composition.
TW094109725A 2004-03-29 2005-03-29 Photosensitive composition, photosensitive film, and permanent pattern and process for forming the same TW200606583A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004095060 2004-03-29
JP2005082426A JP2005316431A (en) 2004-03-29 2005-03-22 Photosensitive composition, photosensitive film, and permanent pattern and process for forming same

Publications (1)

Publication Number Publication Date
TW200606583A true TW200606583A (en) 2006-02-16

Family

ID=35056347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094109725A TW200606583A (en) 2004-03-29 2005-03-29 Photosensitive composition, photosensitive film, and permanent pattern and process for forming the same

Country Status (3)

Country Link
JP (1) JP2005316431A (en)
TW (1) TW200606583A (en)
WO (1) WO2005093515A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799407A (en) * 2016-08-29 2018-03-13 中国科学院苏州纳米技术与纳米仿生研究所 The notched gates preparation method and high-power RF device of a kind of transistor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2562599B1 (en) 2009-01-29 2014-12-10 Digiflex Ltd. Process for producing a photomask on a photopolymeric surface

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2720238B2 (en) * 1992-03-17 1998-03-04 富士写真フイルム株式会社 Photopolymerizable composition, color filter using the same, and method for producing the same
JPH06123967A (en) * 1992-08-26 1994-05-06 Fuji Photo Film Co Ltd Photopolymerizable composition, color filter using the same and its production
JPH07110577A (en) * 1993-08-16 1995-04-25 Fuji Photo Film Co Ltd Photopolymerizable composition, color filter using the composition and its production method
JP3592827B2 (en) * 1996-03-06 2004-11-24 富士写真フイルム株式会社 Method for manufacturing photosensitive element and multilayer wiring board
JPH1184650A (en) * 1997-09-03 1999-03-26 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element and production of printed circuit board using that
JP2000003039A (en) * 1998-06-16 2000-01-07 Fuji Photo Film Co Ltd Photosensitive resin composition, photosensitive element, insulating resin material, and production of multilayer interconnection board using the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799407A (en) * 2016-08-29 2018-03-13 中国科学院苏州纳米技术与纳米仿生研究所 The notched gates preparation method and high-power RF device of a kind of transistor
CN107799407B (en) * 2016-08-29 2020-07-17 中国科学院苏州纳米技术与纳米仿生研究所 Preparation method of groove gate of transistor and high-power radio frequency device

Also Published As

Publication number Publication date
JP2005316431A (en) 2005-11-10
WO2005093515A1 (en) 2005-10-06

Similar Documents

Publication Publication Date Title
JP6442539B2 (en) Near-infrared absorbing composition, near-infrared cut filter using the same, and method for manufacturing the same, and camera module and method for manufacturing the same
KR102380474B1 (en) A photosensitive resin composition, a heterocyclic-containing polymer precursor, a cured film, a laminated body, the manufacturing method of a cured film, and a semiconductor device
US20100218984A1 (en) Photosensitive dry film resist, printed wiring board making use of the same, and process for producing printed wiring board
KR102279447B1 (en) A photosensitive resin composition, a cured film, a laminated body, the manufacturing method of a cured film, and a semiconductor device
TW201245871A (en) Photosensitive composition, cured article, and method for producing actinically cured article
US7387812B2 (en) Heat-curable resin composition
WO2006129697A1 (en) Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
CN102759859B (en) Resin combination, the manufacture method of hardening thing, resin pattern manufacture method, hardening thing and optical component
KR102626093B1 (en) Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device
TWI428393B (en) Resin composition, dry film, and processed product obtained thereby
TWI805825B (en) Photosensitive resin composition, cured film, laminate, production method of cured film, semiconductor device
US8409784B2 (en) Photosensitive resin composition, dry film, and processed product made using the same
JPH10274850A (en) Photosensitive resin composition
JP7289353B2 (en) Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and polyimide or polyimide precursor
JP7281533B2 (en) Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device
CN103064250A (en) Photosensitive resin composition, photosensitive element wherein same is used, method for forming a resist-pattern, and method for producing a printed wiring board
TW200606583A (en) Photosensitive composition, photosensitive film, and permanent pattern and process for forming the same
TW202104367A (en) Curable resin composition, cured film, laminate, method for manufacturing cured film, and semiconductor device
KR20210134002A (en) Curable resin composition, cured film, laminated body, manufacturing method of a cured film, and semiconductor device
TW201936718A (en) Resin composition for insulating film
JP6646079B2 (en) Photocurable composition and photocurable film formed therefrom
EP3276414A1 (en) Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board
KR102555592B1 (en) Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and thermal base generator
JP7171890B2 (en) Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and polymer precursor
TW202215154A (en) Curable resin composition, cured film, laminate, method for manufacturing cured film, and semiconductor device