TW200504894A - Multi-chip ball grid array package and method of manufacture - Google Patents
Multi-chip ball grid array package and method of manufactureInfo
- Publication number
- TW200504894A TW200504894A TW093109314A TW93109314A TW200504894A TW 200504894 A TW200504894 A TW 200504894A TW 093109314 A TW093109314 A TW 093109314A TW 93109314 A TW93109314 A TW 93109314A TW 200504894 A TW200504894 A TW 200504894A
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- TW
- Taiwan
- Prior art keywords
- base
- substrate
- opening
- manufacture
- chip
- Prior art date
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45935303P | 2003-04-02 | 2003-04-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200504894A true TW200504894A (en) | 2005-02-01 |
TWI338927B TWI338927B (en) | 2011-03-11 |
Family
ID=33131882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093109314A TWI338927B (en) | 2003-04-02 | 2004-04-02 | Multi-chip ball grid array package and method of manufacture |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE112004000572B4 (zh) |
TW (1) | TWI338927B (zh) |
WO (1) | WO2004088727A2 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200536089A (en) * | 2004-03-03 | 2005-11-01 | United Test & Assembly Ct Ltd | Multiple stacked die window csp package and method of manufacture |
SG130055A1 (en) | 2005-08-19 | 2007-03-20 | Micron Technology Inc | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices |
SG130066A1 (en) | 2005-08-26 | 2007-03-20 | Micron Technology Inc | Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5986209A (en) * | 1997-07-09 | 1999-11-16 | Micron Technology, Inc. | Package stack via bottom leaded plastic (BLP) packaging |
JP3420706B2 (ja) * | 1998-09-22 | 2003-06-30 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、回路基板、回路基板の製造方法 |
US6424033B1 (en) * | 1999-08-31 | 2002-07-23 | Micron Technology, Inc. | Chip package with grease heat sink and method of making |
US20020127771A1 (en) * | 2001-03-12 | 2002-09-12 | Salman Akram | Multiple die package |
DE10259221B4 (de) * | 2002-12-17 | 2007-01-25 | Infineon Technologies Ag | Elektronisches Bauteil mit einem Stapel aus Halbleiterchips und Verfahren zur Herstellung desselben |
-
2004
- 2004-04-02 WO PCT/IB2004/001734 patent/WO2004088727A2/en active Application Filing
- 2004-04-02 DE DE112004000572T patent/DE112004000572B4/de not_active Expired - Fee Related
- 2004-04-02 TW TW093109314A patent/TWI338927B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2004088727A8 (en) | 2004-12-29 |
DE112004000572B4 (de) | 2008-05-29 |
WO2004088727B1 (en) | 2005-03-10 |
TWI338927B (en) | 2011-03-11 |
WO2004088727A2 (en) | 2004-10-14 |
WO2004088727A3 (en) | 2004-11-11 |
DE112004000572T5 (de) | 2006-03-23 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |