TW200504461A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
TW200504461A
TW200504461A TW093118414A TW93118414A TW200504461A TW 200504461 A TW200504461 A TW 200504461A TW 093118414 A TW093118414 A TW 093118414A TW 93118414 A TW93118414 A TW 93118414A TW 200504461 A TW200504461 A TW 200504461A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
photosensitizer
alkali
group
Prior art date
Application number
TW093118414A
Other languages
Chinese (zh)
Other versions
TWI332121B (en
Inventor
Shuichi Takahashi
Original Assignee
Clariant Int Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Clariant Int Ltd filed Critical Clariant Int Ltd
Publication of TW200504461A publication Critical patent/TW200504461A/en
Application granted granted Critical
Publication of TWI332121B publication Critical patent/TWI332121B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

To provide a photosensitive resin composition comprising an alkali-soluble resin and a photosensitizer, whereby a film which can keep the flatness of the film surface even after baking at high temperature and has good light transparency, and it has good stability with time and particularly applicable to the formation of an interlayer insulating film and a flat panel display and a semiconductor using it. A photosensitive resin composition comprises an alkali-soluble resin, photosensitizer having a quinonediazido group, and a curing agent, wherein the alkali-soluble resin is an acrylic resin, the photosensitizer having a quinonediazido group is a reaction product of a phenolic compound represented by the following general formula (I) and a quinine diazide compound, and the curing agent contains epoxy group. Optionally, the photosensitive resin composition may further comprises a phenolic compound and a curing promoter. wherein R1, R2, R3 and R4 independently of one another, represent H or C1-C2 alkyl group, R5 and R6, independently of one another, represent C1-C2 alkyl group.
TW093118414A 2003-06-26 2004-06-25 Photosensitive resin composition TWI332121B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003182087A JP4099114B2 (en) 2003-06-26 2003-06-26 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
TW200504461A true TW200504461A (en) 2005-02-01
TWI332121B TWI332121B (en) 2010-10-21

Family

ID=33549545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118414A TWI332121B (en) 2003-06-26 2004-06-25 Photosensitive resin composition

Country Status (5)

Country Link
JP (1) JP4099114B2 (en)
KR (1) KR100983210B1 (en)
CN (1) CN100547485C (en)
TW (1) TWI332121B (en)
WO (1) WO2005001575A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676627B (en) * 2015-03-17 2019-11-11 南韓商東友精細化工有限公司 Photosensitive resin composition, photocurable pattern formed from the same and image display comprising the pattern

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5338352B2 (en) * 2009-02-09 2013-11-13 日油株式会社 Positive photosensitive resin composition
KR20110045418A (en) * 2009-10-27 2011-05-04 삼성전자주식회사 Photoresist composition and method of manufacturing a display substrate using the photoresist composition
CN103608727A (en) * 2011-06-20 2014-02-26 日本化药株式会社 Negative photosensitive resin composition and cured product of same
JP2013130816A (en) * 2011-12-22 2013-07-04 Nippon Zeon Co Ltd Resin composition for permanent film and electronic component
KR101807630B1 (en) * 2013-12-11 2017-12-11 후지필름 가부시키가이샤 Photosensitive resin composition, method for producing cured film, cured film, liquid crystal display device and organic el display device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05297582A (en) * 1992-04-23 1993-11-12 Fuji Photo Film Co Ltd Positive photoresist composition
JPH08301990A (en) * 1995-05-09 1996-11-19 Nippon Kayaku Co Ltd Resin composition, resist ink composition, and cured product thereof
JP3901266B2 (en) * 1996-11-15 2007-04-04 東京応化工業株式会社 Photosensitive resin composition
JP3873263B2 (en) * 1997-09-22 2007-01-24 Ｊｓｒ株式会社 Radiation-sensitive resin composition, protective film, interlayer insulating film, and method for forming these films
JP4221819B2 (en) * 1999-06-01 2009-02-12 東レ株式会社 Photosensitive resin precursor composition
US6524764B1 (en) * 1999-06-01 2003-02-25 Toray Industries, Inc. Positive-type photosensitive polyimide precursor composition
JP2000347397A (en) * 1999-06-04 2000-12-15 Jsr Corp Radiation sensitive resin composition and its use for interlayer dielectric
JP2002116536A (en) * 2000-10-06 2002-04-19 Jsr Corp Radiation sensitive resin composition, its cured body and element
JP2003029407A (en) * 2001-05-07 2003-01-29 Sumitomo Bakelite Co Ltd Positive photosensitive resin composition and semiconductor device
JP3848653B2 (en) 2001-09-27 2006-11-22 Ａｚエレクトロニックマテリアルズ株式会社 Photosensitive resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676627B (en) * 2015-03-17 2019-11-11 南韓商東友精細化工有限公司 Photosensitive resin composition, photocurable pattern formed from the same and image display comprising the pattern

Also Published As

Publication number Publication date
WO2005001575A1 (en) 2005-01-06
KR100983210B1 (en) 2010-09-20
JP4099114B2 (en) 2008-06-11
JP2005017666A (en) 2005-01-20
TWI332121B (en) 2010-10-21
CN1806206A (en) 2006-07-19
CN100547485C (en) 2009-10-07
KR20060027817A (en) 2006-03-28

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees