TW200511903A - Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method - Google Patents

Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method

Info

Publication number
TW200511903A
TW200511903A TW093117592A TW93117592A TW200511903A TW 200511903 A TW200511903 A TW 200511903A TW 093117592 A TW093117592 A TW 093117592A TW 93117592 A TW93117592 A TW 93117592A TW 200511903 A TW200511903 A TW 200511903A
Authority
TW
Taiwan
Prior art keywords
photosensitive
formation method
pattern formation
imagine
transcription sheet
Prior art date
Application number
TW093117592A
Other languages
English (en)
Inventor
Morimasa Sato
Yuichi Wakata
Masanobu Takashima
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200511903A publication Critical patent/TW200511903A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW093117592A 2003-06-20 2004-06-18 Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method TW200511903A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003177178 2003-06-20
JP2003433828 2003-12-26

Publications (1)

Publication Number Publication Date
TW200511903A true TW200511903A (en) 2005-03-16

Family

ID=34525352

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117592A TW200511903A (en) 2003-06-20 2004-06-18 Photosensitive transcription sheet, photosensitive laminate, imagine pattern formation method, and wiring pattern formation method

Country Status (3)

Country Link
KR (1) KR20040111121A (zh)
CN (1) CN1573545A (zh)
TW (1) TW200511903A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469883B (zh) * 2008-04-30 2015-01-21 Nissha Printing 部分消光硬塗膜轉印片及其製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4621036B2 (ja) * 2005-02-08 2011-01-26 太陽ホールディングス株式会社 感光性樹脂組成物、及びその硬化物並びに該硬化物からなる表示パネル用スペーサー
KR100778268B1 (ko) * 2005-12-13 2007-11-28 삼성전기주식회사 전도성 포토레지스트 필름 및 기판 제조방법
JP4711862B2 (ja) * 2006-03-08 2011-06-29 富士フイルム株式会社 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
CN101449208B (zh) * 2006-08-03 2011-12-14 旭化成电子材料株式会社 感光性树脂组合物以及层压体
EP2247170B1 (en) * 2008-01-30 2014-10-22 Mitsubishi Paper Mills Limited Method for electroconductive pattern formation
TWI477904B (zh) * 2010-03-26 2015-03-21 Sumitomo Chemical Co Photosensitive resin composition
KR102227564B1 (ko) * 2014-01-20 2021-03-15 삼성디스플레이 주식회사 포토레지스트 조성물
CN105714277B (zh) * 2014-12-03 2019-08-30 珠海方正科技多层电路板有限公司 干膜、电器元件的镀金属方法和电路板的线路制作方法
KR102377139B1 (ko) * 2015-07-30 2022-03-22 동우 화인켐 주식회사 착색 감광성 수지층 및 실리카 함입 기재를 포함하는 적층 기판
JP6661343B2 (ja) * 2015-11-26 2020-03-11 富士フイルム株式会社 転写材料、転写材料の製造方法、積層体、積層体の製造方法、静電容量型入力装置の製造方法、及び、画像表示装置の製造方法
KR102522749B1 (ko) * 2017-11-06 2023-04-17 아사히 가세이 가부시키가이샤 감광성 수지 적층체 및 레지스트 패턴의 제조 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469883B (zh) * 2008-04-30 2015-01-21 Nissha Printing 部分消光硬塗膜轉印片及其製造方法

Also Published As

Publication number Publication date
KR20040111121A (ko) 2004-12-31
CN1573545A (zh) 2005-02-02

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