TW200511417A - Polishing pad and method of producing same - Google Patents

Polishing pad and method of producing same

Info

Publication number
TW200511417A
TW200511417A TW093109767A TW93109767A TW200511417A TW 200511417 A TW200511417 A TW 200511417A TW 093109767 A TW093109767 A TW 093109767A TW 93109767 A TW93109767 A TW 93109767A TW 200511417 A TW200511417 A TW 200511417A
Authority
TW
Taiwan
Prior art keywords
polishing
pad
transmission rate
optical transmission
polishing pad
Prior art date
Application number
TW093109767A
Other languages
English (en)
Inventor
Hisatomo Ohno
Toshihiro Izumi
Mitsuru Saito
Takuya Nagamine
Claughton Miller
Ichiro Kodaka
Original Assignee
Nippon Micro Coating Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micro Coating Kk filed Critical Nippon Micro Coating Kk
Publication of TW200511417A publication Critical patent/TW200511417A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW093109767A 2003-04-11 2004-04-08 Polishing pad and method of producing same TW200511417A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003107863A JP2004319584A (ja) 2003-04-11 2003-04-11 研磨パッド及びその製造方法

Publications (1)

Publication Number Publication Date
TW200511417A true TW200511417A (en) 2005-03-16

Family

ID=33295870

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093109767A TW200511417A (en) 2003-04-11 2004-04-08 Polishing pad and method of producing same

Country Status (6)

Country Link
EP (1) EP1622193A4 (zh)
JP (1) JP2004319584A (zh)
KR (1) KR100721888B1 (zh)
CN (1) CN1771587A (zh)
TW (1) TW200511417A (zh)
WO (1) WO2004093177A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
JP2007149949A (ja) * 2005-11-28 2007-06-14 Roki Techno Co Ltd デバイスウエハ用の研磨パッド
JP2007276009A (ja) * 2006-04-03 2007-10-25 Toyo Tire & Rubber Co Ltd 研磨パッド
JP4931133B2 (ja) * 2007-03-15 2012-05-16 東洋ゴム工業株式会社 研磨パッド
WO2009098917A1 (ja) * 2008-02-04 2009-08-13 Kuraray Co., Ltd. 研磨パッドの製造方法
KR101750775B1 (ko) * 2009-06-29 2017-06-26 디아이씨 가부시끼가이샤 연마 패드용 2액형 우레탄 수지 조성물, 폴리우레탄 연마 패드, 및 폴리우레탄 연마 패드의 제조 방법
JP5350309B2 (ja) * 2010-03-31 2013-11-27 東洋ゴム工業株式会社 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
JP5389973B2 (ja) * 2012-04-11 2014-01-15 東洋ゴム工業株式会社 積層研磨パッド及びその製造方法
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
JP6439963B2 (ja) * 2014-08-22 2018-12-19 富士紡ホールディングス株式会社 保持具及びその製造方法
JP2018029142A (ja) * 2016-08-18 2018-02-22 株式会社クラレ 研磨パッド及びそれを用いた研磨方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6074287A (en) * 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
JP3826729B2 (ja) * 2001-04-25 2006-09-27 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
JP2003048151A (ja) * 2001-08-08 2003-02-18 Rodel Nitta Co 研磨パッド

Also Published As

Publication number Publication date
KR100721888B1 (ko) 2007-05-28
WO2004093177A1 (ja) 2004-10-28
KR20050042752A (ko) 2005-05-10
JP2004319584A (ja) 2004-11-11
EP1622193A1 (en) 2006-02-01
EP1622193A4 (en) 2008-08-20
CN1771587A (zh) 2006-05-10
WO2004093177B1 (ja) 2005-03-31

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