200531923 玖、發明說明： 【發明所屬之技術領域】 本發明是有關於一種接合方法，特別是指一種應用於 微型構件上之接合方法。 5 【先前技術】 微系統技術是指製造體積微小、具有功能且自成系統 之結構的技術，一般如微機電系統 (Micro-Electro-Mechanical System，MEMS)、微機光系統 (Micro-Optic-Mechanical System，MOMS)，以及微光機電 10 系統（Micro-Electro-Mecha-Optical System, MEMOS)等，均 屬於微系統技術之領域。由於微系統可廣泛地應用於資訊 電子、光電通訊、精密機械、環保監控、醫療生化等領域， 並可大幅提昇各個領域之技術水準，因此是現今科技發展 之關鍵技術領域，而其中又以釐米（mm)級至微米（// m)級 15 之微型結構的製造技術扮演極為重要的角色。 然而，如欲運用現有之接合方式，將微型構件接合形 成微型結構時，則因技術困難度及製造成本極高，而成為 微系統技術的一大障礙。一般微型結構之微型構件間的接 合方法，包含下列幾種： 20 1)高分子黏膠接合··其主要是藉由高分子黏著劑之黏 著效果達到接合該等微型構件之功效，具有簡單、快速等 優點，但由於難以控制塗佈之均勻度，以及高分子黏著劑 之黏性造成塗佈後存在一定厚度等問題，且對於應用溫度 以及化學藥劑之反應較為敏感，因此實施於微米級之微型 200531923 構件接合上具有接合界面長久使用之可靠度問題。 2)擴散接合（diffusion banding):其接合方法則是利用 高壓高溫加熱使待接合之構件於接觸部分形成融熔狀 態，同時施加以壓力使該待接合之構件相互緊迫，並持續 5 一段相當長之時間，使該待接合之構件之材料彼此相互擴 散而達到接合之效果。其優點在於因接觸部分是在融熔狀 態或接近融熔狀態時進行彼此擴散，故退火後接觸部分不 會產生明顯的接合界面，且接觸部分接合缺陷較少，使得 接合強度較佳。另一方面，由於接合過程中該等構件之材 10 料是在融熔狀態或接近融熔狀態進行擴散接合，因此接合 後之結構能承受低於該材料熔點之高溫環境，有利於所接 合形成結構之應用。 然而由於擴散接合的過程中需在融熔狀態或接近融 熔狀態並施以相當大之力量，因此當待接合者係微形構件 15 時，施壓容易造成該等待接合之微型構件變形，甚至喪失 原先設計之功能，例如微型流道斷面之改變，便會使得整 體流道系統效率受影響，甚至失效；因此難以適用於微形 構件與其他工件間之接合，特別是微型構件與微型構件間 之接合，縱算其材料如彈性模數等的材料常數再大，由於 20 該等微型構件之尺寸均相當細小，導致該等微型構件之結 構強度仍相當有限，而難以實際應用或者在信賴度上存有 高度的疑慮，故微米級之微型構件無法以此方法有效地達 成接合之目的，或者至少其良率甚低。同時，由於微型構 件不易施以機械硏磨使表面粗糙降低，使得施加予該兩微 200531923 型構件相互緊迫之壓力無法降低。因此高融熔溫度（以銅為 例達900QC以上）、接合時間長、接合壓力大、低表面粗糙 度等需求，造成此方法在微型構件接合量產不易。 3)擴散軟焊：其接合方法是先於待接合構件其中之一 5 的接合面上蒸鍍或濺鍍一層低熔點金屬，而後將另一構件 疊合於其上，並以治具固定施壓在高真空爐加溫進行接 合，使該低熔點金屬擴散至該等微型構件内與構件表面金 屬反應形成反應層，因此具有低溫接合，且於接合後能應 用於高溫環境之優點。然而，由於以此方法進行微型構件 10 之接合時，對於微型構件之接合面的平整度，以及蒸鍍一 層低熔點金屬之技術要求相當高，不論是製程之環境控 制，或者是該低熔點金屬之大面積蒸鍍或濺鍍厚度均勻度 相當難以控制，因此導致以此方法進行該等微型構件接合 之效果相當不穩定。再者，與擴散接合法一樣，以此方法 15 接合微型構件對表面粗糙度的要求甚高，同時大面積批製 問題大，造成本居高不下。 因此現有之方法不是會破壞微型構件之初始結構，便 是其接合方法成本與技術難度高，以致於難以廣泛地運用 於微型構件之接合，達到大量且低成本之製造優勢。 20 【發明内容】 本發明之主要目的是在提供一種能應用於微型結構 製作之微型構件接合方法。 本發明之另一目的是在提供一種技術困難度較低之 微型構件接合方法。 200531923 本發明之又一目的是在提供一種製作成本較低之微 型構件接合方法。 本發明之再一目的是在提供一種能大量製造之微型 構件接合方法。 5 本發明係一種微型構件接合方法，用以將一具有接合 面之微型構件與工件接合，該微型構件接合方法包含下列 步驟： a)鍍設低熔點金屬薄膜於該待接合微型構件之接合面 上； 10 b)將該待接合工件貼靠於該低熔點金屬薄膜上；及 c)加熱使該低熔點金屬薄膜呈熔融狀態，並施加一使 該接合面與該工件相互靠近之力量於該微型構件及該工 件上。 而當本發明應用於將兩分別具有接合面之微型構件 15 相接合時，該微型構件接合方法則包含下列步驟： a) 鍍設一低熔點金屬薄膜於該等待接合微型構件其中 之一的接合面上； b) 將另一待接合微型構件的接合面貼靠於該低熔點金 屬薄膜上；及 20 c)加熱使該低熔點金屬薄膜呈熔融狀態，並施加一使 該等接合面相互靠近之力量於該等微型構件上。 本發明之功效是能以較低之技術困難度與製作成本 大量進行微型構件與其他工件，以及微型構件與微型構件 間之接合，並達到緊密接合之良好效果。 200531923 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 、下配&參考圖式之二較佳實施例的詳細說明中，將町清 楚的明白。在提出詳細說明之前，要注意的是，在以下的 5 敘述中，類似的元件是以相同的編號來表示。 如圖1所示，本發明微型構件接合方法之第一較佳實 施例疋用於將一具有一接合面11之微型構件1與一工件2 妾口在本貫轭例中，該微型構件1是一以銅為材質所製 1 成之槽道結構，具有—厚度為lGG/zm之底板12,以及複 1〇 數由該底板12呈一角度延伸、且高度為⑽鋒之側雙 13，该接合面Π則是形成於該等側壁13遠離該底板12 之頂緣，而該等相鄰兩侧壁13間隔為1〇〇//m，藉由該底 板12與該等側壁13能界定出複數槽道10。該工件2則為 、鋼為材質所製成且厚度為200 //m之蓋板，並具有一 ”亥微型構件i之接合面u配合之待接合面2ι。因此當 該工件2接合於該微型構件i之側壁13遠離該底板^處 之接合面11上時，便能藉由該底板12、該等側壁13，以 及該工件2界定出一流道結構。 雖然在本實施例中，該微型構件1與該工件2均是以 鋼金屬為材質製成，但並非以此為限，該微型構件1與該 工件2不僅能分別以不同材質之金屬製成外，更能以包含 如矽晶等其他半導體材質製成，關於該微型構件1與該工 件2之材料選擇容後再述。但須強調的是，如圖2及圖3 示在此疋以兩片尺寸同樣為3cm X 3cm X 〇e25cm之 200531923 銅箔6、6’分別形成多數個上述之微型構件j與工件使 其得以大量批造，至於上述之微型構件〗與工 丨卞2之數 5 10 15 目，則視各元件尺寸大小，以及如上述銅箔6、6,等所採 用進行製作之材料的大小決定，在此雖舉面積為允加木 3cm之銅箔6、6,為例，但非以此為限，當知其他如“cm X 26 cm，甚至以上之尺寸，也都能應用於本發明中。 如圖4所示，本發明微型構件接合方法包含下列步驟： 步驟100，如圖i至圖3所示，對該微型構件/之該 接合面11及該工件2之該待接合面21進行表面處理。: 步驟是為了清潔該接合面u及該待接合面2ι，以避免因 遠接合面11或該待接合面21受污染而影響接合效果；其 通常是以蒸館水’或者利用化學溶劑進行清洗。在本實施 例中’由於該微型構件！與該工件2均形成於以銅所製成 之該等㈣6、6,上，故本步驟是先以濃度在鄉到50% 範圍内之石肖酸溶液清洗該接合面U與該待接合面Η，再 以清水沖洗該接合面U與該待接合面21，最後使該接合 面11與該待接合面21乾燥，並立即進行下—步驟。 步驟102 ’如圖1及 ς 6 - 及圖5所不，鍍設一低熔點金屬薄 膜3於該微型構件1之接合面u上。在本實施例中，該低 炫點金屬薄膜3之材質為錫金屬’並且是採用電鑛之方式 1·夬速地儿積厚度7“之該低、熔點金屬形成薄膜3於該銅 荡6(見圖1之各該微型構件1之接合面ii上。當然，由 於該低溶點金屬薄膜3县田认阳& μ 疋用於知接该微型構件1及該工件 20 1 ,故該低炼點金屬薄膜3之材質並不限定為錫金屬，其 200531923 5 10 15 也可以是錫銦合金、錫鉍合金及錫銅合金其中之一，以 其他包含錫金屬之焊材，均能適用於本實施例中；同樣 地，該低㈣金屬薄膜3之厚度也非以為限’，:於 在本實施例中，該等側壁13高度⑽鋒，因此該低㈣ 金屬薄膜3之厚度小於心m均具有相當良好之焊接效 果，亦即在不破壞微型結構的條件下達成良好的接合界 面，其中又以厚度為5//111至8//m為佳。 丨 在本實施例中，雖是以電鑛之方式將該低溶點金屬薄 膜3鍍設於該微型構件丨之接合面^上，但並非以此方式 為限，其他如濺鍍及蒸鍍等能將該低熔點金屬薄膜3沉積 於該接合面11上之方法，也都適用於本發明中。因此僅就 本步驟而言，只要能供該低熔點金屬薄膜3以電鍍、濺鍍， 以及蒸鍵等狀方式沉積於其上之材料，均能作為製作該 微型構件1及該工件2之材料。 