TW200507291A - Improved packaging process and structure of light emitting diode - Google Patents
Improved packaging process and structure of light emitting diodeInfo
- Publication number
- TW200507291A TW200507291A TW092121715A TW92121715A TW200507291A TW 200507291 A TW200507291 A TW 200507291A TW 092121715 A TW092121715 A TW 092121715A TW 92121715 A TW92121715 A TW 92121715A TW 200507291 A TW200507291 A TW 200507291A
- Authority
- TW
- Taiwan
- Prior art keywords
- frame
- cavity
- light emitting
- resin
- dispensing
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to an improved packaging process and structure of light emitting diode. The process comprises adhering a die to the pin of a frame; soldering an electrode wire from the die so that the other end of the electrode wire is soldered to the other pin of the frame, thereby completing the processing operation of the frame; performing a first dispensing in the cavity of a mold; curing a first resin layer in the cavity after baking; next performing a second dispensing in the cavity to pour resin adhesive containing fluorescent material into the cavity for covering the cured first resin layer and thus form a fluorescent layer; performing a third dispensing after the fluorescent layer is solidified to fill up the resin glue in the cavity of the mold; placing the frame soldered with the electrode wire into the resin adhesive of the cavity before the resin adhesive is solidified; performing a second baking and curing to form a second resin layer packaged outside the frame and integrated with the first resin layer and the fluorescent layer; and cutting off the excessive material tape on the frame to produce light emitting diodes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92121715A TWI227061B (en) | 2003-08-07 | 2003-08-07 | Improved packaging process and structure of light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92121715A TWI227061B (en) | 2003-08-07 | 2003-08-07 | Improved packaging process and structure of light emitting diode |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI227061B TWI227061B (en) | 2005-01-21 |
TW200507291A true TW200507291A (en) | 2005-02-16 |
Family
ID=35654734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92121715A TWI227061B (en) | 2003-08-07 | 2003-08-07 | Improved packaging process and structure of light emitting diode |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI227061B (en) |
-
2003
- 2003-08-07 TW TW92121715A patent/TWI227061B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI227061B (en) | 2005-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |