TW200511903A - Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method - Google Patents
Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation methodInfo
- Publication number
- TW200511903A TW200511903A TW093117592A TW93117592A TW200511903A TW 200511903 A TW200511903 A TW 200511903A TW 093117592 A TW093117592 A TW 093117592A TW 93117592 A TW93117592 A TW 93117592A TW 200511903 A TW200511903 A TW 200511903A
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensitive
- formation method
- pattern formation
- imagine
- transcription sheet
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003177178 | 2003-06-20 | ||
JP2003433828 | 2003-12-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200511903A true TW200511903A (en) | 2005-03-16 |
Family
ID=34525352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093117592A TW200511903A (en) | 2003-06-20 | 2004-06-18 | Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20040111121A (zh) |
CN (1) | CN1573545A (zh) |
TW (1) | TW200511903A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI469883B (zh) * | 2008-04-30 | 2015-01-21 | Nissha Printing | 部分消光硬塗膜轉印片及其製造方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4621036B2 (ja) * | 2005-02-08 | 2011-01-26 | 太陽ホールディングス株式会社 | 感光性樹脂組成物、及びその硬化物並びに該硬化物からなる表示パネル用スペーサー |
KR100778268B1 (ko) * | 2005-12-13 | 2007-11-28 | 삼성전기주식회사 | 전도성 포토레지스트 필름 및 기판 제조방법 |
JP4711862B2 (ja) * | 2006-03-08 | 2011-06-29 | 富士フイルム株式会社 | 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板 |
KR101059408B1 (ko) * | 2006-08-03 | 2011-08-29 | 아사히 가세이 일렉트로닉스 가부시끼가이샤 | 감광성 수지 조성물 및 적층체 |
EP2247170B1 (en) * | 2008-01-30 | 2014-10-22 | Mitsubishi Paper Mills Limited | Method for electroconductive pattern formation |
TWI477904B (zh) * | 2010-03-26 | 2015-03-21 | Sumitomo Chemical Co | Photosensitive resin composition |
KR102227564B1 (ko) * | 2014-01-20 | 2021-03-15 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 |
CN105714277B (zh) * | 2014-12-03 | 2019-08-30 | 珠海方正科技多层电路板有限公司 | 干膜、电器元件的镀金属方法和电路板的线路制作方法 |
KR102377139B1 (ko) * | 2015-07-30 | 2022-03-22 | 동우 화인켐 주식회사 | 착색 감광성 수지층 및 실리카 함입 기재를 포함하는 적층 기판 |
JP6661343B2 (ja) * | 2015-11-26 | 2020-03-11 | 富士フイルム株式会社 | 転写材料、転写材料の製造方法、積層体、積層体の製造方法、静電容量型入力装置の製造方法、及び、画像表示装置の製造方法 |
KR102570709B1 (ko) * | 2017-11-06 | 2023-08-24 | 아사히 가세이 가부시키가이샤 | 감광성 수지 적층체 및 레지스트 패턴의 제조 방법 |
-
2004
- 2004-06-08 CN CNA2004100462717A patent/CN1573545A/zh active Pending
- 2004-06-17 KR KR1020040045141A patent/KR20040111121A/ko not_active Application Discontinuation
- 2004-06-18 TW TW093117592A patent/TW200511903A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI469883B (zh) * | 2008-04-30 | 2015-01-21 | Nissha Printing | 部分消光硬塗膜轉印片及其製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1573545A (zh) | 2005-02-02 |
KR20040111121A (ko) | 2004-12-31 |
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