200426971 Π) 玖、發明說明 [胃B月所屬之技術領域】 本發明係關於在半導體、平面顯示器用之面板、光碟 等’在高淸潔度環境下進行其製程之物品的製造工程之中 ’爲了收容該物品所用之一種製品收容容器。更詳細地說 ’本發明係關於將上述物品在主要爲3 00毫米（1 2吋）直徑 半導體晶圓之處理工程中做爲被收容物而使用的所謂晶圓 傳送盒（FOUP)中，其內部的淸淨化方法。 【先前技術】 至目前爲止，在半導體裝置之製造工程中，係對晶圓 施以各種處理的工廠全體予以無塵室（clean room)化，而 對應製程所要求的高淸淨化。但是，隨著晶圓的大徑化， 在該種對應上欲獲得構成上之環境會有成本等方面之問題 ，近數年來，對各個處理裝置保持其高淸淨度方面，係採 用確保微小環境空間的手段。 具體上，並非提高工廠全體之淸淨度，而係僅在製造 工程內之各個處理裝置內及在其等之間的移動中所使用的 保管用容器（以下稱爲傳送盒（pod))內保持高淸淨度。該傳 送盒係以上述之FOUP爲其總稱。因而，僅將微小空間做 成高淸淨度之時，可獲得與將工廠全體予以無塵室化同樣 的効果，因此可實現設備投資或維修費之降低，及有效率 的生產工程。 以下，將以實際上使用之對應所謂微小空間的半導體 -5- (2) (2)200426971 處理裝置等而簡單地說明。第15圖顯示半導體晶圓處理裝 置5 0之全體。半導體晶圓處理裝置50主要係由晶圓載入機 (load port)5 1、輸送室52、及處理室59所構成。分別之接 合部分係以晶圓載入機側之間隔板55a及蓋58a、處理室 側之間隔板55b及蓋58b而區分。在半導體晶圓處理裝置 5 0中’爲了將塵埃在輸送室5 2中排出以保持高淸淨度，利 用設置在其上部的風扇（未圖示）產生從輸送室52的上方朝 向下方的空氣流。因而使塵埃隨時地朝向下側而排出。 在晶圓載入機5 1上，做爲矽晶圓等（以下只稱晶圓）之 保管用容器的傳送盒（pod)2係被安裝在台53上。如早先所 述，輸送室52的內部爲了處理晶圓1而保持在高淸淨度， 更在其內部設置有機器手54。晶圓利用該機器手54而在傳 送盒2內部與處理室59內部之間輸送。在處理室59中，雖 然通常在晶圓表面等進行薄膜形成、薄膜加工等之處理所 用之各種機構亦包含於其中，但是這些構成與本發明沒有 直接關係，因此在此省略其說明。 傳送盒2具有將做爲被處理物的晶圓1收容在其內部的 空間，其均爲具備有：在一面具有開口部之箱狀的本體部 2a、及將該開口部密閉用之蓋4。在本體部2a之內部配置 具有將晶圓1朝向一個方向重疊用之複數段的棚架。載置 於其上的各個晶圓1係以一定之間隔而收容在傳送盒2內部 。而，在此所顯示的例中，晶圓I被重疊的方向係爲垂直 方向。在輸送室52之晶圓載入機5 1側設置有開口部1 0。開 口部1 〇，係傳送盒2以靠近開口部1 0之方式而配置於晶圓 -6- (3) (3)200426971 載入機51之時，被配置於與傳送盒2之開口部10對向的位 置上。並且，在輸送室52中內側的開口部1〇附近，設置有 後述之打開器3。 第1 6A及1 6B圖係分別顯示先前技術裝置中將打開器 3放大的側剖面圖，及從輸送室5 2側看去之打開器3的正面 圖。第1 7圖係槪略地顯示使用打開器3將蓋4從傳送盒2打 開之狀態的側剖面圖。打開器3具備有門6及門臂42。在門 6上安裝有固定構件4 6，門6經由該固定構件4 6而可轉動地 連結到門臂42之一端。門臂42的另一端’相對於爲空氣驅 動式之氣缸31之一部分的桿37之前端部’經由樞軸40而可 轉動地支持在該樞軸40上。 門臂42之該一端與該另一端之間設置有貫通孔。該孔 與固定在可使打開器3升降的可動部56之支持構件60上的 固定構件3 9之孔係以未圖示的銷貫通’因而構成支點4 1。 從而，因應於氣缸31之驅動造成桿37的伸縮之時’門臂42 係以支點4 1爲中心而轉動。門臂4 2之支點4 1係固定在設置 於可升降的可動部5 6之支持構件60上。門6具有保持接口 11a及lib，其可以真空吸住而保持傳送盒2之盖4。 利用這些構成而進行晶圓1之處理時’首先以靠近輸 送室開口部10之形態將傳送盒配置在台53上’由門6將蓋4 保持。然後，將氣缸31之桿37縮回之時’門臂42以支點41 爲中心而從輸送室開口部離開地移動。門6及蓋4由於此 動作而一起轉動，而將蓋4從傳送盒2上移開。此狀態顯示 於第17圖中。其後，將可動部56降下而將蓋4輸送到預定 (4) (4)200426971 之待避位置。 通常，在將晶圓等收容的狀態下之傳送盒2內部，{系 被管理淸淨度用的乾燥氮氣等所充滿，以防止污染物質、 氧化性氣體等侵入傳送盒內部。但是，該傳送盒通過處理 室後也收容晶圓之故，使污染物質等在處理室等之中附著 到晶圓上，想來這是該等污染物質被帶入傳送盒內部之情 況。這些污染物質被帶入下一個處理室內部之情形之下， 亦會使通過該處理室之時本來必須進行所需的晶圓處理變 成無法進行之情況。因此，在晶圓從傳送盒移到輸送室之 時，必須將污染物質除去。 在先前技術的FOUP中，爲了對應該要求，在傳送盒 底部設置有將淸除用之氣體導入傳送盒內部的給氣孔及排 出用的排氣孔。這些給氣孔及排氣孔係分別連接到載置該 傳送盒的支持台上所設置的淸除用氣體給氣孔及排氣孔。 在實際之操作上，管理淸淨度用的高壓氣體係經由這些給 氣孔而從支持台側導入傳送盒內部。同時，已經存在於傳 送盒內部的氣體及污染物質等係經由這些排氣孔而排出到 外部。利用該操作，可實行將被帶入傳送盒內部之污染物 質等除去。 但是，只是將高壓氣體從傳送盒底部導入之時，氣體 流必會通過晶圓外周附近爲主之比較容易通過的區域。從 而，欲使具有充分流速的氣體通過以微小間隔而被保持的 各個晶圓之上下面係很困難。但是，污染物質等主要附著 在晶圓的上面或下面，因而在習知的方式中欲將污染物質 •8- (5) (5)200426971 等除去係很困難。 爲了將附著在晶圓之污染物質等除去的方法上，提案 有曰本特開200 3 -4 5 93 3號公報中所揭示的方法。在該方法 中’設置有與輸送室爲另一個空間，其被用以收容打開器 。該空間在位於傳送盒之開口部的正面上方之部分，具有 氣體供給口。從該氣體供給口朝向傳送盒內部供給淸潔氣 體’在傳送盒內部循環且從傳送盒下部流出到該空間內的 淸潔氣體，從該空間下部進行排氣。使用以上的構成，使 淸潔氣體在傳送盒內部循環之時，和先前的方法比較，可 更確實地將污染物質等除去。 並且，在日本特開平11-251422號公報中，揭示有將 淸潔氣體導入於保持在傳送盒內部之各個晶圓之間的方法 。在該方法中，在傳送盒內部中設置有連通到收容各個晶 圓之各個溝部的氣體導入用流路及氣體排出用流路。淸潔 氣體經由該氣體導入用流路而吹出到各個晶圓之表面上， 而後變成含有污染物質等的該淸潔氣體，經由該氣體排出 用流路而進行排氣，因此可更確實地將污染物質等除去。 日本特開平2003 -45 93 3號公報中所揭示的方法，係關 於傳送盒內部的濕度及氧化度之降低、及有機物污染之防 止方面，可預期有某些程度的效果。但是，存在於以微小 間隔而被保持的各個晶圓之間的氣體之替換仍很困難。從 而，欲獲得將附著在晶圓的上下面的污染物質等除去的效 果，也同樣地很困難。 依照日本特開平11_2 5 1 422號公報所揭示的方法，欲 (6) (6)200426971 將附著在晶圓的上下面的污染物質等除去係爲可能。但是 ，在實際之構成上欲將氣體導入用流路的內徑保持很大仍 很困難。因此，在該流路之上游側及下游側中，會產生導 入晶圓表面上的氣體壓力差，或以預定壓力導入之時間差 ，故因應於晶圓的保持位置之污染物質的除去効果會有不 同。 並且，支持台、傳送盒形狀、加上傳送盒內部淸除用 之淸潔氣體的供給孔及排出孔的配置等，在半導體製造業 界幾乎已經規格化。從而，必須做成與該規格不同的曰本 特開平1 1 -25 1 422號公報所揭示的傳送盒，有與目前汎用 的支持台等無法共用之問題。 【發明內容】 本發明係鑑於上述情況而開發完成者，其目的在提供 一種晶圓傳送盒的淸除方法及淸除裝置，其可將附著於晶 圓上的污染物質等有効地除去。 爲了解決上述課題，本發明之淸除裝置，其係對收容 在具備有：由開口及載置各個被收容物朝向預定方向並列 之複數個棚架所形成的本體、及可從本體分離且將開口塞 住的蓋之傳送盒，而將預定之氣體吹出以進行淸除操作的 淸除裝置，其特徵爲：其具有：在蓋從本體分離之狀態中 ，可將開口的前面朝向預定之方向移動的框架、及對框架 保持預定的位置關係之下’可朝向預定方向移動之氣體供 給噴嘴。 -10· (7) (7)200426971 而，在上述淸除裝置中，框架可保持將收容於傳送盒 中之被收容物進行映照（mapping)之感測器，亦可使氣體 供給噴嘴與感測器並置。並且，在上述淸除裝置中，亦可 使預定之氣體從氣體供給噴嘴吹出的計時，與在氣體供給 噴嘴朝向預定方向移動之時，通過被收容物所延伸之平面 的計時爲同步較佳。並且，在上述淸除裝置中，亦可使氣 體供給噴嘴相對於被收容物所延伸之方向或平面，以預定 角度朝向下方的方向，而將預定之氣體吹出。 而，在上述淸除裝置中，被收容物係與半導體製造所 使用的晶圓、或高淸潔度環境下進行其各種處理之各種物 品對應。並且，雖然傳送盒係收容半導體晶圓之例的晶圓 傳送盒（FOUP)，但是只要可收容各種物品者的話，並不 特別限於FOUP。並且，蓋從本體分離之狀態，係與傳送 盒載置於晶圓載入機上，而使收容在傳送盒內的晶圓經由 晶圓載入機而移載到晶圓處理裝置的狀態對應。並且，在 此所述的淸除操作，係將附著於物品上而存在的塵埃、有 機物、不純物元素、氧化性氣體等之污染物質除去的操作 之意。並且，所謂映照（mapping)，係檢出收容在棚架之 格段上之晶圓的有無，而後與棚架之位置訊息對應而操作 之意。 並且，爲了解決上述課題，本發明之淸除裝置，其係 對收容在具備有：由開口及載置各個被收容物且朝向預定 方向並列之複數個棚架所形成的本體、及可從本體分離且 將開口塞住的蓋之傳送盒，而將預定之氣體吹出以進行淸 -11 - (8) (8)200426971 除操作的淸除裝置，其特徵爲：具備有：從被收容物之端 部以預定距離做爲間隔而設置，在被收容物中相對於預定 方向，對垂直延伸的面之大致全領域上，大致均勻地將預 定之氣體吹出之氣體供給噴嘴、支持氣體供給噴嘴且可將 氣體供給噴嘴朝向上述預定方向而驅動之支持構件。 而，在上述淸除裝置中，最好支持構件爲從傳送盒之 本體部將上述蓋裝設及脫離用的構件。並且，預定之氣體 從氣體供給噴嘴吹出之計時，和在支持構件朝向預定方向 移動之時，通過被收容物所延伸之平面的計時爲同步較佳 。再者，氣體供給噴嘴對與被收容物所延伸之平面爲平行 之面，及對平面爲以預定角度朝向下方延伸的面所圍住的 領域，將預定之氣體吹出較佳。 而，在上述淸除裝置中，被收容物係與半導體製造所 使用的晶圓、或高淸潔度環境下進行其各種處理之各種物 品對應。並且，雖然傳送盒係收容半導體晶圓之例的晶圓 傳送盒（FOUP)，但是只要可收容各種物品者的話，並不 特別限於FOUP。並且，蓋從本體分離之狀態，係與傳送 盒載置於晶圓載入機上，而使收容在傳送盒內的晶圓經由 晶圓載入機而移載到晶圓處理裝置的狀態對應。並且，在 此所述的淸除操作，係將附著於物品上而存在的塵埃、有 機物、不純物元素、氧化性氣體等之污染物質除去的操作 之意。並且，所謂映照（mapping)，係檢出收容在棚架之 階段上之晶圓的有無，而後與棚架之位置訊息對應而操作 之意。 -12- 200426971 Ο) 並且，爲了解決上述課題’本發明之淸除方法，係對 收容在具備有：由開口及載置各個被收容物且朝向預定方 向並列之複數個棚架所形成的本體、及可從本體分離且將 開口塞住的蓋之傳送盒，而將預定之氣體吹出以進行淸除 操作的淸除方法，其特徵爲：包含有：將蓋從本體分離， 使開口之前面沿著預定之方向而將氣體供給噴嘴移動，從 氣體供給噴嘴將預定之氣體對被收容物吹出，因而實行被 收容物之淸除的工程。 而，在上述淸除方法中，亦可使氣體供給噴嘴與感測 器並置，與進行淸除之工程的同時，利用感測器而進行使 收容於傳送盒內的被收容物之映照（mapping)工程。並且 ，在上述淸除方法中，進行淸除之工程，在氣體供給噴嘴 朝向預定方向移動之時，成爲與通過被收容物所延伸之平 面的計時同步較佳。並且，在上述淸除方法中，在進行淸 除之工程中，亦可使氣體供給噴嘴相對於與上述被收容物 所延伸之平面成平行的方向或對上述平面以預定角度而朝 向下方的方向，將預定之氣體吹出。 而，在上述淸除方法中，被收容物係與半導體製造所 使用的晶圓、或高淸潔度環境下進行其各種處理之各種物 品對應。並且，雖然傳送盒係收容半導體晶圓者之例的晶 圓傳送盒（FOUP)，但是只要可收容各種物品者的話，並 不特別限於FOUP。並且，蓋從本體分離之狀態，係與傳 送盒載置於晶圓載入機上，收容在傳送盒內的晶圓經由晶 圓載入機而移載到晶圓處理裝置的狀態對應。並且，在此 -13- (10) (10)200426971 所述的淸除操作，係將附著於物品上而存在的塵埃、有機 物、不純物元素、氧化性氣體等之污染物質除去的操作之 意。並且，所謂映照（mapping)，係檢出收容在棚架之階 段上之晶圓的有無，而後與棚架之位置訊息對應而操作之 意。 並且，爲了解決上述課題，本發明之淸除方法，係對 收容在具備有：由開口及載置各個被收容物且朝向預定方 向並列之複數個棚架所形成的本體、及可從本體分離且將 開口塞住的蓋之傳送盒，而將預定之氣體吹出以進行淸除 操作的淸除方法，其特徵爲：包含有：將蓋從本體分離的 工程、使開口之前面從被收容物之端部以保持預定距離做 爲間隔而設置之狀態，而沿著預定之方向將氣體供給噴嘴 移動之工程、從氣體供給噴嘴，相對於被收容物中之預定 方向爲垂直的方向上延伸的面之大致全領域上，將預定之 氣體大致均勻地吹出，而實行被收容物之淸除的工程。 而，在上述淸除方法中，氣體供給噴嘴最好係固定在 從傳送盒之本體將蓋裝設及脫離所用的門上。並且，進行 淸除的工程，在氣體供給噴嘴朝向預定方向移動之時，成 爲與通過被收容物所延伸之平面的計時同步較佳。再者， 在進行淸除之工程中，氣體供給噴嘴相對於與被收容物所 延伸之平面成平行之面，及對平面爲以預定角度朝向下方 延伸的面之間，將預定之氣體吹出較佳。 而，在上述淸除方法中，被收容物係與半導體製造所 使用的晶圓、或高淸潔度環境下進行其各種處理之各種物 -14· (11) (11)200426971 品對應。並且，雖然傳送盒係收容半導體晶圓者之例的晶 圓傳送盒（FOUP)，但是只要可收容各種物品者的話，並 不特別限於FOUP。並且，蓋從本體分離之狀態，係與傳 送盒載置於晶圓載入機上，收容在傳送盒內的晶圓經由晶 圓載入機而移載到晶圓處理裝置的狀態對應。並且，在此 所述.的淸除操作，係將附著於物品上而存在的麈埃、有機 物、不純物元素、氧化性氣體等之污染物質除去的操作之 意。並且，所謂映照（mapping)，係檢出收容在棚架之階 段上之晶圓的有無，而後與棚架之位置訊息對應而操作之 .τΣίη 思° 依照本發明，氣體供給噴嘴可從傳送盒開口進入傳送 盒內部，而朝向晶圓表面將高淸潔度之氣體吹出。並且， 氣體供給噴嘴可朝向晶圓被重疊的方向移動，且可相對於 一片一片的晶圓而個別地進行氣體之吹出。從而，在晶圓 表面上附著的塵埃、不純物之污染物賢等可以有効且確實 地除去。並且，傳送盒內部之淸除操作，可利用氣體供給 噴嘴在晶圓處理中隨時進行，因此可將晶圓保持在更淸潔 的環境中。並且，本發明對現有的FOUP系統中之映照裝 置’僅須追加氣體供給噴嘴及氣體配管即可實施，因此對 已規格化之系統，可以價廉且簡便地安裝。 並且，依照本發明，氣體供給噴嘴與晶圓隔開預定距 離，而將高淸潔度氣體朝向晶圓表面之全域吹出。並且， 氣體供給噴嘴可朝向晶圓重疊的方向移動，且可相對於一 片一片的晶圓而個別地進行氣體之吹出。從而，在晶圓表 -15- (12) (12)200426971 面上附著的塵埃、不純物之污染物質等可以有効且確實地 除去。並且，將傳送盒內部之淸除操作，利用氣體供給噴 嘴在晶圓處理中可隨時進行，因此可將晶圓保持在更淸潔 的環境中。並且，本發明對現有的F Ο U P系統中之晶圓載 入機之門，僅須追加氣體供給噴嘴及氣體配管即可實施， 對已規格化之系統，可以價廉且簡便地安裝。 【實施方式】 (第一實施形態） 本發明之第一個施形態將參照附圖而說明如下。第1 圖係關於本發明的淸除裝置之槪略構成，其係顯示晶圓傳 送盒、收容於傳送盒內部的晶圓及本發明的淸除裝置，從 側面看去之狀態的槪略構成圖。並且，第2圖係第1圖所示 之各個構成及其附加之構成，從上方看去的狀態之槪略構 成圖。而，在傳送盒（pod)中本來包含有，支持晶圓之棚 架、配置於蓋與傳送盒之間的密封構件等各種構成，並且 ，在門方面亦附加有種種之構成。但是，這些構成與本發 明沒有直接關係，因此在此處省略詳細的圖示及說明。 在圖中，由框構件所構成的框架5係配置成圍住於打 開器中的門6之周圍。在框架5之上部，設置有第2圖所示 之一對棒狀體13a及13b。而，該等棒狀體13a、13b從傳 送盒2之開口面朝向傳送盒內部，而延伸於對該開口面爲 垂直的方向上。該棒狀體13a及13b支持著氣體供給噴嘴 2 1 a及2 1 b，而使該氣體供給噴嘴2 1 a及2 1 b與該棒狀體朝 -16- (13) (13)200426971 向同一方向。氣體供給噴嘴21a及21b之每一個上，分別 連接到未圖示之氣體供給管線，其可因應於從外部之操作 而將淸潔氣體供給到該噴嘴。該等氣體供給噴嘴2 1 a、2 1 b 朝向晶圓1重疊的方向而依序地移動，而將淸潔氣體供給 到各個晶圓1之間。其結果，可達成晶圓之表裏面及傳送 盒內部之淸潔氣體對污染物質等之除去操作，即所謂淸除 操作。 在本實施形態中，氣體供給噴嘴2 1 a及2 1 b係配置在 相對於傳送盒2之中心線，即對保持於傳送盒內部的晶圓1 之中心線，分別僅以預定之間隔d而分離之與該中心線有 關的對象之位置上。並且，各個氣體供給噴嘴21a及21b 可對晶圓1之表面平行，或對該平面僅以預定角度α而將 氣體朝向下方供給的方式，分別地固定到對應的棒狀體 1 3 a、1 3 b上。而，該等間隔d及角度α最好係因應於保 持在傳送盒2之各個晶圓的間隔、傳送盒2之形狀等，而將 晶圓1上之污染物質等有効地除去且從傳送盒2之內部將污 染物質等排出的方式，而做適當地調整較佳。並且，基於 同樣的理由，噴嘴之數量可視該實施例而增減。或者，亦 可將噴嘴做成可驅動之構成。 在本發明中，可對每一片晶圓進行污染物質等之除去 操作，與先前技術比較時，在高淸潔度的狀態下，可將晶 圓保持於傳送盒內部。並且，在本發明中，可將污染物質 等之除去操作所需的氣體流量、淸除時間等，對各個晶圓 而做個別控制。從而，可經常地在一定條件下實施該除去 -17· (14) (14)200426971 操作，且容易地使傳送盒中所有晶圓之管理狀態保持一定 〇 而，從氣體供給噴嘴2 1 a及2 1 b供給到傳送盒2內部的 氣體等，可依照先前技術使用設置於傳送盒2中的排氣孔 而排出。並且，該淸除操作係在蓋4被開放的狀態下而實 行之故，亦可使用設置於輸送室中之未圖示的排氣系統而 實行。並且，可以考慮使一旦從晶圓除去的污染物質等， 防止其再附著到其它的晶圓或傳送盒內部，或者流入輸送 室較佳。在此情況下，如上述日本特開平2003-45933號公 報中所揭示，爲了將使用於污染物質等之除去作業中的淸 潔氣體有効地進行排氣，亦可在輸送室內設置與傳送盒連 通的排氣專用之小室。 如上面所述，最好將一旦從晶圓除去的污染物質等， 迅速地運到傳送盒外部較佳。因此，在更有効地實行將污 染物質除去方面，如上述本特開平1 1 -25 1 422號公報中所 揭示，亦可考慮附加對應於各個晶圓之排氣用之接口。但 是，如此構成的附加需要將對應於規格的傳送盒做大幅的 規格變更。從而，對與現在使用中的FOUP有關之系統， 使用本發明之時，考慮不設置如此的排氣用接口較佳。 並且，污染物質等亦有以塵埃之形態而附著在晶圓上 之情形。如此之塵埃由於帶電而由靜電吸引力附著於晶圓 的情況很多。對於如此之塵埃，不只是將高淸潔度氣體吹 到晶圓的表面而已，利用離子化氣體實施吹附時，可更有 効地除去。從而，氣體供給噴嘴或其附近，可附加將氣體 -18- (15) (15)200426971 等予以離子化之所謂離子化機，因而成爲可因應於需要而 供給離子化的氣體之構成。 (本實施形態適用的一個實施例） 其次，將參照附圖說明本發明之淸除裝置適用於現在 使用中的FOUP有關之系統的情況進行說明。而，本發明 適用的半導體晶圓處理裝置及傳送盒，其槪略構成與先前 技術中所述的構成爲大致相同，因此省略同一構成之說明 。而，進行保持於傳送盒2內部之晶圓的映照操作用之構 成被附加到打開器3之中的情況很多。該等之構成方面， 包含有檢測晶圓之有無的一對透過感測器、支持該等感測 器之框架、驅動框架之機構、檢測感測器之現在位置之機 構等。在本適用例中，將支持本發明之氣體供給噴嘴的框 架5，與支持該透過感測器的框架做成共通化之時，可使 本發明之實施變成更容易。 關於晶圓處理裝置50之槪略構成上，如第8圖所示之 先前技術者，在輸送室52中具備有在晶圓載入機5 1側上比 傳送盒2之蓋4更大若干之輸送室開口部10。做爲輸送室52 內部之輸送室開口部10之側上，設置有將傳送盒2之蓋4開 閉用的打開器3。在此處，將參照第3A及3B圖而說明適 用於本發明之打開器。第3 A圖係將第1圖中之晶圓載入機 51、傳送盒2、打開器3及蓋4縮小，而顯示裝置全體之圖 ，第3B圖係第3A圖中所示之構成從輸送室52內部側看去 之圖。 打開器3具備有門6及框架5。門6爲可將輸送室開口部 (16) (16)200426971 1 〇塞住之大小的板狀體，其面上具備有做爲真空吸氣孔之 保持部1 la及1 lb。門6將輸送室開口部10塞住之時，位於 傳送盒2側之面被做成平面而可與蓋4密接。門6上安裝著 具有孔之固定構件4 6。設置於門臂4 2之上端的樞軸4 5可轉 動地貫通於該孔中而被固定。在門臂42之下端形成有孔。 樞軸40貫通該孔，及做爲門開閉用驅動裝置之空氣驅動式 的門開閉用氣缸31之一部分的桿37之前端上之孔。因而， 門臂42與氣缸31結合，而可轉動地被氣缸31所支持。 框架5係爲由沿著輸送室開口部1 〇，且配置成將門6圍 住之框構件所形成的構造體。框架5係被安裝於很長地延 伸於其下側的框構件之框架臂丨2a及框架臂〗2b的上端。 在框架臂12a及框架臂12b的下端形成有未圖示之孔。樞 軸44貫通該孔，及做爲框架驅動裝置之空氣驅動式的框架 驅動用氣缸35之一部分的桿38之前端上之孔。因而，該等 框架臂與氣缸35結合，框架臂可轉動地被氣缸3 5所支持。 支持框架臂12a及12b爲了平均地支撐負荷，而沿著 框架5的中心軸成對稱，且平行地朝向垂直方向上延伸。 在支持框架臂12a及12b分別之上端與下端之間，安裝有 分別垂直於支持框架臂12a及12b之桿47。支持構件60之 上配置有從支持構件60垂直地伸出之形狀而做爲支點支持 部之固定構件39。固定構件39之貫通孔中配置有軸承（未 圖示），軸承的外環11固定於貫通孔的內壁上，而軸承的 內環則樞支於桿47上。因此，桿47在內包於固定構件39之 貫通孔中之狀態下構成支點4 1。 -20- (17) (17)200426971 該支點41係使框架臂12a及12b的支點’及門臂的支 點共通而兼做爲同軸上之支點的構成。即’在門臂42的上 端與下端之間設置有另外的貫通孔。桿47貫通該貫通孔而 構成支點4 7。由於氣缸3 1之驅動使桿3 7產生伸縮’因而使 門臂42以支點41爲中心而轉動。門臂42之支點41被固定於 設在可升降的可動部56上的支持構件60之上。門6具有保 持接口 1 la及1 lb，而可利用真空吸引將傳送盒2之蓋4保 持。門臂42在將門6推到輸送室開口部10之時（以下稱爲待 機狀態），係大致配置成朝向垂直方向，門6利用門臂42之 轉動而從輸出室52之壁面朝向離開的方向移動。 因應於框架驅動用氣缸3 5之驅動所形成桿3 8的伸縮之 時，框架臂12a及12b以支點41爲中心而轉動。即，框架 臂12a及12b亦被固定於設在可升降的可動部56上的支持 構件60之上。框架5在門6位於待機狀態之時，配置成從輸 送室52之壁面成傾斜地分離。即，在該狀態下，框架臂 12a及12b對門臂42以某個角度傾斜的狀態而被支持，框 架5大致抵接在輸送室52的壁面上。 在配置於框架5之上部的框構件上，支持棒13a及13b 係固定成朝向輸送室52之壁面側突出。做爲第1透過式感 測器之透過式感測器9a及9b互相成對向，並且氣體供給 噴嘴21a及21b以滿足上述位置關係的方式而分別安裝在 棒狀體1 3 a及1 3 b之個別的前端上。 在晶圓處理裝置5 0上，設置有可使打開器3升降用的 可動部56。第4A圖係打開器3之可動部56從晶圓載入機51 (18) (18)200426971 側看去之圖，第4 B圖係顯示第4 A圖之箭頭χ的視圖。可 動部56具備有朝向垂直方向進行升降用的空氣驅動式之無 桿式氣缸33及支持構件60，以成爲來自於傳送盒2的空氣 流的下游的方式，而配置於比傳送盒2的下面更下方之處 。在支持構件60上，安裝有固定構件39及空氣驅動式之氣 缸3 1及氣缸3 5。可動部5 6係設置於晶圓載入機5 1側，其係 經由設置於間隔板5 5上之長孔5 7，而由門臂4 2及框架臂 12a及12b支持在輸送室52側的打開器3。 長孔5 7係設置在可動部5 6之移動方向，即在本實施例 之情況係以垂直方向做爲其長邊的方向上。並且，由長孔 57而不使輸出室52內的淸潔度降低的方式，將晶圓載入機 5 1及輸送室5 2以蓋5 8隔開。又，爲了防止打開器3在下降 之時超過限度所用之限制器5 9被設置在間隔板5 5的下方。 無桿式氣缸3 3及導件6 1 a及導件6 1 b係沿著長孔5 7而設置 在間隔板55上。可動部56係利用無桿式氣缸33而沿著導件 61a及導件61b進行升降。在可動部56之橫向上沿著無桿 式氣缸33具備有感測監視器（sensoI· dog)7。 感測監視器7爲沿著無桿式氣缸3 3之方向延伸之板狀 體，在其長邊方向上具有以一定間隔配置的指標手段。在 本實施例中，係以一定間隔配置的缺口之凹凸部1 2做爲指 標手段。該凹凸部之數量係與傳送盒內之晶圓配置用棚架 之段數對應，並且該凹凸部在靠近可動部之任意的棚架時 ，必須配置成與一個缺口對應。在感測監視器7之可動部 56中，橫向的間隔板55上固定有做爲第2透過感測器的透 •22- (19) (19)200426971 過感測器8。 透過感測器8之感測器部係配置成，將具有設置在感 測監視器7上一定間隔之缺口的凹凸部1 2挾住’因而可因 應於可動部5 6之移動而檢測感測監視器7之凹凸部1 2。在 可動部56之支持構件60上’設置有第3透過感測器62’另 一方面，在長孔5 7之下側附近的間隔板5 5上，設置有限制 器64。在該機構中，突出部將限制器64遮光之時，停止信 號被發送到可動部56而使打開器3之全體的動作停止。 其次，根據這些之構成，將使用第3A圖、第3B圖至 第7圖而說明晶圓1上的污染物質之除去操作及映照操作如 何進行。而，第3 A圖係顯示待機狀態，第5圖係顯示將蓋 4開閉而使框架5運轉的狀態，第6圖係顯示晶圓1上的污染 物質之除去操作及映照操作完成的狀態，第7圖係顯示對 晶圓1進行之操作完成後框5回到待機狀態的狀態。並且， 第4 A圖及第4B圖係分別顯示爲了檢測框架5之驅動位置 所設置之感測監視器及關連的構成之正面圖及側面圖。 在前面之處理工程完成後的傳送盒2內之棚架上，收 容有滿足前處理規格的晶圓1，另一方面，未能滿足規格 的晶圓1從前處理階段的工程被排除。傳送盒2內之棚架的 棚段係存在有晶圓1之段與不存在有晶圓1之段混在一起。 該狀態的傳送盒2，如第3 A圖所示，被載置於輸送室5 2之 台5 3上，而以接近輸送室開口部丨〇之方式移動。在該狀態 下’打開器3係在待機狀態。亦即，門開閉用氣缸3丨之桿 3 7係最伸長的狀態，其係使門臂42以支點4 1爲中心將門6 (20) (20)200426971 推壓到輸送室開口部l 〇而將其塞住的狀態。 在本實施例中，在該狀態下，門臂42係朝垂直方向而 直立的狀態。另一方面，框架驅動用氣缸35之桿38係最縮 回的狀態，框架臂12a及12b係被作用而在以支點41爲中 心將框架5從輸送室52拉離的狀態。亦即，在本實施例中 ，框架臂12a及12b係變成對門臂42以某個角度而傾斜的 狀態。 第5圖係顯示傳送盒2接近輸送室開口部1 〇，而使門6 將蓋4保持的狀態。傳送盒2接近輸送室開口部1〇之時，傳 送盒2之蓋4密接到門6上，利用真空吸引而經由保持部1 1 a 及1 lb將傳送盒2之蓋4保持。門6將蓋4保持之時，門開閉 用氣缸31移動而使桿37縮回。接著，設置在門臂42之端部 上的樞軸4 0被拉近到支持底部6 0側，門臂4 2依照槓桿原理 ，由支點4 1轉動而將門6從微小環境開口部1 〇拉離，使蓋4 從傳送盒2開放。 蓋4在開放之後，框架5之上端進入開口部1 〇之位置， 可動部5 6僅少量地下降，直到框架臂1 2 a及1 2 b成爲可轉 動之位置。下降完成之後，實際上框架臂12才開始其轉動 動作。亦即’框架驅動用氣缸35之桿38伸出，而使框架臂 12a及12b轉動，直到框架5大致抵接在輸送室開口部1〇之 周圔爲止。此時，安裝在框架5之上側的氣體供給噴嘴21a 及21b，及透過式感測器9a及9b，從輸送室開口部1〇朝向 外部出來’而插入傳送盒2內。在此時點上，氣體供給噴 嘴21a及21b係位於第2圖所示的配置上。並且，與氣體供 •24- (21) (21)200426971 給噴嘴2 1 a及2 1 b並置的第丨透過式感測器9a及9b，係配 置成將晶圓1存在於將渠等連結的直線上，而構成檢測空 間。 在該狀態下’與可動部56朝向垂直方向移動之同時， 以高淸潔度氣體對各個晶圓1吹出而進行污染物質之除去 操作及晶圓1之映照操作，係依照順序進行。亦即，打開 益3係由無桿式氣缸33作用而下降到第6圖所示之位置。透 過式感測器9 a及9 b，係與可動部5 6及打開器3 —起相對於 晶圓1之面而朝垂直方向下降。預先將各個感測器設定成 ，當晶圓1存在於棚架之段上之時，從透過式感測器9a發 出之光被遮住’另一方面，晶圓1在棚架之段上缺少之時 ，不遮住透過式感測器9a發出之光。透過式感測器9b被 晶圓1遮住時，會發出非透過信號，透過式感測器9b不被 晶圓1遮住時，則會發出透過信號。 因此，檢測到非透過信號之時，可判斷晶圓1存在， 檢測透過信號之時則判斷晶圓1缺少。反應於該透過信號 ，高淸潔度氣體在預定時間、以預定壓力，從氣體供給噴 嘴2 1 a及2 1 b對晶圓1吹出，因而可有効地實行對各個晶圓 之污染物質等的除去操作。而，在該情況下，雖然考慮氣 體之使用效率，亦可因應於非透過信號而停止高淸潔氣體 之吹出，但是考慮到由於晶圓間之間隔不同而使成爲操作 對象的晶圓上之氣體流速變化之時，亦可變更氣體之吹出 條件。 透過感測器8之感測器部係配置成，將具有設置在感 (22) (22)200426971 測監視器7上一定間隔之缺口的凹凸部1 2挾住。從而’可 動部5 6下降之時，透過感測器8也一起下降，而檢測感測 監視器7之凹凸部12。此時，透過感測器8在通過凹部之時 ，透過感測器8不被遮光而將透過信號發出，通過凸部之 時，透過感測器8被遮光而發出非透過信號。因而，若預 先設定感測監視器7之凹凸部12，使透過式感測器9a及9b 通過傳送盒2內之棚架之各段的時點，與透過式感測器8通 過凹部的時點對應的話，則透過式感測器8檢測的透過· 非透過信號，變成可顯示透過式感測器9實際通過之棚架 之段的信號。 此項與透過式感測器9a被晶圓1遮光的結果而檢測的 透過•非透過信號之檢測結果比較，在檢測透過式感測器 8對應於棚架之段的信號之時透過式感測器9a被遮光的話 ，可判斷晶圓1存在於棚架之段上，另一方面，那時若透 過式感測器9a不被遮光的話，則可判斷晶圓1於在該棚架 之段上缺少。根據這些判斷，而將高淸潔氣體之吹出計時 或吹出條件等變更之時，可更有効地實行污染物質等之除 去操作。對所有的晶圓1反覆地進行該操作，支持棒到達 打開器3之映照操作完成位置之時，可完成污染物質等之 除去操作及映照操作。 其後，將框架驅動用氣缸35之桿38再度縮回時，框架 臂12a及12b轉動，框架5從輸送室開口部1〇移動而離開。 在桿38在最縮回之時，框架5之移動完成。然後，可動部 5 6移動到最下點，將蓋4開放，同時完成對晶圓1進行污染 -26- (23) (23)200426971 物質等之除去操作及映照操作之一連串動作。此狀態係第 7圖所示的狀態。 如上所說明者，在本實施例中，氣體供給噴嘴2 1 a及 2 1b，及透過式感測器9a及9b係固定於同一框架5上。並 且，做爲將框架5轉動之手段的框架臂12a及12b設置有框 架驅動用氣缸。將這些之構成從輸送室開口部1 0設置在充 分地離開之可動部56上之時，不必使氣體供給噴嘴及透過 感測器進行展開動作的裝置被設置在晶圓1之附近。並且 ，利用感測監視器7及透過式感測器8之時，可使對應於傳 送盒2內棚架之段的同步信號容易地產生，因此不必在驅 動裝置上使用驅動馬達，而且與晶圓1之映照操作同時地 ，可進行更有効的污染物質等之除去操作。因而利用感測 監視器7之時，可使無法產生信號的空氣驅動式氣缸被利 用到晶圓1之映照操作上。 而且，在本實施例中，雖然門臂42之支點及映照框架 5之支點係以支點4 1而共通化，但是兩者做成分別的支點 亦可達成同樣的效果。亦即，設置於門臂42上之第1支點 及設置於映照框架上的第2支點上係爲相異的支點時，亦 可達成同樣的效果。雖然可動部5 6、支點4 1、門開閉用氣 缸3 1及映照框架驅動用氣缸3 5爲做成一體化，但是在獲得 本發明效果上並不一定要做成一體化。只要將這些機構配 置在對傳送盒2爲空氣流之下游的話，可達成同樣的效果 而且’在本實施例中，對於以FOUP之規格爲基準的 (24) (24)200426971 構成不做大的變更而做爲本發明所適用的目的上，雖然氣 體供給噴嘴與晶圓映照用之感測器並列而做成固定在支持 棒之上，但是本發明並不限定於此。具體上，亦可將氣體 供給噴嘴與感測器固定在相異的框架上。並且，亦可將驅 動機構附加到氣體供給噴嘴中，而將氣體供給噴嘴做成與 晶圓面平行地移動或轉動。做成該構成之時，可使噴嘴的 數量變少，並且晶圓表面可均勻地被進行淸除。並且，亦 考慮到污染物質等之附著狀況係因應於前面進行之處理而 變動。在此情況下，可視附著狀況及氣體之使用狀態而適 當地增減氣體供給噴嘴之數量。 並且，在本實施例中，雖然污染物質等之除去操作係 與映照操作僅一次而進行，但是本發明並不限定於此。該 除去操作，除了在輸送室內之機器手接近傳送盒內之晶圓 之時以外，亦可經常隨時地進行。從而，亦可使晶圓在處 理裝置內施行各種處理之間，對保持於傳送盒內之晶圓反 覆地進行該除去操作。 並且，在本實施例中，雖然係以FOUP做爲對象而敘 述，但是本發明的適用例並不限定於該系統。只要是具有 內部可收容複數個被保持物之容器，及利用該容器將被保 持物輸送且將被保持物輸送到處理裝置中的輸送室之系統 的話，本發明之污染物質等之除去裝置（淸除裝置）均可適 用0 (第二實施形態） (25) (25)200426971 關於本發明之第二實施形態方面’以下將參照附圖而 說明。第8A至8C圖係關於本發明之淸除裝置的槪略構成 圖，其係晶圓傳送盒、收容於晶圓傳送盒內部之晶圓晶圓 及本發明之淸除裝置，從渠等的側面看去之狀態的槪略構 成圖。第8A圖係顯示淸除操作的開始時之圖，第8B圖係 顯示淸除操作之途中之圖，第8C圖係顯示淸除操作中關 鍵部之放大圖。 並且，第9A圖係顯示第8A至8C圖所示之各構成及 其附帶的構成，從上方看去之狀態的槪略構成圖，第9B 圖係將淸除裝置之關鍵部朝向水平方向切斷，而顯示該切 斷面從上方看去之狀態的槪略構成圖。而，在傳送盒中本 來包含有，支持晶圓的棚架、配置於蓋與傳送盒之間的密 封構件等各種構成，並且，門亦附帶影種種的構成，但是 ，這些構成與本發明沒有直接關係，因此在此處省略詳細 的圖示及說明。 在圖中，可朝向圖中箭頭所示方向將淸潔氣體放出的 氣體供給噴嘴2 1 ’被安裝於打開器中門6的上部。在氣體 供給噴嘴2 1上分別地連接有未圖示之氣體供給管線，其可 因應於從外部之操作而將淸潔氣體供給到該噴嘴。如第9B 圖所示，氣體供給噴嘴2 1係由朝向與晶圓1之表面平行的 方向延伸之大致爲管狀構件22所形成，該管狀構件22具有 在與晶圓1之表面平行地形成之線狀上形成的開口 2 2 a。而 ，淸潔氣體從位於管狀構件22之大致中央而未與開口 22a 對向的部分導入到該寬大的構件內部中。將氣體供給噴嘴 -29- (26) (26)200426971 2 1朝向使晶圓1重疊的方向依序地移動，而對各個晶圓之 間供給淸潔氣體。其結果，可達成晶圓之表裏面及傳送盒 2內部利用淸潔氣體之污染物質等之除去操作，及所謂的 淸除操作。門6係朝向與晶圓1重疊的方向平行而被驅動。 從而，門6之驅動時從氣體供給噴嘴2 1將淸潔氣體放出之 時，可對傳送盒2內部之晶圓1依序地進行淸理操作。 在本實施形態中，氣體供給噴嘴2 1中管狀構件2 2的中 心，係從傳送盒2之開口端面僅以預定間隔L而分離。開 口 22a具有的形狀，可使從開口 22a放出的淸潔氣體，如 第9B圖所示而朝向水平方向擴散，並且如第8A至8C圖 所示朝向垂直方向擴散。在管狀構件22與傳送盒2本體的 開口部之間設置有間隔L之時，淸潔氣體朝水平方向對晶 圓1之表面全域吹出，而成爲可除去污染物質等之構成。 並且，從通常氣體供給噴嘴放出的氣體之流速在噴嘴開口 附近最快，隨著從開口部離開而急速地下降。從而，從很 靠近晶圓端部的位置供給氣體之情況時，在晶圓表面中氣 體流之上游及下游會產生流速差，因而使污染物質等之除 去效率恐有產生大的差異之虞’或者極端的情況，快的氣 體流衝擊到晶圓端部上所產生的亂流，會有產生污染物質 等之除去效率降低之可能性，亦即，利用間隔L之設置， 可將這些之可能性降低，同時可在晶圓表面上很容易地形 成大致均等流速的氣流，因而對晶圓之表裏面前領域上可 進行均等且有效率的污染物質等之除去操作。並且，在垂 直方向上，做成將淸潔氣體相對於從水平方向以角度3朝 -30- (27) (27)200426971 向下方之領域放出的構成之時，可以使新的淸潔氣體以某 個角度接觸晶圓之表裏面，因而可更有效率地除去污染物 質等。而，該等間隔L及角度Θ，最好係因應於保持於傳 送盒2中晶圓之大小、各個之間隔、傳送盒2之形狀等’將 晶圓1上之污染物質更有效率地除去且從傳送盒2內部將其 排出的方式，而做適當地調整較佳。並且，以同樣的理由 ，亦可將開口 22a之寬度、長度、開口角或數量，視該實 施例而做增減，或者可將開口 22a之朝向變更。 在本發明中，可對每一片晶圓，並且可對其表裏面之 全領域進行將污染物質等之除去操作，與先前技術比較， 在高淸淸潔度的狀態下，可將晶圓保持於傳送盒內部。並 且，在本發明中，污染物質等之除去操作所需的氣體流量 、淸除時間等，可做成對各個晶圓進行個別控制。從而， 經常隨時地在一定條件下可進行該除去操作，因而可使傳 送盒內所有的晶圓之管理狀態容易地保持一定。 而且，亦可使從氣體供給噴嘴2 1供給到傳送盒2內部 的氣體等’使用習知方式在傳送盒2中設置的排氣孔而進 行排出。並且，該淸除操作係蓋4在開放狀態下進行之故 ，亦可使用設置於輸送室中未圖示的排氣系統而進行。並 且，可考慮使一旦從晶圓除去的污染物質等，防止其再附 著到其它的晶圓或傳送盒內部，或者流入輸送室較佳。在 此情況下，如上述日本特開平2 0 0 3 - 4 5 9 3 3號公報中所揭示 ’爲了將使用於污染物質等之除去作業中的淸潔氣體有効 地進行排氣，亦可在輸送室內設置與傳送盒連通的排氣專 -31 · (28) (28)200426971 用之小室。 如上面所述，最好將一旦從晶圓除去的污染物質等， 迅速地運到傳送盒外部較佳。因此，在更有効地實行將污 染物質除去方面，如上述本特開平1卜2 5 1 422號公報中所 揭示，亦可考慮附加對應於各個晶圓之排氣用之接口。但 是，如此構成的附加需要將對應於規格的傳送盒做大幅的 規格變更。從而，對與現在使用中的FOUP有關之系統， 使用本發明之時，考慮不設置如此的排氣用接口較佳。 並且，污染物質等亦有以塵埃之形態而附著在晶圓上 之情形。如此之塵埃由於帶電而由靜電吸引力附著於晶圓 的情況很多。對於如此之塵埃，不只是將高淸潔度氣體吹 到晶圓的表面而已，利用離子化氣體實施吹附時，可更有 効地除去。從而，氣體供給噴嘴或其附近，可附加將氣體 等予以離子化之所謂離子化機，因而成爲可因應於需要而 供給離子化的氣體之構成。 (本實施形態適用的一個實施例） 其次，將參照附圖說明本發明之淸除裝置適用於現在 使用中的FOUP有關之系統的情況進行說明。而，本發明 適用的半導體晶圓處理裝置及傳送盒，其槪略構成與先前 技術中所述的構成爲大致相同，因此省略同一構成之說明 。並且，前述之氣體供給噴嘴21亦可由與上述門6爲獨立 之構件而支持及驅動。但是，將本發明之氣體供給噴嘴等 配置於門6之上部之時，可使本發明更容易實施。 關於晶圓處理裝置5 0之槪略構成上，如第1 5圖所示之 (29) (29)200426971 先前技術者，在輸送室52中具備有在晶圓載入機5 1側上比 傳送盒2之蓋4更大若干之輸送室開口部10。爲輸送室52內 部之輸送室開口部1 〇之側上，設置有將傳送盒2之蓋4開閉 用的打開器3。在此處，將參照第1 〇A及1 0B圖而說明適 用於本發明之打開器。第1 〇 A圖係將第1圖中之晶圓載入 機51、傳送盒2、打開器3及蓋4縮小，而顯示裝置全體之 圖，第10B圖係第10A圖中所示之構成從輸送室52內部側 看去之圖。 打開器3具備有門6及框架5。門6爲可將輸送室開口部 10塞住之大小的板狀體，其面上具備有做爲真空吸氣孔之 保持部1 la及1 lb。門6將輸送室開口部10塞住之時，位於 傳送盒2側之面被做成平面而可與蓋4密接。門6上安裝著 具有孔之固定構件46。設置於門臂42之上端的樞軸45可轉 動地貫通於該孔中而被固定。在門臂42之下端形成有孔。 樞軸40貫通該孔，及做爲門開閉用驅動裝置之空氣驅動式 的門開閉用氣缸31之一部分的桿37之前端上之孔。因而， 門臂42與氣缸31結合，而可轉動地被氣缸31所支持。 框架5係爲由沿著輸送室開口部1 0，且配置成將門6圍 住之框構件所形成的構造體。框架5係被安裝於很長地延 伸於其下側的框構件之框架臂l2a及框架臂12b的上端。 在框架臂12a及框架臂12b的下端形成有未圖示之孔。樞 軸44貫通該孔，及做爲框架驅動裝置之空氣驅動式的框架 驅動用氣缸35之一部分的桿38之前端上之孔。因而，該等 框架臂與氣缸35結合，框架臂可轉動地被氣缸35所支持。 (30) (30)200426971 支持框架臂12a及12b爲了平均地支撐負荷，而沿著 框架5的中心軸成對稱，且平行地朝向垂直方向上延伸。 在支持框架臂12a及12b分別之上端與下端之間，安裝有 分別垂直於支持框架臂1 2 a及1 2 b之桿4 7。支持構件6 0之 上配置有從支持構件60垂直地伸出之形狀而做爲支點支持 部之固定構件39。固定構件39之貫通孔中配置有軸承（未 圖示），軸承的外環11固定於貫通孔的內壁上，而軸承的 內環則樞支於桿47上。因此，桿47在內包於固定構件39之 貫通孔中之狀態下構成支點4 1。 該支點41係使框架臂12a及12b的支點，及門臂的支 點共通而兼做爲同軸上之支點的構成。即，在門臂42的上 端與下端之間設置有另外的貫通孔。桿47貫通該貫通孔而 構成支點47。由於氣缸31之驅動使桿37產生伸縮，因而使 門臂42以支點41爲中心而轉動。門臂42之支點41被固定於 設在可升降的可動部56上的支持構件60之上。門6具有保 持接口 1 la及1 lb，而可利用真空吸引將傳送盒2之蓋4保 持。門臂42在將門6推到輸送室開口部10之時（以下稱爲待 機狀態），係大致配置成朝向垂直方向，門6利用門臂42之 轉動而從輸出室52之壁面而朝向離開的方向移動。 因應於框架驅動用氣缸3 5之驅動所形成桿3 8的伸縮， 框架臂12a及12b可以支點41爲中心而轉動。即，框架臂 12a及12b亦被固定於設在可升降的可動部56上的支持構 件60之上。框架5在門6位於待機狀態之時，配置成從輸送 室5 2之壁面成傾斜地離開。另一方面，框架5從該待機狀 (31) (31)200426971 態朝向抵接於輸送室52的壁面之方向，將框架臂12a及 12b轉動之時，框架5大致抵接在輸送室52的壁面上。 在配置於框架5之上部的框構件上，支持棒1 3 a及1 3 b 係固定成朝向輸送室52之壁面側突出。做爲第1透過式感 測器之透過式感測器9a及9b互相成對向地而分別安裝在 棒狀體13a及13b之個別的前端上。 在晶圓處理裝置5 0上，設置有可使打開器3升降用的 可動部5 6。第1 1 A圖係打開器3之可動部5 6從晶圓載入機 51側看去之圖，第11B圖係顯示第11A圖之箭頭X的視圖 。可動部56具備有朝向垂直方向進行升降用的空氣驅動式 之無桿式氣缸33及支持構件60，以成爲來自於傳送盒2的 空氣流的下游的方式，而配置於比傳送盒2的下面更下方 之處。可動部5 6係設置於晶圓載入機5 1側，其係經由設置 於間隔板55上之長孔57，而以門臂42及框架臂12a及12b 支持輸送室52側的打開器3。 長孔57係設置在可動部56之移動方向，即在本實施例 之情況係以垂直方向做爲其長邊的方向上。並且，由長孔 57而不使輸出室52內的淸潔度降低的方式，將晶圓載入機 51及輸送室52以蓋58隔開。又，防止打開器3下降之時的 超過限度所用之限制器59被設置在間隔板55的下方。無桿 式氣缸33及導件61a及導件61b係沿著長孔57而設置在間 隔板5 5上。可動部5 6係利用無桿式氣缸3 3而沿著導件6 1 a 及導件61b進行升降。在可動部5 6之橫向上沿著無桿式氣 缸3 3具備有感測監視器7。 -35- (32) (32)200426971 感測監視器7爲沿著無桿式氣缸3 3之方向延伸之板狀 體，在其長邊方向上具有以一定間隔配置的指標手段。在 本實施例中，係以一定間隔配置的缺口之凹凸部1 2做爲指 標手段。該凹凸部之數量係與傳送盒內之晶圓配置用棚架 之段數對應，並且該凹凸部在靠近可動部之任意的棚架時 ，必須配置成與一個缺口對應。在感測監視器7之可動部 56中，橫向的間隔板55上固定有做爲第2透過感測器的透 過感測器8。 透過感測器8之感測器部係配置成，將具有設置在感 測監視器7上一定間隔之缺口的凹凸部1 2挾住’因而可因 應於可動部5 6之移動而檢測感測監視器7之凹凸部1 2。在 可動部56之支持構件60上，設置有第3透過感測器62，另 一方面，在長孔5 7之下側附近的間隔板5 5上，設置有限制 器64。在該機構中，突出部將限制器64遮光之時，停止信 號被發送到可動部5 6而使打開器3之全體的動作停止。 其次，根據這些之構成，晶圓1上的污染物質之除去 操作及映照操作如何地進行，將使用第10A圖、第10B圖 至第1 4圖而說明。而，第1 0 A圖係顯示待機狀態，第1 2圖 係顯示將蓋4開閉而使框架5運轉的狀態，第1 3圖係顯示晶 圓1上的污染物質之除去操作及映照操作完成的狀態，第 1 4圖係顯示對晶圓1進行之操作完成後，框5回到待機狀態 的狀態。並且，第1 1 A圖及第1 1 B圖係分別顯示爲了檢測 框架5之驅動位置所設置之感測監視器及關連的構成之正 面圖及側面圖。 -36- (33) (33)200426971 在前面之處理工程完成後的傳送盒2內之棚架上，收 容有滿足前處理規格的晶圓1，另一方面，未能滿足規格 的晶圓1從前處理階段的工程被排除。傳送盒2內之棚架的 格段係存在有晶圓1之段與不存在有晶圓1之段混在一起。 該狀態的傳送盒2，如第10A圖所示，被載置於輸送室52 之台53上，而以接近輸送室開口部10之方式移動。在該狀 態下，打開器3係在待機狀態。亦即，門開閉用氣缸3 1之 桿3 7係最伸長的狀態，其係使門臂42以支點41爲中心將門 6推壓到輸送室開口部1 〇而將其塞住的狀態。 在本實施例中，在該狀態下，門臂42係朝垂直方向而 直立的狀態。另一方面，框架驅動用氣缸35之桿38係最縮 回的狀態，框架臂12a及12b係被作用而在以支點41爲中 心將框架5從輸送室5 2拉離的狀態。亦即，在本實施例中 ，框架臂12a及12b係變成對門臂42以某個角度而傾斜的 狀態。 第12圖係顯示傳送盒2接近輸送室開口部10，而使門6 將蓋4保持的狀態。傳送盒2接近輸送室開口部1〇之時’傳 送盒2之蓋4密接到門6上，利用真空吸引而經由保持部1 la 及1 lb將傳送盒2之蓋4保持。門6將蓋4保持之時，門開閉 用氣缸31移動而使桿37縮回。接著，設置在門臂42之端部 上的樞軸40被拉近到支持底部60側，門臂42依照槓桿原理 ，以支點4 1而轉動因而將門6從輸送室開口部1 〇拉離’使 蓋4從傳送盒2被開放。 蓋4在開放之後，框架5之上端進入開口部1 〇之位置’ (34) (34)200426971 可動部56僅少量地下降，直到框架臂12a及丨2b成爲可轉 動之位置爲止。下降完成之後，實際上框架臂12才開始其 轉動動作。亦即，框架驅動用氣缸3 5之桿3 8伸出，而使框 架臂1 2a及1 2b轉動’直到框架5大致抵接在輸送室開口部 1 〇之周圍爲止。此時，安裝在框架5之上側的透過式感測 器9a及9b，從輸送室開口部1〇朝向外部出來，而插入傳 送盒2內。在此時點上，氣體供給噴嘴2 1係位於第8 A圖所 示的配置上。並且，第1透過式感測器9a及9b，係配置成 將晶圓1存在於將渠等連結的直線上，而構成檢測空間。 在該狀態下，與可動部56朝向垂直方向移動之同時， 以高淸潔度氣體對各個晶圓1吹出而進行污染物質之除去 操作及晶圓1之映照操作，係依序地實施。亦即，打開器3 係由無桿式氣缸3 3作用而下降到第1 3圖所示之位置。透過 式感測器9a及9b，係與打開器3 —起相對於晶圓1之面而 朝垂直方向下降。預先將各個感測器設定成，當晶圓1存 在於棚架之段上之時，從透過式感測器9a發出之光被遮 住，另一方面，晶圓1在棚架之段上缺少之時，不遮住透 過式感測器9a發出之光。透過式感測器9b被晶圓1遮住時 ，會發出非透過信號，透過式感測器9b不被晶圓1遮住時 ，則會發出透過信號。 因此，檢測到非透過信號之時’可判斷晶圓1存在’ 檢測透過信號之時則判斷晶圓1缺少。反應於該透過信號 時，高淸潔度氣體在預定時間、以預定壓力’從氣體供給 噴嘴2 1 a及2 1 b對晶圓1吹出，因而可有効地實行對各個晶 -38- (35) (35)200426971 圓之污染物質等的除去操作。而，在該情況下’雖然考慮 氣體之使用效率，亦可因應於非透過信號而停止高淸潔氣 體之吹出，但是考慮到由於晶圓間之間隔不同而使成爲操 作對象的晶圓上之氣體流速變化之時，亦可變更氣體之吹 出條件。 透過感測器8之感測器部係配置成，將具有設置在感 測監視器7上一定間隔之缺口的凹凸部1 2挾住。從而’可 動部56下降之時，透過感測器8也一起下降’而檢測感測 監視器7之凹凸部1 2。此時，透過感測器8在通過凹部之時 ，透過感測器8不被遮光而將透過信號發出’通過凸部之 時，透過感測器8被遮光而發出非透過信號。因而’若預 先設定感測監視器7之凹凸部1 2，使透過式感測器9a及9b 通過傳送盒2內之棚架之各段的時點’與透過式感測器8通 過凹部的時點對應的話，則透過式感測器8檢測的透過· 非透過信號，變成可顯示透過式感測器9實際通過之棚架 之段的信號。 此項與透過式感測器9a被晶圓1遮光的結果而檢測的 透過•非透過信號之檢測結果比較，在檢測透過式感測器 8對應於棚架之段的信號之時，透過式感測器9 a被遮光的 話，可判斷晶圓〗存在於棚架之段上’另一方面’那時若 透過式感測器9a不被遮光的話，則可判斷晶圓1於在該棚 架之段上缺少。根據這些判斷’而將高淸潔氣體之吹出計 時或吹出條件等變更之時’可更有効地實行污染物質等之 除去操作。對所有的晶圓1反覆地進行該操作’支持棒到 • 39 · (36) (36)200426971 達打開器3之映照操作完成位置之時，可完成污染物質等 之除去操作及映照操作。 其後，將框架驅動用氣缸35之桿38再度縮回時，可使 框架臂12a及12b轉動，框架5從輸送室開口部10移動而離 開。在桿38在最縮回之時，框架5之移動完成。然後，可 動部56移動到最下點，將蓋4開放，同時完成對晶圓1進行 污染物質等之除去操作及映照操作之一連串動作。此狀態 係第1 4圖所示的狀態。 如上所說明者，在本實施例中，氣體供給噴嘴2 1朝向 與晶圓支重疊方向平行地移動而固定在門6上。從而，可 隨時在同一條件下供給淸潔氣體。並且，利用感測監視器 7及透過式感測器8之時，可使對應於傳送盒2內棚架之段 的同步信號容易地產生，因此不必在驅動裝置上使用驅動 馬達，而且與晶圓1之映照操作同時地，可進行更有効的 污染物質等之除去操作。 而且，在本實施例中，雖然門臂42之支點及映照框架 5之支點係以支點4 1而共通化，但是兩者做成分別的支點 亦可達成同樣的效果。亦即，設置於門臂42上之第1支點 及設置於映照框架上的第2支點上係爲相異的支點時，亦 可達成同樣的效果。雖然可動部5 6、支點4 1、門開閉用氣 缸31及映照框架驅動用氣缸35爲做成一體化，但是在獲得 本發明效果上並不一定要做成一體化。只要將這些機構配 置在對傳送盒2爲空氣流之下游的話，可達成同樣的效果 -40- (37) (37)200426971 而且，在本實施例中，對於以FOUP之規格爲基準的 構成不做大的變更而做爲本發明所適用的目的上，雖然氣 體供給噴嘴係固定在門的上部，但是本發明並不限定於此 。具體上，亦可以門構成相異的框架，而後將氣體供給噴 嘴固定在該框架上。並且，亦可將驅動機構附加到氣體供 給噴嘴中，而將氣體供給噴嘴做成可對與晶圓面平行的軸 轉動。並且，亦考慮到污染物質等之附著狀況係因應於前 面進行之處理而變動。在此情況下，亦可視附著狀況及氣 體之使用狀態而適當地增減氣體供給噴嘴中開口之寬度、 長度、開口角或數量。在此情況下，所謂數量之增加係指 水平方向中中開口數量的增加及垂直方向中開口數量的增 加兩者。 並且，在本實施例中，雖然污染物質等之除去操作係 與映照操作僅一次而進行，但是本發明並不限定於此。該 除去操作，除了在輸送室內之機器手接近傳送盒內之晶圓 之時以外，亦可經常隨時地進行。從而，亦可使晶圓在處 理裝置內施行各種處理之間，對保持於傳送盒內之晶圓反 覆地進行該除去操作。 並且，在本實施例中，雖然係以FOUP做爲對象而敘 述，但是本發明的適用例並不限定於該系統。只要是具有 內部可收容複數個被保持物之容器，及利用該容器將被保 持物輸送且將被保持物輸送到處理裝置中的輸送室之系統 的話，本發明之污染物質等之除去裝置（淸除裝置）均可適 用0 -41 - (38) (38)200426971 【圖式簡單說明】 第1圖係顯示本發明之第一實施形態之淸除裝置、晶 圓傳送盒、晶圓傳送盒用之蓋及打開器之一部分，從其等 的側面看去之時的槪略構成圖。 第2圖係顯示本發明之第一實施形態之淸除裝置及配 置於周邊之構成，從上方看去的狀態之槪略構成圖。 第3 A圖係將第1圖所顯示之打開器及其附近縮小，而 從其等的側面看去之狀態的槪略構成圖。 第3 B圖係顯示將第3 A圖所示之構成，從輸送室側看 去之時的槪略構成圖。 第4A圖係關於與上述實施形態有關連的實施例中之 打開器的可動部，該可動部從晶圓載入機側看去之時的正 面圖。 第4B圖係顯示將示於圖3A之構成，由側面視得之圖 〇 第5圖係顯示晶圓之映照之順序的打開器，從側面看 去之狀態的槪略構成圖，其係顯示映照之準備完成時的狀 態之圖。 第6圖係顯示晶圓之映照之順序的打開器，從側面看 去之狀態的槪略構成圖，其係顯示映照之動作完成時的狀 態之圖。 第7圖係顯示晶圓之映照之順序的打開器，從側面看 去之狀態的槪略構成圖，其係顯示映照及蓋之開放動作全 部完成時的狀態之圖。 -42- (39) (39)200426971 第8A圖係顯示本發明之第二實施形態之淸除裝置、 晶圓傳送盒、晶圓傳送盒用之蓋及打開器之一部分，從該 等的側面看去之時的槪略構成圖。 第8 B圖係顯示本發明之第二實施形態之淸除裝置、 晶圓傳送盒、晶圓傳送盒用之蓋及打開器之一部分，從該 等的側面看去之時的槪略構成圖。 第8C圖係關於本發明之第二實施形態之淸除裝置之 關鍵部，係顯示從其側面看去之時的槪略構成圖。 第9A圖係關於本發明之第二實施形態之淸除裝置， 及配置於周邊之構成從上方看去之狀態的槪略構成圖。 第9B圖係關於本發明之第二實施形態之淸除裝置之 關鍵部，將其朝向水平方向切斷，顯示該切斷面從上方看 去之狀態的槪略構成圖。 第10A圖係將第8A至C圖所示之打開器及其附近之 構成縮小，而顯示從側面看去之狀態的槪略構成圖。 第10B圖係顯示第10A圖所示之構成從輸送室側看去 之狀態的槪略構成圖。 第1 1 A圖係關於與上述實施形態有關連的實施例中之 打開器的可動部，該可動部從晶圓載入機側看去之時的正 面圖。 第1 1 B圖係顯示第1 1 A圖所示之構成從側面看去之圖 〇 第1 2圖係顯示晶圓之映照之順序的打開器，從側面看 去之狀態的槪略構成圖，其係顯示映照之準備完成時的狀 -43- (40) (40)200426971 態之圖。 第1 3圖係顯示晶圓之映照之順序的打開器，從側面看 去之狀態的槪略構成圖，其係顯示映照之動作完成時的狀 態之圖。 第1 4圖係顯示晶圓之映照之順序的打開器，從側面看 去之狀態的槪略構成圖，其係顯示映照及蓋之開放動作全 部完成時的狀態之圖。 第1 5圖係顯示本發明及先前技術適用的一般之半導體 晶圓處理裝置之槪略構成的全體側面圖。 第16A圖係將第15圖所示的裝置中先前技術之打開器 及其附近的構成放大，而顯示從側面看去之狀態的槪略構 成圖。 第1 6 B圖係顯示第1 6 A圖所不之構成從輸送室側看去 之狀態的槪略構成圖。 第1 7圖係顯示晶圓之淸除操作的打開器等，從側面看 去之狀態的槪略構成圖，其係顯不淸除準備完成時的狀態 之圖。 [圖號說明] 1 晶圓 2 傳送盒 3 打開器 4 蓋 5 框架 -44- (41)200426971 6 門 10 輸 送 室 開 □ 部 13a ，1 3 b 棒 狀 體 2 1a ，2 1 b 氣 體 供 給 噴 嘴 50 晶 圓 處 理 裝 置 5 1 晶 圓 載 入 機 52 輸 送 室 11a 、lib 保 持 部 46 固 定 構 件 42 門 臂 40 ' 44、4 5 樞 軸 3 1、 35 氣 缸 37、 38 桿 12a 、12b 框 架 臂 60 支 持 構 件 47 桿 39 固 定 構 件 4 1 支 點 56 可 動 部 9a、 9b 透 過 式 感 測 器 33 Μ j i \\ 桿 式 氣 缸 55 間 隔 板 57 長 孔 58 蓋200426971 Π) 发明 Description of the invention [Technical field of stomach month] The present invention relates to semiconductors, flat panel displays, optical discs, and the like during the manufacturing process of articles whose processes are performed in a high-cleanness environment. An article storage container for the article. More specifically, the present invention relates to a so-called wafer transfer box (FOUP) which uses the above-mentioned article as a contained object in a processing process mainly for semiconductor wafers having a diameter of 300 mm (12 inches). Internal plutonium purification method. [Previous Technology] Until now, in the manufacturing process of semiconductor devices, the entire factory that performs various processes on wafers has been cleaned, and the high-purity purification required by the manufacturing process has been met. However, with the increase in the diameter of wafers, there are problems in cost and other aspects of the environment required to obtain such a structure. In recent years, in order to maintain the high cleanliness of each processing device, a small amount of guarantee has been adopted. Means of environmental space. Specifically, it does not increase the cleanliness of the entire plant, but only in storage containers (hereinafter referred to as pods) used in each processing device in manufacturing processes and during movement between them. Maintain high cleanliness. The transfer box is referred to as the above-mentioned FOUP. Therefore, when only a small space is used to achieve high cleanliness, the same effect as that of a clean room in the entire plant can be obtained, so that equipment investment or maintenance costs can be reduced, and efficient production processes can be achieved. In the following, a semiconductor device corresponding to a so-called micro-space which is actually used will be briefly described -5- (2) (2) 200426971 processing device. FIG. 15 shows the entirety of the semiconductor wafer processing apparatus 50. The semiconductor wafer processing apparatus 50 is mainly composed of a wafer loader 51, a transfer chamber 52, and a processing chamber 59. The respective joint portions are distinguished by the partition plate 55a and the cover 58a between the wafer loader side and the partition plate 55b and the cover 58b between the processing chamber side. In the semiconductor wafer processing apparatus 50, 'in order to discharge dust in the transfer chamber 52 to maintain a high degree of cleanliness, a fan (not shown) provided on the upper portion thereof generates air from above the transfer chamber 52 and downwards. flow. Therefore, the dust is discharged toward the lower side at any time. In the wafer loader 51, a pod 2 serving as a storage container for silicon wafers (hereinafter referred to simply as a wafer) is mounted on the stage 53. As described earlier, the inside of the transfer chamber 52 is maintained at a high cleanliness for processing the wafer 1, and a machine hand 54 is provided inside the transfer chamber 52. The wafer is transferred between the inside of the transfer box 2 and the inside of the processing chamber 59 by the robot hand 54. In the processing chamber 59, although various mechanisms for generally performing thin film formation, thin film processing, and the like on a wafer surface are also included therein, these configurations are not directly related to the present invention, and thus descriptions thereof are omitted here. The transfer box 2 has a space for accommodating the wafer 1 as an object to be processed, and each of them includes a box-shaped body portion 2 a having an opening on one side, and a cover 4 for sealing the opening. . Arranged inside the main body portion 2a are a plurality of shelves for stacking the wafers 1 in one direction. Each wafer 1 placed thereon is housed inside the transfer box 2 at a certain interval. In the example shown here, the direction in which the wafers I are overlapped is the vertical direction. An opening portion 10 is provided on the wafer loader 51 side of the transfer chamber 52. The opening 10 is arranged on the wafer-6 so that the transfer box 2 is close to the opening 10 (3) (3) 200426971 The loader 51 is arranged on the opening 10 of the transfer box 2 Opposite position. Further, an opener 3 to be described later is provided near the inside opening portion 10 in the transfer chamber 52. Figures 16A and 16B are enlarged side sectional views of the opener 3 in the prior art device, and front views of the opener 3 as viewed from the conveying chamber 52 side, respectively. Fig. 17 is a side sectional view schematically showing a state where the cover 4 is opened from the transport box 2 using the opener 3. The opener 3 includes a door 6 and a door arm 42. A fixing member 46 is attached to the door 6, and the door 6 is rotatably connected to one end of the door arm 42 via the fixing member 46. The other end 'of the door arm 42 is rotatably supported on the pivot 40 via a pivot 40 with respect to the front end of the rod 37 which is a part of the air-driven cylinder 31. A through hole is provided between the one end of the door arm 42 and the other end. This hole and a hole of the fixing member 39 fixed to the supporting member 60 of the movable portion 56 capable of raising and lowering the opener 3 are penetrated with a pin (not shown), thereby forming a fulcrum 41. Therefore, in response to the expansion and contraction of the lever 37 caused by the driving of the cylinder 31, the gate arm 42 rotates around the fulcrum 41. The fulcrum 41 of the door arm 42 is fixed to a support member 60 provided on a movable portion 56 that can be raised and lowered. The door 6 has a holding interface 11a and lib, which can be vacuum-held to hold the cover 4 of the transfer box 2. When the wafer 1 is processed using these configurations, 'the transfer box is first placed on the stage 53 near the transfer chamber opening 10' and the cover 4 is held by the door 6. Then, when the lever 37 of the air cylinder 31 is retracted ', the gate arm 42 moves away from the opening of the transfer chamber with the fulcrum 41 as the center. The door 6 and the cover 4 are rotated together by this action, and the cover 4 is removed from the transfer box 2. This status is shown in Figure 17. Thereafter, the movable portion 56 is lowered and the cover 4 is conveyed to a predetermined avoidance position of (4) (4) 200426971. In general, the inside of the transfer box 2 in a state where wafers and the like are stored is filled with dry nitrogen gas and the like for management cleanliness to prevent intrusion of pollutants, oxidizing gases, and the like into the transfer box. However, because the transfer box also contains the wafer after passing through the processing chamber, contaminated substances and the like are attached to the wafer in the processing chamber and the like. It is thought that this kind of pollutants are brought into the inside of the transfer box. In the case where these pollutants are brought into the next processing chamber, the wafer processing that is necessary to pass through the processing chamber becomes impossible. Therefore, as the wafer is moved from the transfer box to the transfer chamber, contamination must be removed. In the FOUP of the prior art, in order to respond to the requirements, the bottom of the transfer box is provided with a gas supply hole for introducing purging gas into the inside of the transfer box and an exhaust hole for discharge. These air supply holes and air exhaust holes are connected to the gas supply holes and air exhaust holes for scavenging gas provided on the support table on which the transfer box is placed, respectively. In practice, a high-pressure gas system for managing the cleanliness is introduced into the transfer box from the support table side through these air supply holes. At the same time, gases and pollutants already existing inside the transfer box are discharged to the outside through these vent holes. With this operation, removal of contaminants and the like carried into the inside of the transfer box can be performed. However, when only high-pressure gas is introduced from the bottom of the transfer box, the gas flow must pass through the relatively easy-to-pass area mainly around the wafer periphery. Therefore, it is difficult to pass a gas having a sufficient flow rate through the upper and lower surfaces of each wafer held at a minute interval. However, pollutants and the like are mainly attached to the top or the bottom of the wafer, so it is difficult to remove the pollutants in a conventional manner, such as 8- (5) (5) 200426971. A method disclosed in Japanese Patent Application Laid-Open No. 200 3 -4 5 93 3 has been proposed for a method for removing contaminated substances and the like attached to a wafer. In this method, another space is provided with the transfer chamber, which is used to receive the opener. This space has a gas supply port in a portion located above the front face of the opening of the transfer box. The purge gas is supplied from the gas supply port toward the inside of the transfer box, and the purge gas that circulates inside the transfer box and flows out from the lower portion of the transfer box into the space is exhausted from the lower portion of the space. With the above configuration, when the cleaning gas is circulated inside the transfer box, it is possible to more reliably remove contaminated substances and the like compared to the previous method. In addition, Japanese Patent Application Laid-Open No. 11-251422 discloses a method of introducing a purge gas between each wafer held inside a transfer box. In this method, a gas introduction flow path and a gas discharge flow path are provided in the inside of the transfer box, and communicate with each groove portion accommodating each crystal circle. The cleaning gas is blown onto the surface of each wafer through the gas introduction flow path, and then becomes the cleaning gas containing pollutants and the like, and is exhausted through the gas discharge flow path, so that the gas can be more reliably discharged. Removal of contaminated substances. The method disclosed in Japanese Patent Application Laid-Open No. 2003-45 93 No. 3 is related to the reduction of the humidity and oxidation degree inside the transfer box, and the prevention of organic pollution, and it is expected to have a certain degree of effect. However, replacement of the gas existing between the wafers held at minute intervals is still difficult. Therefore, it is similarly difficult to obtain the effect of removing contaminants and the like attached to the upper and lower surfaces of the wafer. According to the method disclosed in Japanese Unexamined Patent Publication No. 11_2 5 1 422, it is possible to (6) (6) 200426971 remove the contaminants and the like attached to the upper and lower surfaces of the wafer. However, it is still difficult to maintain a large internal diameter of the gas introduction flow path in a practical configuration. Therefore, the pressure difference between the gas introduced into the wafer surface and the time difference between the introduction of the gas at the predetermined pressure occurs on the upstream side and the downstream side of the flow path. Therefore, the removal effect of the contaminated substances at the holding position of the wafer may have an effect. different. In addition, the support table, the shape of the transfer box, and the arrangement of the supply holes and discharge holes of the cleaning gas for removing the inside of the transfer box have been almost standardized in the semiconductor manufacturing industry. Therefore, the transfer box disclosed in Japanese Patent Application Laid-Open No. 1 1-25 1 422, which is different from the standard, has to be used, and there is a problem that the transfer box cannot be shared with a widely used support desk. SUMMARY OF THE INVENTION The present invention has been developed in view of the above circumstances, and an object thereof is to provide a method for erasing a wafer transfer box and an erasing device which can effectively remove pollutants and the like attached to a wafer. In order to solve the above-mentioned problems, the eradication device of the present invention includes a main body formed by a plurality of scaffolds formed by openings and placing each contained object in a predetermined direction, and a main body which can be separated from the main body and An erasing device for a cover transport box for opening a cover to blow out a predetermined gas to perform an erasing operation, which is characterized in that: in a state where the cover is separated from the body, the front face of the opening can be directed in a predetermined direction The moving frame and a gas supply nozzle that can move in a predetermined direction while maintaining a predetermined positional relationship with the frame. -10 · (7) (7) 200426971 In the above-mentioned erasing device, the frame can hold a sensor that maps the contained object stored in the transfer box, and can also make the gas supply nozzle and the sensor The detectors are juxtaposed. Further, in the above-mentioned erasing device, it is also preferable to synchronize the timing of blowing out a predetermined gas from the gas supply nozzle with the timing of passing through the plane extended by the object when the gas supply nozzle moves in a predetermined direction. Furthermore, in the above-mentioned erasing device, the gas supply nozzle may be directed downward at a predetermined angle with respect to a direction or a plane where the object is extended to blow out a predetermined gas. In addition, in the above-mentioned erasing apparatus, the objects to be contained correspond to wafers used in semiconductor manufacturing, or various articles that perform various processes in a high-cleanness environment. Furthermore, although the transfer cassette is a wafer transfer cassette (FOUP), which is an example of a semiconductor wafer, it is not particularly limited to a FOUP as long as it can accommodate various articles. In addition, the state where the cover is separated from the body corresponds to a state in which the transfer box is placed on the wafer loader, and the wafer contained in the transfer box is transferred to the wafer processing apparatus through the wafer loader. . The erasing operation described herein is an operation for removing contaminated substances such as dust, organic substances, impurities, and oxidizing gases that are present on an article. In addition, the so-called mapping is intended to detect the presence or absence of a wafer stored on a grid section of a scaffold, and then operate in accordance with the position information of the scaffold. In addition, in order to solve the above-mentioned problems, the eradication device of the present invention includes a main body formed by openings and a plurality of scaffolds in which a plurality of objects to be accommodated are arranged and are aligned in a predetermined direction. The cover transfer box that separates and plugs the opening, and blows out a predetermined gas to perform the removal operation. The removal device includes: The ends are provided at predetermined distances. The gas supply nozzles, the support gas supply nozzles, and the support gas supply nozzles that blow the predetermined gas approximately uniformly over the entire area of the vertically extending surface with respect to the predetermined direction in the contained object, and A support member that can drive the gas supply nozzle toward the predetermined direction. In the above-mentioned erasing apparatus, it is preferable that the supporting member is a member for attaching and detaching the cover from the main body of the transfer box. In addition, it is preferable that the timing of the predetermined gas blown out from the gas supply nozzle is synchronized with the timing of the plane extending through the contained object when the support member moves in the predetermined direction. Furthermore, it is preferable that the gas supply nozzle blows out a predetermined gas in a region surrounded by a plane parallel to a plane extended by the contained object and a plane surrounded by a plane extending downward at a predetermined angle. In addition, in the above-mentioned erasing apparatus, the objects to be contained correspond to wafers used in semiconductor manufacturing, or various articles that perform various processes in a high-cleanness environment. Furthermore, although the transfer cassette is a wafer transfer cassette (FOUP), which is an example of a semiconductor wafer, it is not particularly limited to a FOUP as long as it can accommodate various articles. In addition, the state where the cover is separated from the body corresponds to a state in which the transfer box is placed on the wafer loader, and the wafer contained in the transfer box is transferred to the wafer processing apparatus through the wafer loader. . The erasing operation described herein is an operation for removing contaminated substances such as dust, organic substances, impurities, and oxidizing gases that are present on an article. In addition, the so-called mapping refers to detecting the presence or absence of a wafer contained in the stage of the scaffold, and then operating in accordance with the position information of the scaffold. -12- 200426971 〇) In addition, in order to solve the above-mentioned problem, the method for eliminating the present invention, the main body is formed by: a body formed by openings and a plurality of scaffolds placed in parallel with each other in a predetermined direction. And an erasing method for a cover transfer box that can be separated from the body and plugged with an opening, and blown out a predetermined gas to perform an erasing operation, which is characterized in that it includes: separating the cover from the body so that the opening is in front of the opening The gas supply nozzle is moved in a predetermined direction, and a predetermined gas is blown out from the gas supply nozzle to the contained object, so that the contained object is removed. In the erasing method described above, the gas supply nozzle and the sensor may be juxtaposed, and at the same time as the erasing process, the sensor is used to perform mapping of the objects to be contained in the transfer box. )engineering. In addition, in the erasing method described above, it is preferable to synchronize with the timing of the plane extending through the contained object when the gas supply nozzle moves in a predetermined direction. In addition, in the erasing method, in the erasing process, the gas supply nozzle may be oriented in a direction parallel to the plane in which the contained object extends or in a downward direction at a predetermined angle to the plane. , Blow out the predetermined gas. In addition, in the above-mentioned erasing method, the contained object corresponds to a wafer used in semiconductor manufacturing, or a variety of objects subjected to various processes in a high-cleanness environment. Furthermore, although the transfer box is a wafer transfer box (FOUP), which is an example of a semiconductor wafer, it is not particularly limited to a FOUP as long as it can accommodate various articles. The state where the cover is separated from the body corresponds to a state in which the transfer box is placed on the wafer loader, and the wafer contained in the transfer box is transferred to the wafer processing apparatus via the wafer loader. In addition, the erasing operation described in -13- (10) (10) 200426971 is an operation for removing contaminated substances such as dust, organic matter, impurities, and oxidizing gas that are present on the article. In addition, the so-called mapping is intended to detect the presence or absence of a wafer contained in the stage of the scaffold, and then operate in accordance with the position information of the scaffold. In addition, in order to solve the above-mentioned problems, the eradication method of the present invention includes a main body formed by openings and a plurality of scaffolds in which each contained object is placed and arranged in a predetermined direction, and the main body can be separated from the main body. In addition, the method for removing a cover is a cover transfer box with an opening plugged therein, and a predetermined gas is blown out to perform an erasing operation, which is characterized in that it includes a process of separating the cover from the main body and the front face of the opening from the contained object. The end portion is provided with a predetermined distance as an interval, and the process of moving the gas supply nozzle in a predetermined direction extends from the gas supply nozzle in a direction perpendicular to the predetermined direction of the contained object. In the whole area, the predetermined gas is blown out substantially uniformly, and the removal of contained objects is carried out. In the above-mentioned erasing method, it is preferable that the gas supply nozzle is fixed to a door for attaching and detaching the cover from the main body of the transfer box. In addition, it is preferable that the erasing process be synchronized with the timing of the plane extending through the contained object when the gas supply nozzle moves in a predetermined direction. Moreover, in the eradication process, the gas supply nozzle blows out a predetermined gas between a plane parallel to the plane where the contained object extends and a plane whose plane extends downward at a predetermined angle. good. However, in the above-mentioned erasing method, the object to be contained corresponds to wafers used in semiconductor manufacturing, or various objects subjected to various processes in a high-cleanness environment. (14) (11) (11) 200426971 Furthermore, although the transfer box is a wafer transfer box (FOUP), which is an example of a semiconductor wafer, it is not particularly limited to a FOUP as long as it can accommodate various articles. The state where the cover is separated from the body corresponds to a state in which the transfer box is placed on the wafer loader, and the wafer contained in the transfer box is transferred to the wafer processing apparatus via the wafer loader. And, as described here. The eradication operation is intended to remove contaminated substances such as ravioli, organic substances, impurities, and oxidizing gases that are present on the article. And, the so-called mapping is to detect the presence or absence of a wafer contained in the stage of the scaffold, and then operate in correspondence with the position information of the scaffold. τΣίη 思 ° According to the present invention, The gas supply nozzle can enter the inside of the transfer box through the opening of the transfer box, The high-cleanness gas is blown out toward the wafer surface. and, The gas supply nozzle can be moved in the direction in which the wafers are overlapped, In addition, the gas can be blown out individually for each wafer. thereby, Dust on the wafer surface, Impurities and impurities can be removed effectively and reliably. and, The erasing operation inside the transport box, Gas supply nozzles can be used at any time during wafer processing, As a result, the wafer can be kept in a cleaner environment. and, The present invention can be implemented for the mapping device in the existing FOUP system only by adding a gas supply nozzle and a gas pipe. So for a standardized system, Can be installed inexpensively and easily. and, According to the invention, The gas supply nozzle is spaced a predetermined distance from the wafer, The high cleanliness gas is blown out toward the entire area of the wafer surface. and, The gas supply nozzle can be moved in the direction in which the wafers overlap, Moreover, the gas can be blown out individually with respect to each wafer. thereby, Dust attached to the surface of the wafer table -15- (12) (12) 200426971, Impurities and the like can be effectively and reliably removed. and, The erasing operation inside the transport box, The gas supply nozzle can be used at any time during wafer processing. As a result, the wafer can be kept in a cleaner environment. and, According to the present invention, the gate of the wafer loader in the existing F 0 U P system, Only need to add gas supply nozzle and gas piping, For standardized systems, Can be installed inexpensively and easily. [Embodiment] (First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration of an erasing device according to the present invention. It shows the wafer transfer box, A wafer housed inside a transfer box and the eradication device of the present invention, A schematic diagram of the state when viewed from the side. and, Fig. 2 shows each structure shown in Fig. 1 and its additional structure. The outline of the state viewed from above is sketched. and, It was originally included in the pod, Shelf support for wafers, Various structures such as a sealing member disposed between the cover and the transfer box, And, Various structures are also added to the door. but, These components are not directly related to the present invention, Therefore, detailed illustration and description are omitted here. In the picture, A frame 5 composed of a frame member is arranged to surround the door 6 in the opener. Above the frame 5, A pair of rod-shaped bodies 13a and 13b shown in Fig. 2 are provided. and, The rod-shaped bodies 13a, 13b faces the inside of the transfer box from the opening surface of the transfer box 2, It extends in a direction perpendicular to the opening surface. The rod-shaped bodies 13a and 13b support the gas supply nozzles 2 1 a and 2 1 b, The gas supply nozzles 2 1 a and 2 1 b are aligned with the rod-shaped body in the same direction as -16- (13) (13) 200426971. On each of the gas supply nozzles 21a and 21b, Respectively connected to a gas supply line (not shown), It can supply cleaning gas to the nozzle in response to an operation from the outside. The gas supply nozzle 2 1 a, 2 1 b sequentially moves toward the direction in which wafer 1 overlaps, The cleaning gas is supplied between the wafers 1. the result, Removal of contaminated substances from the inside and outside of the wafer by the cleaning gas, This is the so-called erasing operation. In this embodiment, The gas supply nozzles 2 1 a and 2 1 b are arranged at the center line with respect to the transfer box 2, That is, for the centerline of wafer 1 held inside the transfer box, The positions of the objects related to the centerline are separated at predetermined intervals d, respectively. and, The respective gas supply nozzles 21a and 21b can be parallel to the surface of the wafer 1, Or a method of supplying gas downward to the plane at a predetermined angle α, Fixed to the corresponding rods 1 3 a, 1 3 b. and, The interval d and the angle α are preferably based on the interval of each wafer held in the transfer box 2, The shape of the transfer box 2, etc. The method of effectively removing the contaminated materials and the like on the wafer 1 and discharging the contaminated materials and the like from the inside of the transfer box 2, It is better to make proper adjustments. and, For the same reason, The number of nozzles can be increased or decreased depending on the embodiment. or, The nozzle can also be made driveable. In the present invention, Removal of contaminants, etc. can be performed on each wafer, When compared with the prior art, In a state of high cleanliness, The wafer can be held inside the transfer box. and, In the present invention, The gas flow required for the removal of pollutants, etc. Erasing time, etc. Individual control for each wafer. thereby, This removal can often be performed under certain conditions. -17 · (14) (14) 200426971 operation, And it is easy to keep the management state of all wafers in the transfer box. The gas and the like supplied from the gas supply nozzles 2 1 a and 2 1 b into the inside of the transfer box 2, It can be discharged in accordance with the prior art using a vent hole provided in the transfer box 2. and, This erasing operation is performed with the cover 4 opened, It is also possible to use an exhaust system (not shown) installed in the transfer chamber. and, It can be considered to make the pollutants and the like removed from the wafer once, Prevent it from reattaching to other wafers or transfer boxes, Or it is better to flow into the transfer chamber. In this situation, As disclosed in the aforementioned Japanese Patent Publication No. 2003-45933, In order to effectively exhaust the cleaning gas used in the removal of pollutants, etc., It is also possible to set up a dedicated chamber for the exhaust which is connected to the transfer box in the conveying room. As mentioned above, It is best to remove pollutants, etc. from the wafer once, It is better to ship quickly to the outside of the transfer box. therefore, With regard to more effective removal of pollutants, As disclosed in the aforementioned Japanese Patent Application Laid-Open No. 1 1-25 1 422, It is also conceivable to add an interface for exhaust corresponding to each wafer. But yes The additional configuration requires a large specification change of the transfer box corresponding to the specification. thereby, For systems related to FOUPs in use today, When using the present invention, It is considered better not to provide such an exhaust port. and, Contaminants may be attached to the wafer in the form of dust. Such dust is often attached to the wafer by electrostatic attraction due to charging. For such dust, It ’s not just blowing high-cleanness gas onto the surface of the wafer, When blowing with ionized gas, Can be removed more efficiently. thereby, The gas supply nozzle or its vicinity, A so-called ionizer which can ionize the gas -18- (15) (15) 200426971, etc. Therefore, it becomes a structure which can supply an ionized gas according to a need. (An embodiment to which this embodiment is applied) Next, The case where the erasing device of the present invention is applied to a FOUP-related system currently in use will be described with reference to the drawings. and, A semiconductor wafer processing apparatus and a transfer box applicable to the present invention, The general structure is roughly the same as that described in the prior art. Therefore, the description of the same structure is omitted. and, There are many cases where the structure for performing the mapping operation of the wafer held inside the transfer box 2 is added to the opener 3. In terms of composition, Contains a pair of transmission sensors that detect the presence or absence of wafers, Frameworks that support these sensors, Institutions that drive the framework, A mechanism that detects the current position of the sensor, etc. In this application, Frame 5 supporting the gas supply nozzle of the present invention, When it is made common with the frame supporting the transmission sensor, The implementation of the present invention can be made easier. With regard to the general structure of the wafer processing apparatus 50, As shown in the prior art in Figure 8, The transfer chamber 52 is provided with a transfer chamber opening 10 that is larger than the cover 4 of the transfer cassette 2 on the wafer loader 51 side. As the side of the conveying chamber opening 10 inside the conveying chamber 52, An opener 3 for opening and closing the cover 4 of the transfer box 2 is provided. Here, An opener suitable for the present invention will be described with reference to Figs. 3A and 3B. Figure 3A shows the wafer loader 51 in Figure 1, Transfer box 2, The opener 3 and cover 4 are reduced, The whole picture of the display device, Fig. 3B is a view of the structure shown in Fig. 3A as viewed from the inside of the transfer chamber 52. The opener 3 includes a door 6 and a frame 5. The door 6 is a plate-shaped body capable of plugging the opening of the conveying chamber (16) (16) 200426971 1 0, The surface is provided with holding portions 1 a and 1 lb as vacuum suction holes. When the door 6 blocks the transport chamber opening 10, The surface on the side of the transfer box 2 is made flat and can be in close contact with the cover 4. The door 6 is provided with a fixing member 46 having a hole. A pivot shaft 45 provided at the upper end of the door arm 42 is rotatably penetrated through the hole to be fixed. A hole is formed in the lower end of the door arm 42. The pivot 40 penetrates the hole, And a hole at the front end of a lever 37 which is a part of an air-driven door opening / closing cylinder 31 serving as a door opening / closing drive device. thus, The door arm 42 is combined with the cylinder 31, It is rotatably supported by the cylinder 31. The frame 5 is composed of 10 along the opening of the transfer chamber. And it is arrange | positioned as the structure formed by the frame member which surrounds the door 6. The frame 5 is attached to the upper end of the frame arm 2a and the frame arm 2b of the frame member extending very long on its lower side. Holes (not shown) are formed in the lower ends of the frame arms 12a and 12b. The pivot 44 penetrates the hole, And a hole at the front end of the rod 38 which is a part of the air-driven frame driving cylinder 35 as a frame driving device. thus, These frame arms are combined with the cylinder 35, The frame arm is rotatably supported by the cylinder 35. The support frame arms 12a and 12b support the load evenly, And symmetrical along the center axis of frame 5, It extends in a vertical direction in parallel. Between the upper and lower ends of the support frame arms 12a and 12b, respectively, Mounted are rods 47 perpendicular to the support frame arms 12a and 12b, respectively. A fixing member 39 is provided on the supporting member 60 as a fulcrum supporting portion in a shape protruding vertically from the supporting member 60. A bearing (not shown) is arranged in the through hole of the fixing member 39, The outer ring 11 of the bearing is fixed to the inner wall of the through hole, The inner ring of the bearing is pivotally supported on the rod 47. therefore, The rod 47 constitutes a fulcrum 41 in a state where it is enclosed in the through hole of the fixing member 39. -20- (17) (17) 200426971 The fulcrum 41 is a structure in which the fulcrum of the frame arms 12a and 12b and the fulcrum of the door arm are common and serve as a fulcrum on the same axis. That is, another through hole is provided between the upper end and the lower end of the door arm 42. The rod 47 passes through the through hole to constitute a fulcrum 47. The driving of the cylinder 31 causes the lever 37 to expand and contract 'so that the door arm 42 rotates around the fulcrum 41 as a center. The fulcrum 41 of the door arm 42 is fixed to a support member 60 provided on a movable portion 56 that can be raised and lowered. The door 6 has a holding interface 1 la and 1 lb, Instead, the cover 4 of the transfer box 2 can be held by vacuum suction. When the door arm 42 pushes the door 6 to the conveying chamber opening 10 (hereinafter referred to as a standby state), Is roughly oriented vertically, The door 6 moves in a direction away from the wall surface of the output chamber 52 by the rotation of the door arm 42. In response to the expansion and contraction of the rod 38 formed by the driving of the frame driving cylinder 35, The frame arms 12a and 12b rotate around the fulcrum 41 as a center. which is, The frame arms 12a and 12b are also fixed to a support member 60 provided on a movable portion 56 that can be raised and lowered. When the frame 5 is in the standby state, It is arranged obliquely from the wall surface of the transmission chamber 52. which is, In this state, The frame arms 12a and 12b are supported with the door arm 42 inclined at an angle, The frame 5 is substantially in contact with the wall surface of the transfer chamber 52. On the frame member arranged on the upper part of the frame 5, The support rods 13a and 13b are fixed so as to protrude toward the wall surface side of the transfer chamber 52. The transmissive sensors 9a and 9b, which are the first transmissive sensors, face each other, The gas supply nozzles 21a and 21b are mounted on the respective front ends of the rod-shaped bodies 1a and 13b so as to satisfy the positional relationship. On the wafer processing apparatus 50, A movable portion 56 for raising and lowering the opener 3 is provided. Figure 4A is a view of the movable portion 56 of the opener 3 as viewed from the side of the wafer loader 51 (18) (18) 200426971. Figure 4B is a view showing arrow χ of Figure 4A. The movable section 56 includes an air-driven rodless cylinder 33 for raising and lowering in a vertical direction and a support member 60. So as to be downstream of the air flow from the transfer box 2, It is arranged further below the bottom of the transport box 2. On the support member 60, A fixed member 39 and an air-driven cylinder 31 and a cylinder 35 are attached. The movable part 5 6 is provided on the wafer loader 5 1 side. It is through a long hole 5 7 provided in the partition plate 5 5, The door arm 42 and the frame arms 12a and 12b support the opener 3 on the conveying chamber 52 side. The long hole 5 7 is provided in the moving direction of the movable portion 56. That is, in the case of this embodiment, the vertical direction is taken as the direction of its long side. and, A way of making the long hole 57 without reducing the cleanliness in the output chamber 52, The wafer loader 51 and the transfer chamber 5 2 are separated by a cover 5 8. also, A limiter 59 for preventing the opener 3 from exceeding the limit when it is lowered is provided below the partition plate 55. The rodless cylinder 3 3 and the guide 6 1 a and the guide 6 1 b are provided on the partition plate 55 along the long hole 57. The movable portion 56 is raised and lowered along the guide 61a and the guide 61b by the rodless cylinder 33. A sensor monitor 7 is provided along the rodless cylinder 33 in the lateral direction of the movable portion 56. The sensing monitor 7 is a plate-shaped body extending in the direction of the rodless cylinder 33. Index means are arranged at regular intervals in the long side direction. In this embodiment, The notched uneven portions 12 arranged at regular intervals are used as the index means. The number of the concave-convex portions corresponds to the number of stages of the wafer arrangement shelf in the transfer box. And when the uneven portion is close to any of the scaffolds of the movable portion, Must be configured to correspond to a gap. In the movable portion 56 of the sensing monitor 7, A horizontal transmission plate 55 is fixed to the transmission sensor 2 as a second transmission sensor 22- (19) (19) 200426971. The sensor section of the sensor 8 is configured to The concavo-convex portion 12 having cutouts provided at regular intervals on the sensing monitor 7 is held, so that the concavo-convex portion 12 of the sensing monitor 7 can be detected in response to movement of the movable portion 56. The third transmission sensor 62 'is provided on the support member 60 of the movable portion 56. On the partition plate 5 5 near the lower side of the long hole 5 7, A limiter 64 is provided. In the institution, When the protrusion blocks the limiter 64, A stop signal is sent to the movable unit 56 to stop the entire operation of the opener 3. Secondly, Based on these constitutions, Will use Figure 3A, Figures 3B to 7 illustrate how the contaminant removal operation and mapping operation on the wafer 1 are performed. and, Figure 3 A shows the standby state, Fig. 5 shows a state where the cover 5 is opened and closed and the frame 5 is operated. FIG. 6 shows a state where the removal operation and the reflection operation of the contaminants on the wafer 1 are completed, FIG. 7 shows a state where the frame 5 returns to the standby state after the operation on the wafer 1 is completed. and, Figures 4A and 4B are a front view and a side view, respectively, of a sensing monitor and associated components provided to detect the driving position of the frame 5. On the scaffold in the transfer box 2 after the previous processing project is completed, Contains wafers 1 that meet pre-processing specifications, on the other hand, Wafers that failed to meet specifications were excluded from the pre-processing stage. The shelf section of the shelf in the transfer box 2 is a section where the wafer 1 is present and a section where the wafer 1 is not present. Transport box 2 in this state, As shown in Figure 3 A, Is placed on the table 5 3 of the transfer chamber 5 2, Instead, it moves so as to approach the opening of the transfer chamber. In this state, the 'opener 3 is in a standby state. that is, The door opening and closing cylinder 3 丨 the lever 3 7 is the most extended state, This is a state in which the door arm 42 presses the door 6 (20) (20) 200426971 around the fulcrum 41 to the conveying chamber opening 10 and plugs it. In this embodiment, In this state, The door arm 42 stands in a vertical direction. on the other hand, The rod 38 of the frame driving cylinder 35 is in the most retracted state, The frame arms 12a and 12b are acted to pull the frame 5 away from the transfer chamber 52 with the fulcrum 41 as the center. that is, In this embodiment, The frame arms 12a and 12b are inclined to the door arm 42 at an angle. FIG. 5 shows that the transfer box 2 is close to the opening 1 of the transfer chamber. Then, the state where the door 6 holds the cover 4 is maintained. When the transfer box 2 approaches the opening 10 of the transfer chamber, The cover 4 of the transmission box 2 is tightly connected to the door 6, The cover 4 of the transfer box 2 is held by the vacuum suction through the holding portions 1 1 a and 1 lb. When the door 6 holds the cover 4, The door opening and closing cylinder 31 moves to retract the lever 37. then, The pivot 40 provided on the end of the door arm 42 is drawn closer to the support bottom 60 side, The door arm 4 2 follows the principle of leverage, The fulcrum 41 is rotated to pull the door 6 away from the microenvironment opening 10, The cover 4 is opened from the transfer box 2. After the cover 4 is opened, The upper end of the frame 5 enters the opening 10, The movable part 