TW200510470A - Polishing pad and method of polishing a semiconductor wafer - Google Patents

Polishing pad and method of polishing a semiconductor wafer

Info

Publication number
TW200510470A
TW200510470A TW093111148A TW93111148A TW200510470A TW 200510470 A TW200510470 A TW 200510470A TW 093111148 A TW093111148 A TW 093111148A TW 93111148 A TW93111148 A TW 93111148A TW 200510470 A TW200510470 A TW 200510470A
Authority
TW
Taiwan
Prior art keywords
polishing
hole
wall
light transmitting
transmitting member
Prior art date
Application number
TW093111148A
Other languages
English (en)
Inventor
Hiromi Aoi
Hiroshi Shiho
Kou Hasegawa
Nobuo Kawahashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200510470A publication Critical patent/TW200510470A/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J11/00—Teats
    • A61J11/007—Teats having orthodontic properties, e.g. for promoting correct teeth development
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J11/00—Teats
    • A61J11/0035—Teats having particular shape or structure
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61J—CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
    • A61J11/00—Teats
    • A61J11/0035—Teats having particular shape or structure
    • A61J11/006—Teats having particular shape or structure for improving flexibility
TW093111148A 2003-04-22 2004-04-21 Polishing pad and method of polishing a semiconductor wafer TW200510470A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003117538 2003-04-22

Publications (1)

Publication Number Publication Date
TW200510470A true TW200510470A (en) 2005-03-16

Family

ID=32959616

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111148A TW200510470A (en) 2003-04-22 2004-04-21 Polishing pad and method of polishing a semiconductor wafer

Country Status (5)

Country Link
US (1) US20040224611A1 (zh)
EP (1) EP1470892A1 (zh)
KR (1) KR20040093402A (zh)
CN (1) CN1569398A (zh)
TW (1) TW200510470A (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8475228B2 (en) 2006-07-03 2013-07-02 Applied Materials, Inc. Polishing pad with partially recessed window
TWI461255B (zh) * 2010-04-16 2014-11-21 Applied Materials Inc 用於產生薄墊中的模塑窗之方法
TWI587977B (zh) * 2013-03-15 2017-06-21 應用材料股份有限公司 帶有次窗密封件的拋光墊及形成此拋光墊的方法
US11161218B2 (en) 2016-02-26 2021-11-02 Applied Materials, Inc. Window in thin polishing pad

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US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
EP1466699A1 (en) * 2003-04-09 2004-10-13 JSR Corporation Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method
CN100424830C (zh) * 2004-04-23 2008-10-08 Jsr株式会社 用于抛光半导体晶片的抛光垫、层叠体和方法
DE102004031878B3 (de) * 2004-07-01 2005-10-06 Epcos Ag Elektrisches Mehrschichtbauelement mit zuverlässigem Lötkontakt
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
CN101966697B (zh) 2006-04-19 2015-04-22 东洋橡胶工业株式会社 抛光垫的制造方法
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
PL2079559T3 (pl) * 2006-07-14 2013-03-29 Saint Gobain Abrasives Inc Artykuł ścierny bez podłoża
TWI409136B (zh) 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US8562389B2 (en) * 2007-06-08 2013-10-22 Applied Materials, Inc. Thin polishing pad with window and molding process
EP2227350A4 (en) * 2007-11-30 2011-01-12 Innopad Inc CUSHION WITH FINISHED MOUNTING WINDOW FOR CHEMICAL-MECHANICAL POLISHING
CN101431021B (zh) * 2008-12-11 2010-09-08 上海合晶硅材料有限公司 一种薄型硅单晶抛光片加工方法
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
WO2010081084A2 (en) * 2009-01-12 2010-07-15 Novaplanar Technology Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
SG181890A1 (en) * 2009-12-22 2012-07-30 3M Innovative Properties Co Polishing pad and method of making the same
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US8920219B2 (en) * 2011-07-15 2014-12-30 Nexplanar Corporation Polishing pad with alignment aperture
JP5732354B2 (ja) * 2011-09-01 2015-06-10 東洋ゴム工業株式会社 研磨パッド
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
TWI671161B (zh) 2012-04-02 2019-09-11 美商湯瑪士衛斯有限公司 用於離心鑄造聚合物拋光墊之方法及系統及由該方法製得之拋光墊
CN106457523A (zh) * 2014-06-17 2017-02-22 阪东化学株式会社 研磨垫及研磨垫的制造方法
SG11201806662WA (en) * 2016-02-26 2018-09-27 Applied Materials Inc Window in thin polishing pad
TWI593511B (zh) * 2016-06-08 2017-08-01 智勝科技股份有限公司 研磨墊及研磨方法
US10813444B2 (en) * 2018-05-16 2020-10-27 Jh Rhodes Company, Inc. Porous polymeric polishing bristles and methods for their manufacture
US20180169827A1 (en) * 2016-12-16 2018-06-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods for making chemical mechanical planarization (cmp) polishing pads having integral windows
KR101945874B1 (ko) * 2017-08-07 2019-02-11 에스케이씨 주식회사 표면 처리된 연마패드용 윈도우 및 이를 포함하는 연마패드
CN110712117B (zh) * 2018-07-12 2021-08-10 鼎朋企业股份有限公司 应用于非水平研磨表面的研磨机

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6832950B2 (en) * 2002-10-28 2004-12-21 Applied Materials, Inc. Polishing pad with window
US20020144771A1 (en) * 1999-02-11 2002-10-10 Kuczynski Joseph Paul UV curable adhesives containing ceramic microspheres
DE10084915C2 (de) * 1999-08-27 2003-12-24 Asahi Chemical Ind Polierkissen und Poliervorrichtung
DE60228784D1 (de) * 2001-04-25 2008-10-23 Jsr Corp Lichtduchlässiges Polierkissen für eine Halbleiterschleife
US6599765B1 (en) * 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
US6702866B2 (en) * 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US6960120B2 (en) * 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8475228B2 (en) 2006-07-03 2013-07-02 Applied Materials, Inc. Polishing pad with partially recessed window
TWI461255B (zh) * 2010-04-16 2014-11-21 Applied Materials Inc 用於產生薄墊中的模塑窗之方法
US10744618B2 (en) 2013-03-15 2020-08-18 Applied Materials, Inc. Polishing pad with secondary window seal
US9731397B2 (en) 2013-03-15 2017-08-15 Applied Materials, Inc. Polishing pad with secondary window seal
TWI615241B (zh) * 2013-03-15 2018-02-21 應用材料股份有限公司 帶有次窗密封件的拋光墊及形成此拋光墊的方法
TWI639487B (zh) * 2013-03-15 2018-11-01 美商應用材料股份有限公司 帶有次窗密封件的拋光墊及形成此拋光墊的方法
TWI587977B (zh) * 2013-03-15 2017-06-21 應用材料股份有限公司 帶有次窗密封件的拋光墊及形成此拋光墊的方法
US11618124B2 (en) 2013-03-15 2023-04-04 Applied Materials, Inc. Polishing pad with secondary window seal
US11161218B2 (en) 2016-02-26 2021-11-02 Applied Materials, Inc. Window in thin polishing pad
TWI748985B (zh) * 2016-02-26 2021-12-11 美商應用材料股份有限公司 拋光墊及其製造方法
TWI780978B (zh) * 2016-02-26 2022-10-11 美商應用材料股份有限公司 拋光墊及其製造方法
TWI808823B (zh) * 2016-02-26 2023-07-11 美商應用材料股份有限公司 拋光墊及其製造方法
US11826875B2 (en) 2016-02-26 2023-11-28 Applied Materials, Inc. Window in thin polishing pad
TWI824946B (zh) * 2016-02-26 2023-12-01 美商應用材料股份有限公司 拋光墊及其製造方法

Also Published As

Publication number Publication date
US20040224611A1 (en) 2004-11-11
KR20040093402A (ko) 2004-11-05
EP1470892A1 (en) 2004-10-27
CN1569398A (zh) 2005-01-26

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