TW200509329A - LED package material and process - Google Patents

LED package material and process

Info

Publication number
TW200509329A
TW200509329A TW092123504A TW92123504A TW200509329A TW 200509329 A TW200509329 A TW 200509329A TW 092123504 A TW092123504 A TW 092123504A TW 92123504 A TW92123504 A TW 92123504A TW 200509329 A TW200509329 A TW 200509329A
Authority
TW
Taiwan
Prior art keywords
photosensitive polymer
package material
led package
light
led
Prior art date
Application number
TW092123504A
Other languages
English (en)
Inventor
Yung-Shu Yang
Original Assignee
Yung-Shu Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yung-Shu Yang filed Critical Yung-Shu Yang
Priority to TW092123504A priority Critical patent/TW200509329A/zh
Priority to US10/716,624 priority patent/US6958250B2/en
Priority to KR1020040002181A priority patent/KR100607001B1/ko
Priority to JP2004009593A priority patent/JP2005072552A/ja
Publication of TW200509329A publication Critical patent/TW200509329A/zh

Links

Classifications

    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M15/00—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment
    • D06M15/19—Treating fibres, threads, yarns, fabrics, or fibrous goods made from such materials, with macromolecular compounds; Such treatment combined with mechanical treatment with synthetic macromolecular compounds
    • D06M15/21—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D13/00—Woven fabrics characterised by the special disposition of the warp or weft threads, e.g. with curved weft threads, with discontinuous warp threads, with diagonal warp or weft
    • D03D13/004—Woven fabrics characterised by the special disposition of the warp or weft threads, e.g. with curved weft threads, with discontinuous warp threads, with diagonal warp or weft with weave pattern being non-standard or providing special effects
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2505/00—Industrial
    • D10B2505/18—Outdoor fabrics, e.g. tents, tarpaulins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
TW092123504A 2003-08-26 2003-08-26 LED package material and process TW200509329A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW092123504A TW200509329A (en) 2003-08-26 2003-08-26 LED package material and process
US10/716,624 US6958250B2 (en) 2003-08-26 2003-11-20 Light-emitting diode encapsulation material and manufacturing process
KR1020040002181A KR100607001B1 (ko) 2003-08-26 2004-01-13 발광 다이오드 제조방법 및 캡슐화 재료
JP2004009593A JP2005072552A (ja) 2003-08-26 2004-01-16 発光ダイオードのパッケージ体及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092123504A TW200509329A (en) 2003-08-26 2003-08-26 LED package material and process

Publications (1)

Publication Number Publication Date
TW200509329A true TW200509329A (en) 2005-03-01

Family

ID=34215125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092123504A TW200509329A (en) 2003-08-26 2003-08-26 LED package material and process

Country Status (4)

Country Link
US (1) US6958250B2 (zh)
JP (1) JP2005072552A (zh)
KR (1) KR100607001B1 (zh)
TW (1) TW200509329A (zh)

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Publication number Priority date Publication date Assignee Title
US7192795B2 (en) * 2004-11-18 2007-03-20 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US7314770B2 (en) * 2004-11-18 2008-01-01 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20070029034A1 (en) * 2005-08-02 2007-02-08 Mgaya Alexander P Dual cure adhesives
US20070092737A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
WO2007047289A1 (en) * 2005-10-17 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20070092736A1 (en) * 2005-10-21 2007-04-26 3M Innovative Properties Company Method of making light emitting device with silicon-containing encapsulant
US20070092636A1 (en) * 2005-10-24 2007-04-26 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
US7595515B2 (en) * 2005-10-24 2009-09-29 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
US7655486B2 (en) * 2006-05-17 2010-02-02 3M Innovative Properties Company Method of making light emitting device with multilayer silicon-containing encapsulant
US20070269586A1 (en) * 2006-05-17 2007-11-22 3M Innovative Properties Company Method of making light emitting device with silicon-containing composition
US8092735B2 (en) * 2006-08-17 2012-01-10 3M Innovative Properties Company Method of making a light emitting device having a molded encapsulant
KR101271225B1 (ko) * 2006-10-31 2013-06-03 삼성디스플레이 주식회사 발광 다이오드 칩 및 발광 다이오드 광원 모듈의 제조 방법
KR100845089B1 (ko) 2007-02-08 2008-07-09 충북대학교 산학협력단 발광다이오드의 인캡슐레이션 방법
US8330176B2 (en) * 2007-02-13 2012-12-11 3M Innovative Properties Company LED devices having lenses and methods of making same
JP3138795U (ja) * 2007-11-02 2008-01-17 サンケン電気株式会社 半導体発光装置及び半導体発光装置を用いた面状発光源
CN100483760C (zh) * 2007-12-14 2009-04-29 暨南大学 一种白色发光二极管的封装方法
GB2462411B (en) * 2008-07-30 2013-05-22 Photonstar Led Ltd Tunable colour led module
CN104517862B (zh) * 2013-09-29 2018-11-02 深南电路有限公司 一种指纹传感器封装方法和结构
TWI664708B (zh) * 2014-12-16 2019-07-01 Deca Technologies Inc. 標記一半導體封裝之方法
KR102173090B1 (ko) * 2019-09-04 2020-11-03 (주)라이타이저 캐리어 기판의 선택적 전사 방법, 이를 이용한 디스플레이 장치의 제조 방법 및 그 방법에 의해 제조되는 디스플레이 장치
KR102203649B1 (ko) * 2019-09-10 2021-01-15 (주)라이타이저 서브 픽셀 csp, 서브 픽셀 csp의 제조 방법, 디스플레이 장치의 제조 방법 및 그 방법에 의해 제조되는 디스플레이 장치
KR102173102B1 (ko) * 2019-09-11 2020-11-04 (주)라이타이저 프로브 카드, 이를 이용한 테스트 장치와 방법, 디스플레이 장치의 제조 방법 및 그 방법에 의해 제조되는 디스플레이 장치
CN113358548A (zh) * 2021-06-16 2021-09-07 厦门多彩光电子科技有限公司 一种紫外led封装胶的质量评估方法

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NL8303316A (nl) 1983-09-28 1985-04-16 Philips Nv Werkwijze voor het vervaardigen van een inrichting voor het uitzenden van licht.
JPH0597063U (ja) * 1991-04-15 1993-12-27 モレックス インコーポレーテッド 電気コネクタ
JPH0595136A (ja) * 1991-10-02 1993-04-16 Fanuc Ltd 発光ダイオードの固着方法
TW262537B (zh) * 1993-07-01 1995-11-11 Allied Signal Inc
US5991160A (en) * 1995-12-27 1999-11-23 Infineon Technologies Corporation Surface mount LED alphanumeric display
JP3337405B2 (ja) * 1996-12-27 2002-10-21 シャープ株式会社 発光表示素子およびその電気配線基板への接続方法ならびに製造方法
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
BR0208683A (pt) * 2001-04-06 2004-03-30 Borden Chem Inc Conjunto de fibra ótica revestida e respectivo processo de preparação e composição de revestimento de fibras óticas
JP2003132717A (ja) 2001-10-29 2003-05-09 Shinano Kagaku Kogyo Kk イルミネーション発光器

Also Published As

Publication number Publication date
US20050048681A1 (en) 2005-03-03
KR20050022161A (ko) 2005-03-07
JP2005072552A (ja) 2005-03-17
US6958250B2 (en) 2005-10-25
KR100607001B1 (ko) 2006-08-01

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