5 6 descends only slightly, Until the frame arms 1 2 a and 1 2 b become rotatable positions. After the descent is complete, Actually, the frame arm 12 starts its turning movement. That is, the rod 38 of the frame driving cylinder 35 is extended, While rotating the frame arms 12a and 12b, Until the frame 5 abuts on the periphery of the conveyance chamber opening 10 approximately. at this time, Gas supply nozzles 21a and 21b mounted on the upper side of the frame 5, And transmissive sensors 9a and 9b, It comes out from the opening 10 of the transfer chamber toward the outside 'and is inserted into the transfer box 2. At this point, The gas supply nozzles 21a and 21b are located in the arrangement shown in Fig. 2. and, With the gas supply 24-24 (21) (21) 200426971 Feed nozzles 9a and 9b juxtaposed to nozzles 2 1 a and 2 1 b, Is arranged so that the wafer 1 exists on a straight line connecting the channels and the like, It constitutes a detection space. In this state, at the same time as the movable portion 56 moves in the vertical direction, The high-cleanness gas is blown out to each wafer 1 to perform the operation of removing pollutants and the mapping operation of wafer 1. This is done in order. that is, The Y3 is opened by the rodless cylinder 33 and lowered to the position shown in FIG. 6. Transmissive sensors 9 a and 9 b, Together with the movable portion 56 and the opener 3, it is lowered vertically with respect to the surface of the wafer 1. Set each sensor to in advance, When wafer 1 exists on the section of the scaffold, The light from the transmissive sensor 9a is blocked ’On the other hand, When wafer 1 is missing on the shelf section, The light emitted from the transmissive sensor 9a is not blocked. When the transmissive sensor 9b is covered by the wafer 1, A non-transmitting signal, When the transmissive sensor 9b is not covered by the wafer 1, A transmission signal will be issued. therefore, When a non-transmitting signal is detected, It can be judged that wafer 1 exists, When the transmission signal is detected, it is judged that the wafer 1 is missing. In response to the transmitted signal, High cleanliness gas at a predetermined time, At a predetermined pressure, Blow out wafer 1 from gas supply nozzles 2 a and 2 1 b. Therefore, the operation of removing contaminated substances and the like from each wafer can be effectively performed. and, In that case, Although considering the efficiency of gas use, It is also possible to stop the blowing of high-purity gas in response to a non-transmissive signal. However, when the flow rate of the gas on the wafer to be operated is changed due to the difference between the wafers, It is also possible to change the gas blowing conditions. The sensor section of the sensor 8 is configured to The concave-convex portions 12 having notches provided at regular intervals on the sensing monitor 7 are pinched. Therefore, when 'movable part 5 6 is lowered, The sensor 8 also descends together, The uneven portion 12 of the sensing monitor 7 is detected. at this time, When the sensor 8 passes through the recess, The transmission sensor 8 is not shielded from light and transmits a transmission signal. When passing through the protrusion, The transmission sensor 8 is shielded from light and emits a non-transmission signal. thus, If the uneven portion 12 of the sensing monitor 7 is set in advance, When passing the transmissive sensors 9a and 9b through the sections of the scaffold in the transfer box 2, Corresponding to the point at which the transmissive sensor 8 passes through the recess, The transmitted and non-transmitted signals detected by the transmissive sensor 8, It becomes a signal which can display the segment of the scaffolding which the transmissive sensor 9 actually passed. This item is compared with the detection result of the transmission / non-transmission signal detected by the transmission sensor 9a being blocked by the wafer 1. If the transmissive sensor 9a is shielded when detecting the signal of the transmissive sensor 8 corresponding to the section of the scaffold, It can be determined that the wafer 1 exists on the section of the scaffold, on the other hand, If the transmissive sensor 9a was not blocked at that time, It can be judged that the wafer 1 is missing on the section of the scaffold. Based on these judgments, When changing the blowing timing or blowing conditions of high-purity gas, Removal of pollutants, etc. can be performed more effectively. This operation is repeated for all wafers 1, When the support stick reaches the mapping operation completion position of the opener 3, Removal and reflection of pollutants can be completed. Since then, When the rod 38 of the frame driving cylinder 35 is retracted again, Frame arms 12a and 12b rotate, The frame 5 moves from the conveyance chamber opening 10 and leaves. When lever 38 is most retracted, The movement of frame 5 is completed. then, The movable part 5 6 moves to the lowest point, Open cover 4 At the same time, a series of operations including the removal operation and the reflection operation of the substance -26- (23) (23) 200426971 are completed. This state is the state shown in FIG. As explained above, In this embodiment, Gas supply nozzles 2 1 a and 2 1b, The transmissive sensors 9a and 9b are fixed on the same frame 5. And, The frame arms 12a and 12b as means for rotating the frame 5 are provided with a frame driving cylinder. When these components are provided from the conveying chamber opening portion 10 on the movable portion 56 sufficiently separated, A device that does not require a gas supply nozzle and a spreading operation through a sensor is provided near the wafer 1. And, When the sensing monitor 7 and the transmissive sensor 8 are used, The synchronization signal corresponding to the section of the inner shelf of the transmission box 2 can be easily generated, So it is not necessary to use a drive motor on the drive, And simultaneously with the mapping operation of wafer 1, More efficient removal of contaminated materials can be performed. Therefore, when using the sensing monitor 7, An air-driven cylinder that cannot generate a signal can be used for the wafer 1 mapping operation. and, In this embodiment, Although the fulcrum of the door arm 42 and the fulcrum of the reflection frame 5 are common to the fulcrum 41, However, the same effect can be achieved by making the two separate fulcrum points. that is, When the first fulcrum set on the door arm 42 and the second fulcrum set on the reflection frame are different fulcrum points, The same effect can be achieved. Although the movable part 5 6, Fulcrum 4 1. The door opening and closing cylinder 3 1 and the imaging frame driving cylinder 35 are integrated, However, it is not necessary to be integrated in order to obtain the effects of the present invention. As long as these mechanisms are arranged downstream of the air flow to the transfer box 2, The same effect can be achieved. Also, in this embodiment, (24) (24) 200426971, which is based on the FOUP specifications, is used for the purpose for which the present invention is applied without major changes. Although the gas supply nozzle and the sensor for wafer mapping are juxtaposed and fixed on the support rod, However, the present invention is not limited to this. Specifically, It is also possible to fix the gas supply nozzle and the sensor on different frames. and, It is also possible to add a drive mechanism to the gas supply nozzle, The gas supply nozzle is moved or rotated parallel to the wafer surface. When the composition is made, Can reduce the number of nozzles, And the wafer surface can be uniformly eradicated. and, It is also considered that the adhesion state of pollutants and the like may change depending on the previous processing. In this situation, The number of gas supply nozzles can be appropriately increased or decreased depending on the adhesion condition and the gas usage state. and, In this embodiment, Although the removal operation of pollutants and the like is performed only once and the reflection operation, However, the present invention is not limited to this. The removal operation, Except when the robot in the transfer room approaches the wafer in the transfer box, It can also be done from time to time. thereby, It can also allow wafers to be processed within the processing device. This removal operation is repeatedly performed on the wafer held in the transfer box. and, In this embodiment, Although it is described in terms of FOUP, However, the application examples of the present invention are not limited to this system. As long as it has a container that can hold multiple objects, And a system for conveying an object to be held using the container and conveying the object to a conveying chamber in a processing device, The pollutant removal device (elimination device) of the present invention can be applied to 0 (Second Embodiment) (25) (25) 200426971 The second embodiment of the present invention is described below with reference to the drawings. 8A to 8C are schematic diagrams of the erasing device of the present invention, It is a wafer transfer box, The wafer wafer contained in the wafer transfer box and the eradication device of the present invention, The outline of the state as seen from the side of the canal and so on. Figure 8A is a diagram showing the start of the erasing operation, Figure 8B is a diagram showing the way of erasing operation. Fig. 8C is an enlarged view showing a key part in the erasing operation. and, Fig. 9A shows the structures shown in Figs. 8A to 8C and the accompanying structures. A schematic diagram of the state when viewed from above, Figure 9B cuts the key part of the eradication device horizontally. A schematic diagram showing the state of the cut surface viewed from above. and, It was included in the box, Shelves supporting wafers, Various structures such as a sealing member arranged between the cover and the transfer box, and, The door also comes with various structures, But, These constitutions are not directly related to the present invention, Therefore, detailed illustrations and explanations are omitted here. In the picture, A gas supply nozzle 2 1 ′ capable of releasing the cleaning gas in the direction indicated by the arrow in the figure is mounted on the upper part of the door 6 of the opener. A gas supply line (not shown) is connected to each of the gas supply nozzles 21, It can supply cleaning gas to the nozzle in response to an operation from the outside. As shown in Figure 9B, The gas supply nozzle 21 is formed by a substantially tubular member 22 extending in a direction parallel to the surface of the wafer 1, The tubular member 22 has an opening 2 2 a formed in a line shape formed parallel to the surface of the wafer 1. While The cleaning gas is introduced into the large member from a portion located at the approximate center of the tubular member 22 without facing the opening 22a. The gas supply nozzle -29- (26) (26) 200426971 2 1 is sequentially moved toward a direction in which the wafer 1 overlaps, A purge gas is supplied between the wafers. the result, Removal of contaminated substances on the surface of the wafer and inside the transfer box 2 using cleaning gas, And the so-called erasing operation. The gate 6 is driven in a direction parallel to the direction in which the wafer 1 overlaps. thereby, When the gate 6 is driven, when the cleaning gas is released from the gas supply nozzle 21, The wafers 1 inside the transfer box 2 can be sequentially processed. In this embodiment, The center of the tubular member 22 in the gas supply nozzle 21, It is separated from the open end surface of the transfer box 2 only by a predetermined interval L. The shape of the opening 22a, The cleaning gas released from the opening 22a, As shown in Figure 9B, it spreads horizontally. And as shown in Figures 8A to 8C, it spreads in the vertical direction. When the space L is provided between the tubular member 22 and the opening of the main body of the transfer box 2, The purging gas blows out across the surface of the crystal circle 1 in the horizontal direction. It becomes a structure which can remove pollutants, etc. and, The velocity of the gas released from the normal gas supply nozzle is the fastest near the nozzle opening. It descends rapidly as it leaves the opening. thereby, When supplying gas from a position close to the end of the wafer, A difference in flow velocity occurs upstream and downstream of the gas flow in the wafer surface. Therefore, there may be a big difference in the removal efficiency of pollutants, etc. 