步驟104,如圖6所示，將該工件2之待接合面2ι貼 靠於該已鍍設於該微型構件接合面21表面上之低熔點 金屬薄膜3遠離該微型構件丨側。在本實施例中，以熱壓 機（見圖7)將該微型構件i與該工件2加熱，同時施加力量 使該微型構件1與該工件2相互靠近，其對位方式則如圖 7及圖8所示。由於一般熱壓機5具有一供承載物品之下 熱壓板51，以及一與該下熱壓板51相對之上熱壓板52, 因此，配合圖2及圖3所示，在本發明中，為使該微型構 件1及戎工件2正確對位，是先在各該下熱壓板51上標 記擺放記號53，例如圖中之”l”形記號。隨後將形成有該 20 200531923 微型構件1及該工件2之柏β ( 彳嗲53俨—_ '〇 ^ 、6’疊合置放於鄰近該等 處。再取—磁鐵54靠近該等形成有該微型構 件1及該工件2之銅落6、6 起構 6、6，，並使其等對齊，在本實引該等銅羯 5 10 15 20 在本實施例中，該磁鐵54盥 記號則樣呈” L，,形。最後再移開磁鐵Μ，由於該等形= 有該微型構件1及社件2之㈣6、6,僅是以其較薄之 側邊貼靠於磁鐵54上’因此能在不移動該等㈣Η，的 情況下’移除該磁鐵54，完成該微型構件i及該工件2之 精確對位。 ’厂 6 ’如圖9所示，加熱使該低熔點金屬薄膜3 呈熔融狀態，並施加一力量於該微型構件〗及該工件2 上，使該微型構件i之接合面u與該工件2之待接合面 21相互靠近。在本步射是以熱壓機（見圖7)將該微型構 件1與該工件2加熱到160t^ 28〇〇c之溫度範圍内以進 行接合，而以加熱到18〇。(：至25〇t之溫度範圍内為較佳，· 並同時施加5至40 kg/cm2之力量使該微型構件j與該工 件2相互靠近。當加熱之範圍與施加力量之大小達到上述 狀態後，穩定地在5分鐘至60分鐘的時間内維持此一狀 態，使該低熔點金屬薄膜3之錫金屬材質擴散進入該微型 構件1及該工件2之銅金屬材質内，形成銅錫介金屬區域 4 ’完成該微型構件1與該工件2之接合作業。 由於本步驟是同時運用加熱與施力之方式使該低炼 點金屬薄膜3擴散進入該微型構件1與該工件2内，而質 麦為炫點較咼之介金屬材質，故就本步驟而言，只要能與 11 200531923 該低熔點金屬薄膜3之材質於適當的溫度及壓力下形成介 金屬區域4之材料，均能作為製作該微型構件丨及該工件 2之材料。 5 10 15 20 依上述步驟完成接合後，該微型構件1之接合面n 與該工件2接觸部分形成有介金屬區域4，因此使得接合 後之微型結構能在高於該低熔點金屬薄膜3之材質熔點之 環境下工作；更由於擴散之效果，使得該微型構件丨與該 工件2間之接合強度能達到該介金屬㈣所具有之強度。 … w /，'从〜1双尘葙構時200531923 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a joining method, and particularly to a joining method applied to micro-components. 5 [Prior technology] Micro system technology refers to the technology of manufacturing a small, functional and self-contained structure, such as Micro-Electro-Mechanical System (MEMS), Micro-Optic-Mechanical System, MOMS), and Micro-Electro-Mecha-Optical System (MEMOS), etc., all belong to the field of micro-system technology. Microsystems can be widely used in information electronics, optoelectronic communication, precision machinery, environmental monitoring, medical and biochemical fields, and can greatly improve the technical standards of various fields. Therefore, microsystems are the key technology areas of today's scientific and technological development. (Mm) to micrometer (// m) level 15 microstructure manufacturing technology plays an extremely important role. However, if the existing joining methods are to be used to join micro-components to form a micro-structure, it will become a major obstacle to micro-system technology due to the technical difficulty and extremely high manufacturing costs. The general method for joining micro-structures of micro-structures includes the following: 20 1) Polymer adhesive bonding ... It mainly achieves the effect of joining these micro-components through the adhesive effect of polymer adhesives. Fast and other advantages, but because it is difficult to control the uniformity of the coating, and the viscosity of the polymer adhesive causes problems such as a certain thickness after coating, and is sensitive to the application temperature and the reaction of chemical agents, it is implemented at the micron level. Miniature 200531923 Component joints have reliability issues with long-term use of the joint interface. 2) Diffusion banding: The joining method is to use high pressure and high temperature heating to make the members to be joined in a molten state at the same time. At the same time, apply pressure to make the members to be joined press each other for a long period of 5 minutes. In time, the materials of the members to be joined are mutually diffused to achieve the effect of joining. The advantage is that the contact parts diffuse to each other in the molten state or near the molten state, so the contact part does not produce a significant joint interface after annealing, and the contact part has fewer joint defects, which makes the joint strength better. On the other hand, since the materials of these components are diffusely joined in the molten state or near the molten state during the joining process, the structure after joining can withstand the high temperature environment below the melting point of the material, which is conducive to the formation of the joined Application of structure. However, since the