TW200507291A - Improved packaging process and structure of light emitting diode - Google Patents

Improved packaging process and structure of light emitting diode

Info

Publication number
TW200507291A
TW200507291A TW092121715A TW92121715A TW200507291A TW 200507291 A TW200507291 A TW 200507291A TW 092121715 A TW092121715 A TW 092121715A TW 92121715 A TW92121715 A TW 92121715A TW 200507291 A TW200507291 A TW 200507291A
Authority
TW
Taiwan
Prior art keywords
frame
cavity
light emitting
resin
dispensing
Prior art date
Application number
TW092121715A
Other languages
Chinese (zh)
Other versions
TWI227061B (en
Inventor
Jui-Tuan Li
Original Assignee
Joinscan Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joinscan Electronics Co Ltd filed Critical Joinscan Electronics Co Ltd
Priority to TW92121715A priority Critical patent/TWI227061B/en
Application granted granted Critical
Publication of TWI227061B publication Critical patent/TWI227061B/en
Publication of TW200507291A publication Critical patent/TW200507291A/en

Links

Landscapes

  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

The present invention relates to an improved packaging process and structure of light emitting diode. The process comprises adhering a die to the pin of a frame; soldering an electrode wire from the die so that the other end of the electrode wire is soldered to the other pin of the frame, thereby completing the processing operation of the frame; performing a first dispensing in the cavity of a mold; curing a first resin layer in the cavity after baking; next performing a second dispensing in the cavity to pour resin adhesive containing fluorescent material into the cavity for covering the cured first resin layer and thus form a fluorescent layer; performing a third dispensing after the fluorescent layer is solidified to fill up the resin glue in the cavity of the mold; placing the frame soldered with the electrode wire into the resin adhesive of the cavity before the resin adhesive is solidified; performing a second baking and curing to form a second resin layer packaged outside the frame and integrated with the first resin layer and the fluorescent layer; and cutting off the excessive material tape on the frame to produce light emitting diodes.
TW92121715A 2003-08-07 2003-08-07 Improved packaging process and structure of light emitting diode TWI227061B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92121715A TWI227061B (en) 2003-08-07 2003-08-07 Improved packaging process and structure of light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92121715A TWI227061B (en) 2003-08-07 2003-08-07 Improved packaging process and structure of light emitting diode

Publications (2)

Publication Number Publication Date
TWI227061B TWI227061B (en) 2005-01-21
TW200507291A true TW200507291A (en) 2005-02-16

Family

ID=35654734

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92121715A TWI227061B (en) 2003-08-07 2003-08-07 Improved packaging process and structure of light emitting diode

Country Status (1)

Country Link
TW (1) TWI227061B (en)

Also Published As

Publication number Publication date
TWI227061B (en) 2005-01-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees