200522806 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種具有穿孔或通孔之印刷布線板的製造 方法。 · 【先前技術】 · 習用技術係利用於載體上層壓感光層所構成的感光性轉 印片（也稱爲乾膜光阻劑），藉由光微影技術而製造印刷 布線板。例如，具有穿孔之印刷布線板係依如下之方式而 進行製造。首先，於表面具備金屬層之印刷布線板形成用 ® 基板（例如，鍍銅層壓板）上形成穿孔，再於穿孔內側壁 部形成金屬層。接著，於基板表面金屬層上，使感光性轉 印片之感光層與金屬層相接觸而重疊，將光照射於含有金 屬層表面之布線圖案形成區域與穿孔開口部之區域，成爲 既定之圖案狀而使感光層硬化。接著，剝取感光性轉印片 之載體，將布線圖案形成區域上之硬化層與穿孔開口部區 域上之硬化層（稱爲幕膜）以外之未硬化感光層區域予以 去除而露出基板表面之金屬層。然後，進行所露出之金屬 鲁 層部分的蝕刻處理，之後，去除硬化層，製得表面上具備 金屬布線圖案之印刷布線板。 如此方式，於基板表面之金屬層上，重疊感光性轉印片 之感光層，然後，將光照射成既定之圖案狀後，剝取感光 - 性轉印片之載體的情形下，載體較宜使用撓性透明薄膜載 體。 於印刷布線板之製造步驟，若基板表面之金屬層與硬化 層之密著性不足，可能於蝕刻之際，發生硬化層剝離而布 200522806 線圖案斷線等之問題。因此，爲了提高基板表面之金屬層 與硬化層之密著性的目的下，基板表面之金屬層表面進行 粗面化處理（一般而言，拋光硏磨處理）。 爲了感光性轉印片之高解析度化，將感光層厚度予以薄 化爲有效的。然而，一旦薄化感光層之厚度，往往發生於 穿孔之周邊部分，硬化層變形或厚度變薄，於印刷布線板 製造時，.硬化層變得容易破裂之類的問題。因此，著手進 行感光性轉印片之硏發，以使高解析度之圖案形成爲可能 的，並且，能夠形成難以發生幕膜破裂之硬化層。 於專利文獻1，揭示一種具有第一感光層與第二感光層而 成的二層感光層之感光性轉印片，其中第一感光層係於載 體上設置鹼可溶性、因加熱而造成的流動性小與感應活性 能量線；第二感光層係再於其上，設置鹼可溶性、因加熱 而造成的流動性大與感應活性能量線。於此專利文獻1中， 說明藉由將感光性轉印片之第二感光層埋入穿孔內，能夠 保護穿孔之金屬層。然而，於印刷布線板製造之最後步驟， 由於不得不去除穿孔內所埋入之硬化樹脂（第二感光層之 硬化物），將有印刷布線板之製造步驟變得複雜之類的問 題。 【專利文獻1】日本公開專利第平8-54732號公報 【發明内容】 發明所欲解決之技術問題 本發明之課題在於提供一種有利於工業上進行印刷布線 板之製造方法，其利用具備能夠形成具備高解析度硬化層 與高強度硬化層（幕膜）之感光層的感光性轉印片，製造 200522806 具有穿孔或通孔且具備高解析度之金屬布線圖案的印刷布 線板。 解決問穎之技術手段 本發明之課題在於提供一種由下列步驟而成的印刷布線 · 板之製造方法： . (i)製備一印刷布線板形成用基板的步驟，於載體上，依 序層壓相對低感度之第一感光層、相對高感度之第二感光 層的感光性轉印片；與表面被金屬層所覆蓋的基板，並且， 該金屬層之Ra所示之表面粗糙度於0.01至〇.40//m之範 鲁 圍內，其中， 第一感光層係由包含黏結劑聚合物、含乙烯性不飽和鍵 之單體與光聚合起始劑的感光性樹脂組成物而成的，藉由 光之照射，含有乙嫌性不飽和鍵之單體將進行聚合而硬化， 第二感光層係由包含黏結劑聚合物、含乙烯性不飽和鍵 之單體與光聚合起始劑的感光性樹脂組成物而成的，藉由 光之照射，含有乙烯性不飽和鍵之單體將進行聚合而硬化； (2 )層壓步驟，於印刷布線板形成用基板之表面，第二感 鲁 光層連接於金屬層般地層壓感光性轉印片，而得到依序層 壓印刷布線板形成用基板、第二感光層、第一感光層與載 體的感光性層壓物； (3 )布線部曝光步驟，從感光性層壓物之載體側，至少印 · 刷布線板形成用基板之布線圖案形成區域上，將使第二感 - 光層硬化所需光量之光照射成既定之圖案狀，形成既定圖 案之硬化層區域； 200522806 (4)洞部曝光步驟，從感光性層壓物之載體側，將第一感 光層與第二感光層同時硬化所需光量之光照射或既定圖案 於包含印刷布線板形成用基板之穿孔或通孔之開口部的區 域，形成被覆穿孔或通孔之開口部區域的硬化層區域； (5 )載體剝離步驟，由感光性層壓物剝離載體； (6 )顯像步驟，溶解去除印刷布線板形成用基板上之第一 感光層與第二感光層之未硬化區域，使得基板表面之該未 硬化區域的金屬層露出； (7 )鈾刻步驟，利用蝕刻液溶解去除所露出之區域的金屬 層；以及 (8 )硬化層去除步驟，由印刷布線板形成用基板去除硬化 層。 本發明之製造方法的較佳態樣係如下所示。 (A )金屬層之表面粗糙度係藉由化學硏磨處理而調節至 該範圍。 (B )於該步驟（3 )所用之光均爲雷射光。 另外，本發明之課題在於提供一種由下列步驟而成的具有 穿孔或通孔之印刷布線板的製造方法： (1 )製備一印刷布線板形成用基板的步驟，於載體上，依 序層壓相對低感度之第一感光層、相對高感度之第二感光 層的感光性轉印片；與具有穿孔或通孔且表面被金屬層所 覆蓋的基板，並且，該金屬層之Ra所示之表面粗糙度於0.01 至0.40//m之範圍內，其中， 第一感光層係由包含黏結劑聚合物、含乙烯性不飽和鍵 之單體與光聚合起始劑的感光性樹脂組成物而成的，藉由 200522806 光之照射，含有乙烯性不飽和鍵之單體將進行聚合而硬化， 第二感光層係由包含黏結劑聚合物、含乙烯性不飽和鍵 之單體與光聚合起始劑的感光性樹脂組成物而成的，藉由 光之照射，含有乙烯性不飽和鍵之單體將進行聚合而硬化； · (2 )層壓步驟，於印刷布線板形成用基板之表面，第二感 . 光層連接於金屬層般地層壓感光性轉印片，而得到依序層 壓印刷布線板形成用基板、第二感光層、第一感光層與載 體的感光性層壓物； (3 )布線部曝光步驟，從感光性層壓物之載體側，至少於 · 印刷布線板形成用基板之布線圖案形成區域上，將第二感 光層硬化所需光量之光照射成既定之圖案狀，形成既定圖 案之硬化層區域； (4 )洞部曝光步驟，從感光性層壓物之載體側，將第一感 光層與第二感光層同時硬化所需光量之光照射成既定圖案 於包含印刷布線板形成用基板之穿孔或通孔之開口部的區 域，形成被覆穿孔或通孔之開口部區域的硬化層區域； (5 )載體剝離步驟，由感光性層壓物剝離載體； ® (6 )顯像步驟，溶解去除印刷布線板形成用基板上之第一 感光層與第二感光層之未硬化區域，使得基板表面之該未 硬化區域的金屬層露出； (7 )蝕刻步驟，利用鈾刻液溶解去除所露出之區域的金屬 _ 層；以及 ~ (8 )硬化層去除步驟，由印刷布線板形成用基板去除硬化 層。 -10 - 200522806 本發明之製造方法的較佳態樣係如下所示° (A )金屬層之表面粗糙度係藉由化學硏磨處理而調節至 該範圍。 (B)於該步驟（3)與（4)所用之光均爲雷射光。 · 另外，本發明之感光性層壓物，藉由R a所示之表面粗糙 · 度於0.01至0.40//m範圍內的金屬層，覆蓋表面之印刷布 線板形成用基板上，依序層壓相對高感度之第二感光層、 相對低感度之第一感光層，其中， 第二感光層係由包含黏結劑聚合物、含乙烯性不飽和鍵 · 之單體與光聚合起始劑的感光性樹脂組成物而成的，藉由 光之照射，含有乙烯性不飽和鍵之單體將進行聚合而硬 化；以及 第一感光層係由包含黏結劑聚合物、含乙烯性不飽和鍵 之單體與光聚合起始劑的感光性樹脂組成物而成的，藉由 光之照射，含有乙烯性不飽和鍵之單體將進行聚合而硬化。 本發明之感光性層壓物的較佳態樣係如下所示。 (A) 金屬層之表面粗糙度係藉由化學硏磨處理而調節至 0 該範圍。 (B) 於第一感光層上層壓載體。 還有，於本專利說明書中，所謂「R a所示之表面粗糙度」 係指依照日本工業規格（Π S B 0 6 0 1 - 1 9 9 4 )所規定的算術 ‘ 平均粗糙度。 - ·【·發明之效果】 用於本發明之製造方法實施的感光性轉印片能夠藉由改 -11 - 200522806 變其照射量（曝光量），形成厚度相互不同的硬化層。若 使用如此之感光性轉印片，能夠於具有穿孔或通孔且於表 面具備金屬層之印刷布線板形成用基板，分別形成覆蓋其 穿孔或通孔之厚度厚的高強度硬化層，與覆蓋金屬層表面 之布線圖案形成區域之厚度薄的高解析度硬化層。 於印刷布線板形成用基板表面之金屬層表面的布線圖案 形成區域上，形成該厚度薄的高解析度硬化層之情形，必 須使基板表面之金屬層表面粗糙度成爲適度之値。此係因 爲於布線圖案形成區域上所形成的硬化層之解析度高，因 而於曝光步驟受到照射於感光層之光的基板表面金屬層表 面上之不規則反射的影響。具體而言，若光不規則反射量 大，布線圖案形成區域外側附近之感光層將因不規則反射 的光而被硬化，其結果，因而使曝光後硬化層之解析度微 量降低。本發明製造方法所用之印刷布線板形成用基板表 面金屬層之表面粗糙度於0.01至0.40/zm之範圍內。藉由 使用具備此適度表面粗糙度之金屬層的基板，由於減低該 金屬層表面上之光的不規則反射，不會使基板表面金屬層 與硬化層之密著性降低，能夠形成高解析度之硬化層。還 有，利用具備習知一層感光層之感光性轉印片的印刷布線 板的製造方法上，爲了於穿孔上形成充分強度之幕膜，因 而於基板表面之金屬層上，形成厚度厚的，亦即，低解析 度的硬化層，將不會發生因該光不規則反射而造成的解析 度降低般之問題。 由於本發明之製造方法係使用形成於基板表面之金屬層 表面之厚度厚的高強度硬化層，與厚度薄的高解析度硬化 -12 - 200522806 層，有利於工業上進行具有穿孔或通孔且具備高解析度金 屬布線圖案之印刷布線板的製造。 【實施方式】 【發明之實施態樣】 茲將參照附隨的圖示，以製造具有穿孔或通孔之印刷布 線板之情形爲代表例，說明本發明印刷布線板的製造方 法。首先，針對本發明製造方法所用之感光性轉印片進行 說明。第1圖係顯示較宜用於本發明製造方法實施之感光 性轉印片一例之構造的橫剖面圖。 第1圖之感光性轉印片10具有依序層壓載體11、第一 感光層12、第二感光層13與保護膜14所構成。第一感光 層1 2與第二感光層1 3分別由包含黏結劑聚合物、含乙烯 性不飽和鍵之單體與光聚合起始劑的感光性樹脂組成物而 成的，藉由光之照射，含有乙烯性不飽和鍵之單體將進行 聚合而硬化。本發明所用之感光性轉印片，其主要特徵爲： 相較於第一感光層12,第二感光層13具有相對感度高之特 點。於此，所謂感度高意指第二感光層1 3之硬化，使用較 第一感光層1 2爲少的光照射量而開始硬化。 茲將參照附隨的第2圖，以說明於本發明所用之感光性 轉印片上的光照射量與感光層硬化量之關係。第2圖係顯 示從撓性透明薄膜載體側’將光照射於第1圖之感光性轉 印片時所示之光照射量與硬化層厚度關係之感度曲線的圖 形。於第2圖，橫軸表示光照射量，縱軸表示藉由光之照 射所硬化的感光層厚度。縱軸之D表示第二感光層的厚度， -13 - 200522806 E表示第一感光層的厚度與第二感光層的厚度相加後的整 個感光層厚度。 如第2圖所示，若爲本發明所用之感光性轉印片，從撓 性透明薄膜載體所照射的光，儘管依撓性透明薄膜載體、 - 第一感光層與第二感光層之順序進入，使用較第一感光層 . 爲少的光量，使第二感光層開始硬化。第二感光層開始硬 化的光量S較宜於0.1〜10mJ/cm2之範圍內。第二感光層之 硬化量係隨著光量之增加而增加.，不久整個第二感光層將 硬化。爲了使第二感光層硬化所需之光量A較宜爲20ml/cm2 φ 以下（尤以2〜15m J/cm2範圍內）較爲理想。 整個第二感光層硬化之後，若持續增加光量，第一感光 層將開始硬化，若進一步增加光量，整個第一感光層將進 行硬化。第二感光層硬化所需之光量A與第一感光層硬化 所需之光量B之比値A/B，較宜於0.01〜0.5之範圍內。 直到第一感光層開始硬化前所需之光量C可以與第二感 光層硬化所需之光量A相等，但宜較光量A爲大。第二感 光層硬化所需之光量A與直到第一感光層開始硬化前所需 ® 之光量C的差値C-A，宜較第二感光層硬化所需之照射量A 之1 0倍以下的量（尤以1 . 1〜1 0倍之範圍內更爲理想）’ 或是100mJ/cm2以下（尤以1〜100mJ/cm2之範圍內）更爲理 想。 * 具有如此之感度曲線的感光性轉印片，例如，能夠藉由 - 使第二感光層光聚合起始劑之含量較第一感光層爲多而得 到，或是於第二感光層中添加增感劑而得到。針對感光性 -14 - 200522806 轉印片之材料與製造方法，將詳述如後。 接著，針對本發明之具有穿孔或通孔之印刷布線板的製 造方法，茲將參照附隨的圖示之第3圖以進行說明。 首先，利用該第1圖與第2圖進行說明，製備一^感光性 、 轉印片，其構造爲依序層壓第一感光層與第二感光層，其 . 中，相對低感度之第一感光層係於載體上，由包含黏結劑 聚合物、含乙烯性不飽和鍵之單體與光聚合起始劑的感光 性樹脂組成物而成的，藉由光之照射，含有乙烯性不飽和 鍵之單體將進行聚合而硬化；與相對高感度之第二感光層 鲁 係由包含黏結劑聚合物、含乙烯性不飽和鍵之單體與光聚 合起始劑的感光性樹脂組成物而成的，藉由光之照射，含 有乙烯性不飽和鍵之單體將進行聚合而硬化。 然後，製備印刷布線板形成用基板2 1，如第3 ( A )圖所 示，係一種具有穿孔22且表面被金屬層23所覆蓋之基板， 該基板表面金屬層23之Ra所示之表面粗糙度於0.01至 0.40//m之範圍內。金屬層23之表面粗糙度較宜於0.05至 0 . 2 0 // m之範圍內。例如，印刷布線板形成用基板2 1可以 鲁 使用於鍍銅層壓基板與於玻璃-環氧樹脂等之絕緣基板材 上形成.鍍銅層之基板，或是將此等各個基板之金屬層表面 予以圖案化，再於其上層壓層間絕緣膜，進一步形成鍍銅 層的基板（層壓基板）。如此方式，藉由使用金屬層之表 β 面粗糙度於該範圍內之印刷布線板形成用基板，能夠於此 - 金屬層表面形成密著性優異且高解析度之硬化層。印刷布 線板形成用基板表面之金屬層表面粗糙度與形成於此金屬 -15 - 200522806 層表面的硬化層解析度之關係，將詳述如後。 基板表面金屬層23之表面粗糙度較宜藉由硏 調節至該範圍。硏磨處理之代表例，可列舉：拋 理、洗滌硏磨處理與化學硏磨處理。硏磨處理尤 磨處理特別理想。以下，以化學硏磨處理爲例， 使金屬層23之表面粗糙度成爲該範圍之較佳處理 行說明。 藉由適度之化學硏磨處理，去除基板金屬層表 的氧化物，或是附著於金屬層表面之油分，並且 面之金屬層係沿著其表面之方向進行均勻硏磨。 夠使基板表面之金屬層表面與其上所形成的硬化 力得以提高且均勻化。 化學硏磨處理係藉由於印刷布線板形成用·基板 面，使溶解該金屬之處理液得以接觸並部分溶解 進行硏磨的處理。通常，化學硏磨處理之後，接 布線板形成用基板進行水洗（於水洗之前也有進 情形），然後進行乾燥。將處理液接觸於印刷布 用基板之金屬層表面的處理例子，可列舉：浸漬 淋處理等。噴淋處理上，處理液係從連接於噴淋 淋噴嘴進行噴霧。針對印刷布線板形成用基板. 理，已詳細揭示於日本公開專利第平6 - 2 0 4 6 6 1與2P 號各公報。 用於化學硏磨處理之處理液的例子，可列舉： 處理液與過氧化氫系處理液。過氧化氫系處理液 磨處理而 光硏磨處 以化學硏 ” 針對爲了 . 條件等進 面所形成 ，基板表 _ 因此，能 層之密著 金屬層表 其表面而 著，印刷 行酸洗的 線板形成 © 處理、噴 配管之噴 之化學處 1 1 - 608 3 ^ 氯化鐵系 較宜使用 -16 - 200522806 過氧化氫濃度爲8g/升（容許範圍：4〜168 g/升）、硫酸濃 度爲100g/升（容許範圍：50〜200 g/升）、銅離子濃度爲 〇〜50 g/升之處理液。過氧化氫系處理液之溫度較宜爲30 °C (容許範圍：25〜40°C )。使用淋幕處理之情形，淋幕配 _ 管之壓力較宜爲0 . 2MPa (容許範圍：0 . 1〜0 . 3MPa )。淋幕 - 處理之時間較宜爲2 5秒（容許範圍：2 0〜4 0秒）。 接著，如第3 ( B )圖所示，於印刷布線板形成用基板21 之表面，使用加壓滾筒3 1，進行感光性轉印片1 〇之第二感 光層1 3的層壓（層壓步驟）。藉此，可以得到依序層壓印 · 刷布線板形成用基板2 1、第二感光層1 3、第一感光層1 2 與撓性透明薄膜載體1 1之構造的感光性層壓物。感光性轉 印片10之層壓能夠於室溫（15〜3 0°C )或加熱下（30〜180 °C )進行。尤以60〜140 °C之加熱下進行更爲理想。 還有，不使用感光性轉印片，而是藉由於印刷布線板形 成用基板表面依序進行後述之感光性轉印片製造用之第二 感光性樹脂組成物溶液與第一感光性樹脂組成物溶液的直 接塗布、乾燥，也可以得到依序層壓印刷布線板形成用基 β 板、第二感光層與第一感光層之構造的感光性層壓物。 接著，如第3 ( C )圖所示，從感光性層壓物之撓性透明 薄膜載體1 1側面，照射光而使感光層硬化。於印刷布線板 形成用基板21之布線圖案形成區域，將第二感光層13硬 化的所需光量之光照射成既定之圖案狀，形成布線圖案形 · 成用之硬化層1 5區域（布線部曝光步驟）。於印刷布線板 形成用基板之穿孔2 2的開口部與其周圍，照射分別第一感 -17 - 200522806 光層12與第二感光層13硬化的所需光量之光，形成穿孔 之金屬層保護用之硬化層1 6的區域（孔洞部曝光步驟）。 布線部曝光步驟與孔洞部曝光步驟，雖然可以個別獨立地 進行，但是較宜合倂進行。曝光係藉由將光透過光罩而進 行照射，或是藉由利用雷射曝光裝置而進行雷射光之照 射。用於曝光之光源係使用透過撓性透明薄膜載體1 1，並 且使相對於所用之光聚合起始劑，使用可產生活性電磁 波、波長從310〜700nm (較宜爲3 5 0〜5 00nm)範圍之紫外線 至可見光區域之光線的光源。例如，可以使用（超）高壓 水銀燈、氙燈、碳弧燈、鹵素燈、複寫用螢光燈、半導體 雷射等之習知光源。除此之外，也可以使用電子線或X線 等。 於曝光步驟，照射於感光層之光係於基板表面之金屬層 2 3表面進行不規則反射。經不規則反射的光，例如，僅使 布線圖案形成用之硬化層1 5外側附近的第二感光層1 3硬 化，而使得硬化層1 5之解析度降低。本發明製造方法所用 之印刷布線板形成用基板表面之金屬層表面粗糙度於0 . 0 1 至0.40//m(更佳爲0.05至0.20//m)之範圍內。藉由使 用具備此適度表面粗糙度之金屬層的基板，由於減低了該 金屬層表面上之光的不規則反射，不會使基板表面之金屬 層與硬化層之密著性降低，能夠形成高解析度的硬化層。 亦即，若基板表面金屬層23之表面粗糙度低於0.01/im， 金屬層23與硬化層15之密著性便爲不足，而且，若表面 粗糙度超過0 . 40 // m，硬化層1 5之解析度將降低。 -18 - 200522806 接著，如第3 ( D )圖所示，從感光性層壓物剝離撓性透 明薄膜載體Π (載體剝離步驟）。 接著，如第3 ( E )圖所示，利用適當之顯像液溶解去除 印刷布線板形成用基板21上之第一感光層1 2與第二感光 - 層1 3的未硬化區域，進行布線圖案形成用之硬化層1 5與 . 穿孔之金屬層保護用之硬化層1 6的顯像，使基板表面之金 屬層2 3予以露出（顯像步驟）。對於感光層之未硬化區域 的「溶解去除」，也包含溶解感光層之未硬化區域的一部 分，殘留之部分將作爲剝離片而予以去除。顯像液之例子， 鲁 可列舉：鹼性水溶液（例如，碳酸鈉溶液）、含有機溶劑 之鹼性水溶液與有機溶劑。 接著，如第3 ( F )圖所示，利用蝕刻液溶解去除基板表 面所露出的金屬層2 3 (蝕刻步驟）。由此，於印刷布線板 形成用基板21形成布線圖案24。利用銅形成金屬層23之 情形，對於蝕刻液，能夠使用氯化亞鐵水溶液、氯化亞銅 水溶液、氯化銅水溶液等。 接著，如第3 ( G )圖所示，利用氫氧化鈉或氫氧化鉀等 Φ 之強鹼性水溶液，將硬化層1 5、1 6作爲剝離片1 7而從印 刷布線板形成用基板予以去除（硬化物去除步驟）。進行 如此方式，能夠製造內壁表面具有被金屬層所覆蓋之穿孔 的印刷布線板。 · 還有，有本發明並非受該具有穿孔或通孔之印刷布線板 . 的製造所限定。例如，製作相同上述之感光性層壓物，於 其印刷布線板形成用基板之布線圖案形成區域，第二感光 -19 - 200522806 層硬化所需光量之光照射成既定之圖案狀，以後同樣地， 藉由剝離載體、顯像感光層、蝕刻印刷布線板形成用基板 之金屬層、然後去除硬化層，能夠製作具備高解析度金屬 布線圖案（無穿孔或通孔）之印刷布線板。於製作如此之 - 印刷布線板之際，例如，於該印刷布線板形成用基板之布 · 線圖案形成區域以外之區域，將第一感光層與第二感光層 同時硬化所需光量之光照射成既定之圖案狀，能夠製作具 備該高解析度之金屬布線圖案與不需高解析度之金屬布線 圖案（無穿孔或通孔）之印刷布線板。 · 以下，針對第1圖構造之感光性轉印片的材料與製造方 法，進行詳細說明。感光性轉印片所用之黏結劑聚合物較 宜爲可溶於鹼性水溶液，或是藉由與鹼性水溶液之接觸而 至少具有進行膨潤之性質的共聚物。對於鹼性水溶液，具 有可溶性或膨潤性之共聚物的例子，可列舉：藉由含羧基 之乙烯單體與其他可共聚合之乙烯單體的共聚合所得到的 含羧基之乙烯共聚物。 含羧基之乙烯單體的例子，可列舉：（甲基）丙烯酸、 鲁 乙烯基安息香酸、馬來酸、衣康酸、丁烯酸、桂皮酸、丙 烯酸二聚物、苯乙烯磺酸、2 -丙烯基醯胺-2-甲基丙烷磺酸 與磷酸一（甲基）丙烯醯基乙酯等。另外，也可以利用具 有（甲基）丙烯酸2-羥乙酯等之具有羥基的單體與馬來酸 ’ 酐或對苯二甲酸酐般之環狀酸酐之加成反應物。或是，也 - 可以使用作爲羧基先驅物之含馬來酸酐、衣康酸酐等之含 酸酐之單體。還有，基於共聚合性、成本或溶解性等觀點， -20 - 200522806 於此等例子之中，尤以（甲基）丙烯酸特別理想。 其他可共聚合之單體的例子，可列舉：不含酸性基（尤 其不含羧基）之乙烯不飽和單體。尤以與酸性基不具有反 應性之單體更爲理想。例如，較宜爲（甲基）丙烯酸酯類、 · 丁烯酸酯類、乙烯基酯類、馬來酸二酯類、富馬酸二酯類、 · 衣康酸二酯類、（甲基）丙烯醯胺類、苯乙烯類與乙烯基 醚類。此等之單體，例如可列舉：如下之化合物： (甲基）丙烯酸酯類之例子，可列舉：（甲基）丙烯酸 甲酯、（甲基）丙烯酸乙酯、（甲基）丙烯酸正丙酯、（甲 春 基）丙烯酸異丙酯、（甲基）丙烯酸正丁酯、（甲基）丙 烯酸異丁酯、（甲基）丙烯酸第三丁酯、（甲基）丙烯酸 正己酯、（甲基）丙烯酸-2·乙基己酯、（甲基）丙烯酸乙 酸基乙酯、（甲基）丙烯酸苯酯、（甲基）丙烯酸-2-羥乙 酯、（甲基）丙烯酸-2-甲氧基乙酯、（甲基）丙烯酸- 2-乙氧基乙酯、（甲基）丙烯酸- 2- (2 -甲氧基乙氧基）乙酯、 (甲基）丙烯酸環己酯、（甲基）丙烯酸苯甲酯、（甲基） 丙烯酸二乙二醇一甲基醚、（甲基）丙烯酸二乙二醇一乙 鲁 基醚、（甲基）丙烯酸二乙二醇一苯基醚、（甲基）丙烯 酸三乙二醇一甲基醚與（甲基）丙烯酸三乙二醇一乙基醚 等。 丁烯酸酯類之例子，可列舉：丁烯酸丁酯與丁烯酸己酯 ' 等。乙烯基酯類之例子，可列舉：乙烯乙酸酯、乙烯丙酸 · 酯、乙烯丁酸酯、乙烯基甲氧基乙酸酯與苯甲酸乙烯酯等。 馬來酸二酯類之例子，可列舉：馬來酸二甲酯、馬來酸 -21 - 200522806 二乙酯與馬來酸二丁酯等。富馬酸二酯類之例子，可列舉： 富馬酸二甲酯、富馬酸二乙酯與富馬酸二丁酯等。衣康酸 二酯類之例子，可列舉：衣康酸二甲酯.、衣康酸二乙酯與 衣康酸二丁酯等。 - (甲基）丙烯醯胺類之例子，可列舉··（甲基）丙烯醯 . 胺、N -甲基（甲基）丙烯醯胺、N_乙基（甲基）丙烯醯胺、 N -丙基（甲基）丙烯醯胺、N -正丁基（甲基）丙烯醯胺、 N -第三（甲基）丙烯醯胺、N -環己基（甲基）丙烯醯胺、 N-(2 -甲氧基乙基）（甲基）丙烯醯胺、N，N -二甲基（甲 鲁 基）丙烯醯胺、N，N -二乙基（甲基）丙烯醯胺、N -苯基（甲 基）丙烯醯胺、N -苯甲基（甲基）丙烯醯胺與（甲基）丙 烯醯基嗎啉等。 苯乙烯類之例子，可列舉·：苯乙烯、甲基苯乙烯、二甲 基苯乙烯、三甲基苯乙烯、乙基苯乙烯、異丙基苯乙烯、 丁基苯乙烯、羥基苯乙烯、甲氧基苯乙烯、丁氧基苯乙烯、 乙醯氧基苯乙烯、氯苯乙烯、二氯苯乙烯、溴苯乙烯、氯 甲基苯乙烯、乙烯基苯甲酸甲酯與α -甲基苯乙烯等。乙烯 ® 基醚類之例子，可列舉：甲基乙烯醚、丁基乙烯醚、己基 乙烯醚與甲氧基乙基乙烯醚等。 也可以使用其他之乙烯基吡啶、乙烯基吡咯烷酮、乙烯 基咔唑與（甲基）丙烯腈等。 ’ 可以僅使用此等化合物之一種，另外，也可以合倂二種 - 以上使用。特別理想之可共聚合的單體例子係（甲基）两 烯酸甲酯、（甲基）丙烯酸-2 -乙基己酯、（甲基）丙嫌酸 -22 - 200522806 苯甲酯、苯乙嫌、α -甲基苯乙條、氯苯乙；^、溴苯乙稀與 羥基苯乙烯等。 含殘基乙稀基共聚物之具有竣基的重複單位含量，於整 個共聚物之重複單位中的1〜60莫耳％之範圍內，較宜爲 - 5〜50莫耳％之範圍內，尤以10〜40莫耳％更爲理想。含竣 . 基乙嫌基共聚物之分子量，較宜爲質量平均分子量於 1000〜200000之範圍內，尤以4000〜100000之範圍內更爲理 想。 感光層中之黏結劑聚合物之含量，第一‘感光層與第二感 · 光層均較宜於5〜96質量％之範圍內，尤以40〜80質量％之 範圍更爲理想。 含乙烯性不飽和鍵單體之較佳例係具有至少二個乙烯性 不飽和雙鍵之化合物（以下，也稱爲多官能單體）。例如， 如此之多官能單體的例子，可列舉：揭示於日本公開專利 第昭3 6 - 5 09 3、昭3 5 - 1 47 1 9、昭44 - 287 27號等之公報的化 合物。揭示於該公報之化合物（（甲基）丙烯酸酯類、（甲 基）丙烯醯胺類、烯丙基化合物、乙烯基醚化合物、乙烯 · 基酯類）的例子，可列舉如下之化合物。丙烯酸酯類與甲 基丙烯酸酯類之例子，可列舉：多元醇之聚丙嫌酸酯類與 聚甲基丙烯酸酯類（此處，所謂「聚」係指二（甲基）丙 烯酸酯以上），此多元醇之例子，可列舉：聚乙二醇、聚 · 丙二醇、聚丁二醇、聚環己烯氧化物、聚苯乙烯氧化物、 聚氧雜環丁烷、聚四氫呋喃、環己二醇、二甲苯二醇、二_ (/3 -羥基乙氧基）苯、甘油、二甘油、新戊二醇、三羥甲 -23 - 200522806 基丙烷、三羥甲基乙烷、季戊四醇、二季戊四醇、山梨糖 醇酐、山梨糖醇、丁二醇、丁三醇、2 - 丁烯-1 , 4 -二醇、2 -丁烯-1,4-二醇、2 -正丁基-2-乙基-丙二醇、2 -丁炔-1,4-二醇、3 -氯-1,2 -丙二醇、1,4-環己烷二甲醇、3 -環己烯 -1，1 -二甲醇、萘二醇、2，3 -二溴-2 - 丁烯-1，4 -二醇、2，2 -二乙基-1，3 -丙二醇、1，5-二羥基-1，2,3,4 -四氫萘、2,5-二甲基·2,5 -己二醇、2,2-二甲基-1,3 -丙二醇、2,2 -二苯 基-1 , 3 -丙二醇、十二烷二醇、內消旋赤蘚醇、2 -乙基-1，3 -己二醇、2 -乙基-2-羥甲基-1，3 -丙二醇、2 -乙基-2-甲基 -1，3 -丙二醇、庚二醇、己二醇、3 -己烯-2, 5-二醇、羥基 苯甲基醇、羥乙基間苯二酚、2 -甲基-1，4 -丁二醇、2 -甲基 -2,4 -戊二醇、壬二醇、辛一醇、戊二醇、1-苯基-1,2 -乙 二醇、丙二醇、2,2,4,4-四甲基-1,3 -環丁 二醇、2,3,5,6-四甲基二甲苯-α， α’ -二醇、1,1，4,4 -四苯基-1，4-丁 二醇、1，1,4,4 -四苯基-2-丁炔-1，4 -二醇、1,2,6 -三羥 基己烷、1,1’ -雙-2-萘酚、二羥基萘、1,1’ -亞甲基-二 -2 -萘酚、1，2,4 -苯三醇、雙酚、2, 2’ -雙（4 -羥苯基）丁 烷、1，1 -雙（4 -羥苯基）環己烷、雙（羥苯基）甲烷、鄰 苯二酚、4-氯間苯二酚、3 ,4-二羥基氫化桂皮酸、對苯二 酚、羥基苯甲基醇、甲基對苯二酚、亞甲基- 2,4，6-三羥基 苯甲酸酯、間苯三酚、1,2,3 -苯三酚、間苯二酚、葡萄糖、 α - ( 1-胺基乙基）羥基苯甲基醇、2-胺基-2-乙基-1，3-丙二醇、2 -胺基-2-甲基-1，3 -丙二醇、3 -胺基-1,2 -丙二 醇、Ν- ( 3-胺基丙基）二乙醇胺、Ν，Ν’ -雙（2-羥乙基） -24 - 200522806 哌嗪、2，2 -雙（羥甲基）-2 , 2， ，2 ” -氮川三乙醇、2 , 2 -雙 (羥甲基）丙醯酸、1，3-雙（羥甲基）尿素、1,2-雙（4-吡啶）-1，2 -乙二醇、N -正丁基二乙醇胺、二乙醇胺、N -伸 乙基二乙醇胺、3 -氫硫基-1，2 -丙二醇、3 -哌啶基-1，2 -丙 . 二醇、2 - ( 2 -吡啶基）-1 , 3 -丙二醇、三乙醇胺、α - ( 1 -胺乙基）-，羥基苯甲基醇與3-胺基-4-羥基苯基碉等。 此等丙烯酸酯類與甲基丙烯酸酯類之中，基於容易取得 的觀點，最好之例子，可列舉：乙二醇二丙烯酸酯、二乙 二醇二丙烯酸酯、三乙二醇二丙烯酸酯、四乙二醇二丙烯 鲁 酸酯、乙二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、 三乙二醇二甲基丙烯酸酯、四乙二醇二甲基丙烯酸酯、聚 乙二醇二丙烯酸酯、四丙二醇二丙烯酸酯、十二丙二醇二 丙烯酸酯、三羥甲基丙烷三丙烯酸酯、三羥甲基丙烷三甲 基丙烯酸酯、季戊四醇四丙烯酸酯、季戊四醇三丙烯酸酯、 季戊四醇二丙烯酸酯、季戊四醇二甲基丙烯酸酯、二季戊 四醇五丙烯酸酯、甘油三丙烯酸酯、二甘油二甲基丙烯酸 酯、1，3 -丙二醇二丙烯酸酯、丨，2, 4 -丁三醇三甲基丙烯酸 ® 酯、1，4 -環己二醇二丙烯酸酯、〗，〗_戊二醇二丙烯酸酯、 新戊二醇二丙烯酸酯與環氧乙烷加成之三羥甲基丙烷的三 丙烯酸酯等。 丙烯醯胺類與甲基丙烯醯胺類之例子，除了亞甲基雙丙 - 烯醯胺、亞甲基雙甲基丙烯醯胺之外，可列舉：乙二胺、 ^ 二胺基丙烷、二胺基丁烷、五亞甲基二胺、六亞甲基二胺、 雙（2 -胺丙基）胺、二伸乙基三胺、五亞甲基二胺、八亞 -25 - 200522806 甲基二胺與具有藉由雜原子所中斷的聚胺與環之聚胺（例 如，伸苯基二胺、伸二甲苯基二胺、Θ - ( 4 -胺基苯基）乙 胺、二胺基苯甲酸、二胺基甲苯、二胺基蒽、二胺基莽等） 等。 - 烯丙基化合物之例子，可列舉：苯二甲酸、對苯二甲酸、 - 癸二酸、己二酸、戊二酸、丙二酸與硝酸等之二羧酸的二 烯丙基酯；蒽二磺酸、苯二磺酸、2，5-二羥基·；7-苯二磺酸、 二羥基萘二磺酸與萘二磺酸等之二磺酸的二烯丙基酯，及 二烯丙基醯胺等。乙烯基醚化合物之例子，可列舉：該多 鲁 元醇之聚乙烯基醚{例如，乙二醇二乙烯基醚、1，3,5 -三-/3 -乙烯氧基乙氧基苯、1，3-二-/3 -乙烯氧基乙氧基苯與甘 油三乙烯基醚}。乙烯基酯類之例子，可列舉··二乙烯基丁 二酸酯、二乙烯基己二酸酯、二乙烯基鄰苯二甲酸酯、二 乙烯基對苯二甲酸酯、二乙烯基苯-1，3 -二磺酸酯與二乙烯 基丁烷-1，4 -二磺酸酯等。苯乙烯化合物之例子，可列舉： 二乙烯基苯、；7-烯丙基苯乙烯與，異丙基苯乙烯等。 該化合物以外的化合物，可列舉：N - /3 -羥乙基-石-(甲 鲁 基丙烯醯胺）乙基丙烯酸酯、N，N -雙（々-甲基丙烯氧乙基） 丙烯醯胺、烯丙基甲基丙烯酸酯等之具有二個以上不同的 乙烯性不飽和雙鍵之化合物；再者，使至少具有二個羥基 之聚醇化合物與稍微過剩之至少具有二個異氰酸酯基之聚 · 異氰酸酯化合物反應的反應生成物，再與具有至少一個羥 · 基與至少一個乙烯性不飽和基之化合物經反應而得到的至 少具有二個乙烯性不飽和雙鍵之多官能胺甲酸酯化合物也 -26 - 200522806 適用於本發明之化合物。 此等多官能單體能夠單獨使用或合倂二種以上使用。感 光層中之多官能單體的含量，第一感光層與第二感光層均 較宜於5〜90質量％範圍內，尤以15〜60質量％範圍內更爲 · 理想。 . 光聚合起始劑可列舉：芳香族酮、揭示於美國專利第 2 3 6 7660號說明書之連位聚縮酮二醯化合物、揭示於美國專 利第2448828號說明書之偶姻醚化合物、揭示於美國專利 第2 7 2 2 5 1 2號說明書之被α -烴所取代的芳香族偶姻醚化合 · 物、掲示於美國專利第3 046 1 27與29 5 1 75 8號說明書之多 核醌化合物、揭示於美國專利第3 5 4 9 3 6 7號說明書之三芳 基咪唑二聚物與；胺基酮之組合、揭示於日本公開專利第 昭5 1 - 48 5 1 6號公報之苯并噻唑化合物與三鹵素甲基三 嗪化合物、揭示於美國專利第4239850號說明書之三鹵素 甲基三嗪化合物、揭示於美國專利第42 1 2976號說明書 之三鹵素甲基噚二唑化合物等。尤以芳香族酮較佳。 該芳香族酮之較佳例，可列舉：二苯甲酮、2 -甲基二苯 ® 甲酮、3 -甲基二苯甲酮、4 -甲基二苯甲酮、4 -甲氧基二苯 甲酮、2-氯二苯甲酮、4-氯二苯甲酮、4-溴二苯甲酮、2-羧基二苯甲酮、2 -乙氧基羧基二苯甲酮、二苯甲酮四羧酸 或其四甲基酯、4 -甲氧基-4’ -二甲胺基二苯甲酮、4, 4’ - · 二甲氧基二苯甲酮、4 -二甲基胺基二苯甲酮、4 -二甲基胺 - 基苯乙酮、蒽醌、2 -第三丁基蒽醌、2 -甲基蒽醌、菲醌、 氧雜蒽酮、硫雜蒽酮、2 -氯硫雜蒽酮、2，4 -二甲基硫雜蒽 -27 - 200522806 酮、2，4 -二乙基硫雜蒽酮、莽、吖啶酮與苯偶姻、苯偶姻 醚類（例如，苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻丙基 醚、苯偶姻異丙基醚、苯偶姻苯基醚、苯甲基二甲基縮酮）、 4，4’ -雙（二烷基胺基）二苯甲酮類（例如，4，4’ -雙（二 ‘ 甲基胺基）二苯甲酮、4, 4’ -雙（二環己基胺基）二苯甲 - 酮、4, 4’ -雙（二乙基胺基）二苯甲酮、4，4’ -雙（二羥 乙基胺基）二苯甲酮）等。特別理想之例子，可列舉：二 苯甲酮。 一般而言，感光層中之光聚合起始劑的含量，第一感光 · 層與第二感光層均爲0.1〜10質量％，更佳爲0.5〜5質量 %。以光聚合起始劑的含量調整第一感光層與第二感光層 之感度差時，第二感光層之光聚合起始劑的含量較宜設爲 第一感光層之光聚合起始劑的1 . 5〜10倍含量之量，尤以2〜5 倍之量更爲理想。 於感光性轉印片之感光層中，也可以添加增感劑。通常， 增感劑僅添加於第二感光層中。 增感劑能夠使用較宜之多核芳香族類（例如，芘、茈、 ® 三鄰亞苯）、氧雜蒽類（例如，螢光素、曙紅、紅黴素、 若丹明B、孟加拉玫瑰紅）、花青類（例如，硫裁基花青、 氧羰基花青）、部花青類（例如，部花青、香芹部花青）、 噻嗪類（例如，硫僅、亞甲藍、甲苯胺藍）、吖啶類（例 * 如，吖啶橙、氯黃素、吖啶黃）、蒽醌類（例如，蒽醌）、 - 角鯊鐵類（例如，角鯊鑰）。 相對於感光層之全部成分，增感劑之添加量爲0 · 0 5〜3 0 -28 - 200522806 質量％之範圍，較宜爲0·1〜20質量％之範圍，尤以〇·2〜10 質量％之範圍更爲理想° 感光性轉印片之感光層也可以含有三苯基咪唑二聚物。 三苯基咪唑二聚物之例子，可列舉：2-(2氯苯基）-4, 5- ' 二苯基咪唑二聚物、2-(2’ -氯苯基）-4,5 -二（3’ -甲氧 · 基苯基）咪唑二聚物、2-(2氟苯基）-4, 5 -二苯基咪唑 二聚物、2 - (2’ -甲氧基苯基）-4, 5 -二苯基咪唑二聚物與 2-(4’ ·甲氧基苯基）-4,5-二苯基咪唑二聚物。 感光性轉印片之感光層’也可以含有例如揭示於J ®200522806 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a printed wiring board with perforations or through holes. · [Prior art] · Conventional technology uses a photosensitive transfer sheet (also known as a dry film photoresist) composed of a photosensitive layer laminated on a carrier to manufacture printed wiring boards by photolithography technology. For example, a printed wiring board having perforations is manufactured in the following manner. First, a perforation is formed on a printed wiring board forming substrate (for example, a copper-clad laminate) having a metal layer on the surface, and then a metal layer is formed on the inner wall portion of the perforation. Next, on the metal layer on the substrate surface, the photosensitive layer of the photosensitive transfer sheet is brought into contact with the metal layer to overlap, and light is irradiated to the area including the wiring pattern forming area and the perforated opening portion on the surface of the metal layer to become a predetermined one. The pattern is made to harden the photosensitive layer. Next, the carrier of the photosensitive transfer sheet is peeled off, and the hardened layer on the wiring pattern formation area and the hardened layer (referred to as the curtain film) on the perforated opening area are removed to expose the substrate surface. Of the metal layer. Then, the exposed metal layer is etched, and then the hardened layer is removed to obtain a printed wiring board having a metal wiring pattern on the surface. In this way, when the photosensitive layer of the photosensitive transfer sheet is superposed on the metal layer on the substrate surface, and then the light is irradiated into a predetermined pattern, and the carrier of the photosensitive transfer sheet is stripped, the carrier is more suitable. Use a flexible transparent film carrier. In the manufacturing steps of the printed wiring board, if the adhesion between the metal layer and the hardened layer on the surface of the substrate is insufficient, the hardened layer may be peeled off during the etching and the cloth pattern may be broken. Therefore, in order to improve the adhesion between the metal layer on the substrate surface and the hardened layer, the surface of the metal layer on the substrate surface is roughened (in general, polished and honed). In order to increase the resolution of the photosensitive transfer sheet, it is effective to reduce the thickness of the photosensitive layer. However, once the thickness of the photosensitive layer is thinned, it often occurs in the peripheral portion of the perforation, and the hardened layer is deformed or the thickness becomes thin. When manufacturing the printed wiring board, Problems such as the hardened layer becoming easily cracked. Therefore, the development of the photosensitive transfer sheet was started to make it possible to form a pattern with a high resolution, and to form a hardened layer that was difficult to crack the curtain film. Patent Document 1 discloses a photosensitive transfer sheet having a two-layer photosensitive layer composed of a first photosensitive layer and a second photosensitive layer. The first photosensitive layer is provided on the carrier with alkali-soluble and flow caused by heating. Low sensitivity and inductive active energy rays; the second photosensitive layer is on top of which is provided with alkali-soluble, high fluidity caused by heating and inductive active energy rays. In this patent document 1, it is explained that the perforated metal layer can be protected by burying the second photosensitive layer of the photosensitive transfer sheet in the perforation. However, in the final step of manufacturing the printed wiring board, since the hardened resin (hardened material of the second photosensitive layer) embedded in the perforation has to be removed, there are problems such that the manufacturing steps of the printed wiring board become complicated . [Patent Document 1] Japanese Laid-Open Patent Publication No. 8-54732 [Summary of the Invention] Technical Problem to be Solved by the Invention The object of the present invention is to provide a method for manufacturing a printed wiring board which is industrially advantageous. Forming a photosensitive transfer sheet having a photosensitive layer with a high-resolution hardened layer and a high-strength hardened layer (curtain film), 200522806 A printed wiring board with perforated or through holes and a high-resolution metal wiring pattern. The technical solution to solve the problem of the present invention is to provide a method for manufacturing a printed wiring board by the following steps: (i) a step of preparing a substrate for forming a printed wiring board, on a carrier, sequentially laminating a photosensitive transfer sheet having a relatively low-sensitivity first photosensitive layer and a relatively high-sensitivity second photosensitive layer; The substrate covered by the metal layer, and the surface roughness indicated by Ra of the metal layer is 0. 01 to 〇. Within the range of 40 // m, the first photosensitive layer is made of a photosensitive resin composition containing a binder polymer, a monomer containing an ethylenically unsaturated bond, and a photopolymerization initiator. Upon exposure to light, monomers containing ethylenically unsaturated bonds will be polymerized and hardened. The second photosensitive layer is composed of a photopolymerization agent containing a binder polymer, an ethylenically unsaturated bond-containing monomer, and a photopolymerization initiator. Based on a flexible resin composition, a monomer containing an ethylenically unsaturated bond is polymerized and hardened by irradiation of light; (2) a laminating step, on the surface of the substrate for forming a printed wiring board, the second sense The Lu Guang layer is connected to a metal layer to laminate a photosensitive transfer sheet, and a photosensitive laminate in which a printed wiring board forming substrate, a second photosensitive layer, a first photosensitive layer, and a carrier are sequentially laminated is obtained; (3 ) Wiring part exposure step, from the carrier side of the photosensitive laminate, at least the wiring pattern forming area of the printed wiring board forming substrate is printed and brushed, and the light of the amount of light required to harden the second photosensitive layer is irradiated Forming a predetermined pattern, forming a hardened layer region of a predetermined pattern 200522806 (4) Cavity exposure step, from the carrier side of the photosensitive laminate, the first photosensitive layer and the second photosensitive layer are cured simultaneously with the required amount of light or a predetermined pattern on the substrate including the printed wiring board formation The area of the opening of the perforation or through hole forms the hardened layer area covering the area of the opening of the perforation or through hole; (5) Carrier peeling step, the carrier is peeled from the photosensitive laminate; (6) Development step, dissolution Removing the uncured areas of the first photosensitive layer and the second photosensitive layer on the substrate for forming a printed wiring board, so that the metal layer of the uncured area on the substrate surface is exposed; (7) a uranium etching step, which uses an etchant to dissolve and remove A metal layer in the exposed area; and (8) a hardened layer removing step of removing the hardened layer from the printed wiring board forming substrate. The preferable aspect of the manufacturing method of this invention is shown below. (A) The surface roughness of the metal layer is adjusted to this range by a chemical honing process. (B) The light used in step (3) is laser light. In addition, the subject of the present invention is to provide a method for manufacturing a printed wiring board having perforations or through-holes, which is composed of the following steps: (1) a step of preparing a substrate for forming a printed wiring board on a carrier in order A photosensitive transfer sheet in which a relatively low-sensitivity first photosensitive layer and a relatively high-sensitivity second photosensitive layer are laminated; a substrate having perforations or through-holes and whose surface is covered by a metal layer; and the Ra layer of the metal layer The surface roughness shown is 0. 01 to 0. Within the range of 40 // m, the first photosensitive layer is made of a photosensitive resin composition containing a binder polymer, a monomer containing an ethylenically unsaturated bond, and a photopolymerization initiator. Irradiated by light, monomers containing ethylenic unsaturated bonds will be polymerized and hardened. The second photosensitive layer is a photosensitive resin containing a binder polymer, a monomer containing ethylenic unsaturated bonds, and a photopolymerization initiator. The composition is made, and the monomer containing ethylenic unsaturated bond will be polymerized and hardened by the irradiation of light; (2) the lamination step, on the surface of the substrate for forming a printed wiring board, the second sense. The optical layer is connected to a metal layer to laminate a photosensitive transfer sheet, so as to obtain a photosensitive laminate in which a printed wiring board forming substrate, a second photosensitive layer, a first photosensitive layer, and a carrier are sequentially laminated; (3) The wiring portion exposure step irradiates a predetermined amount of light from the carrier side of the photosensitive laminate at least on the wiring pattern forming area of the printed wiring board forming substrate with a light amount required for curing the second photosensitive layer. Shape, forming a hardened layer region of a predetermined pattern; (4) a cavity exposure step, irradiating the light of the light quantity required for the first photosensitive layer and the second photosensitive layer to be hardened simultaneously from the carrier side of the photosensitive laminate into a predetermined pattern on The area including the openings of the perforations or through-holes of the substrate for forming a printed wiring board forms a hardened layer area covering the openings of the perforations or through-holes; (5) a carrier peeling step, the carrier is peeled from the photosensitive laminate; ® (6) developing step, dissolving and removing the uncured area of the first photosensitive layer and the second photosensitive layer on the printed wiring board forming substrate, so that the metal layer of the uncured area on the substrate surface is exposed; (7) etching step Uranium was dissolved using engraved area exposed by removing the metal layer, _; ~ and (8) the step of removing the hardened layer, is formed by removing the hardened layer printed wiring board substrate. -10-200522806 A preferred aspect of the manufacturing method of the present invention is shown below. (A) The surface roughness of the metal layer is adjusted to this range by chemical honing. (B) The light used in steps (3) and (4) is laser light. In addition, the photosensitive laminate of the present invention has a surface roughness shown by R a. The degree is less than 0. 