diffusion bonding process needs to be in a molten state or close to the molten state and exert a considerable force, when the micro-member 15 is to be joined, the pressure is likely to cause the micro-members waiting to be joined to deform, even Losing the originally designed functions, such as the change of the cross section of the micro flow channel, will affect the efficiency of the overall flow channel system and even fail; therefore it is difficult to apply to the joint between the micro-shaped components and other workpieces, especially the micro-components and micro-components. Even if the material constants of the materials, such as the modulus of elasticity, are large, the size of these micro-components is quite small, resulting in the structural strength of these micro-components is still quite limited, which is difficult to be practically used or trusted. There is a high degree of skepticism, so micron-sized micro-components cannot effectively achieve the purpose of joining by this method, or at least their yield is very low. At the same time, because the micro-structures are not easily subjected to mechanical honing to reduce the surface roughness, the mutual pressing pressure applied to the two micro-scale 200531923-type components cannot be reduced. Therefore, the requirements of high melting temperature (above 900QC for copper), long bonding time, high bonding pressure, and low surface roughness make this method difficult for mass production of micro-component bonding. 3) Diffusion soldering: its joining method is to evaporate or sputter a layer of low-melting metal on the joining surface of one of the members 5 to be joined, and then superimpose the other member on it and fix it with a fixture. The bonding is performed by heating in a high vacuum furnace, so that the low melting point metal diffuses into the micro-components and reacts with the metal on the surface of the components to form a reaction layer. Therefore, it has the advantages of low-temperature bonding and can be applied to high-temperature environments after bonding. However, when joining the micro-components 10 in this way, the technical requirements for the flatness of the joint surfaces of the micro-components and the evaporation of a layer of low-melting metal are very high, regardless of the environmental control of the process or the low-melting metal. Large-area vapor deposition or sputtering thickness uniformity is quite difficult to control, so the effect of joining these micro-components by this method is quite unstable. Furthermore, as with the diffusion bonding method, bonding micro-components with this method has high requirements for surface roughness, and at the same time, large-area batching problems pose a high cost. Therefore, the existing methods will either destroy the initial structure of the micro-components, or the cost and technical difficulty of the joining method will be so high that it will be difficult to widely apply the micro-components to achieve a large number of low-cost manufacturing advantages. [Summary of the Invention] The main object of the present invention is to provide a method for joining micro-components which can be applied to the fabrication of micro-structures. Another object of the present invention is to provide a method for joining micro-components with low technical difficulty. 200531923 Another object of the present invention is to provide a method for joining micro-structures with low manufacturing cost. It is still another object of the present invention to provide a method for joining micro-members which can be manufactured in large quantities. 5 The present invention is a micro-component bonding method for bonding a micro-component with a bonding surface to a workpiece. The micro-component bonding method includes the following steps: a) plating a low-melting metal film on the bonding surface of the micro-component to be bonded 10 b) abut the workpiece to be joined against the low-melting-point metal film; and c) heat to bring the low-melting-point metal film into a molten state, and apply a force to bring the joining surface and the workpiece closer to each other Miniature components and the workpiece. When the present invention is applied to join two micro-members 15 each having a joint surface, the method for joining micro-members includes the following steps: a) plating a low-melting metal film on one of the micro-members waiting to be joined; Surface; b) abutting the joining surface of another micro-component to be joined against the low-melting-point metal film; and 20 c) heating to make the low-melting-point metal film into a molten state, and applying a method to bring the joining surfaces close to each other The power is on these micro-components. The effect of the present invention is that the micro-components and other workpieces, and the micro-components and the micro-components can be joined in large quantities with low technical difficulty and manufacturing cost, and achieve the good effect of tight joints. 200531923 [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the detailed description of the preferred embodiment with reference to Figure 2 below. Before giving a detailed description, please note that in the following 5 descriptions, similar elements are represented by the same numbers. As shown in FIG. 1, a first preferred embodiment of a method for joining micro-components of the present invention is used to connect a micro-component 1 with a joint surface 11 and a workpiece 2 in the present yoke example. The micro-component 1 It is a channel structure made of copper. It has a base plate 12 with a thickness of 1GG / zm, and a number of 10 extending from the base plate 12 at an angle and having a height of 13. The joint surface Π is formed on the top edges of the side walls 13 away from the bottom plate 12, and the two adjacent side walls 13 are spaced at a distance of 100 // m. The bottom plate 12 and the side walls 13 can be defined出 Plural number of channels 10. The workpiece 2 is a cover plate made of steel and having a thickness of 200 // m, and has a surface to be joined 2m with the joint surface u of the miniature member i. Therefore, when the workpiece 2 is joined to the When the side wall 13 of the micro-component i is far away from the joint surface 11 on the bottom plate ^, the first-class structure can be defined by the bottom plate 12, the side walls 13, and the workpiece 2. Although in this embodiment, the micro- The component 1 and the workpiece 2 are both made of steel metal, but not limited to this. The micro-component 1 and the workpiece 2 can be made not only of metals of different materials, but also can include silicon crystals, for example. Made of other semiconductor materials, the material selection of the micro component 1 and the workpiece 2 will be described later. However, it must be emphasized that, as shown in Figure 2 and Figure 3, the size of the two pieces is also 3cm X 3cm X 〇e25cm 200531923 Copper foils 6 and 6 'form a large number of the above-mentioned micro-structures j and workpieces, respectively, so that they can be mass-produced. As for the above-mentioned micro-structures and the number of 5 and 15 items, the components are considered as Size, as well as the copper foil 6, 6, etc. The size of the material is determined. Although the copper foils 6 and 6 with an area of 3 cm are allowed as an example, it is not limited to this. When you know that other sizes such as "cm X 26 cm, or even above, are also It can be applied to the present invention. As shown in FIG. 4, the micro-component bonding method of the present invention includes the following steps: Step 100, as shown in FIG. I to FIG. 3, surface the micro-component / the bonding surface 11 and the workpiece 2 to be bonded 21. deal with. : The steps are to clean the joining surface u and the to-be-joined surface 2ι, so as to avoid the influence