'or extreme cases. The turbulence caused by the fast gas flow impinging on the wafer end, There is a possibility that the removal efficiency of pollutants and the like may decrease, that is, With the setting of interval L, Can reduce these possibilities, At the same time, it is easy to form a roughly uniform flow on the wafer surface. Therefore, uniform and efficient removal of contaminated materials can be performed on the front and back surfaces of the wafer. and, In the vertical direction, When the cleaning gas is released from the horizontal direction at an angle of 3 toward -30- (27) (27) 200426971, You can make the new cleaning gas contact the surface of the wafer at an angle. As a result, pollutants and the like can be removed more efficiently. and, The intervals L and angles Θ, It is best to respond to the size of the wafer held in the transfer box 2, Interval of each, The shape of the transfer box 2 and the like 'are a way to more efficiently remove contaminants on the wafer 1 and discharge them from the inside of the transfer box 2, It is better to make proper adjustments. and, For the same reason, The width of the opening 22a, length, Opening angle or quantity, Increase or decrease depending on the embodiment, Alternatively, the orientation of the opening 22a may be changed. In the present invention, For each wafer, In addition, it can remove pollutants and other substances on the entire surface of the watch. Compared with the prior art, In a state of high cleanliness, The wafer can be held inside the transfer box. And, In the present invention, Gas flow required for removal of pollutants, etc. Erasing time, etc. Can be made for individual control of each wafer. thereby, This removal operation can often be performed under certain conditions at any time, Therefore, the management status of all wafers in the transfer box can be easily maintained constant. and, The gas or the like supplied from the gas supply nozzle 21 to the inside of the transfer box 2 may be discharged using a vent hole provided in the transfer box 2 in a conventional manner. and, The removal operation is performed in the open state, It may be performed using an exhaust system (not shown) provided in the transfer chamber. And, It is conceivable to make pollutants and the like removed from the wafer once Prevent it from reattaching to other wafers or transfer boxes, Alternatively, it is preferable to flow into the transfer chamber. In this situation, As disclosed in the aforementioned Japanese Patent Application Laid-Open No. 2003- 4 5 9 3 3 ’In order to effectively exhaust the cleaning gas used in the removal of pollutants, etc., It is also possible to set an exhaust chamber in the conveying room that communicates with the conveying box -31 · (28) (28) 200426971. As mentioned above, It is best to remove pollutants, etc. from the wafer once, It is better to ship quickly to the outside of the transfer box. therefore, With regard to more effective removal of pollutants, As disclosed in the aforementioned Japanese Patent Publication No. 1 2 2 1 422, It is also conceivable to add an interface for exhaust corresponding to each wafer. But yes The additional configuration requires a large specification change of the transfer box corresponding to the specification. thereby, For systems related to FOUPs in use today, When using the present invention, It is considered better not to provide such an exhaust port. and, Contaminants may be attached to the wafer in the form of dust. Such dust is often attached to the wafer by electrostatic attraction due to charging. For such dust, It ’s not just blowing high-cleanness gas onto the surface of the wafer, When blowing with ionized gas, Can be removed more efficiently. thereby, The gas supply nozzle or its vicinity, A so-called ionizer can be added to ionize gas, etc. Therefore, it becomes a structure which can supply an ionized gas according to a need. (An embodiment to which this embodiment is applied) Next, The case where the erasing device of the present invention is applied to a FOUP-related system currently in use will be described with reference to the drawings. and, A semiconductor wafer processing apparatus and a transfer box applicable to the present invention, The general structure is roughly the same as that described in the prior art. Therefore, the description of the same structure is omitted. and, The aforementioned gas supply nozzle 21 may be supported and driven by a separate member from the aforementioned door 6. but, When the gas supply nozzle or the like of the present invention is arranged on the upper part of the door 6, This makes the invention easier to implement. With regard to the general configuration of the wafer processing apparatus 50, As shown in Figure 15 (29) (29) 200426971 prior art, The transfer chamber 52 is provided with a transfer chamber opening 10 that is larger than the cover 4 of the transfer cassette 2 on the wafer loader 51 side. Is on the side of the opening 10 of the conveying chamber inside the conveying chamber 52, An opener 3 for opening and closing the cover 4 of the transfer box 2 is provided. Here, An opener suitable for the present invention will be described with reference to FIGS. 10A and 10B. Figure 10A shows the wafer loader 51 in Figure 1, Transfer box 2, The opener 3 and cover 4 are reduced, The whole picture of the display device, Fig. 10B is a view of the structure shown in Fig. 10A as viewed from the inside of the transfer chamber 52. The opener 3 includes a door 6 and a frame 5. The door 6 is a plate-shaped body having a size capable of plugging the opening 10 of the transfer chamber. The surface is provided with holding portions 1 a and 1 lb as vacuum suction holes. When the door 6 blocks the transport chamber opening 10, The surface on the side of the transfer box 2 is made flat and can be in close contact with the cover 4. The door 6 is provided with a fixing member 46 having a hole. A pivot shaft 45 provided at the upper end of the door arm 42 is rotatably penetrated through the hole to be fixed. A hole is formed in the lower end of the door arm 42. The pivot 40 penetrates the hole, And a hole at the front end of a lever 37 which is a part of an air-driven door opening / closing cylinder 31 serving as a door opening / closing drive device. thus, The door arm 42 is combined with the cylinder 31, It is rotatably supported by the cylinder 31. The frame 5 is formed by 10 along the opening of the transfer chamber, And it is arrange | positioned as the structure formed by the frame member which surrounds the door 6. The frame 5 is attached to the upper ends of the frame arm 12a and the frame arm 12b of the frame member extended long below. Holes (not shown) are formed in the lower ends of the frame arms 12a and 12b. The pivot 44 penetrates the hole, And a hole at the front end of the rod 38 which is a part of the air-driven frame driving cylinder 35 as a frame driving device. thus, These frame arms are combined with the cylinder 35, The frame arm is rotatably supported by the air cylinder 35. (30) (30) 200426971 Support frame arms 12a and 12b to support load evenly, And symmetrical along the center axis of frame 5, It extends in a vertical direction in parallel. Between the upper and lower ends of the support frame arms 12a and 12b, respectively, Mounted with rods 4 7 perpendicular to the support frame arms 1 2 a and 1 2 b, respectively. Above the supporting member 60, a fixing member 39 is provided as a fulcrum supporting portion in a shape protruding vertically from the supporting member 60. A bearing (not shown) is arranged in the through hole of the fixing member 39, The outer ring 11 of the bearing is fixed to the inner wall of the through hole, The inner ring of the bearing is pivotally supported on the rod 47. therefore, The rod 47 constitutes a fulcrum 41 in a state where it is enclosed in the through hole of the fixing member 39. The fulcrum 41 is a fulcrum for the frame arms 12a and 12b, It is in common with the fulcrum of the door arm and doubles as a fulcrum on the same axis. which is, Another through hole is provided between the upper end and the lower end of the door arm 42. The rod 47 passes through the through hole to constitute a fulcrum 47. Due to the driving of the cylinder 31, the rod 37 is expanded and contracted, Therefore, the door arm 42 is rotated about the fulcrum 41 as a center. The fulcrum 41 of the door arm 42 is fixed to a support member 60 provided on a movable portion 56 that can be raised and lowered. The door 6 has a holding interface 1 la and 1 lb, Instead, the cover 4 of the transfer box 2 can be held by vacuum suction. When the door arm 42 pushes the door 6 to the conveying chamber opening 10 (hereinafter referred to as a standby state), Is roughly oriented vertically, The door 6 moves in a direction away from the wall surface of the output chamber 52 by the rotation of the door arm 42. According to the expansion and contraction of the rod 38 formed by the driving of the frame driving cylinder 35, The frame arms 12 a and 12 b can be rotated around the fulcrum 41. which is, The frame arms 12a and 12b are also fixed to a support member 60 provided on a movable portion 56 that can be raised and lowered. When the frame 5 is in the standby state, It is arranged so as to be inclined away from the wall surface of the transfer chamber 52. on the other hand, The frame 5 goes from the standby state (31) (31) 200426971 to the direction of abutting against the wall surface of the conveying chamber 52, When the frame arms 12a and 12b are rotated, The frame 5 abuts substantially on the wall surface of the transfer chamber 52. On the frame member arranged on the upper part of the frame 5, The support bars 1 3 a and 1 3 b are fixed so as to protrude toward the wall surface side of the transfer chamber 52. The transmissive sensors 9a and 9b, which are the first transmissive sensors, are mounted on the respective front ends of the rod-shaped bodies 13a and 13b in pairs with each other. On the wafer processing apparatus 50, A movable portion 5 6 for raising and lowering the opener 3 is provided. Figure 1 1A is a view of the movable part 5 6 of the opener 3 as viewed from the wafer loader 51 side. FIG. 11B is a view showing an arrow X in FIG. 11A. The movable portion 56 includes an air-driven rodless cylinder 33 for raising and lowering in a vertical direction and a support member 60. So as to be downstream of the air flow from the transfer box 2, Instead, it is arranged further below than the lower surface of the transport box 2. The movable part 5 6 is provided on the wafer loader 5 1 side. It is through a long hole 57 provided in the partition plate 55, The door arm 42 and the frame arms 12 a and 12 b support the opener 3 on the side of the transfer chamber 52. The long hole 57 is provided in the moving direction of the movable portion 56, That is, in the case of this embodiment, the vertical direction is taken as the direction of its long side. and, A way of making the long hole 57 without reducing the cleanliness in the output chamber 52, The wafer loader 51 and the transfer chamber 52 are separated by a cover 58. also, A limiter 59 for preventing exceeding the limit when the opener 3 is lowered is provided below the partition plate 55. The rodless cylinder 33, the guide 61a, and the guide 61b are provided on the partition plate 55 along the long hole 57. The movable portion 5 6 is moved up and down along the guide 6 1 a and the guide 61 b by a rodless cylinder 3 3. A sensor monitor 7 is provided along the rodless cylinder 3 3 in the lateral direction of the movable portion 56. -35- (32) (32) 200426971 The sensing monitor 7 is a plate-like body extending in the direction of the rodless cylinder 33. Index means are arranged at regular intervals in the long side direction. In this embodiment, The notched uneven portions 12 arranged at regular intervals are used as the index means. The number of the concave-convex portions corresponds to the number of stages of the wafer arrangement shelf in the transfer box. And when the uneven portion is close to any of the scaffolds of the movable portion, Must be configured to correspond to a gap. In the movable portion 56 of the sensing monitor 7, A transmissive sensor 8 as a second transmissive sensor is fixed to the horizontal partition plate 55. The sensor section of the sensor 8 is configured to The concavo-convex portion 12 having cutouts provided at regular intervals on the sensing monitor 7 is held, so that the concavo-convex portion 12 of the sensing monitor 7 can be detected in response to movement of the movable portion 56. On the supporting member 60 of the movable portion 56, A third transmission sensor 62 is provided, on the other hand, On the partition plate 5 5 near the lower side of the long hole 5 7, A limiter 64 is provided. In the institution, When the protrusion blocks the limiter 64, A stop signal is sent to the movable section 56 to stop the entire operation of the opener 3. Secondly, Based on these constitutions, How does the removal operation and mapping operation of the contaminated material on the wafer 1 proceed, Figure 10A will be used, 10B to 14 are described. and, Figure 10 A shows the standby state, Fig. 12 shows a state where the cover 4 is opened and closed and the frame 5 is operated. Figure 13 shows the completion of the removal operation and reflection operation of the pollutants on the wafer 1. Figure 14 shows that after the operation on wafer 1 is completed, The frame 5 returns to the standby state. and, Figures 11A and 11B are a front view and a side view, respectively, of a sensing monitor and related components provided to detect the driving position of the frame 5. -36- (33) (33) 200426971 On the scaffold in the transfer box 2 after the previous processing project is completed, Contains wafers 1 that meet pre-processing specifications, on the other hand, Wafers that failed to meet specifications were excluded from the pre-processing stage. The grid section of the shelf in the transfer box 2 is a section in which the wafer 1 exists and a section in which the wafer 1 does not exist are mixed together. Transport box 2 in this state, As shown in Figure 10A, Is placed on the table 53 of the transfer chamber 52, On the other hand, it moves so that it may approach the opening