TW200506974A - Bidirectional thermal trimming of electrical resistance - Google Patents

Bidirectional thermal trimming of electrical resistance

Info

Publication number
TW200506974A
TW200506974A TW093107603A TW93107603A TW200506974A TW 200506974 A TW200506974 A TW 200506974A TW 093107603 A TW093107603 A TW 093107603A TW 93107603 A TW93107603 A TW 93107603A TW 200506974 A TW200506974 A TW 200506974A
Authority
TW
Taiwan
Prior art keywords
trimming
pulses
parameters
electrical resistance
sequence
Prior art date
Application number
TW093107603A
Other languages
English (en)
Inventor
Oleg Grudin
Leslie Landsberger
Gennadiy Frolov
Original Assignee
Microbridge Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microbridge Technologies Inc filed Critical Microbridge Technologies Inc
Publication of TW200506974A publication Critical patent/TW200506974A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/20—Resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/26—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material
    • H01C17/265—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material by chemical or thermal treatment, e.g. oxydation, reduction, annealing
    • H01C17/267—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material by chemical or thermal treatment, e.g. oxydation, reduction, annealing by passage of voltage pulses or electric current
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0802—Resistors only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Measuring Volume Flow (AREA)
  • Non-Adjustable Resistors (AREA)
TW093107603A 2003-03-20 2004-03-20 Bidirectional thermal trimming of electrical resistance TW200506974A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US45588703P 2003-03-20 2003-03-20

Publications (1)

Publication Number Publication Date
TW200506974A true TW200506974A (en) 2005-02-16

Family

ID=33418072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093107603A TW200506974A (en) 2003-03-20 2004-03-20 Bidirectional thermal trimming of electrical resistance

Country Status (8)

Country Link
US (2) US7667156B2 (zh)
EP (1) EP1609185B1 (zh)
JP (1) JP2006520532A (zh)
AT (1) ATE475196T1 (zh)
CA (1) CA2519690A1 (zh)
DE (1) DE602004028225D1 (zh)
TW (1) TW200506974A (zh)
WO (1) WO2004097859A2 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7714694B2 (en) 2004-09-21 2010-05-11 Microbridge Technologies Canada, Inc. Compensating for linear and non-linear trimming-induced shift of temperature coefficient of resistance
US8847117B2 (en) 2008-03-14 2014-09-30 Sensortechnics GmbH Method of stabilizing thermal resistors
US8940598B2 (en) * 2010-11-03 2015-01-27 Texas Instruments Incorporated Low temperature coefficient resistor in CMOS flow
US8723637B2 (en) 2012-04-10 2014-05-13 Analog Devices, Inc. Method for altering electrical and thermal properties of resistive materials
JP6073705B2 (ja) * 2013-02-26 2017-02-01 エスアイアイ・セミコンダクタ株式会社 ヒューズ回路及び半導体集積回路装置
US9570538B2 (en) 2014-03-19 2017-02-14 International Business Machines Corporation Methods of manufacturing polyresistors with selected TCR
US20150302957A1 (en) * 2014-04-18 2015-10-22 Ohmite Manufacturing Co. Method of laser trimming at low and high temperatures

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2639246A (en) * 1951-11-29 1953-05-19 Gen Electric Method for stabilizing semiconductor material
US3723257A (en) * 1970-03-30 1973-03-27 Western Electric Co Methods and apparatus for trimming thin-film devices to value by means of a computer-controlled anodization process
US3649801A (en) * 1970-04-29 1972-03-14 Gen Electric Film resistor trimmer
US3916142A (en) * 1973-03-29 1975-10-28 Gte Automatic Electric Lab Inc Method of static trimming of film deposited resistors
US4782202A (en) * 1986-12-29 1988-11-01 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for resistance adjustment of thick film thermal print heads
GB2258356B (en) * 1991-07-31 1995-02-22 Metron Designs Ltd Method and apparatus for conditioning an electronic component having a characteristic subject to variation with temperature
US5466484A (en) * 1993-09-29 1995-11-14 Motorola, Inc. Resistor structure and method of setting a resistance value
JPH08224879A (ja) * 1994-12-19 1996-09-03 Xerox Corp 液滴エジェクタ閾値調整方法
US5679275A (en) * 1995-07-03 1997-10-21 Motorola, Inc. Circuit and method of modifying characteristics of a utilization circuit
US6306718B1 (en) * 2000-04-26 2001-10-23 Dallas Semiconductor Corporation Method of making polysilicon resistor having adjustable temperature coefficients
US6958523B2 (en) * 2000-09-15 2005-10-25 Texas Instruments Incorporated On chip heating for electrical trimming of polysilicon and polysilicon-silicon-germanium resistors and electrically programmable fuses for integrated circuits
DE60222162T2 (de) * 2001-09-10 2008-06-12 Microbridge Technologies Inc., Montreal Verfahren zum effektiven trimmen von widerständen durch wärmepulse
US6911361B2 (en) * 2003-03-10 2005-06-28 Sharp Laboratories Of America, Inc. Low temperature processing of PCMO thin film on Ir substrate for RRAM application
US7703051B2 (en) * 2003-03-20 2010-04-20 Microbridge Technologies Inc. Trimming temperature coefficients of electronic components and circuits
WO2005006100A2 (en) * 2003-07-14 2005-01-20 Microbrige Technologies Inc. Adjusting analog electric circuit outputs

Also Published As

Publication number Publication date
US20070034608A1 (en) 2007-02-15
WO2004097859A2 (en) 2004-11-11
US7667156B2 (en) 2010-02-23
JP2006520532A (ja) 2006-09-07
CA2519690A1 (en) 2004-11-11
DE602004028225D1 (de) 2010-09-02
EP1609185B1 (en) 2010-07-21
US20100101077A1 (en) 2010-04-29
ATE475196T1 (de) 2010-08-15
WO2004097859A3 (en) 2004-12-29
EP1609185A2 (en) 2005-12-28

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