of the joining effect due to the contamination of the far-to-joint surface 11 or the to-be-joined surface 21; it is usually washed with steamed water or using a chemical solvent. . In this embodiment 'thanks to the micro-member! Both the work piece 2 and the work piece 2 are formed on the cymbals 6, 6 and 6 made of copper, so in this step, the joining surface U and the to-be-joined surface are first cleaned with a lithocholic acid solution having a concentration in the range of 50% to 50%. Alas, rinse the bonding surface U and the surface to be bonded 21 with water, and finally dry the bonding surface 11 and the surface to be bonded 21, and immediately proceed to the next step. Step 102 ′, as shown in FIGS. 1 and 6-and FIG. 5, a low-melting-point metal film 3 is plated on the joining surface u of the micro-component 1. In this embodiment, the material of the low-dazzle metal thin film 3 is tin metal, and the electric ore method is adopted. The thickness of the low-melting point metal 7 is formed by the low-melting-point metal 7 in the copper 6 (See Fig. 1 on the joining surface ii of each of the micro-components 1. Of course, since the low-solute-point metal thin film 3 is used by Sun Yat-Sen & μ 疋 to know the connection of the micro-component 1 and the workpiece 20 1, The material of the low-melting-point metal film 3 is not limited to tin metal, and its 200531923 5 10 15 can also be one of tin-indium alloy, tin-bismuth alloy, and tin-copper alloy. Other solder materials containing tin metal can be used. In this embodiment, the thickness of the low-thickness metal thin film 3 is not limited. In this embodiment, the sidewalls 13 are highly sharp, so the thickness of the low-thickness metal thin film 3 is less than the core. m has a very good welding effect, that is, a good joint interface is achieved without destroying the microstructure, and the thickness is preferably 5 // 111 to 8 // m. 丨 In this embodiment, although The low-melting-point metal thin film 3 is plated on the micro-components by means of electric ore 丨The bonding surface ^ is not limited in this way, and other methods such as sputtering and vapor deposition that can deposit the low-melting-point metal thin film 3 on the bonding surface 11 are also applicable to the present invention. In this step, as long as the material capable of being deposited on the low-melting-point metal thin film 3 by means of electroplating, sputtering, and vapor bonding can be used as the material for making the micro-component 1 and the workpiece 2. Step 104 As shown in FIG. 6, the to-be-joined surface 2m of the workpiece 2 abuts the low-melting-point metal thin film 3 that has been plated on the surface of the micro-component bonding surface 21 away from the micro-component. In this embodiment, The micro-component i and the workpiece 2 are heated by a hot press (see FIG. 7), and at the same time, a force is applied to bring the micro-component 1 and the workpiece 2 closer to each other. The alignment method is shown in FIGS. 7 and 8. Since the general hot press 5 has a lower hot pressing plate 51 for carrying articles and an upper hot pressing plate 52 opposite to the lower hot pressing plate 51, as shown in FIG. 2 and FIG. 3, in the present invention, In order to correctly align the micro-component 1 and the workpiece 2, the lower hot pressing plate 51 is first Mark placement mark 53, such as the "l" mark in the figure. The 20 200531923 miniature component 1 and the cypress β of the workpiece 2 ('53 俨 —_ '〇 ^, 6' are placed on top of each other Near them. Then take—the magnet 54 is close to the copper drops 6, 6 and 6, 6 where the micro-component 1 and the workpiece 2 are formed, and align them.羯 5 10 15 20 In this embodiment, the magnet 54 has a "L ,," shape. Finally, the magnet M is removed, because the shape = 微型 6, 6 of the micro-component 1 and the social component 2 Only with its thin side abutting on the magnet 54 'so it is possible to' remove the magnet 54 without moving the slugs, and complete the precise alignment of the micro-component i and the workpiece 2 '. 'Factory 6' As shown in FIG. 9, heating causes the low-melting-point metal thin film 3 to be in a molten state, and exerts a force on the micro-component and the workpiece 2, so that the joint surface u of the micro-component i and the workpiece 2 The surfaces to be joined 21 are close to each other. In this step, the micro-component 1 and the workpiece 2 are heated to a temperature range of 160t ^ 2800c by a hot press (see Fig. 7) to be joined, and heated to 180. (: It is better in a temperature range of 25 ° t, and at the same time, a force of 5 to 40 kg / cm2 is applied to bring the micro-member j and the workpiece 2 close to each other. When the heating range and the applied force reach the above state After that, this state is stably maintained for a period of 5 minutes to 60 minutes, so that the tin metal material of the low-melting-point metal thin film 3 diffuses into the copper metal material of the microstructure 1 and the workpiece 2 to form a copper-tin-metal Zone 4 'completes the joining operation of the micro-component 1 and the workpiece 2. Since this step is to use both heating and force to diffuse the low-melting point metal film 3 into the micro-component 1 and the workpiece 2, the quality Mak is a relatively low-grade intermetallic material, so as far as this step is concerned, as long as it can form the intermetallic region 4 under the appropriate temperature and pressure with the material of the low-melting metal film 3 of 2005200523 The micro-component 丨 and the material of the workpiece 2. 5 10 15 20 After the bonding is completed in accordance with the above steps, a metal-metal region 4 is formed at the contact portion n of the micro-component 1 and the workpiece 2 so that after bonding, The microstructure can work in an environment higher than the melting point of the material of the low-melting-point metal thin film 3; moreover, due to the effect of diffusion, the bonding strength between the micro-component 丨 and the workpiece 2 can reach the strength of the intermetallic ㈣. … W /, 'from ~ 1 double dust
應用本發明進行接合之方法^圖1G所示，本發明微； 構件接合方法之第二較佳實施例是用於接合兩分別具^ -接合面η、u，之微型構件ii，，在本實施例中，^ 微型構件I、m銅為㈣所製成之槽道結構，但立 不以此為限。各該微型構件^，具有_厚度為i⑽鋒肩 板12、12,，以及複數由各該底板12、12，呈一角度延伸-且高度為lOOym之側壁13、13,，該接合面u、U，同樣 是形成於言亥等側们3、13,遠離各該底板12、12，之頂緣’， 而各該等相鄰兩側壁13、13，間隔均為，且與各該 底板12、12，配合能分別界定出複數槽道1〇、ι〇，。當該等/ 微型構件！之接合㈣與另一微型構们，的接合二 ^合時’便能定義出-由複數槽道1〇、1〇，組成之流道結 冓。如圖U所示，本發明微型構件接合方法包含下列步驟. 步驟200，對該等微型構件1、1，之個別接合面u、 進行表面處理。首Μ以-如硝酸溶液等之化學溶劑主 12 200531923 再以清水沖洗，最後使其乾燥並 洗δ亥荨接合面11、11， 立即進行下一步驟。 5 10 15 20 …步驟202’如圖12所示’賴—⑽點金屬薄膜3於 違等微型構件！之接合面^上。在本實施例中，該低溶點 金屬薄膜3是以電鑛之方式沉積厚度以m之錫銦合金於 該等接合面11上而形成的，但並非以此材質亦非以此加工 方式為限。 步驟204’如圖13所示，將另一微型構件i，的接合面 11，貼靠於該低熔點金屬薄膜3上；其對位方法與上述步驟 # 104大致相同’惟因另一微型構件1，亦形成有結構，因此 對位時應注意其方向。 步驟206，如圖14所示，加熱使該低熔點金屬薄膜3 呈熔融狀態，同時施加一力量於該等微型構件i上，使該 等微型構件1、1’個別之接合面U、U，相互靠近。在本實 施例中是以熱壓機5(見圖7)將該等微型構件iJ，加熱到 180C至250°C之溫度範圍内，同時施加1〇kg/cm2之力量 使該等微型構件1、1，相互靠近；並在此一狀態下維持ι〇 _ 分鐘，使該低熔點金屬薄膜3擴散進入該等微型構件i與 - 1’之側壁13、13’内，藉由溫度與壓力使不同材質之分子互 · 相結合，形成介金屬區域4，完成該等微型構件1i，之接 合作業。 綜上所述’本發明微型構件接合方法以電鍍之方式將 該低熔點金屬薄膜3鍍設於該微型構件1之接合面u上， 因此能以較簡單且成本較低之方式在短時間之内將該低 13 200531923 熔點金屬薄膜3以微米層級之厚度大面積且均勻地分佈於 該接合面11上，完全克服過往以高分子黏膠接合所面臨塗 佈不均之困境，與擴散軟焊因焊材鍍設成本與沉積厚度所 造成生產成本過高，以及接合面平坦度、焊材、焊材鍍設 5 厚度和製程之環境控制等技術困難度較高等之問題。 此外，更由於本發明微型構件接合方法是以熱壓方式 施加5 kg/cm2至40kg/cm2之力量使該微型構件1與該工件 2或另一微型構件Γ緊迫貼合，因此不僅能加速縮短該微 型構件1與該工件2或另一微型構件Γ接合所需時間外， 10 更不會破壞該微型構件1 (與另一微型構件Γ)之初始結 構，且能以較低之技術困難度與製作成本廣泛地運用於微 型構件之接合，使其達到大量且低成本之製造優勢，充分 符合本發明之目的。 惟以上所述者，僅為本發明之二較佳實施例而已，當 15 不能以此限定本發明實施之範圍，即大凡依本發明申請專 利範圍及發明說明書内容所作的等效變化與修飾，皆應仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是本發明微型構件接合方法之第一較佳實施例的 20 —平面示意圖，說明一微型構件及一工件之構造； 圖2是該第一較佳實施例之一平面圖，說明一銅箔形 成有複數個微型構件； 圖3是該第一較佳實施例之一平面圖，說明另一銅箔 形成有複數個工件； 14 200531923 圖4是該第一較佳實施例之一流程圖； 圖5是該第-較佳實施例之一平面示意圖說 微型構件上鍍設一低熔點金屬薄膜； 、〜 5 10 15 20 圖6是該第一較佳實施例之一平面示意圖說明將該 工件貼合於該低溶點金屬薄膜上； 平面示意圖，說明該等 圖7是該第一較佳實施例之一 鋼箔於一熱壓機上對位之方式； 圖8疋该熱壓機之下熱壓板的俯視圖（圖7中沿線 VIII-VIII之剖面示意圖）； 、 圖9是該第一較佳實施例之一平面示意圖，說明該微 型構件及該工件彼此接合並形成介金屬區域； 圖10是本發明微型構件接合方法之第二較佳實施例 、一平面示意圖，說明兩微型構件之構造； 圖11疋该第二較佳實施例之一流程圖； 圖12疋该第二較佳實施例之一平面示意圖，說明於 ’型構件其中之一上鍍設一低炼點金屬薄膜； y 13疋该第二較佳實施例之一平面示意圖，說明將 X專微型構件其中另—貼合於該低溶點金屬薄膜上；及 圖14 等微型構件 疋邊第二較佳實施例之一平面示意圖，說明該 彼此接合並形成介金屬區域。 15 200531923 【圖式之主要元件代表符號說明】 1 、Γ微型構件 4 介金屬區域該 10 、10’槽道 5 熱壓機 11 、11’接合面 51 下熱壓板 12 、12’底板 52 上熱壓板 13 、13’側壁 53 記號 2 工件 54 磁鐵 21 待接合面 6 、6’銅箔 3 低熔點金屬薄膜 100.102.104.106.步驟 200.202.204.206.步驟 16The method of applying the present invention for joining ^ As shown in Fig. 1G, the present invention is micro; The second preferred embodiment of the method for joining members is for joining two micro-components ii having ^ -joining surfaces η, u, respectively. In the embodiment, the micro-components I and m copper are channel structures made of rhenium, but not limited to this. Each of the micro-components ^ has a shoulder plate 12, 12 with a thickness of 侧壁, and a plurality of side walls 13, 13, extending from each of the base plates 12, 12 at an angle-and a height of 100 μm, and the joint surface u, U is also formed on the sides 3, 13 of Yan Hai and the like, away from the top edge of each of the bottom plates 12, 12, and the adjacent two side walls 13, 13 are spaced apart from each other and each of the bottom plates 12 , 12, the coordination energy can define a plurality of channels 10, ι〇, respectively. When such / miniature components! The junction of the joint ㈣ and another microstructure can be defined-the channel junction 组成 composed of a plurality of channels 10 and 10. As shown in FIG. U, the method for bonding micro-components of the present invention includes the following steps. Step 200: Surface treatment is performed on the individual bonding surfaces u of the micro-components 1, 1. First, chemical solvents such as nitric acid solution, etc. 12 200531923 Rinse with water, and finally dry and wash the delta junction surface 11, 11 and immediately proceed to the next step. 5 10 15 20… Step 202 ′ as shown in FIG. 12 ′ —Lai point metal film 3 on the illegal micro-member! Of the joint surface ^ 上. In this embodiment, the low-melting-point metal thin film 3 is formed by depositing a tin-indium alloy with a thickness of m on the joint surfaces 11 in an electric ore manner. limit. Step 204'As shown in FIG. 13, the bonding surface 11 of another micro-component i 'is abutted against the low-melting-point metal thin film 3; the alignment method is substantially the same as that of step # 104 above, except that another micro-component 1, also has a structure, so pay attention to its direction when positioning. In step 206, as shown in FIG. 14, the low-melting-point metal thin film 3 is heated, and a force is applied to the micro-components i, so that the individual joint surfaces U, U of the micro-components 1, 1 ', Close to each other. In this embodiment, the micro-components iJ are heated by a hot press 5 (see FIG. 7) to a temperature range of 180C to 250 ° C, and at the same time a force of 10 kg / cm2 is applied to make the micro-components 1 , 1, close to each other; and maintained in this state for ι__ minutes, so that the low-melting-point metal film 3 diffuses into the side walls 13, 13 'of the micro-components i and -1', and is caused by temperature and pressure Molecules of different materials are combined with each other to form an intermetallic region 4 to complete the joining operation of these micro-structures 1i. In summary, the method for joining micro-components of the present invention is to plate the low-melting-point metal thin film 3 on the joint surface u of the micro-components 1 by electroplating. Therefore, the method can be performed in a simple and low-cost manner in a short time. The low 13 200531923 melting point metal thin film 3 is uniformly distributed on the joint surface 11 in a large area with a thickness of micron level, which completely overcomes the problem of uneven coating faced by polymer adhesive bonding in