01 to 0. A metal layer in the range of 40 // m, on the surface of the printed wiring board forming substrate covering the surface, a relatively high-sensitivity second photosensitive layer and a relatively low-sensitivity first photosensitive layer are sequentially laminated, wherein the second photosensitive layer It is a photosensitive resin composition containing a binder polymer, a monomer containing an ethylenically unsaturated bond ·, and a photopolymerization initiator. The monomer containing the ethylenically unsaturated bond is irradiated by light. It is polymerized and hardened; and the first photosensitive layer is a photosensitive resin composition containing a binder polymer, a monomer containing an ethylenically unsaturated bond, and a photopolymerization initiator, and is irradiated with light to contain The ethylenically unsaturated bond monomer will polymerize and harden. The preferable aspect of the photosensitive laminate of this invention is as follows. (A) The surface roughness of the metal layer is adjusted to the range of 0 by chemical honing. (B) A carrier is laminated on the first photosensitive layer. In addition, in this patent specification, the "surface roughness shown by Ra" means the arithmetical average roughness according to the Japanese Industrial Standards (Π S B 0 60 0 1-1 9 4). -[Effects of the invention] The photosensitive transfer sheet used in the manufacturing method of the present invention can be changed in its irradiation amount (exposure amount) by changing -11-200522806 to form hardened layers with different thicknesses. If such a photosensitive transfer sheet is used, it is possible to form a thick high-strength hardened layer covering a through hole or a through hole on a printed wiring board forming substrate having a hole or a through hole and a metal layer on the surface, and A thin high-resolution hardened layer covering a wiring pattern formation area on the surface of the metal layer. When forming the thin high-resolution hardened layer on the wiring pattern forming area on the surface of the metal layer on the substrate for forming a printed wiring board, the surface roughness of the metal layer on the substrate must be moderate. This is because the resolution of the hardened layer formed on the area where the wiring pattern is formed is high, and therefore the exposure step is affected by irregular reflection on the surface of the metal layer on the substrate surface where the light is irradiated to the photosensitive layer. Specifically, if the amount of light irregular reflection is large, the photosensitive layer near the outside of the wiring pattern formation area is hardened by the irregularly reflected light, and as a result, the resolution of the hardened layer after exposure is slightly reduced. The surface roughness of the metal layer on the surface of the printed wiring board forming substrate used in the manufacturing method of the present invention is 0. 01 to 0. Within the range of 40 / zm. By using a substrate provided with a metal layer having such a moderate surface roughness, since irregular reflection of light on the surface of the metal layer is reduced, the adhesion between the metal layer and the hardened layer on the surface of the substrate is not reduced, and high resolution can be formed. Of hardened layer. In addition, in a method for manufacturing a printed wiring board using a photosensitive transfer sheet having a conventional photosensitive layer, in order to form a sufficient strength curtain film on the perforations, a thick layer is formed on the metal layer on the substrate surface. That is, the low-resolution hardened layer will not cause problems such as a decrease in resolution caused by the irregular reflection of the light. Since the manufacturing method of the present invention uses a thick high-strength hardened layer formed on the surface of the metal layer on the substrate surface, and a thin high-resolution hardened -12-200522806 layer, it is advantageous for industrial applications with perforations or through holes and Manufacturing of printed wiring boards with high-resolution metal wiring patterns. [Embodiment] [Implementation Mode of the Invention] A manufacturing method of a printed wiring board according to the present invention will be described with reference to the accompanying drawings, taking a case where a printed wiring board having perforations or through holes is manufactured as a representative example. First, a photosensitive transfer sheet used in the manufacturing method of the present invention will be described. Fig. 1 is a cross-sectional view showing the structure of an example of a photosensitive transfer sheet which is preferably used in the practice of the manufacturing method of the present invention. The photosensitive transfer sheet 10 in FIG. 1 includes a carrier 11, a first photosensitive layer 12, a second photosensitive layer 13, and a protective film 14 laminated in this order. The first photosensitive layer 12 and the second photosensitive layer 13 are respectively formed of a photosensitive resin composition containing a binder polymer, a monomer containing an ethylenically unsaturated bond, and a photopolymerization initiator. Upon irradiation, a monomer containing an ethylenically unsaturated bond is polymerized and hardened. The photosensitive transfer sheet used in the present invention is mainly characterized in that, compared with the first photosensitive layer 12, the second photosensitive layer 13 has a relatively high sensitivity. Here, the term "high sensitivity" means that the hardening of the second photosensitive layer 13 is started, and the hardening is started using a light irradiation amount smaller than that of the first photosensitive layer 12. The relationship between the amount of light irradiated on the photosensitive transfer sheet used in the present invention and the amount of hardened photosensitive layer will be described with reference to the accompanying Figure 2. Fig. 2 is a graph showing a sensitivity curve showing the relationship between the amount of light irradiation and the thickness of the cured layer when the light is irradiated onto the photosensitive transfer sheet of Fig. 1 from the flexible transparent film carrier side. In Fig. 2, the horizontal axis represents the light irradiation amount, and the vertical axis represents the thickness of the photosensitive layer hardened by the irradiation of light. D on the vertical axis represents the thickness of the second photosensitive layer, and -13-200522806 E represents the thickness of the entire photosensitive layer after the thickness of the first photosensitive layer is added to the thickness of the second photosensitive layer. As shown in FIG. 2, in the case of the photosensitive transfer sheet used in the present invention, the light irradiated from the flexible transparent film carrier depends on the order of the flexible transparent film carrier, the first photosensitive layer and the second photosensitive layer. Enter, use the first photosensitive layer. For a small amount of light, the second photosensitive layer starts to harden. The light amount S at which the second photosensitive layer starts to harden is more preferably 0. Within the range of 1 ~ 10mJ / cm2. The amount of hardening of the second photosensitive layer increases as the amount of light increases. Soon, the entire second photosensitive layer will harden. In order to harden the second photosensitive layer, the amount of light A is more preferably 20 ml / cm2 φ or less (especially in the range of 2 to 15 m J / cm2). After the entire second photosensitive layer is hardened, if the amount of light continues to increase, the first photosensitive layer will begin to harden. If the amount of light is further increased, the entire first photosensitive layer will be hardened. The ratio of the amount of light A required to harden the second photosensitive layer and the amount of light B required to harden the first photosensitive layer 値 A / B, which is more preferably 0. 01 ~ 0. Within the range of 5. The amount of light C required until the first photosensitive layer starts to harden may be equal to the amount of light A required to harden the second photosensitive layer, but it should be larger than the amount of light A. The difference CA between the amount of light A required for the second photosensitive layer to harden and the amount of light C required before the first photosensitive layer begins to harden should be less than 10 times the amount of irradiation A required for the second photosensitive layer to harden (Especially 1. A range of 1 to 10 times is more desirable) 'or 100 mJ / cm2 or less (especially in a range of 1 to 100 mJ / cm2). * A photosensitive transfer sheet having such a sensitivity curve can be obtained by, for example,-making the content of the photopolymerization initiator of the second photosensitive layer more than that of the first photosensitive layer, or adding it to the second photosensitive layer A sensitizer is obtained. The material and manufacturing method of the photosensitive -14-200522806 transfer sheet will be described in detail later. Next, a method for manufacturing a printed wiring board having a perforation or a through hole according to the present invention will be described with reference to the accompanying figure 3. First, using the first and second figures to explain, prepare a photosensitive, transfer sheet, which is configured to sequentially laminate a first photosensitive layer and a second photosensitive layer, which. In the middle, a relatively low-sensitivity first photosensitive layer is formed on a support and is made of a photosensitive resin composition containing a binder polymer, a monomer containing an ethylenically unsaturated bond, and a photopolymerization initiator. Upon irradiation, monomers containing ethylenically unsaturated bonds will polymerize and harden; the second photosensitive layer with a relatively high sensitivity is initiated by monomers containing a binder polymer, ethylenically unsaturated bonds and photopolymerization. A photosensitive resin composition made of an agent is irradiated with light, and a monomer containing an ethylenically unsaturated bond is polymerized and hardened. Then, a substrate 21 for forming a printed wiring board is prepared. As shown in FIG. 3 (A), it is a substrate having a through hole 22 and the surface is covered with a metal layer 23. Surface roughness is less than 0. 01 to 0. Within the range of 40 // m. The surface roughness of the metal layer 23 is more preferably 0. 05 to 0. 2 0 // m. For example, the printed wiring board forming substrate 21 can be formed on a copper-plated laminated substrate and an insulating base material such as glass-epoxy resin. Copper-plated substrates, or the metal layer surfaces of these individual substrates are patterned, and interlayer insulation films are laminated thereon to further form copper-plated substrates (laminated substrates). In this way, by using a substrate for forming a printed wiring board having a surface β surface roughness within the range of the metal layer, a hardened layer with excellent adhesion and high resolution can be formed on the surface of the metal layer. The relationship between the surface roughness of the metal layer on the surface of the printed wiring board forming substrate and the resolution of the hardened layer formed on the surface of this metal -15-200522806 layer will be described in detail later. The surface roughness of the substrate surface metal layer 23 is preferably adjusted to this range by 硏. Representative examples of the honing process include polishing, washing honing, and chemical honing. Honing is particularly desirable. In the following, a chemical honing process is taken as an example to describe a preferable process for making the surface roughness of the metal layer 23 in this range. The oxide on the surface of the metal layer of the substrate or the oil on the surface of the metal layer is removed by a moderate chemical honing process, and the metal layer on the surface is uniformly honed along the direction of its surface. It is sufficient to make the surface of the metal layer on the substrate surface and the hardening force formed thereon uniform and uniform. The chemical honing process is a process in which a processing liquid in which the metal is dissolved is brought into contact with and partially dissolved by the substrate surface for forming a printed wiring board and the substrate is subjected to honing. Generally, after the chemical honing process, the substrate for forming a wiring board is washed with water (in some cases before the washing with water), and then dried. Examples of the treatment in which the treatment liquid is brought into contact with the surface of the metal layer of the substrate for printing cloth include dipping and the like. In the spray treatment, the treatment liquid is sprayed from a spray nozzle connected to the treatment liquid. For printed wiring board forming substrates. The mechanism is disclosed in detail in Japanese Laid-Open Patent Publications Nos. Heisei 6-2 0 4 6 6 1 and 2P. Examples of the treatment liquid used in the chemical honing process include a treatment liquid and a hydrogen peroxide-based treatment liquid. The chemical treatment of the light honing place is carried out by grinding the hydrogen peroxide-based treatment liquid. Conditions such as the entrance surface, the substrate table_ Therefore, the surface of the metal layer can be adhered to the surface of the metal layer, the printing line is formed by the pickling line. © Processing, spray pipe spraying chemical department 1 1-608 3 ^ chlorine For iron systems, -16-200522806 hydrogen peroxide concentration is 8g / liter (allowable range: 4 ~ 168 g / liter), sulfuric acid concentration is 100g / liter (allowable range: 50 ~ 200 g / liter), copper ion A treatment solution having a concentration of 0 to 50 g / liter. The temperature of the hydrogen peroxide treatment liquid is preferably 30 ° C (permissible range: 25 to 40 ° C). In the case of shower curtain treatment, the pressure of the shower curtain _ pipe is preferably 0. 2MPa (Allowable range: 0. 1 ~ 0. 3MPa). Shower curtain-The processing time is preferably 25 seconds (permissible range: 20 to 40 seconds). Next, as shown in FIG. 3 (B), the second photosensitive layer 13 of the photosensitive transfer sheet 10 is laminated on the surface of the printed wiring board forming substrate 21 using a pressure roller 31 ( Lamination step). Thereby, a photosensitive laminate having a structure in which a printed circuit board 2 and a printed wiring board forming substrate 2 1, a second photosensitive layer 1 3, a first photosensitive layer 1 2, and a flexible transparent film carrier 1 1 are sequentially laminated can be obtained. . The lamination of the photosensitive transfer sheet 10 can be performed at room temperature (15 ~ 30 ° C) or under heating (30 ~ 180 ° C). It is more ideal to carry out heating at 60 ~ 140 ° C. In addition, instead of using a photosensitive transfer sheet, the second photosensitive resin composition solution and the first photosensitive resin for the production of a photosensitive transfer sheet described later are sequentially performed on the surface of the substrate for forming a printed wiring board. By directly applying and drying the composition solution, a photosensitive laminate having a structure in which a base beta plate for forming a printed wiring board, a second photosensitive layer, and a first photosensitive layer are sequentially laminated can also be obtained. Next, as shown in FIG. 3 (C), light is irradiated from the side of the flexible transparent film carrier 11 of the photosensitive laminate to harden the photosensitive layer. In the wiring pattern formation area of the printed wiring board formation substrate 21, a predetermined amount of light is irradiated with light of a required amount of light for curing the second photosensitive layer 13 to form a hardened layer for wiring pattern formation and formation. 15 areas (Wiring section exposure step). The opening of the perforation 22 of the printed wiring board forming substrate and its surroundings are irradiated with light of a required amount of light for the first sensing -17-200522806 light layer 12 and the second photosensitive layer 13 to form a perforated metal layer for protection. The area where the hardened layer 16 is used (the hole portion exposure step). Although the wiring portion exposure step and the hole portion exposure step may be performed independently, they are preferably performed in combination. The exposure is performed by transmitting light through a mask, or by using a laser exposure device. The light source used for the exposure is to use a transparent transparent film carrier 11 and use a photopolymerization initiator that generates active electromagnetic waves with a wavelength of 310 to 700 nm (preferably 3 5 0 to 5 00 nm). A light source in the range of ultraviolet to visible light. For example, (ultra-high-pressure) mercury lamps, xenon lamps, carbon arc lamps, halogen lamps, replication fluorescent lamps, semiconductor lasers, and other conventional light sources can be used. In addition, electronic wires or X-rays can also be used. In the exposure step, the light irradiated on the photosensitive layer is irregularly reflected on the surface of the metal layer 2 3 on the substrate surface. The irregularly reflected light, for example, hardens only the second photosensitive layer 13 near the outer side of the hardened layer 15 for wiring pattern formation, so that the resolution of the hardened layer 15 is lowered. The surface roughness of the metal layer on the surface of the substrate for forming a printed wiring board used in the manufacturing method of the present invention is 0. 0 1 to 0. 40 // m (more preferably 0. 05 to 0. 20 // m). By using a substrate provided with a metal layer having such a moderate surface roughness, since irregular reflection of light on the surface of the metal layer is reduced, the adhesion between the metal layer and the hardened layer on the surface of the substrate is not reduced, and a high degree of formation Resolution hardened layer. That is, if the surface roughness of the substrate surface metal layer 23 is lower than 0. 01 / im, the adhesion between the metal layer 23 and the hardened layer 15 is insufficient, and if the surface roughness exceeds 0. 40 // m, the resolution of the hardened layer 15 will decrease. -18-200522806 Next, as shown in Fig. 3 (D), the flexible transparent film carrier Π is peeled from the photosensitive laminate (carrier peeling step). Next, as shown in FIG. 3 (E), the uncured areas of the first photosensitive layer 12 and the second photosensitive-layer 13 on the printed wiring board forming substrate 21 are removed by dissolving with an appropriate developing solution, and the process is performed. Hardened layers 15 and 15 for wiring pattern formation. The hardened layer 16 for protecting the perforated metal layer is developed to expose the metal layer 23 on the surface of the substrate (development step). The "dissolution removal" of the uncured area of the photosensitive layer also includes dissolving a portion of the uncured area of the photosensitive layer, and the remaining portion is removed as a release sheet. Examples of the developing solution include a basic aqueous solution (for example, a sodium carbonate solution), an alkaline aqueous solution containing an organic solvent, and an organic solvent. Next, as shown in FIG. 3 (F), the metal layer 2 3 exposed on the surface of the substrate is removed by dissolution using an etching solution (etching step). Thereby, a wiring pattern 24 is formed on the printed wiring board forming substrate 21. In the case where the metal layer 23 is formed using copper, for the etchant, an aqueous solution of ferrous chloride, an aqueous solution of cuprous chloride, an aqueous solution of copper chloride, or the like can be used. Next, as shown in FIG. 3 (G), using a strong alkaline aqueous solution of Φ such as sodium hydroxide or potassium hydroxide, the hardened layers 15 and 16 are used as release sheets 17 to form a printed wiring board substrate. Remove it (hardened matter removal step). In this manner, a printed wiring board having a perforated surface covered with a metal layer on the inner wall surface can be manufactured. · Also, the present invention is not affected by the printed wiring board with perforations or through holes. Limited by manufacturing. For example, the same photosensitive laminate as described above is produced, and the wiring pattern forming area of the printed wiring board forming substrate is formed, and the light of the light amount required for the second photosensitive-19-200522806 layer hardening is irradiated into a predetermined pattern, and thereafter Similarly, a printed cloth having a high-resolution metal wiring pattern (without perforations or through holes) can be produced by peeling the carrier, the photosensitive layer, and etching the metal layer of the substrate for forming a printed wiring board, and then removing the hardened layer. Line board. When manufacturing such a printed wiring board, for example, in a region other than the cloth / line pattern forming region of the printed wiring board formation substrate, the first photosensitive layer and the second photosensitive layer are simultaneously cured by a required amount of light. Light is irradiated into a predetermined pattern, and a printed wiring board having such a high-resolution metal wiring pattern and a high-resolution metal wiring pattern (without perforations or through holes) can be produced. · The material and manufacturing method of the photosensitive transfer sheet having the structure shown in Fig. 1 will be described in detail below. The binder polymer used in the photosensitive transfer sheet is preferably a copolymer that is soluble in an alkaline aqueous solution or has at least the property of swelling upon contact with an alkaline aqueous solution. Examples of the copolymer having solubility or swelling in the alkaline aqueous solution include a carboxyl group-containing ethylene copolymer obtained by copolymerizing a carboxyl group-containing ethylene monomer and other copolymerizable ethylene monomers. Examples of carboxyl group-containing vinyl monomers include (meth) acrylic acid, luvinyl benzoic acid, maleic acid, itaconic acid, butenoic acid, cinnamic acid, acrylic acid dimer, styrene sulfonic acid, 2 -Allyl fluorenamine-2-methylpropanesulfonic acid and mono (meth) acryl fluorenyl ethyl phosphate and the like. In addition, an addition reaction product of a monomer having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate and a cyclic acid anhydride such as maleic acid 'or terephthalic anhydride can also be used. Alternatively, it is also possible to use an anhydride-containing monomer containing maleic anhydride, itaconic anhydride and the like as a carboxyl precursor. In addition, from the viewpoints of copolymerizability, cost, or solubility, -20-200522806 is particularly preferable among these examples. Examples of other copolymerizable monomers include ethylene unsaturated monomers which do not contain acidic groups (especially carboxyl groups). Monomers having no reactivity with acidic groups are particularly preferred. For example, (meth) acrylates, butyrates, vinyl esters, maleic diesters, fumaric diesters, itaconic acid diesters, (methyl ) Acrylamides, styrenes and vinyl ethers. Examples of such monomers include the following compounds: Examples of (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, and n-propyl (meth) acrylate Ester, isopropyl (methacryl) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, third butyl (meth) acrylate, n-hexyl (meth) acrylate, (formyl) 2) ethylhexyl acrylate, ethyl acetate (meth) acrylate, phenyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-methyl (meth) acrylate Ethoxyethyl, 2-ethoxyethyl (meth) acrylate, 2- (2-methoxyethoxy) ethyl (meth) acrylate, cyclohexyl (meth) acrylate, ( Benzyl (meth) acrylate, diethylene glycol (meth) acrylate monomethyl ether, diethylene glycol (meth) acrylate monoethyl ether, diethylene glycol (meth) acrylate monophenyl ether , Triethylene glycol (meth) acrylate monomethyl ether and triethylene glycol (meth) acrylate monoethyl ether. Examples of the methacrylic acid esters include butyl methacrylate and hexyl methacrylate. Examples of vinyl esters include ethylene acetate, ethylene propionate, ethylene butyrate, vinyl methoxy acetate, and vinyl benzoate. Examples of the maleic acid diesters include dimethyl maleate, -21-200522806 diethyl maleate, and dibutyl maleate. Examples of fumaric acid diesters include dimethyl fumarate, diethyl fumarate and dibutyl fumarate. Examples of itaconic acid diesters include: dimethyl itaconic acid. , Diethyl itaconate and dibutyl itaconate. -Examples of (meth) acrylamide: (Meth) acrylamine. Amine, N-methyl (meth) acrylamide, N-ethyl (meth) acrylamide, N-propyl (meth) acrylamide, N-n-butyl (meth) acrylamide , N-tertiary (meth) acrylamide, N -cyclohexyl (meth) acrylamide, N- (2-methoxyethyl) (meth) acrylamide, N, N-dimethyl (Methalyl) acrylamide, N, N-diethyl (meth) acrylamide, N-phenyl (meth) acrylamide, N-benzyl (meth) acrylamide and (Meth) acrylfluorenylmorpholine and the like. Examples of styrenes include: styrene, methylstyrene, dimethylstyrene, trimethylstyrene, ethylstyrene, isopropylstyrene, butylstyrene, hydroxystyrene, Methoxystyrene, butoxystyrene, ethoxylated styrene, chlorostyrene, dichlorostyrene, bromostyrene, chloromethylstyrene, methyl vinyl benzoate, and α-methylbenzene Ethylene, etc. Examples of ethylene ® based ethers include methyl vinyl ether, butyl vinyl ether, hexyl vinyl ether, and methoxyethyl vinyl ether. Other vinylpyridines, vinylpyrrolidone, vinylcarbazole, and (meth) acrylonitrile can also be used. ’You can use only one of these compounds, or you can combine two of them-the above. Examples of particularly desirable copolymerizable monomers are (meth) dienoic acid methyl ester, (meth) acrylic acid 2-ethylhexyl ester, (meth) propionic acid-22-200522806 benzyl ester, benzene Ethylene, α-methylphenethyl, chlorophenethyl; ^, bromostyrene and hydroxystyrene. The content of the repeating unit with a residue in the ethylene-containing copolymer having a radical is within a range of 1 to 60 mol% in the repeating unit of the entire copolymer, and more preferably within a range of -5 to 50 mol%. 10 to 40 mol% is more desirable. With completion. The molecular weight of the ethylene-based copolymer is more preferably in the range of 1,000 to 200,000, and more preferably in the range of 4,000 to 100,000. The content of the binder polymer in the photosensitive layer is preferably in the range of 5 to 96% by mass, and more preferably in the range of 40 to 80% by mass. A preferred example of the ethylenically unsaturated bond-containing monomer is a compound having at least two ethylenically unsaturated double bonds (hereinafter, also referred to as a polyfunctional monomer). For example, examples of such a polyfunctional monomer include compounds disclosed in Japanese Laid-Open Patent Publication Nos. Sho 3-6-5 093, Sho 35-1477-1, Sho 44-287 27 and the like. Examples of the compounds ((meth) acrylates, (meth) acrylamides, allyl compounds, vinyl ether compounds, and vinyl esters)) disclosed in this publication include the following compounds. Examples of acrylates and methacrylates include polyacrylic acid esters and polymethacrylates of polyhydric alcohols (herein, "poly" refers to di (meth) acrylate or more), Examples of the polyhydric alcohol include polyethylene glycol, polypropylene glycol, polybutylene glycol, polycyclohexene oxide, polystyrene oxide, polyoxetane, polytetrahydrofuran, and cyclohexanediol. , Xylene glycol, bis (/ 3-hydroxyethoxy) benzene, glycerol, diglycerol, neopentyl glycol, trimethylol-23-200522806 based propane, trimethylolethane, pentaerythritol, dipentaerythritol , Sorbitan, sorbitol, butanediol, butanetriol, 2-butene-1, 4-diol, 2-butene-1,4-diol, 2-n-butyl-2- Ethyl-propanediol, 2-butyne-1,4-diol, 3-chloro-1,2-propanediol, 1,4-cyclohexanedimethanol, 3-cyclohexene-1,1-dimethanol, Naphthalene glycol, 2,3-dibromo-2 -butene-1,4-diol, 2,2-diethyl-1,3-propanediol, 1,5-dihydroxy-1,2,3, 4-tetrahydronaphthalene, 2,5-dimethyl-2,5-hexanediol, 2,2-dimethyl-1,3-propanediol 2,2-diphenyl-1,3-propanediol, dodecanediol, mesoerythritol, 2-ethyl-1,3-hexanediol, 2-ethyl-2-hydroxymethyl -1,3-propanediol, 2-ethyl-2-methyl-1,3-propanediol, heptanediol, hexanediol, 3-hexene-2, 5-diol, hydroxybenzyl alcohol, hydroxy Ethyl resorcinol, 2-methyl-1,4-butanediol, 2-methyl-2,4-pentanediol, nonanediol, octanol, pentanediol, 1-phenyl- 1,2-ethylene glycol, propylene glycol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, 2,3,5,6-tetramethylxylene-α, α '- Diol, 1,1,4,4-tetraphenyl-1,4-butanediol, 1,1,4,4-tetraphenyl-2-butyne-1,4-diol, 1,2 , 6-trihydroxyhexane, 1,1'-bis-2-naphthol, dihydroxynaphthalene, 1,1'-methylene-di-2 -naphthol, 1,2,4-benzenetriol, Bisphenol, 2, 2'-bis (4-hydroxyphenyl) butane, 1,1-bis (4-hydroxyphenyl) cyclohexane, bis (hydroxyphenyl) methane, catechol, 4- Chlororesorcinol, 3,4-dihydroxyhydrocinnamic acid, hydroquinone, hydroxybenzyl alcohol, methylhydroquinone, methylene-2,4,6-trihydroxybenzoate M-benzene , 1,2,3-benzenetriol, resorcinol, glucose, α- (1-aminoethyl) hydroxybenzyl alcohol, 2-amino-2-ethyl-1,3-propanediol, 2-amino-2-methyl-1,3-propanediol, 3-amino-1,2-propanediol, N- (3-aminopropyl) diethanolamine, N, N'-bis (2-hydroxyl Ethyl) -24-200522806 Piperazine, 2,2-bis (hydroxymethyl) -2,2,2,2 "-azatriol, 2,2-bis (hydroxymethyl) propanoic acid, 1, 3-bis (hydroxymethyl) urea, 1,2-bis (4-pyridine) -1,2-ethylene glycol, N-n-butyldiethanolamine, diethanolamine, N-ethylenediethanolamine, 3- Hydroxythio-1,2-propanediol, 3-piperidinyl-1,2-propane. Diol, 2- (2-pyridyl) -1, 3-propanediol, triethanolamine, α- (1-aminoethyl)-, hydroxybenzyl alcohol and 3-amino-4-hydroxyphenylphosphonium, etc. . Among these acrylates and methacrylates, from the viewpoint of easy availability, the best examples include ethylene glycol diacrylate, diethylene glycol diacrylate, and triethylene glycol diacrylate. , Tetraethylene glycol diacrylic acid ester, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, Polyethylene glycol diacrylate, tetrapropylene glycol diacrylate, dodecanediol diacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol triacrylate , Pentaerythritol diacrylate, pentaerythritol dimethacrylate, dipentaerythritol pentaacrylate, glycerol triacrylate, diglycerol dimethacrylate, 1,3-propanediol diacrylate, 1, 2, 4-butanetriol Trimethacrylic acid ester, 1,4-cyclohexanediol diacrylate, and __pentanediol diacrylate, neopentyl glycol diacrylate and ethylene oxide trimethylolpropane Of triacrylate. Examples of acrylamide and methacrylamide include, in addition to methylenebispropene-methyleneamine, methylenebismethacrylamide, ethylenediamine, ^ diaminopropane, Diaminobutane, pentamethylenediamine, hexamethylenediamine, bis (2-aminopropyl) amine, diethylenetriamine, pentamethylenediamine, octamine-25-200522806 Methyldiamines and polyamines having polyamines and rings interrupted by heteroatoms (eg, phenylenediamine, xylenyldiamine, Θ-(4-aminophenyl) ethylamine, diamine Benzoic acid, diaminotoluene, diaminoanthracene, diaminomanganese, etc.). -Examples of allyl compounds include phthalic acid, terephthalic acid,-diallyl esters of dicarboxylic acids such as sebacic acid, adipic acid, glutaric acid, malonic acid, and nitric acid; Anthracenedisulfonic acid, benzenedisulfonic acid, 2,5-dihydroxy ·; diallyl esters of disulfonic acids such as 7-benzenedisulfonic acid, dihydroxynaphthalenedisulfonic acid and naphthalenedisulfonic acid, and Allyl ammonium and the like. Examples of vinyl ether compounds include polyvinyl ethers of the dolugenol {for example, ethylene glycol divinyl ether, 1,3,5-tri- / 3-vinyloxyethoxybenzene, 1,3-di- / 3-vinyloxyethoxybenzene and glycerol trivinyl ether}. Examples of vinyl esters include divinyl succinate, divinyl adipate, divinyl phthalate, divinyl terephthalate, and divinyl Benzene-1,3-disulfonate and divinylbutane-1,4-disulfonate and the like. Examples of the styrene compound include divinylbenzene, 7-allylstyrene, and isopropylstyrene. Examples of compounds other than this compound include: N-/ 3 -hydroxyethyl-stone- (methyl-methacrylamide) ethyl acrylate, N, N -bis (fluorene-methacryloxyethyl) propylene fluorene Compounds having two or more different ethylenically unsaturated double bonds, such as amines, allyl methacrylates, and the like, and a polyhydric alcohol compound having at least two hydroxyl groups and a slightly excess compound having at least two isocyanate groups A polyfunctional urethane having at least two ethylenically unsaturated double bonds obtained by reacting a reaction product of a poly · isocyanate compound with a compound having at least one hydroxy · group and at least one ethylenically unsaturated group. Compounds -26-200522806 are also suitable for use in the compounds of the present invention. These polyfunctional monomers can be used alone or in combination of two or more kinds. The content of the polyfunctional monomer in the photosensitive layer is preferably in the range of 5 to 90% by mass, and more preferably in the range of 15 to 60% by mass. . Examples of the photopolymerization initiator include aromatic ketones, concatenated polyketal dihydrazone compounds disclosed in US Patent No. 2 3 7660, conjugated ether compounds disclosed in US Patent No. 2448828, and disclosed in US Patent No. 2 7 2 2 5 1 2 Aromatic couple ether ether compounds substituted with α-hydrocarbons, polynuclear quinone compounds shown in US Pat. Nos. 3 046 1 27 and 29 5 1 75 8 A combination of a triarylimidazole dimer and an amine ketone disclosed in the specification of US Patent No. 3 5 4 9 3 6 7; a benzothiazole compound disclosed in Japanese Laid-Open Patent Publication No. Sho 5 1-48 5 1 6 And trihalomethyltriazine compounds, trihalomethyltriazine compounds disclosed in the specification of U.S. Patent No. 4,239,850, trihalomethyltriazine compounds disclosed in the specification of U.S. Patent No. 42 1 2976, and the like. Aromatic ketones are particularly preferred. Preferable examples of the aromatic ketone include benzophenone, 2-methyldiphenyl® ketone, 3-methylbenzophenone, 4-methylbenzophenone, and 4-methoxy Benzophenone, 2-chlorobenzophenone, 4-chlorobenzophenone, 4-bromobenzophenone, 2-carboxybenzophenone, 2-ethoxycarboxybenzophenone, benzophenone Ketone tetracarboxylic acid or its tetramethyl ester, 4-methoxy-4'-dimethylaminobenzophenone, 4, 4'-dimethoxybenzophenone, 4-dimethyl Aminobenzophenone, 4-dimethylamine-acetophenone, anthraquinone, 2-tert-butylanthraquinone, 2-methylanthraquinone, phenanthrenequinone, xanthone, thioanthrone , 2-chlorothiaxanthone, 2,4-dimethylthioanthracene-27-200522806 ketone, 2,4-diethylthiaxanthone, manganese, acridinone and benzoin, benzoin Ethers (for example, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin phenyl ether, benzyl dimethyl ketal) 4,4'-bis (dialkylamino) benzophenones (for example, 4,4'-bis (di'methylamino) benzophenone, 4,4'-bis (bicyclic already Aminoamino) benzophenone, 4, 4'-bis (diethylamino) benzophenone, 4,4'-bis (dihydroxyethylamino) benzophenone) and the like. A particularly desirable example is benzophenone. In general, the content of the photopolymerization initiator in the photosensitive layer, the first photosensitive layer and the second photosensitive layer are both 0. 1 ~ 10 mass%, more preferably 0. 5 to 5 mass%. When the sensitivity of the first photosensitive layer and the second photosensitive layer is adjusted by the content of the photopolymerization initiator, the content of the photopolymerization initiator of the second photosensitive layer is more preferably set as the photopolymerization initiator of the first photosensitive layer. 1 . 5 to 10 times the amount, especially 2 to 5 times is more desirable. A sensitizer may be added to the photosensitive layer of the photosensitive transfer sheet. Generally, a sensitizer is added only to the second photosensitive layer. Sensitizers can use more suitable polynuclear aromatics (for example, pyrene, osmium, ® tri- o-phenylene), xanthracenes (for example, luciferin, eosin, erythromycin, rhodamine B, Bangladesh Rose red), cyanines (for example, thiocyanine, oxycarbonyl cyanine), merocyanine (for example, merocyanine, parsley cyanine), thiazines (for example, sulfur only, subcyanine) Methylene blue, toluidine blue), acridines (eg * acridine orange, chloroflavin, acridine yellow), anthraquinones (eg, anthraquinone),-squalid iron (eg, shark key ). The addition amount of the sensitizer is in the range of 0 · 0 5 to 3 0 -28-200522806 mass% relative to all the components of the photosensitive layer, more preferably in the range of 0.1 · 20 to 20 mass%, and especially in the range of 0.2 to 2 A range of 10% by mass is more desirable. The photosensitive layer of the photosensitive transfer sheet may contain a triphenylimidazole dimer. Examples of triphenylimidazole dimers include 2- (2chlorophenyl) -4, 5- 'diphenylimidazole dimer, 2- (2'-chlorophenyl) -4,5- Di (3'-methoxy · phenylphenyl) imidazole dimer, 2- (2fluorophenyl) -4, 5-diphenylimidazole dimer, 2- (2'-methoxyphenyl) -4, 5-diphenylimidazole dimer and 2- (4'-methoxyphenyl) -4,5-diphenylimidazole dimer. The photosensitive layer ’of the photosensitive transfer sheet may also contain, for example, disclosed in J ®
Couser 著之「Light Sensitive System:感光系」第 5 章 之有機硫化合物、過氧化物、氧化還原系化合物、偶氮與 重氮化合物、光還原性色素與有機鹵化合物等。有機硫化 合物之例子，可列舉：二正丁基二硫化物、二苯甲基二硫 化物、2 -氫硫基苯并噻唑、2 -氫硫基苯并噚唑、噻吩、乙 基三氯甲烷磺酸酯與2 -氫硫基苯并咪唑。過氧化物之例 子，可列舉：二-第三丁基過氧化物、過氧化苯醯與甲基乙 基酮過氧化物。氧化還原化合物係由過氧化物與還原劑之 ® 組合而成的，其例子可列舉：亞鐵離子與過硫酸離子、鐵 離子與過氧化物等。偶氮與重氮化合物之例子’可列舉： α，α，-偶氮二醯丁腈、2 -偶氮-2_甲基丁腈與，胺基二苯 胺之重氮鑰類。光還原性色素之例子，可列舉：孟加拉玫 ^ 瑰紅、紅黴素、曙紅、丙烯基黃素、核黃素與硫僅。有機 - 鹵化合物之例子，可列舉：2 -三氯甲基-5-苯基-1，3,4 -噁 二唑、2 -三氯甲基-5- (4 -氯苯基）-1,3, 4 -曙二唑、2 -三 -29 - 200522806 氯甲基-5- ( 1-萘基）-1，3,4-噚二唑、2 -三氯甲基-5- (2-萘基）-1,3, 4-噚二唑、2 -三溴甲基-5-苯基-1，3，4 -噁二 唑、2 -三溴甲基-5- (2 -萘基）-1，3，4-噚二唑、2 -三氯甲 基-5-苯乙烯基-1，3，4-腭二唑、2 -三氯甲基-5- (4-氯苯乙 — 烯基）-1，3，4 -噚二唑、2 -三氯甲基-5- (4 -甲氧基苯乙烯 · 基）-1，3,4-曙二唑、2 -三氯甲基-5- (1-萘基）-1，3,4-曙 二唑、2 -三氯甲基-5- (4-77 -丁氧基苯乙烯基）-1，3,4 -噚 二唑、2 -三溴甲基-5-苯乙烯基-1,3 ,4 -卩f二唑、苯基三溴 甲颯、，硝基苯基三溴甲颯、，氯苯基三溴甲楓、2,4,6- Φ 參（三氯甲基）三嗪、2-苯基-4, 6 -雙（三氯甲基）-r 三嗪、2-(4 -甲氧基苯基）-4, 6 -雙（三氯甲基）三嗪、 2- (4-氯苯基）-4, 6-雙（三溴甲基）三嗪。 再者，有機鹵化合物之例子，可列舉：鹵化烴、鹵化醇 化合物、鹵化羰基化合物、鹵化醚化合物、鹵化酯化合物 與鹵化醯胺化合物。鹵化烴之例子，可列舉：四溴化碳、 碘仿、1，2 -二溴乙烷、1，1，2，2 -四溴乙烷、1，1 -雙（，氯 苯基）-2, 2,2 -三氯乙烷、1,2 -二溴-1，1,2 -三氯乙烷、 鲁 1，2，3 -三溴丙烷、1 -溴-4 -氯丙烷、1 , 2，3 , 4 -四溴丁烷、四 氯環丙院、六氯環戊二烯與二溴環己烷等。鹵化醇化合物 之例子，可列舉：2,2, 2 -三氯乙醇、三溴乙醇、1,3 -二氯 -2 -丙醇、1，1，1-三氯-2-丙醇、二（碘六亞甲基）胺基異 | 丙醇、三溴-第三丁醇與2，2, 3 -三氯丁烷-1，4 -二醇等。鹵 _ 化羰基化合物之例子，可列舉：1，1 -二氯丙酮、1，3 -二氯 丙酮、六氯丙酮、六溴丙酮、1，1，3,3 -四氯丙酮、1，1，1- -30 - 200522806 三氯丙酮、3,4 -二溴-2-丁酮與1，4 -二氯-2-丁酮-二溴環己 酮等。鹵化醚化合物之例子，可列舉：2 -溴乙基甲基醚、 2 -溴乙基乙基醚、二（2 -溴乙基）醚與1,2 -二氯乙基乙基 醚等。鹵化酯化合物之例子，可列舉：鹵化羧酸之酯、羧 > 酸之鹵化酯或是鹵化羧酸之鹵化酯，此等之例子，可列舉： . 醋酸溴乙酯、三氯醋酸乙酯、三氯醋酸三氯乙酯、2，3 -二 溴丙基丙烯酸酯之均聚物與共聚物、二溴丙酸三氯乙酯、 a , yS -二氯丙烯酸乙酯等。鹵化醯胺化合物之例子，可列 舉：氯乙醯胺、溴乙醯胺、二氯乙醯胺、三氯乙醯胺、三 ® 溴乙醯胺、三氯乙基三氯乙醯胺、2 -溴異戊酮醯胺、2,2,2-三氯戊酮醯胺、N -氯琥珀醯亞胺與N -溴琥珀醯亞胺等。於 有機鹵化物之中，較宜於同一碳原子上鍵結二個以上鹵原 子之鹵化物，尤以於一個碳原子上具有三個鹵素原子的鹵 化物更爲理想。有機鹵化物可以單獨使用，也可以合倂二 種以上使用。此等之中，特別理想之有機鹵化物爲三溴甲 基苯碾、2，4 -雙（三氯甲基）-6 -苯三唑。相對於感光層整 個成分，有機鹵化物之量，通常爲0.001〜5質量％之範圍， ® 更佳爲0 . 0 0 5〜1質量％之範圍。 於感光性轉印片之感光層中，也可以進一步添加熱聚合 禁止劑。熱聚合禁止劑之例子，可列舉：，甲氧基酚、氫 醌、烷基或芳基取代氫醌、第三丁基鄰苯二酚、1，2, 3 -苯 三酚、氯化亞酮、氯醌、萘胺、萘酚、2, 6 -二第三丁基 ^ 對甲酚、吡啶、硝基苯、二硝基苯、對甲苯胺、亞甲基藍、 有機銅與水楊酸甲酯等。相對於多官能單體，此等之熱聚 -31 - 200522806 合禁止劑，較宜含有〇· 001〜5質量％之範圍。 於感光性轉印片之感光層中，爲了控制膜物性（撓性） 也可以添加可塑劑，其例子可列舉：鄰苯二甲酸二甲酯、 鄰苯二甲酸二丁酯、鄰苯二甲酸二異丁酯、鄰苯二甲酸二 · 辛酯、鄰苯二甲酸二辛基癸醯酯、鄰苯二甲酸二環己酯、 . 鄰苯二甲酸雙十三烷酯、鄰苯二甲酸丁基苯甲酯、鄰苯二 甲酸二異癸酯、鄰苯二甲酸二芳酯等之鄰苯二甲酸酯類； 鄰苯二甲酸二甲基乙二醇酯、鄰苯二甲酸乙基乙二醇乙 酯、鄰苯二甲酸乙基乙二醇甲酯、鄰苯二甲酸丁基乙二醇 鲁 丁酯、二辛酸三乙二醇酯等之乙二醇酯類；三甲酚二醇磷 酸酯、磷酸三苯基酯等之磷酸酯類；己二酸二異丁酯、己 二酸二辛基酯、癸二酸二甲酯、癸二酸二丁酯、癸二酸二 辛酯、馬來酸二丁酯等之脂肪族二鹼酯類；苯磺胺、甲 苯磺胺、N -正丁基乙醯胺等之醯胺類；檸檬酸三乙酯、甘 油三乙醯酯、月桂酸丁酯等。可塑劑較宜使用；7-甲苯磺胺。 感光性轉印片之感光層能夠含有白色（1 e u c 〇 )色素。白色 色素之例子，可列舉：參二甲胺基苯基）甲烷（白色 · 結晶紫）、參二乙胺基苯基）甲烷、參（，二甲胺基 -甲基苯基）甲院、參（J9 -二乙胺基甲基苯基）甲院、 雙二丁胺基苯基）-[/7- (2 -氰乙基）甲胺基苯基]甲 烷、雙二甲胺基苯基）-2-喹啉基甲烷、三二丙胺 · 基苯基）甲烷等之胺基三芳基甲烷類；3,6 -雙（二甲胺基） · -9 -苯基黃嘌呤、3 -胺基-6·二甲胺基-2-甲基-9- (〇 -氯苯 基）黃嘌呤等之胺基黃嘌呤類；3,6 -雙（二乙胺基）- 9- ( ΐ - 200522806 乙氧基羰基苯基）硫雜蒽、3,6 -雙（二甲胺基）硫雜蒽等 之硫雜蒽類；3，6 -雙（二乙胺基）-9，1 0 -二氫-9 -苯基吖啶、 3,6-雙（苯甲基胺基）_9,10_二氫-9_甲基吖啶等之胺基 -9，1 0 -二氫吖啶類；3，7 -雙（二乙胺基）啡噚阱等之胺基 ， 啡噚阱類；3，7 -雙（乙胺基）啡噚阱等之胺基啡噚哄類； . 3, 7 -雙（二乙胺基）-5_己基_5, 10 -二氫啡阱等之胺基二氫 啡曙畊阱類；雙（厂二甲胺基苯基）苯胺基甲烷等之胺基 苯基甲基類；4 -胺基-4’ -二甲胺基二苯基胺、4 -胺基-α、 /3 -二氰基氫化桂皮酸甲酯等之胺基氫化桂皮酸類；1 - ( 2 - · 萘基）-2-苯基肼等之肼類；1，4-雙（乙胺基）-2,3-二氫 化蒽類之胺基-2,3_二氫蒽類；Ν,Ν -二乙基苯乙基苯胺 等之苯乙基苯胺類；10 -乙醯基-3, 7 -雙（二甲胺基）啡噻 阱等之含鹼性ΝΗ之白色色素的醯基衍生物；參（4 -二乙胺 基甲苯基）乙氧基羰基甲烷等之不具有可氧化之氫，但 發色化合物上可氧化成白色般之化合物；白色靛類色素； 如揭示於美國專利第3 0425 1 5與3 0425 1 7號之可氧化成顯 色形之有機胺類（例如，4 , 4’ -伸乙基二胺、二苯基胺、 馨 Ν，Ν-二甲基苯胺、4,4’ -亞甲基二胺三苯基胺、Ν -乙烯基 咔唑）。尤以白色結晶紫更爲理想。相對於感光層之全部 成分，該白色色素之量較宜爲0.01〜10質量％之範圍，尤 以0 . 0 5〜5質量％之範圍更爲理想。 _ 於感光性轉印片中，也可以使用使感光層著色並賦與保 · 存安定性目的之染料。較宜之染料的例子’可列舉：豔綠 硫酸鹽、曙紅、乙基紫、紅黴素Β、甲基綠、結晶紫、鹼式 -33 - 200522806 品紅、酚酞、1，3 -二苯基三嗪、茜素紅s、百里香酚酞、甲 基紫2B、奎鈉丁紅、孟加拉玫瑰紅、米塔尼爾黃、百里香 磺溴酞、二甲苯酚藍、甲基橙、橙I V、二苯基酪咔唑、2，7 -一氯莽、對位甲基紅、剛果紅、苯并紅紫素4 B、α -萘基紅、 尼羅藍A、迪吉納、甲基紫、孔雀綠草酸鹽、副品紅、油藍 · # 603 ( Or ient化學工業（股份）製）、若丹明b、若丹明 6G等。染料尤以孔雀綠草酸鹽特別理想。 爲了提高第一感光層與第二感光層之密著性、或是第二 感光層與印刷電路基板形成用基板之密著性，能夠使用感 # 光層習知之所謂的密著促進劑。密著促進劑之例子，可列 舉：苯并咪唑、苯并噚唑、苯并噻唑、2 -氫硫基苯并咪唑、 2 -氫硫基苯并曙唑、2 -氫硫基苯并噻唑、3 -嗎啉甲基-1 -苯 基二π坐-2-硫酮、3 -嗎啉甲基-5-苯基曙哇-2-硫酮、5 -胺基 -3 -嗎啉甲基噻二唑-2 -硫酮與2 -氫硫基-5 -甲基硫噻二唑 等。密著促進劑較宜使用3 -嗎啉甲基· 1 -苯基三唑-2 -二硫 酮。 例如，本發明所用之感光性轉印片可以進行如下之方式 翁 的製造。 .首先’使該各種材料溶解或分散於溶劑中，分別調製第 —感光層形成用之第一感光性樹脂組成物溶液與第二感光 層形成用之第二感光性樹脂組成物溶液。作爲第一感光性 · 樹脂組成物溶液與第二感光層形成用之第二感光性樹脂組 ， 成物溶液之溶劑，例如，可以使用：甲醇、乙醇、正丙醇、 異丙醇、正丁醇、第二丁醇、正己醇等之醇類；丙酮、甲 -34 - 200522806 基乙基酮、甲基異丁基酮、環己酮、二異丁基酮等之酮類； 醋酸乙酯、醋酸丁酯、醋酸正戊酯、硫酸甲酯、丙酸乙酯、 鄰苯二甲酸二甲酯、苯甲酸乙酯等之酯類；甲苯、二甲苯、 苯、乙基苯等之芳香族烴類；四氯化碳、三氯乙烯、氯仿、 k 1，1,1-三氯乙烷、二氯甲烷、氯苯等之鹵化烴類；四氫呋 . 喃、二乙基醚、乙二醇一甲基醚、乙二醇一乙基醚、1-甲 氧基-2 -丙醇等之醚類；二甲基甲醯胺、二甲基磺化物等。 於第一感光性樹脂組成物溶液與第二感光性樹脂組成物溶 液中，也可以添加界面活性劑。 ® 接著，將第一感光性樹脂組成物溶液塗布於撓性透明薄 膜載體之上，藉由進行乾燥而形成第一感光層。若形成第 一感光層，藉由於其上進行第二感光性樹脂組成物溶液之 塗布、乾燥而形成第二感光層。 作爲該撓性透明薄膜載體所使用之載體，較宜爲光透過 性爲良好的。另外，期望表面平滑性爲良好的。撓性透明 薄膜載體之例子，可列舉：聚對苯二甲酸乙二醇酯、聚乙 烯萘酯、聚丙烯、聚乙烯、三醋酸纖維素、二醋酸纖維素、 ® 聚（甲基）丙烯酸烷基酯、聚（甲基）丙烯酸酯共聚物、 聚氯乙烯、聚乙烯醇、聚碳酸酯、聚苯乙烯、.賽璐玢、聚 偏氯乙烯共聚物、聚醯胺、聚醯亞胺、氯乙烯與醋酸乙烯 共聚物、聚四氟乙烷與聚三氟乙烷等之各種塑膠薄膜。再 ~ 者，也可以使用由此等二種以上而成的複合材料。於其中， - 尤以聚對苯二甲酸乙二醇酯薄膜更爲理想。載體厚度一般 爲5〜150//m，更佳爲10〜50ym。 -35 - 200522806 對於感光性轉印片，也可以進一步於第二感光層上設置 保護膜。保護膜之例子，可列舉：使用於該載體之薄膜與 紙或層壓聚乙烯、聚丙烯之紙等。尤以聚乙烯薄膜、聚丙 烯薄膜更爲理想。保護膜厚度較宜爲5〜1 0 0 /z m，更佳爲 · 10〜50 μ m。此時，感光性樹脂層與載體之接著力A以及感 . 光性樹脂層與保護膜之接著力B，必須使A > B之關係成立。 載體/保護膜組合之例子，可列舉：聚對苯二甲酸乙二醇酯 /聚丙烯、聚對苯二甲酸乙二醇酯/聚乙烯、聚氯乙烯/賽璐 玢、聚醯亞胺/聚丙烯等。如該方式，除了由相互不同種類 鲁 之聚合物中選擇載體與保護膜的方法之外，藉由進行載體 與保護膜至少一側的表面處理，也能夠滿足上述之接著力 之關係。一般而言，載體之表面處理係爲了提高與感光性 樹脂層之接著力所進行的，其例子可列舉：底部塗層之塗 設、電暈放電處理、火焰處理、紫外線照射處理、高頻照 射處理、電暈放電照射處理、活性電漿照射處理與雷射光 照射處理等。另外，載體與保護膜之靜磨擦係數也很重要。 此等之靜磨擦係數較宜爲〇.3〜1.4，尤以0.5〜1.2更爲理 鲁 想。由於若低於〇 . 3將過滑’作成滾筒狀之時，將發生捲 取偏移。另外，超過1 · 4之情形’捲成良好之滾筒狀將是 困難的。 另外，也可以進行保護膜之表面處理。表面處理係爲了 > 降低與感光性樹脂層之接著力所進行的。例如’於保護膜 · 表面，設置聚有機矽氧化物、氟化聚烯烴、聚氟乙烯、聚 乙烯醇等之底部塗層。底部塗層之形成’通常藉由於保護 -36 - 200522806 膜表面塗布該聚合物之塗布液後，進行30~15G°C： ( # Μ 5 0〜1 2 0 °C更爲理想）、1〜3 0分鐘之乾燥。 該感光性轉印片能夠適用於具有穿孔或通孔之印^ _ 板之製造。 【實施例】 - [實施例1 ] 於20 // m厚之聚對苯二甲酸乙二醇酯（載體），進行由 下列組成而成的第一感光性樹脂組成物之塗布、乾燥而形 成25//m厚之感光層（第一感光層）。 像 [第一感光性樹脂組成物溶液之組成] 甲基丙烯酸甲酯/丙烯酸-2-乙基己酯/甲基丙烯酸苯甲酯/ 甲基丙烯酸共聚物（共聚物組成（莫耳比）： 55/11.7/4.5/28.8、質量平均分子量：90000、Tg: 70 °C ) 1 5質量份 十二聚二丙烯酸丙二醇酯 6 · 5質量份 二甲基丙烯酸四乙二醇酯 1 . 5質量份 4,4’ -雙（二乙基胺基）： 二苯甲酮 〇.〇4質量份 二苯甲酮I 1 · 〇質量份 甲苯磺醯胺 0 · 5質量份 孔雀綠草酸鹽 〇·〇2質量份 3 -嗎啉甲基-1 -苯基三唑-: ί -硫嗣 〇 · 〇 1質量份 白色結晶紫 0 · 2質量份 三溴甲基苯基》 0 · 1質量份 -37 - 200522806 30質量份 甲基乙基酮 接著，於第一感光層上，進行由下列組成而成的第二感 光性樹脂組成物溶液之塗布、乾燥而形成5 // in厚t胃％ ® (第二感光層）。 [第二感光性樹脂組成物溶液之組成]Couser's "Light Sensitive System: Photosensitive System" Chapter 5 organic sulfur compounds, peroxides, redox compounds, azo and diazo compounds, photoreducible pigments and organic halogen compounds. Examples of the organic sulfur compound include di-n-butyl disulfide, benzhydryl disulfide, 2-hydrothiobenzothiazole, 2-hydrothiobenzoxazole, thiophene, and ethyltrichloro Methanesulfonate with 2-hydrothiobenzimidazole. Examples of the peroxide include di-third butyl peroxide, phenylhydrazine peroxide, and methyl ethyl ketone peroxide. Redox compounds are a combination of peroxide and reducing agent ®. Examples include ferrous ions and persulfate ions, iron ions and peroxides. Examples of the azo and diazo compounds are exemplified by the diazo key species of α, α, -azobishydrazonitrile, 2-azo-2-methylbutyronitrile, and aminodiphenylamine. Examples of photoreducible pigments include: Bengal rose ^ rose red, erythromycin, eosin, acrylflavin, riboflavin, and sulfur only. Examples of organic-halogen compounds include 2-trichloromethyl-5-phenyl-1,3,4-oxadiazole, 2-trichloromethyl-5- (4-chlorophenyl) -1 , 3,4-Dioxadiazole, 2-tri-29-200522806 chloromethyl-5- (1-naphthyl) -1,3,4-fluorenediazole, 2-trichloromethyl-5- (2 -Naphthyl) -1,3,4-fluorenediazole, 2-tribromomethyl-5-phenyl-1,3,4-oxadiazole, 2-tribromomethyl-5- (2-naphthalene Radical) -1,3,4-fluorenediazole, 2-trichloromethyl-5-styryl-1,3,4-fluorenediazole, 2-trichloromethyl-5- (4-chlorobenzene Ethyl-alkenyl) -1,3,4-fluorenediazole, 2-trichloromethyl-5- (4-methoxystyrene · yl) -1,3,4-aradiazole, 2-triazine Chloromethyl-5- (1-naphthyl) -1,3,4-oxadiazole, 2-trichloromethyl-5- (4-77-butoxystyryl) -1,3,4 -Fluoradiazol, 2-tribromomethyl-5-styryl-1,3,4-fluorenfdiazole, phenyltribromoformamidine, nitrophenyltribromoformamidine, chlorophenyl Tribromomethane, 2,4,6- Φ (trichloromethyl) triazine, 2-phenyl-4,6-bis (trichloromethyl) -r triazine, 2- (4 -methoxy Phenyl) -4, 6-bis (trichloromethyl) triazine, 2- (4-chlorophenyl) -4, 6- (Tribromomethyl) triazine. Examples of the organic halogen compounds include halogenated hydrocarbons, halogenated alcohol compounds, halogenated carbonyl compounds, halogenated ether compounds, halogenated ester compounds, and halogenated amine compounds. Examples of halogenated hydrocarbons include carbon tetrabromide, iodoform, 1,2-dibromoethane, 1,1,2,2-tetrabromoethane, 1,1-bis (, chlorophenyl)- 2, 2,2-trichloroethane, 1,2-dibromo-1,1,2-trichloroethane, 1,1,2,3-tribromopropane, 1-bromo-4 -chloropropane, 1 , 2,3,4-tetrabromobutane, tetrachlorocyclopropane, hexachlorocyclopentadiene and dibromocyclohexane. Examples of the halogenated alcohol compounds include 2,2,2-trichloroethanol, tribromoethanol, 1,3-dichloro-2-propanol, 1,1,1-trichloro-2-propanol, and (Iodohexamethylene) amino iso | propanol, tribromo-tertiary butanol and 2,2,3-trichlorobutane-1,4-diol, etc. Examples of halogenated carbonyl compounds include 1,1-dichloroacetone, 1,3-dichloroacetone, hexachloroacetone, hexabromoacetone, 1,1,3,3-tetrachloroacetone, 1,1 , 1--30-200522806 trichloroacetone, 3,4-dibromo-2-butanone and 1,4-dichloro-2-butanone-dibromocyclohexanone. Examples of the halogenated ether compound include 2-bromoethylmethyl ether, 2-bromoethylethyl ether, bis (2-bromoethyl) ether, and 1,2-dichloroethylethyl ether. Examples of halogenated ester compounds include halogenated carboxylic acid esters, carboxylic acid> halogenated esters of carboxylic acids or halogenated carboxylic acid halogenated esters, and examples thereof include:. Ethyl bromoacetate, ethyl trichloroacetate , Trichloroethyl trichloroacetate, homopolymers and copolymers of 2,3-dibromopropyl acrylate, trichloroethyl dibromopropionate, a, yS-ethyl dichloroacrylate, and the like. Examples of halogenated halogen compounds include chloroacetamide, bromoacetamide, dichloroacetamide, trichloroacetamide, tris-bromoacetamide, trichloroethyltrichloroacetamide, 2 -Bromoisopentanone, 2,2,2-trichloropentanone, N-chlorosuccinimide and N-bromosuccinimide. Among the organic halides, a halide in which more than two halogen atoms are bonded to the same carbon atom is preferable, and a halide having three halogen atoms in one carbon atom is more preferable. The organic halides may be used singly or in combination of two or more kinds. Among these, particularly preferred organic halides are tribromomethylbenzene, 2,4-bis (trichloromethyl) -6-benzenetriazole. The amount of the organic halide is generally in the range of 0.001 to 5% by mass, and more preferably in the range of 0.05 to 1% by mass relative to the entire composition of the photosensitive layer. A thermal polymerization inhibitor may be further added to the photosensitive layer of the photosensitive transfer sheet. Examples of thermal polymerization inhibitors include methoxyphenol, hydroquinone, alkyl- or aryl-substituted hydroquinone, third butylcatechol, 1,2,3-benzenetriol, and Ketones, chloroquinones, naphthylamines, naphthols, 2, 6-di-tert-butyl ^ p-cresol, pyridine, nitrobenzene, dinitrobenzene, p-toluidine, methylene blue, organic copper and methyl salicylate Wait. Relative to polyfunctional monomers, these thermal polymerizations -31-200522806 are more prohibited, and preferably contain a range of 0.001 to 5% by mass. A plasticizer may be added to the photosensitive layer of the photosensitive transfer sheet in order to control film properties (flexibility). Examples include dimethyl phthalate, dibutyl phthalate, and phthalic acid. Diisobutyl phthalate, Dioctyl phthalate, Dioctyldecyl phthalate, Dicyclohexyl phthalate, .Ditridecyl phthalate, Butyl phthalate Phthalates such as benzyl methyl ester, diisodecyl phthalate, diaryl phthalate, etc .; dimethyl glycol phthalate, ethyl ethylene phthalate Ethyl alcohol esters, ethyl ethylene glycol phthalate, butyl ethylene glycol rutinate, triethylene glycol dioctanoate, and other ethylene glycol esters; tricresol glycol phosphate , Phosphate esters such as triphenyl phosphate; diisobutyl adipate, dioctyl adipate, dimethyl sebacate, dibutyl sebacate, dioctyl sebacate, horse Aliphatic dibasic esters such as dibutyl maleate; sulfonamide, tosyl sulfonamide, N-n-butylacetamide, and other amines; triethyl citrate, triacetin and glycerol Esters, butyl laurate, etc. Plasticizers are preferred; 7-toluene. The photosensitive layer of the photosensitive transfer sheet can contain a white (1 e u c) pigment. Examples of the white pigment include: ginsyldimethylaminophenyl) methane (white · crystal violet), ginsyldiethylaminophenyl) methane, ginseng (, dimethylamino-methylphenyl) methanine, Ginseng (J9-diethylaminomethylphenyl) methyl benzene, bisdibutylaminophenyl)-[/ 7- (2-cyanoethyl) methylaminophenyl] methane, bisdimethylaminobenzene Amino) Triarylmethanes such as 2-quinolinylmethane, tridipropylamine, and phenylphenyl) methane; 3,6-bis (dimethylamino) · -9-phenylxanthine, 3- Aminoxanthines such as amino-6 · dimethylamino-2-methyl-9- (〇-chlorophenyl) xanthine; 3,6-bis (diethylamino) -9- (ΐ -200522806 Thithanthracenes such as ethoxycarbonylphenyl) thiathracene, 3,6-bis (dimethylamino) thiathracene; 3,6-bis (diethylamino) -9,1 0 -Dihydro-9-phenylacridine, 3,6-bis (benzylamino) _9,10_dihydro-9_methylacridine, and other amino-9,1 0-dihydroacridines Classes; 3,7-bis (diethylamino) phrenyl amines and other amines, pharyngeals; 3,7-bis (ethylamino) pharyngeal amines and other amines;. 3 , 7-double (two Ethylamino) -5_hexyl_5, 10 -Dihydrophrenol and other amine dihydrophlenine traps; bis (plant dimethylaminophenyl) aniline methane and other aminophenylmethyl Class; 4-amino-4'-dimethylaminodiphenylamine, 4-amino-α, / 3-dicyanohydrocinnamic acid methyl esters, and the like; 1-(2- · Hydrazines such as naphthyl) -2-phenylhydrazine; amine-2,3-dihydroanthracenes of 1,4-bis (ethylamino) -2,3-dihydroanthracene; Ν, Ν -Phenethylanilines such as diethylphenethylaniline; 10-fluorenyl derivatives of basic nitrogen-containing white pigments such as 10-ethenyl-3, 7-bis (dimethylamino) phanthiline ; Reference (4-diethylaminotolyl) ethoxycarbonylmethane, etc. do not have oxidizable hydrogen, but can be oxidized to white compounds on chromogenic compounds; white indigo pigments; as disclosed in US Patent No. 3 0425 1 5 and 3 0425 1 No. 7 organic amines that can be oxidized to form a color (for example, 4, 4'-ethylenediamine, diphenylamine, xin N, N-dimethylaniline, 4,4'-methylenediamine triphenylamine, N-vinylcarbazole). White crystal violet is more desirable. The amount of the white pigment is more preferably in the range of 0.01 to 10% by mass, and more preferably in the range of 0.05 to 5% by mass, with respect to all the components of the photosensitive layer. _ In the photosensitive transfer sheet, a dye that colors the photosensitive layer and imparts a stability purpose can also be used. Examples of preferred dyes include: brilliant green sulfate, eosin, ethyl violet, erythromycin B, methyl green, crystal violet, basic formula -33-200522806 magenta, phenolphthalein, 1,3 -2 Phenyltriazine, alizarin red s, thymol phenolphthalein, methyl violet 2B, sodium quinine red, bengal rose red, mithaniel yellow, thyme sulfobrophthalide, xylenol blue, methyl orange, orange IV, Diphenyltyrocarbazole, 2,7-chlorochloromanganese, para-methyl red, Congo red, benzovioletin 4 B, α-naphthyl red, Nile Blue A, Digina, methyl violet, Malachite Greenate, Paramagenta, Oil Blue · # 603 (Orient Chemical Industry (Stock)), Rhodamine b, Rhodamine 6G, etc. Dyes are especially desirable for malachite. In order to improve the adhesion between the first photosensitive layer and the second photosensitive layer, or the adhesion between the second photosensitive layer and the substrate for forming a printed circuit board, a so-called adhesion promoter known as the photosensitive layer can be used. Examples of the adhesion promoter include benzimidazole, benzoxazole, benzothiazole, 2-hydrothiobenzimidazole, 2-hydrothiobenzoxazole, and 2-hydrothiobenzothiazole. , 3 -morpholinomethyl-1 -phenylbisπ-2-thione, 3 -morpholinomethyl-5-phenylshuwa-2-thione, 5-amino-3 -morpholine methyl Thiothiadiazole-2 -thione and 2-hydrothio-5-methylthiothiadiazole. As the adhesion promoter, 3-morpholinomethyl · 1-phenyltriazole-2-dithione is preferably used. For example, the photosensitive transfer sheet used in the present invention can be produced in the following manner. First, the various