TW200502524A - Acquiring method of film thickness - Google Patents

Acquiring method of film thickness

Info

Publication number
TW200502524A
TW200502524A TW093106991A TW93106991A TW200502524A TW 200502524 A TW200502524 A TW 200502524A TW 093106991 A TW093106991 A TW 093106991A TW 93106991 A TW93106991 A TW 93106991A TW 200502524 A TW200502524 A TW 200502524A
Authority
TW
Taiwan
Prior art keywords
plate
covering film
film
backlight
measured
Prior art date
Application number
TW093106991A
Other languages
Chinese (zh)
Other versions
TWI284729B (en
Inventor
So Aikawa
Original Assignee
Japan Science & Tech Agency
Tecnos Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Science & Tech Agency, Tecnos Co Ltd filed Critical Japan Science & Tech Agency
Publication of TW200502524A publication Critical patent/TW200502524A/en
Application granted granted Critical
Publication of TWI284729B publication Critical patent/TWI284729B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G01N21/211—Ellipsometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

This invention, regarding to a method of rapidly acquiring the thickness distributions of a film covering on a plate, was established based on a simple framework, such that the monochromatic incident light 4, which is come from the light source 3 through an attachment lens, shone at the determined target of covering film 2 on fundamental plate 1. Simultaneously, by hierarchically varying the incident angle between the direction of the incident light and the main plate, which was covered by covering film 2, the interfered backlight 5 was measured by the receiving device 6. Hence, the thickness distributions of aforementioned covering film 2 can be measured, through the use of measuring the variations ranges of the backlight 5, where the incident angles are spread between the maximum and minimum of the predetermined values.
TW093106991A 2003-03-18 2004-03-16 Acquiring method of film thickness TWI284729B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003073221A JP3742801B2 (en) 2003-03-18 2003-03-18 Film thickness acquisition method

Publications (2)

Publication Number Publication Date
TW200502524A true TW200502524A (en) 2005-01-16
TWI284729B TWI284729B (en) 2007-08-01

Family

ID=33027789

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093106991A TWI284729B (en) 2003-03-18 2004-03-16 Acquiring method of film thickness

Country Status (4)

Country Link
JP (1) JP3742801B2 (en)
KR (1) KR100724374B1 (en)
TW (1) TWI284729B (en)
WO (1) WO2004083776A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014201733A1 (en) * 2013-06-17 2014-12-24 深圳市华星光电技术有限公司 Method and apparatus for measuring inclined angle of signal line

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4174487B2 (en) * 2005-03-24 2008-10-29 アドバンスド・マスク・インスペクション・テクノロジー株式会社 Image correction method
JP4759772B2 (en) * 2005-07-29 2011-08-31 国立大学法人 熊本大学 Thin film thickness measuring method and thin film thickness measuring apparatus
JP4799268B2 (en) * 2005-07-29 2011-10-26 大日本スクリーン製造株式会社 Unevenness inspection apparatus and unevenness inspection method
JP4084817B2 (en) * 2005-09-16 2008-04-30 テクノス株式会社 Film thickness measuring method and film thickness measuring apparatus
KR100742840B1 (en) * 2005-12-26 2007-07-25 주식회사 포스코 A Method for measuring base coating thickness of electrical steel sheets
JP5586791B2 (en) 2011-10-26 2014-09-10 三菱電機株式会社 Film thickness measurement method
JP6287189B2 (en) * 2013-01-07 2018-03-07 セイコーエプソン株式会社 Recording medium discrimination device and recording medium discrimination method
CN105347128B (en) * 2015-11-27 2018-04-10 日立电梯（中国）有限公司 Elevator monitoring method and elevator brake disc monitoring system
JP6285597B1 (en) * 2017-06-05 2018-02-28 大塚電子株式会社 Optical measuring apparatus and optical measuring method
CN107607051B (en) * 2017-10-26 2019-07-30 京东方科技集团股份有限公司 A kind of film thickness detecting device
JP6371926B1 (en) * 2018-01-29 2018-08-08 大塚電子株式会社 Optical measuring apparatus and optical measuring method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62119403A (en) * 1985-11-19 1987-05-30 Toyobo Co Ltd Film thickness measurement
JPS6412208A (en) * 1987-07-04 1989-01-17 Toyo Boseki Measurement of film thickness and/or refractive index
JPS6475902A (en) * 1987-09-18 1989-03-22 Ricoh Kk Method for measuring refractive index and film thickness
JPH01232202A (en) * 1988-03-14 1989-09-18 Teru Kyushu Kk Film thickness measuring method
JP3106790B2 (en) * 1993-09-01 2000-11-06 株式会社日立製作所 Thin film characteristic value measuring method and apparatus
JPH0922206A (en) * 1995-07-06 1997-01-21 Canon Inc Heating device and image forming device
KR970022206A (en) * 1995-10-16 1997-05-28 김익명 Film thickness measurement method
US5729343A (en) * 1995-11-16 1998-03-17 Nikon Precision Inc. Film thickness measurement apparatus with tilting stage and method of operation
JP3392145B2 (en) * 1996-05-31 2003-03-31 トロペル コーポレーション Interferometer for thickness error measurement of semiconductor wafer
JP2000227310A (en) * 1999-02-08 2000-08-15 Ricoh Co Ltd Instrument and method for measuring film thickness and refractive index
JP2000275016A (en) * 1999-03-26 2000-10-06 Inst Of Physical & Chemical Res Measurement method and measuring apparatus for film characteristic value distribution
US6489612B1 (en) * 1999-04-21 2002-12-03 Seiko Instruments Inc. Method of measuring film thickness
JP2000314612A (en) * 1999-04-30 2000-11-14 Kawatetsu Techno Res Corp Measurement method for film thickness of light transmission film and film thickness measuring device
JP3715843B2 (en) * 1999-08-16 2005-11-16 キヤノン株式会社 Resin sealing body unsealing apparatus and unsealing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014201733A1 (en) * 2013-06-17 2014-12-24 深圳市华星光电技术有限公司 Method and apparatus for measuring inclined angle of signal line

Also Published As

Publication number Publication date
JP2004279296A (en) 2004-10-07
KR100724374B1 (en) 2007-06-04
KR20050107511A (en) 2005-11-11
JP3742801B2 (en) 2006-02-08
WO2004083776B1 (en) 2004-12-16
WO2004083776A1 (en) 2004-09-30
TWI284729B (en) 2007-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees