TW200500171A - Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups - Google Patents

Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups

Info

Publication number
TW200500171A
TW200500171A TW093101740A TW93101740A TW200500171A TW 200500171 A TW200500171 A TW 200500171A TW 093101740 A TW093101740 A TW 093101740A TW 93101740 A TW93101740 A TW 93101740A TW 200500171 A TW200500171 A TW 200500171A
Authority
TW
Taiwan
Prior art keywords
objects
pivotable load
semiconductor wafers
unload
unload cups
Prior art date
Application number
TW093101740A
Other languages
English (en)
Inventor
In-Kwon Jeong
Original Assignee
In-Kwon Jeong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by In-Kwon Jeong filed Critical In-Kwon Jeong
Publication of TW200500171A publication Critical patent/TW200500171A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW093101740A 2003-01-27 2004-01-27 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups TW200500171A (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US44295203P 2003-01-27 2003-01-27
US46114703P 2003-04-08 2003-04-08
US46201503P 2003-04-11 2003-04-11
US46428003P 2003-04-21 2003-04-21
US46658703P 2003-04-30 2003-04-30
US46823903P 2003-05-05 2003-05-05
US46856103P 2003-05-06 2003-05-06
US47748903P 2003-06-10 2003-06-10

Publications (1)

Publication Number Publication Date
TW200500171A true TW200500171A (en) 2005-01-01

Family

ID=32854660

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093101740A TW200500171A (en) 2003-01-27 2004-01-27 Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups

Country Status (6)

Country Link
US (1) US7374471B2 (zh)
EP (1) EP1594653A4 (zh)
JP (1) JP2006516825A (zh)
KR (1) KR20050094468A (zh)
TW (1) TW200500171A (zh)
WO (1) WO2004070778A2 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004070778A2 (en) * 2003-01-27 2004-08-19 In Kwon Jeong Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups
US7421683B2 (en) * 2003-01-28 2008-09-02 Newmerix Corp£ Method for the use of information in an auxiliary data system in relation to automated testing of graphical user interface based applications
US20080038993A1 (en) * 2006-08-08 2008-02-14 Jeong In-Kwon Apparatus and method for polishing semiconductor wafers
KR20110018323A (ko) * 2008-04-25 2011-02-23 어플라이드 머티어리얼스, 인코포레이티드 높은 처리량 화학 기계 연마 시스템
CN102049730B (zh) * 2010-12-29 2012-02-15 清华大学 一种用于化学机械抛光设备的晶圆交换装置
US8807318B2 (en) * 2011-09-20 2014-08-19 International Business Machines Corporation Multi-generational carrier platform
US20130115862A1 (en) * 2011-11-09 2013-05-09 Applied Materials, Inc. Chemical mechanical polishing platform architecture
US11749552B2 (en) * 2019-01-18 2023-09-05 Applied Materials, Inc. Wafer processing tools and methods thereof
TW202120251A (zh) * 2019-07-17 2021-06-01 日商東京威力科創股份有限公司 基板加工裝置、基板處理系統及基板處理方法
US20210323117A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US20220111486A1 (en) * 2020-10-08 2022-04-14 Kctech Co., Ltd. Substrate processing system
KR20230088800A (ko) * 2020-10-21 2023-06-20 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 시스템들의 개선된 유지보수를 위한 세정 유체들의 순차적 적용
KR20220122360A (ko) * 2021-02-26 2022-09-02 주식회사 케이씨텍 기판 연마 시스템

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09174430A (ja) * 1995-12-27 1997-07-08 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨装置
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
US6346038B1 (en) * 1998-12-15 2002-02-12 Mitsubishi Materials Corporation Wafer loading/unloading device and method for producing wafers
US6309279B1 (en) * 1999-02-19 2001-10-30 Speedfam-Ipec Corporation Arrangements for wafer polishing
US6626744B1 (en) * 1999-12-17 2003-09-30 Applied Materials, Inc. Planarization system with multiple polishing pads
US6942545B2 (en) * 2001-04-20 2005-09-13 Oriol, Inc. Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers
US6817923B2 (en) * 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup
US6575818B2 (en) * 2001-06-27 2003-06-10 Oriol Inc. Apparatus and method for polishing multiple semiconductor wafers in parallel
US6949177B2 (en) * 2001-08-16 2005-09-27 Oriol Inc. System and method for processing semiconductor wafers using different wafer processes
JP3761437B2 (ja) 2001-08-29 2006-03-29 Ｎｅｃソフト株式会社 化学物質収支管理における排出量算出システム、排出量算出方法、及びプログラム
JP4197103B2 (ja) 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
JP2003332274A (ja) * 2002-05-17 2003-11-21 Tokyo Seimitsu Co Ltd 化学的機械研磨方法及び化学的機械研磨装置
WO2004070778A2 (en) * 2003-01-27 2004-08-19 In Kwon Jeong Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups

Also Published As

Publication number Publication date
KR20050094468A (ko) 2005-09-27
EP1594653A4 (en) 2007-07-25
US7374471B2 (en) 2008-05-20
US20040216842A1 (en) 2004-11-04
JP2006516825A (ja) 2006-07-06
WO2004070778A2 (en) 2004-08-19
WO2004070778A3 (en) 2005-04-28
EP1594653A2 (en) 2005-11-16

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