materials are dissolved or dispersed in a solvent to prepare a first photosensitive resin composition solution for forming a first photosensitive layer and a second photosensitive resin composition solution for forming a second photosensitive layer, respectively. As the second photosensitive resin group for forming the first photosensitive resin composition solution and the second photosensitive layer, and the solvent of the resultant solution, for example, methanol, ethanol, n-propanol, isopropanol, and n-butane can be used. Alcohols such as alcohols, second butanol, n-hexanol; acetone, methyl-34-200522806 ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, diisobutyl ketone, etc .; ethyl acetate , Butyl acetate, n-amyl acetate, methyl sulfate, ethyl propionate, dimethyl phthalate, ethyl benzoate and other esters; toluene, xylene, benzene, ethylbenzene and other aromatics Hydrocarbons; halogenated hydrocarbons such as carbon tetrachloride, trichloroethylene, chloroform, k 1,1,1-trichloroethane, dichloromethane, chlorobenzene, etc .; tetrahydrofuran, diethyl ether, ethyl Ethers such as glycol monomethyl ether, ethylene glycol monoethyl ether, 1-methoxy-2-propanol, etc .; dimethylformamide, dimethyl sulfonate, etc. A surfactant may be added to the first photosensitive resin composition solution and the second photosensitive resin composition solution. ® Next, the first photosensitive resin composition solution is coated on a flexible transparent film carrier, and the first photosensitive layer is formed by drying. If the first photosensitive layer is formed, the second photosensitive layer is formed by coating and drying the second photosensitive resin composition solution thereon. As the carrier used for the flexible transparent film carrier, it is preferred that the carrier has good light transmittance. In addition, it is desirable that the surface smoothness is good. Examples of flexible transparent film carriers include polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyethylene, cellulose triacetate, cellulose diacetate, ® poly (meth) acrylate Ester, poly (meth) acrylate copolymer, polyvinyl chloride, polyvinyl alcohol, polycarbonate, polystyrene, celluloid, polyvinylidene chloride copolymer, polyamide, polyimide, Various plastic films such as vinyl chloride and vinyl acetate copolymers, polytetrafluoroethane and polytrifluoroethane. Furthermore, a composite material composed of two or more of these materials can also be used. Among them,-polyethylene terephthalate film is more preferable. The thickness of the carrier is generally 5 to 150 // m, and more preferably 10 to 50 μm. -35-200522806 For a photosensitive transfer sheet, a protective film may be further provided on the second photosensitive layer. Examples of the protective film include a film and paper used for the carrier, or a paper laminated with polyethylene or polypropylene. Especially, polyethylene film and polypropylene film are more preferable. The thickness of the protective film is preferably 5 to 100 / z m, and more preferably 10 to 50 μm. At this time, the adhesive force A between the photosensitive resin layer and the carrier and the adhesive force B between the photosensitive resin layer and the protective film must satisfy the relationship of A > B. Examples of the carrier / protective film combination include polyethylene terephthalate / polypropylene, polyethylene terephthalate / polyethylene, polyvinyl chloride / celluloid, polyimide / Polypropylene and so on. In this way, in addition to the method of selecting a carrier and a protective film from polymers of different types, by performing surface treatment on at least one side of the carrier and the protective film, the above-mentioned adhesive force relationship can also be satisfied. Generally speaking, the surface treatment of the carrier is performed to improve the adhesion with the photosensitive resin layer. Examples include: coating of a base coat, corona discharge treatment, flame treatment, ultraviolet irradiation treatment, and high-frequency irradiation. Treatment, corona discharge irradiation treatment, activated plasma irradiation treatment, and laser light irradiation treatment. In addition, the static friction coefficient of the carrier and the protective film is also important. These static friction coefficients are preferably 0.3 to 1.4, and more preferably 0.5 to 1.2. If it is less than 0.3 and the overslip is made into a roll shape, the winding offset will occur. In addition, when it exceeds 1-4, it becomes difficult to roll it into a good roll shape. In addition, a surface treatment of the protective film may be performed. The surface treatment is performed in order to reduce the adhesion to the photosensitive resin layer. For example, a primer layer such as polyorganic silicon oxide, fluorinated polyolefin, polyvinyl fluoride, or polyvinyl alcohol is provided on the surface of the protective film. The formation of the undercoating layer is usually performed after the coating of the polymer is applied on the surface of the protective -36-200522806 film, and then the temperature is 30 ~ 15G ° C: (# Μ 5 0 ~ 1 2 0 ° C is more ideal), 1 ~ Dry for 30 minutes. The photosensitive transfer sheet can be applied to the manufacture of printed boards having perforations or through holes. [Examples]-[Example 1] Formed on 20 // m thick polyethylene terephthalate (carrier) by coating and drying a first photosensitive resin composition composed of the following composition 25 // m thick photosensitive layer (first photosensitive layer). [Composition of the first photosensitive resin composition solution] methyl methacrylate / -2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymer composition (molar ratio): 55 / 11.7 / 4.5 / 28.8, mass average molecular weight: 90,000, Tg: 70 ° C) 1 5 parts by mass of twelve polypropylene dipropylene diacrylate 6 · 5 parts by mass of tetraethylene glycol dimethacrylate 1.5 parts by mass 4,4'-bis (diethylamino): benzophenone 0.04 parts by mass of benzophenone I 1 · 〇 parts by mass of tosylsulfonamide 0 · 5 parts by mass of peacock green grass salt 〇 · 〇2 parts by mass of 3 -morpholinemethyl-1 -phenyltriazole-: 1 -thione 〇 · 〇1 parts by mass of white crystal violet 0 · 2 parts by mass of tribromomethylphenyl "0 · 1 parts by mass- 37-200522806 30 parts by mass of methyl ethyl ketone Then, on the first photosensitive layer, a second photosensitive resin composition solution consisting of the following composition was applied and dried to form 5 // int t stomach% ® (Second photosensitive layer). [Composition of the second photosensitive resin composition solution]
甲基丙烯酸甲酯/丙烯酸-2-乙基己酯/甲基丙烯酸苯甲酉旨/ 甲基丙烯酸共聚物（共聚物組成（莫耳} * 40/26.7/4.5/28.8、質量平均分子量：90〇〇〇、Tg: 5〇C ) 1 5質量份 6 . 5質量份 1 . 5質量份 〇 . 0 4質量份 3 . 〇質量份 〇 . 5質量份 〇 . 〇 2質量份 〇.〇 1質量份 〇 . 2質量份 〇 . 1質量份 3 〇質量份Methyl methacrylate / -2-ethylhexyl acrylate / benzyl methacrylate / methacrylic acid copolymer (copolymer composition (mole) * 40 / 26.7 / 4.5 / 28.8, mass average molecular weight: 90 〇〇〇, Tg: 5〇C) 15 parts by mass 6.5 parts by mass 1.5 parts by mass 3.0 parts by mass 3.0 parts by mass 0.5 parts by mass 0.05 parts by mass 0.01 0.2 mass parts 0.1 mass parts 30 mass parts
十二聚二丙烯酸丙二醇酯 二甲基丙烯酸四乙二醇酯 4, 4’ -雙（二乙基胺基）二苯甲酮 二苯甲酮 ，甲苯磺醯胺 孔雀綠草酸鹽 3 -嗎啉甲基-1 -苯基三唑-2 -硫酮 白色結晶紫 三溴甲基苯基颯 甲基乙基酮 -38 - 200522806 於第二感光層上，層壓20//m厚之聚乙烯薄膜（保護膜） 而得到感光性轉印片。進行如此方式’製備感光性轉印片。 藉由下列方法測定感光性轉印片感度的結果，爲了使第二 感光層硬化所需之光量A爲4 ml/cm2，爲了使第一感光層 · 硬化所需之光量B爲40 mJ/cm2’直到第一感光層開始硬化 - 前所需之光量C爲14 / cm2 (光量C與光量A之差爲10 m J/cm2) 〇 [感度之測定方法] 對於感光性轉印片之感光層’使用高壓水銀燈’從聚對 β 苯二甲酸乙二醇酯薄膜（載體）側’從〇 · 1 mJ / cm2起’以 2 1 /2倍間隔，直到1 〇 〇 m J / c m2爲止’照射不同光量之光而使 感光層硬化。接著，剝取聚對苯二甲酸乙二醇酯薄膜，利 用碳酸鈉水溶液而將感光層之未感光部分予以溶解去除’ 將硬化層予以顯像’再進行其硬化層厚度之測定。接著’ 將光照射量與硬化層厚度之關係予以作圖而得到感度曲 線。經由如此方式’由所得到的感度曲線’讀取硬化層厚 度成爲5#m時之光量（光量A)、硬化層厚度成爲30//m ® 時之光量（光量B)與硬化層厚度超過5//m時之光量（光 量C) 〇 [印刷布線板之製造] 製備一具有直徑3mm之穿孔且表面具備銅層之基板。利 k 用化學硏磨裝置’藉由將主成分爲過氧化氫（濃度：8g/ - 升）、硫酸（濃度：升）與銅離子（濃度：1.9g/升） 之處理液，噴淋於該基板之銅層表面而進行化學硏磨處 -39 - 200522806 理，然後進行乾燥。設定處理液之溫度爲30 °C、淋幕配管 壓力爲0 . 2MP a、處理時間爲2 5秒。量測化學硏磨處理後之 基板表面銅層的表面粗糙度（Ra )爲0 . 1 2 // m。還有，測定 之際的截止値設爲80 // m。進行如此方式而製備鍍銅層壓板 ~ (印刷布線板形成用基板）。 - 接著，將剝離聚對苯二甲酸乙二醇酯薄膜（保護膜）之 感光性轉印片的第二感光層重疊於鍍銅層壓板，利用熱滾 筒層壓機，不使氣泡進入般地進行層壓，得到依序層壓鍍 銅層壓板、第二感光層、第一感光層與聚對苯二甲酸乙二 · 醇酯薄膜（載體）之感光性層壓物。 從所得到的感光性層壓物之聚對苯二甲酸乙二醇酯薄膜 的上面，利用具有40 5nm藍色雷射光源的曝光裝置，於鍍 銅層壓板之布線圖案形成區域，將4 mJ/cm2之光照射成既 定之圖案狀，另一方面，於鍍銅層壓板之穿孔的開口部及 其周圍區域，照射40mJ / cm2之光而將感光層予以曝光。曝 光後，從感光性層壓物剝取聚對苯二甲酸乙二醇酯薄膜（載 體），接著，將濃度1質量％之碳酸鈉水溶液，對第二感 ® 光層表面進行噴淋而將第一感光層與第二感光層之未硬化 區域予以溶解去除而得到硬化層浮凸。 觀察鍍銅層壓板上之硬化層圖案時，於布線圖案形成區 域上之硬化層與穿孔開口部上之硬化層，並未發現剝離或 ~ 破裂等之缺陷。另外，於測定硬化層厚度之時，布線圖案 - 形成區域上之硬化層的厚度爲5 # m，穿孔開口部上之硬化 層的厚度爲3 0 // m。另外，布線圖案形成區域上之硬化層的 -40 - 200522806 最小解像線寬（無堵塞、歪斜等異常之最小硬化層圖案的 寬度）爲20 // m。 接著，於鍍銅層壓板之表面，進行含有氯化鐵蝕刻液之 噴塗，將未被硬化層所覆蓋之已露出之區域的銅層予以溶 ▲ 解去除，然後，進行濃度2質量％之氫氧化鈉水溶液的噴 、 淋而進行硬化層浮凸之去除而得到具有穿孔且表面具備布 線圖案狀之銅層的印刷布線板。目視觀察所得到的印刷電 路板之穿孔時，於穿孔內壁之鍍銅層並未發現異常。 [實施例2 ] _ 製備一具有直徑3mm之穿孔、表面具備銅層之基板。利 用化學硏磨裝置，藉由將主成分爲過氧化氫（濃度：4g/ 升）、硫酸（濃度：50g/升）與銅離子（濃度：ig/升）之 處理液，噴淋於該基板之銅層表面而進行化學硏磨處理， 然後進行乾燥。設定處理液之溫度爲30°C、淋幕配管壓力 爲0 · 2MPa、處理時間爲25秒。量測化學硏磨處理後之基板 表面銅層的表面粗糙度（Ra )爲0 . 05 // m。還有，測定之際 的截止値設爲80 // m。進行如此方式而製備鍍銅層壓板（印 鲁 刷布線板形成用基板）。除了使用經由如此方式所製備之 鍍銅層壓板之外，其餘進行相同於實施例1之方式，於鍍 銅層壓板上形成硬化層圖案。 觀察鑛銅層壓板上之硬化層圖案時，於布線圖案形成區 ~ 域上之硬化層與穿孔開口部上之硬化層，並未發現剝離或 - 破裂等之缺陷。另外，布線圖案形成區域上之硬化層的最 小解像線寬爲20 μ m。接著，進行相同於實施例1之方式， -41 - 200522806 藉由蝕刻銅層，然後，進行硬化層浮凸之去除而得到印刷 布線板。目視觀察所得到的印刷電路板之穿孔時，於穿孔 內壁之鍍銅層並未發現異常。 [實施例3 ] ^ 製備一具有直徑3mm之穿孔、表面具備銅層之基板。利 · 用化學硏磨裝置，藉由將主成分爲過氧化氫（濃度：15g/ 升）、硫酸（濃度：200g/升）與銅離子（濃度：4g/升） 之處理液，噴淋於該基板之銅層表面而進行化學硏磨處 理，然後進行乾燥。設定處理液之溫度爲30°C、淋幕配管 ® 壓力爲0 . 2MPa、處理時間爲25秒。量測化學硏磨處理後之 基板表面銅層的表面粗糙度（Ra )爲0 . 20 // m。還有，測定 之際的截止値設爲80 // m。進行如此方式而製備鍍銅層壓板 (印刷布線板形成用基板）。除了使用經由如此方式所製 備之鍍銅層壓板之外，其餘進行相同於實施例1之方式， 於鍍銅層壓板上形成硬化層圖案。 觀察鍍銅層壓板上之硬化層圖案時，於布線圖案形成區 域上之硬化層與穿孔開口部上之硬化層，並未發現剝離或 ® 破裂等之缺陷。另外，布線圖案形成區域上之硬化層的最 小解像線寬爲2 5 /z m。接著，進行相同於實施例1之方式， 藉由蝕刻銅層，然後，進行硬化層浮凸之去除而得到印刷 布線板。目視觀察所得到的印刷電路板之穿孔時，於穿孔 ‘ 內壁之鍍銅層並未發現異常。 - [實施例4 ] 製備一具有直徑3mm之穿孔、表面具備銅層之基板。利 -42 - 200522806 用化學硏磨裝置，藉由將主成分爲過氧化氫（濃度：2 5 g / 升）、硫酸（濃度：200g/升）與銅離子（濃度：6g/升） 之處理液，噴淋於該基板之銅層表面而進行化學硏磨處 理，然後進行乾燥。設定處理液之溫度爲30°C、淋幕配管 壓力爲0 · 2MP a、處理時間爲3 0秒。量測化學硏磨處理後之 基板表面銅層的表面粗糙度（Ra )爲0 . 30 // m。還有，測定 之際的截止値設爲80 // m。進行如此方式而製備鍍銅層壓板 (印刷布線板形成用基板）。除了使用經由如此方式所製 備之鍍銅層壓板之外，其餘進行相同於實施例1之方式， 於鍍銅層壓板上形成硬化層圖案。 觀察鍍銅層壓板上之硬化層圖案時，於布線圖案形成區 域上之硬化層與穿孔開口部上之硬化層，並未發現剝離或 破裂等之缺陷。另外，布線圖案形成區域上之硬化層的最 小解像線寬爲3 0 // m。接著，進行相同於實施例1之方式， 藉由蝕刻銅層，然後，進行硬化層浮凸之去除而得到印刷 布線板。目視觀察所得到的印刷電路板之穿孔時，於穿孔 內壁之鍍銅層並未發現異常。 [實施例5 ] 製備一具有直徑3mm之穿孔、表面具備銅層之基板。利 用化學硏磨裝置，藉由將主成分爲過氧化氫（濃度：30g/ 升）、硫酸（濃度：200g/升）與銅離子（濃度：8g/升） 之處理液，噴淋於該基板之銅層表面而進行化學硏磨處 理，然後進行乾燥。設定處理液之溫度爲3 5 °C、淋幕配管 壓力爲0 · 2MPa、處理時間爲30秒。量測化學硏磨處理後之 200522806 基板表面銅層的表面粗糙度（Ra )爲0 . 40 // m。還有，測定 之際的截止値設爲8 0 // πι。進行如此方式而製備鍍銅層壓板 (印刷布線板形成用基板）。除了使用經由如此方式所製 備之鍍銅層壓板之外，其餘進行相同於實施例1之方式’ ' 於鍍銅層壓板上形成硬化層圖案。 - 觀察鍍銅層壓板上之硬化層圖案時，於布線圖案形成區 域上之硬化層與穿孔開口部上之硬化層，並未發現剝離或 破裂等之缺陷。另外，布線圖案形成區域上之硬化層的最 小解像線寬爲5 0 // m。接著，進行相同於實施例1之方式’ · 藉由蝕刻銅層，然後，進行硬化層浮凸之去除而得到印刷 布線板。目視觀察所得到的印刷電路板之穿孔時，於穿孔 內壁之鍍銅層並未發現異常。 [比較例1 ] 製備一具有直徑3mm之穿孔、表面具備銅層之基板。利 用化學硏磨裝置，藉由將主成分爲過氧化氫（濃度：55g/ 升）、硫酸（濃度：300g/升）與銅離子（濃度：8g/升） 之處理液，噴淋於該基板之銅層表面而進行化學硏磨處 ® 理，然後進行乾燥。設定處理液之溫度爲40 °C、淋幕配管 壓力爲0.2 5 MPa、處理時間爲40秒。量測化學硏磨處理後 之基板表面銅層的表面粗糙度（Ra )爲0 . 50 // in。還有，測 定之際的截止値設爲80//m。進行如此方式而製備鍍銅層壓 ’ 板（印刷布線板形成用基板）。除了使用經由如此方式所 - 製備之鍍銅層壓板之外，其餘進行相同於實施例1之方式， 於鍍銅層壓板上形成硬化層圖案。 -44 - 200522806 觀察鍍銅層壓板上之硬化層圖案時，於布線圖案形成區 域上之硬化層與穿孔開口部上之硬化層，並未發現剝離或 破裂等之缺陷。另外，布線圖案形成區域上之硬化層的最 小解像線寬爲8 0 // m。接著，進行相同於實施例1之方式， 藉由蝕刻銅層，然後，進行硬化層浮凸之去除而得到印刷 布線板。目視觀察所得到的印刷電路板之穿孔時，於穿孔 內壁之鍍銅層並未發現異常。 【圖式簡單說明】 第1圖係顯示較宜用於本發明之印刷布線板製造方法實 施之感光性轉印片一例的構造之橫剖面圖。 第2圖係顯示從載體側，將光照射於第2圖之感光性轉 印片時所示之光照射量與硬化層厚度關係之感度曲線圖。 第3圖係顯示遵循本發明之具有穿孔的印刷布線板製造 步驟圖。 【主要元件符號說明】 10 感光性轉印片 11 載體 12 第一感光層 13 第二感光層 14 保護膜 15 布線圖案形成用之硬化層 16 穿孔之金屬層保護用之硬化層 17 剝離片 2 1 印刷布線板形成用基板 -45 - 200.522806 22 穿孔 23 金屬層 24 布線圖案 3 1 加壓滾筒Dodecyl propylene glycol diacrylate, tetraethylene glycol dimethacrylate 4, 4 '-bis (diethylamino) benzophenone benzophenone, tosylate peacock green grass salt 3-? Phenylmethyl-1 -phenyltriazole-2 -thione White crystal violet Tribromomethylphenylmethyl ethyl ethyl ketone -38-200522806 On the second photosensitive layer, a 20 // m thick polymer was laminated A vinyl film (protective film) to obtain a photosensitive transfer sheet. In this way, a photosensitive transfer sheet was prepared. As a result of measuring the sensitivity of the photosensitive transfer sheet by the following method, the amount of light A required to harden the second photosensitive layer is 4 ml / cm2, and the amount of light B required to harden the first photosensitive layer is 40 mJ / cm2 'Until the first photosensitive layer starts to harden-the required amount of light C is 14 / cm2 (the difference between the amount of light C and the amount of light A is 10 m J / cm2) 〇 [Method of measuring sensitivity] For the photosensitive layer of a photosensitive transfer sheet 'Using a high-pressure mercury lamp' from the polyethylene terephthalate film (carrier) side '' from 0.1 mJ / cm2 'at 2 1/2 times intervals until 100 m J / c m2' The photosensitive layer is hardened by irradiating light with a different amount of light. Next, the polyethylene terephthalate film was peeled off, and the non-photosensitive portion of the photosensitive layer was dissolved and removed using an aqueous solution of sodium carbonate. The cured layer was developed. Then, the thickness of the cured layer was measured. Next, the relationship between the amount of light irradiation and the thickness of the hardened layer is plotted to obtain a sensitivity curve. In this way, the light amount (light amount A) when the thickness of the hardened layer becomes 5 # m, the light amount (light amount B) when the thickness of the hardened layer becomes 30 // m ®, and the thickness of the hardened layer exceed 5 // Light quantity at light m (light quantity C) ○ [Manufacture of printed wiring board] A substrate having a perforation with a diameter of 3 mm and a copper layer on the surface was prepared. The chemical honing device is used to spray a treatment solution whose main components are hydrogen peroxide (concentration: 8g / -liter), sulfuric acid (concentration: liter), and copper ion (concentration: 1.9g / liter). The surface of the copper layer of the substrate was chemically honed -39-200522806, and then dried. Set the temperature of the treatment liquid to 30 ° C, the pressure of the shower curtain pipe to 0.2 MPa, and the treatment time to 25 seconds. The surface roughness (Ra) of the copper layer on the substrate surface after the chemical honing was measured was 0.1 2 // m. The cut-off value 値 during measurement is set to 80 // m. In this manner, a copper-clad laminate is prepared (a substrate for forming a printed wiring board). -Next, the second photosensitive layer of the photosensitive transfer sheet from which the polyethylene terephthalate film (protective film) was peeled was superimposed on a copper-clad laminate, and a hot-roller laminator was used to prevent air bubbles from entering. Lamination was performed to obtain a photosensitive laminate in which a copper-clad laminate, a second photosensitive layer, a first photosensitive layer, and a polyethylene terephthalate film (carrier) were sequentially laminated. From the top surface of the obtained polyethylene terephthalate film of the photosensitive laminate, using an exposure device having a 40 5 nm blue laser light source, 4 The light of mJ / cm2 is irradiated into a predetermined pattern. On the other hand, the perforated opening of the copper-clad laminate and the surrounding area are irradiated with light of 40mJ / cm2 to expose the photosensitive layer. After the exposure, the polyethylene terephthalate film (carrier) was peeled from the photosensitive laminate, and then a 1% by mass sodium carbonate aqueous solution was sprayed on the surface of the second photosensitive layer to spray The uncured areas of the first photosensitive layer and the second photosensitive layer are dissolved and removed to obtain relief of the cured layer. When the hardened layer pattern on the copper-clad laminate was observed, the hardened layer on the wiring pattern forming area and the hardened layer on the perforated openings were not found to have defects such as peeling or cracking. In addition, when measuring the thickness of the hardened layer, the thickness of the hardened layer on the wiring pattern-formation area was 5 # m, and the thickness of the hardened layer on the perforated opening was 3 0 // m. In addition, the minimum resolution line width of the hardened layer on the wiring pattern formation area (-40-200522806) (the width of the smallest hardened layer pattern without abnormalities such as blockage and skew) is 20 // m. Next, the surface of the copper-clad laminate is sprayed with an etching solution containing ferric chloride to dissolve and remove the copper layer in the exposed area that is not covered by the hardened layer, and then perform hydrogen at a concentration of 2% by mass. Spraying and showering the sodium oxide aqueous solution to remove the relief of the hardened layer to obtain a printed wiring board having a perforated surface and a copper pattern-like copper layer on the surface. When the perforation of the obtained printed circuit board was visually observed, no abnormality was found in the copper plating on the inner wall of the perforation. [Example 2] _ Prepare a substrate with a 3 mm diameter perforation and a copper layer on the surface. Using a chemical honing device, the substrate was sprayed with a treatment solution whose main components were hydrogen peroxide (concentration: 4g / liter), sulfuric acid (concentration: 50g / liter), and copper ions (concentration: ig / liter). The surface of the copper layer was chemically honed, and then dried. Set the temperature of the treatment liquid to 30 ° C, the pressure of the shower piping to 0 · 2 MPa, and the treatment time to 25 seconds. The surface roughness (Ra) of the copper layer on the substrate after the chemical honing was measured was 0.05 05 m. The cut-off 値 at the time of measurement is set to 80 // m. In this manner, a copper-clad laminate (a substrate for forming a printed wiring board) was prepared. A hardened layer pattern was formed on the copper-clad laminate in the same manner as in Example 1 except that the copper-clad laminate prepared in this manner was used. When observing the hardened layer pattern on the mineral copper laminate, the hardened layer on the wiring pattern formation area and the hardened layer on the perforated openings did not reveal defects such as peeling or cracking. In addition, the minimum resolution line width of the hardened layer on the wiring pattern formation area is 20 μm. Next, the same manner as in Example 1 was performed. -41-200522806 The copper wiring layer was etched and then the hardened layer was removed to obtain a printed wiring board. When the perforation of the obtained printed circuit board was visually observed, no abnormality was found in the copper plating on the inner wall of the perforation. [Example 3] ^ A substrate having a hole with a diameter of 3 mm and a copper layer on the surface was prepared. Using a chemical honing device, spray a treatment solution containing hydrogen peroxide (concentration: 15g / liter), sulfuric acid (concentration: 200g / liter), and copper ion (concentration: 4g / liter) on the main components. The surface of the copper layer of the substrate is subjected to a chemical honing process and then dried. Set the temperature of the processing solution to 30 ° C, the pressure of the shower curtain pipe ® to 0.2 MPa, and the processing time to 25 seconds. The surface roughness (Ra) of the copper layer on the substrate surface after the chemical honing was measured was 0. 20 // m. The cut-off value 値 during measurement is set to 80 // m. In this manner, a copper-plated laminate (a substrate for forming a printed wiring board) was prepared. A hardened layer pattern was formed on the copper-clad laminate in the same manner as in Example 1 except that the copper-clad laminate prepared in this manner was used. When observing the hardened layer pattern on the copper-clad laminate, the hardened layer on the wiring pattern forming area and the hardened layer on the perforated openings did not reveal defects such as peeling or cracking. In addition, the minimum resolution line width of the hardened layer on the wiring pattern formation area is 2 5 / z m. Next, a printed wiring board was obtained by etching the copper layer and removing the relief of the hardened layer in the same manner as in Example 1. When the perforation of the obtained printed circuit board was visually observed, no abnormality was found in the copper plating on the inner wall of the perforation. -[Example 4] A substrate having a hole with a diameter of 3 mm and a copper layer on the surface was prepared. Le-42-200522806 With a chemical honing device, the main components are hydrogen peroxide (concentration: 25 g / liter), sulfuric acid (concentration: 200g / liter), and copper ion (concentration: 6g / liter). The liquid is sprayed on the surface of the copper layer of the substrate for chemical honing, and then dried. Set the temperature of the processing solution to 30 ° C, the pressure of the shower curtain pipe to 0 · 2MP a, and the processing time to 30 seconds. The surface roughness (Ra) of the copper layer on the substrate after the chemical honing was measured was 0. 30 // m. The cut-off value 値 during measurement is set to 80 // m. In this manner, a copper-plated laminate (a substrate for forming a printed wiring board) was prepared. A hardened layer pattern was formed on the copper-clad laminate in the same manner as in Example 1 except that the copper-clad laminate prepared in this manner was used. When the hardened layer pattern on the copper-clad laminate was observed, no defects such as peeling or cracking were found on the hardened layer on the wiring pattern forming area and the hardened layer on the perforated opening. In addition, the minimum resolution line width of the hardened layer on the wiring pattern formation area is 3 0 // m. Next, a printed wiring board was obtained by etching the copper layer and removing the relief of the hardened layer in the same manner as in Example 1. When the perforation of the obtained printed circuit board was visually observed, no abnormality was found in the copper plating on the inner wall of the perforation. [Example 5] A substrate having a perforation with a diameter of 3 mm and a copper layer on the surface was prepared. Using a chemical honing device, the substrate was sprayed with a treatment solution whose main components were hydrogen peroxide (concentration: 30 g / liter), sulfuric acid (concentration: 200 g / liter), and copper ions (concentration: 8 g / liter). The surface of the copper layer was chemically honed and then dried. Set the temperature of the treatment liquid to 35 ° C, the pressure of the shower piping to 0 · 2 MPa, and the treatment time to 30 seconds. The surface roughness (Ra) of the copper layer on the surface of the substrate after the chemical honing was measured on 200522806 was 0.40 // m. The cutoff 値 during the measurement is set to 8 0 // πm. In this manner, a copper-plated laminate (a substrate for forming a printed wiring board) was prepared. A hardened layer pattern was formed on the copper-clad laminate in the same manner as in Example 1 except that the copper-clad laminate prepared in this manner was used. -When observing the hardened layer pattern on the copper-clad laminate, the hardened layer on the wiring pattern forming area and the hardened layer on the perforated openings did not reveal defects such as peeling or cracking. In addition, the minimum resolution line width of the hardened layer on the wiring pattern formation area is 50 / m. Next, the same method as in Example 1 was performed. The printed wiring board was obtained by etching the copper layer and then removing the relief of the hardened layer. When the perforation of the obtained printed circuit board was visually observed, no abnormality was found in the copper plating on the inner wall of the perforation. [Comparative Example 1] A substrate having a perforation with a diameter of 3 mm and a copper layer on the surface was prepared. Using a chemical honing device, the substrate was sprayed with a treatment solution whose main components were hydrogen peroxide (concentration: 55 g / liter), sulfuric acid (concentration: 300 g / liter), and copper ions (concentration: 8 g / liter). The surface of the copper layer is chemically honed and then dried. Set the temperature of the processing liquid to 40 ° C, the pressure of the shower curtain pipe to 0.2 5 MPa, and the processing time to 40 seconds. The surface roughness (Ra) of the copper layer on the substrate surface after the chemical honing was measured was 0.50 // in. The cutoff 値 at the time of measurement was set to 80 // m. In this manner, a copper-plated laminated board (a substrate for forming a printed wiring board) was prepared. A hardened layer pattern was formed on the copper-clad laminate in the same manner as in Example 1 except that the copper-clad laminate prepared in this manner was used. -44-200522806 When observing the hardened layer pattern on the copper-clad laminate, the hardened layer on the wiring pattern forming area and the hardened layer on the perforated openings did not show defects such as peeling or cracking. In addition, the minimum resolution line width of the hardened layer on the wiring pattern formation area is 8 0 // m. Next, a printed wiring board was obtained by etching the copper layer and removing the relief of the hardened layer in the same manner as in Example 1. When the perforation of the obtained printed circuit board was visually observed, no abnormality was found in the copper plating on the inner wall of the perforation. [Brief description of the drawings] FIG. 1 is a cross-sectional view showing the structure of an example of a photosensitive transfer sheet that is more suitably used in the method for manufacturing a printed wiring board of the present invention. Fig. 2 is a sensitivity graph showing the relationship between the amount of light irradiation and the thickness of the cured layer when the light is irradiated onto the photosensitive transfer sheet of Fig. 2 from the carrier side. Fig. 3 is a diagram showing a manufacturing process of a printed wiring board having perforations according to the present invention. [Description of Symbols of Main Components] 10 Photosensitive transfer sheet 11 Carrier 12 First photosensitive layer 13 Second photosensitive layer 14 Protective film 15 Hardened layer for wiring pattern formation 16 Hardened layer for perforated metal layer protection 17 Release sheet 2 1 Printed wiring board forming substrate-45-200.522806 22 Perforation 23 Metal layer 24 Wiring pattern 3 1 Press roller
-46 --46-