TW200503848A - Insulating method and insulated metal product - Google Patents

Insulating method and insulated metal product

Info

Publication number
TW200503848A
TW200503848A TW093113125A TW93113125A TW200503848A TW 200503848 A TW200503848 A TW 200503848A TW 093113125 A TW093113125 A TW 093113125A TW 93113125 A TW93113125 A TW 93113125A TW 200503848 A TW200503848 A TW 200503848A
Authority
TW
Taiwan
Prior art keywords
insulating
coating
insulating film
metal product
insulated metal
Prior art date
Application number
TW093113125A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroyuki Sakamoto
Takao Saito
Kazuo Morichika
Hidenori Tanaka
Toshitaka Kawanami
Original Assignee
Nippon Paint Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Paint Co Ltd filed Critical Nippon Paint Co Ltd
Publication of TW200503848A publication Critical patent/TW200503848A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
    • H01L21/02258—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by anodic treatment, e.g. anodic oxidation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
  • Insulated Conductors (AREA)
  • Processes Specially Adapted For Manufacturing Cables (AREA)
  • Insulating Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
TW093113125A 2003-05-12 2004-05-11 Insulating method and insulated metal product TW200503848A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003133715A JP2004337646A (ja) 2003-05-12 2003-05-12 絶縁化方法及び絶縁化金属製品

Publications (1)

Publication Number Publication Date
TW200503848A true TW200503848A (en) 2005-02-01

Family

ID=33432202

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093113125A TW200503848A (en) 2003-05-12 2004-05-11 Insulating method and insulated metal product

Country Status (3)

Country Link
JP (1) JP2004337646A (ja)
TW (1) TW200503848A (ja)
WO (1) WO2004098794A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007066815A (ja) * 2005-09-01 2007-03-15 Suncall Corp 絶縁被覆導線及びその製造方法、並びに、絶縁被覆導線成形品及びその製造方法
JP5074725B2 (ja) * 2005-11-25 2012-11-14 古河電気工業株式会社 電気電子部品用金属材料、その製造方法、および前記電気電子部品用金属材料を用いた電気電子部品
JP2009114467A (ja) * 2006-02-17 2009-05-28 National Institutes Of Natural Sciences 金属含有構造体の形成方法、及び金属含有積層体の形成方法
JP2008041568A (ja) * 2006-08-09 2008-02-21 Mitsubishi Cable Ind Ltd 半導電層を有する平角状電線及びその製造方法
JP2008085077A (ja) * 2006-09-27 2008-04-10 Mitsubishi Cable Ind Ltd リング状絶縁コイル板およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000191958A (ja) * 1998-12-28 2000-07-11 Nippon Paint Co Ltd カチオン電着塗料組成物、複層塗膜形成方法および複層塗膜
JP2000189891A (ja) * 1998-12-28 2000-07-11 Nippon Paint Co Ltd 複層塗膜形成方法、多層塗膜形成方法およびそれによって得られた多層塗膜
JP2001096221A (ja) * 1999-09-28 2001-04-10 Nippon Paint Co Ltd 複合塗膜形成方法および塗装物
JP2001121074A (ja) * 1999-10-22 2001-05-08 Kansai Paint Co Ltd 塗装方法
JP4410895B2 (ja) * 2000-01-28 2010-02-03 関西ペイント株式会社 自動車車体の被覆方法
JP4309017B2 (ja) * 2000-03-29 2009-08-05 本田技研工業株式会社 塗膜形成方法

Also Published As

Publication number Publication date
WO2004098794A1 (en) 2004-11-18
JP2004337646A (ja) 2004-12-02

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