the past, and diffusion soft soldering. The production cost is too high due to the welding material plating cost and deposition thickness, and the technical difficulties such as the flatness of the joint surface, the thickness of the welding material, the welding material plating thickness, and the environmental control of the manufacturing process are high. In addition, since the micro-member bonding method of the present invention applies a force of 5 kg / cm2 to 40 kg / cm2 by hot pressing to make the micro-member 1 and the workpiece 2 or another micro-member tightly fit, it can not only accelerate the shortening. In addition to the time required for the micro-component 1 to join the workpiece 2 or another micro-component Γ, 10 will not destroy the initial structure of the micro-component 1 (and another micro-component Γ), and can be used with a lower technical difficulty. It is widely used in the bonding of micro-components with production costs, so that it can achieve a large number of low-cost manufacturing advantages, which fully meets the purpose of the present invention. However, the above are only the two preferred embodiments of the present invention. When 15 cannot be used to limit the scope of the present invention, that is, equivalent changes and modifications made according to the scope of the patent application and the content of the invention specification, All should still fall within the scope of the invention patent. [Brief description of the drawings] FIG. 1 is a schematic plan view 20 of a first preferred embodiment of the micro-member joining method of the present invention, illustrating the structure of a micro-member and a workpiece; FIG. 2 is one of the first preferred embodiments A plan view illustrating a copper foil formed with a plurality of micro-members; FIG. 3 is a plan view of the first preferred embodiment illustrating another copper foil formed with a plurality of workpieces; 14 200531923 FIG. 4 is the first preferred embodiment Fig. 5 is a schematic plan view of one of the first preferred embodiments, and a low melting point metal film is plated on the micro-member; ~ 5 10 15 20 Fig. 6 is a plan of the first preferred embodiment The schematic diagram illustrates that the workpiece is attached to the low-melting-point metal thin film. The plan schematic diagram illustrates that FIG. 7 is a way of positioning the steel foil on a hot press according to one of the first preferred embodiments. FIG. 8 疋Top view of the hot press plate under the hot press (a schematic cross-sectional view along line VIII-VIII in FIG. 7); FIG. 9 is a schematic plan view of the first preferred embodiment, illustrating that the micro-component and the workpiece are joined to each other and Formation of intermetallic regions; Figure 10 It is a second preferred embodiment of the method for joining micro-components of the present invention, a schematic plan view illustrating the structure of two micro-components; FIG. 11 疋 a flowchart of the second preferred embodiment; FIG. 12 疋 the second preferred implementation One example is a schematic plan view illustrating a low-refining point metal film plated on one of the 'type members'; y 13 疋 A schematic plan view of one of the second preferred embodiments illustrating the addition of the X-specific micro-components to another On the low-melting-point metal thin film; and a schematic plan view of one of the second preferred embodiments of the edge of the micro-members such as FIG. 14, illustrating the bonding with each other and forming the intermetallic region. 15 200531923 [Description of the main symbols of the drawings] 1. Γ micro-component 4. Intermediate metal area 10, 10 'channel 5. Hot press 11, 11' joint surface 51 Under hot press plate 12, 12 'bottom plate 52 Hot press plate 13, 13 'side wall 53 Symbol 2 Work piece 54 Magnet 21 Surface to be joined 6, 6' copper foil 3 Low melting point metal film 100.102.104.106. Step 200.202.204.206. Step 16