WO2004088727A3 - Multi-chip ball grid array package and method of manufacture - Google Patents

Multi-chip ball grid array package and method of manufacture Download PDF

Info

Publication number
WO2004088727A3
WO2004088727A3 PCT/IB2004/001734 IB2004001734W WO2004088727A3 WO 2004088727 A3 WO2004088727 A3 WO 2004088727A3 IB 2004001734 W IB2004001734 W IB 2004001734W WO 2004088727 A3 WO2004088727 A3 WO 2004088727A3
Authority
WO
WIPO (PCT)
Prior art keywords
opening
base
substrate
manufacture
grid array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2004/001734
Other languages
French (fr)
Other versions
WO2004088727A8 (en
WO2004088727A2 (en
WO2004088727B1 (en
Inventor
Fung Leng Chen
Seong Kwang Brandon Kim
Wee Lim Cha
Yi-Sheng Anthony Sun
Wolfgang Hetzel
Jochen Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
United Test and Assembly Center Ltd
Original Assignee
Infineon Technologies AG
United Test and Assembly Center Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG, United Test and Assembly Center Ltd filed Critical Infineon Technologies AG
Priority to DE112004000572T priority Critical patent/DE112004000572B4/en
Priority to US10/552,046 priority patent/US7851899B2/en
Publication of WO2004088727A2 publication Critical patent/WO2004088727A2/en
Publication of WO2004088727A3 publication Critical patent/WO2004088727A3/en
Publication of WO2004088727A8 publication Critical patent/WO2004088727A8/en
Publication of WO2004088727B1 publication Critical patent/WO2004088727B1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

A BGA package (500) is disclosed including a base IC structure (300) having a base substrate (302), with an opening (301c) running lengthwise therethrough. A first semiconductor chip (315) is mounted face-down on the base substrate (301) so that the bond pads (317) thereof are accessible through the opening (301c). The package (500) also includes a secondary IC structure (400) including a secondary substrate (401), having an opening (401c) running there through, and a second semiconductor chip (415). The second chip (415) is mounted face-down on the secondary substrate (401) so that the bond pads (417) thereof are accessible through the opening (401c) in the secondary substrate (401). An encapsulant (425) fills the opening (401c) in the secondary substrate (401) and forms a substantially planar surface (425a) over the underside of the secondary substrate (401). The substantially planar surface (425a) is mounted to the first chip (315) of the base IC structure (300) through an adhesive (504). Wires (521) connect a conductive portion (406) of the secondary IC structure (400) to a conductive portion (303) of the base IC structure (300).
PCT/IB2004/001734 2003-04-02 2004-04-02 Multi-chip ball grid array package and method of manufacture Ceased WO2004088727A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112004000572T DE112004000572B4 (en) 2003-04-02 2004-04-02 Multi-chip ball grid array housing and manufacturing process
US10/552,046 US7851899B2 (en) 2004-04-02 2004-04-02 Multi-chip ball grid array package and method of manufacture

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45935303P 2003-04-02 2003-04-02
US60/459,353 2003-04-02

Publications (4)

Publication Number Publication Date
WO2004088727A2 WO2004088727A2 (en) 2004-10-14
WO2004088727A3 true WO2004088727A3 (en) 2004-11-11
WO2004088727A8 WO2004088727A8 (en) 2004-12-29
WO2004088727B1 WO2004088727B1 (en) 2005-03-10

Family

ID=33131882

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2004/001734 Ceased WO2004088727A2 (en) 2003-04-02 2004-04-02 Multi-chip ball grid array package and method of manufacture

Country Status (3)

Country Link
DE (1) DE112004000572B4 (en)
TW (1) TWI338927B (en)
WO (1) WO2004088727A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200536089A (en) * 2004-03-03 2005-11-01 United Test & Assembly Ct Ltd Multiple stacked die window csp package and method of manufacture
SG130055A1 (en) 2005-08-19 2007-03-20 Micron Technology Inc Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
SG130066A1 (en) 2005-08-26 2007-03-20 Micron Technology Inc Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010012526A1 (en) * 1997-07-09 2001-08-09 Tandy Patrick W. Package stack via bottom leaded plastic (BLP) packaging
US6424033B1 (en) * 1999-08-31 2002-07-23 Micron Technology, Inc. Chip package with grease heat sink and method of making
US20020127771A1 (en) * 2001-03-12 2002-09-12 Salman Akram Multiple die package
US20020189852A1 (en) * 1998-09-22 2002-12-19 Kabushiki Kaisha Toshiba Fabricating method of semiconductor devices, fabricating method of printed wired boards, and printed wired board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10259221B4 (en) * 2002-12-17 2007-01-25 Infineon Technologies Ag Electronic component comprising a stack of semiconductor chips and method of making the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010012526A1 (en) * 1997-07-09 2001-08-09 Tandy Patrick W. Package stack via bottom leaded plastic (BLP) packaging
US20020189852A1 (en) * 1998-09-22 2002-12-19 Kabushiki Kaisha Toshiba Fabricating method of semiconductor devices, fabricating method of printed wired boards, and printed wired board
US6424033B1 (en) * 1999-08-31 2002-07-23 Micron Technology, Inc. Chip package with grease heat sink and method of making
US20020127771A1 (en) * 2001-03-12 2002-09-12 Salman Akram Multiple die package

Also Published As

Publication number Publication date
TW200504894A (en) 2005-02-01
WO2004088727A8 (en) 2004-12-29
TWI338927B (en) 2011-03-11
WO2004088727A2 (en) 2004-10-14
DE112004000572T5 (en) 2006-03-23
DE112004000572B4 (en) 2008-05-29
WO2004088727B1 (en) 2005-03-10

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