part 10 of a conveyance chamber. In this state, The opener 3 is in a standby state. that is, The door opening and closing cylinders 3 1 and 3 3 are in the most extended state. This is a state in which the door arm 42 presses the door 6 against the fulcrum 41 as a center and pushes the door 6 to the conveying chamber opening 10 to block it. In this embodiment, In this state, The door arm 42 stands in a vertical direction. on the other hand, The rod 38 of the frame driving cylinder 35 is in the most retracted state, The frame arms 12a and 12b are actuated to pull the frame 5 away from the transfer chamber 52 with the fulcrum 41 as the center. that is, In this embodiment, The frame arms 12a and 12b are inclined to the door arm 42 at an angle. FIG. 12 shows that the transfer box 2 approaches the opening 10 of the transfer chamber, Then, the state where the door 6 holds the cover 4 is maintained. When the transfer box 2 approaches the opening 10 of the transfer chamber, the cover 4 of the transfer box 2 is tightly connected to the door 6, The cover 4 of the transfer box 2 is held by the vacuum suction through the holding portions 11a and 1lb. When the door 6 holds the cover 4, The door opening and closing cylinder 31 moves to retract the lever 37. then, The pivot 40 provided on the end of the door arm 42 is pulled closer to the support bottom 60 side, The door arm 42 follows the principle of leverage, Rotating at the fulcrum 41, the door 6 is pulled away from the conveying chamber opening 10, and the cover 4 is opened from the conveying box 2. After the cover 4 is opened, The position where the upper end of the frame 5 enters the opening portion 10 '(34) (34) 200426971 The movable portion 56 is lowered only slightly, Until the frame arms 12a and 2b become rotatable positions. After the descent is complete, Actually, the frame arm 12 starts its turning movement. that is, The rod 3 8 of the frame driving cylinder 3 5 is extended, Then, the frame arms 12a and 12b are rotated 'until the frame 5 abuts approximately around the opening portion 10 of the transfer chamber. at this time, Transmissive sensors 9a and 9b mounted on the upper side of the frame 5, It comes out from the opening 10 of the transfer chamber, Instead, it is inserted into the transfer box 2. At this point, The gas supply nozzle 21 is located in the arrangement shown in Fig. 8A. and, First transmission sensors 9a and 9b, Is arranged such that wafer 1 exists on a straight line connecting channels and the like, And constitute a detection space. In this state, At the same time as the movable portion 56 moves in the vertical direction, The high-cleanness gas is blown out to each wafer 1 to perform the operation of removing pollutants and the mapping operation of wafer 1. They are implemented sequentially. that is, The opener 3 is lowered to the position shown in Fig. 13 by the action of the rodless cylinder 33. Transmissive sensors 9a and 9b, It is lowered vertically with the opener 3 with respect to the surface of the wafer 1. Set each sensor in advance, When wafer 1 is on the shelf section, The light emitted from the transmissive sensor 9a is blocked, on the other hand, When wafer 1 is missing on the shelf section, The light from the transmission sensor 9a is not blocked. When the transmissive sensor 9b is covered by the wafer 1, A non-transmitting signal, When the transmissive sensor 9b is not covered by the wafer 1, A transmission signal will be issued. therefore, When a non-transmitting signal is detected, 'the wafer 1 can be determined to exist', and when a transmissive signal is detected, the wafer 1 is determined to be absent. In response to this transmitted signal, High cleanliness gas at a predetermined time, The wafer 1 is blown out from the gas supply nozzles 2 1 a and 2 1 b at a predetermined pressure. Therefore, it is possible to effectively carry out the removal operation of the contaminated substances and the like of each crystal -38- (35) (35) 200426971. and, In this case, 'though considering the use efficiency of the gas, It can also stop the blowing of high-quality clean gas in response to the non-transmitting signal. However, when the gas flow rate on the wafer to be operated is changed due to the difference between wafers, The gas blowing conditions can also be changed. The sensor section of the sensor 8 is configured to The concave-convex portions 12 having notches provided at regular intervals on the sensing monitor 7 are pinched. Therefore, when 'movable part 56 is lowered, The perforated sensor 8 is also lowered together 'to detect the uneven portion 12 of the sensing monitor 7. at this time, When the sensor 8 passes through the recess, When the transmission sensor 8 transmits the transmission signal ’through the convex portion without being blocked by light, The transmission sensor 8 is shielded from light and emits a non-transmission signal. Therefore, if the uneven portions 12 of the sensing monitor 7 are set in advance, When the time points at which the transmissive sensors 9a and 9b pass through the sections of the shelf in the transfer box 2 are corresponded to the time points at which the transmissive sensor 8 passes through the recess, The transmitted and non-transmitted signals detected by the transmissive sensor 8, It becomes a signal which can display the segment of the scaffolding which the transmissive sensor 9 actually passed. This item is compared with the detection result of the transmission / non-transmission signal detected by the transmission sensor 9a being blocked by the wafer 1. When the signal of the transmissive sensor 8 corresponding to the section of the scaffold is detected, If the transmissive sensor 9 a is blocked, It can be judged that the wafer exists on the section of the shelf. On the other hand, if the transmissive sensor 9a is not blocked, It can be determined that the wafer 1 is missing on the section of the shelf. Based on these judgments ', when the timing of blowing out the high-purity gas or when the blowing conditions are changed', it is possible to perform the removal operation of the pollutants and the like more effectively. This operation is performed repeatedly for all wafers 1 '. The support rod is reached to the position where the mapping operation of the opener 3 is completed. • 39 · (36) (36) 200426971 Removal and reflection of pollutants can be completed. Since then, When the rod 38 of the frame driving cylinder 35 is retracted again, The frame arms 12a and 12b can be rotated, The frame 5 is moved away from the conveyance chamber opening 10. When lever 38 is most retracted, The movement of frame 5 is completed. then, The movable part 56 moves to the lowest point, Open cover 4 At the same time, a series of operations such as a removal operation and a reflection operation of the contaminants on the wafer 1 are completed. This state is the state shown in Fig. 14. As explained above, In this embodiment, The gas supply nozzle 21 is fixed to the door 6 while moving in a direction parallel to the direction in which the wafer branches overlap. thereby, It is possible to supply purge gas under the same conditions at any time. and, When the sensing monitor 7 and the transmissive sensor 8 are used, The synchronization signal corresponding to the section of the inner shelf of the transfer box 2 can be easily generated, So it is not necessary to use a drive motor on the drive, And simultaneously with the mapping operation of wafer 1, More efficient removal of contaminated substances can be performed. and, In this embodiment, Although the fulcrum of the door arm 42 and the fulcrum of the reflection frame 5 are common to the fulcrum 41, However, the same effect can be achieved by making the two separate fulcrum points. that is, When the first fulcrum set on the door arm 42 and the second fulcrum set on the reflection frame are different fulcrum points, The same effect can be achieved. Although the movable part 5 6, Fulcrum 4 1. The door opening and closing cylinder 31 and the imaging frame driving cylinder 35 are integrated, However, it is not necessary to be integrated in order to obtain the effects of the present invention. As long as these mechanisms are arranged downstream of the air flow to the transfer box 2, Can achieve the same effect -40- (37) (37) 200426971 and In this embodiment, For the purpose applicable to the present invention, the composition based on the FOUP specifications is not changed significantly. Although the gas supply nozzle is fixed on the upper part of the door, However, the present invention is not limited to this. Specifically, You can also use doors to form different frames. The gas supply nozzle is then fixed to the frame. and, It is also possible to attach a drive mechanism to the gas supply nozzle, On the other hand, the gas supply nozzle is rotatable about an axis parallel to the wafer surface. and, It is also considered that the state of attachment of polluting substances and the like may vary depending on the previous treatment. In this situation, The width of the opening in the gas supply nozzle, length, Opening angle or quantity. In this situation, The increase in the number refers to both an increase in the number of openings in the horizontal direction and an increase in the number of openings in the vertical direction. and, In this embodiment, Although the removal operation of pollutants and the like is performed only once and the reflection operation, However, the present invention is not limited to this. The removal operation, Except when the robot in the transfer room approaches the wafer in the transfer box, It can also be done from time to time. thereby, It can also allow wafers to be processed within the processing device. This removal operation is repeatedly performed on the wafer held in the transfer box. and, In this embodiment, Although it is described in terms of FOUP, However, the application examples of the present invention are not limited to this system. As long as it has a container that can hold multiple objects, And a system for conveying an object to be held using the container and conveying the object to a conveying chamber in a processing device, The removal device (elimination device) for pollutants and the like of the present invention can be applied from 0 to 41-(38) (38) 200426971 [Simplified Illustration] Figure 1 shows the removal device according to the first embodiment of the present invention. , Crystal round transfer box, Part of the lid and opener for the wafer transfer box, A schematic diagram of the structure when viewed from the side. Fig. 2 is a diagram showing a structure of an erasing device and a peripheral device according to a first embodiment of the present invention. The outline of the state of the state viewed from above. Figure 3 A shows the opener shown in Figure 1 and its vicinity reduced. And the outline structure of the state when viewed from the side. Figure 3B shows the structure shown in Figure 3A. A schematic diagram of the structure when viewed from the side of the transfer room. Fig. 4A shows the movable part of the opener in the embodiment related to the above embodiment, This movable portion is a front view when viewed from the wafer loader side. Figure 4B shows the structure shown in Figure 3A. View from the side 〇 Figure 5 shows the sequence of the wafer opener, A schematic diagram of the state when viewed from the side, It is a diagram showing the state when the preparation for the mapping is completed. Fig. 6 is an opener showing the order in which wafers are mapped, A schematic diagram of the state when viewed from the side, It is a diagram showing the state when the action of mapping is completed. Fig. 7 is an opener showing the order of mapping of wafers, A schematic diagram of the state when viewed from the side, It is a diagram showing the state when the opening operation of the reflection and cover is fully completed. -42- (39) (39) 200426971 Figure 8A shows an erasing device according to a second embodiment of the present invention, Wafer transfer box, Part of the lid and opener for the wafer transfer box, A schematic diagram of the structure when viewed from such a side. Fig. 8B shows an erasing device according to a second embodiment of the present invention, Wafer transfer box, Part of the lid and opener for the wafer transfer box, A schematic diagram of the structure when viewed from such a side. FIG. 8C is a diagram showing a key part of an erasing device according to a second embodiment of the present invention. This is a schematic diagram of the structure when viewed from the side. Fig. 9A shows an erasing device according to a second embodiment of the present invention. And a schematic configuration diagram of the components arranged in the surroundings when viewed from above. FIG. 9B is a view of a key part of an erasing device according to a second embodiment of the present invention. Cut it horizontally, A schematic structural view showing a state where the cut surface is viewed from above. Fig. 10A shows the structure of the opener shown in Figs. 8A to C and its vicinity reduced. A schematic diagram showing the state viewed from the side. Fig. 10B is a schematic configuration diagram showing the configuration shown in Fig. 10A as viewed from the conveying chamber side. Fig. 11A shows a movable part of the opener in the embodiment related to the above embodiment, This movable portion is a front view when viewed from the wafer loader side. Figure 1 1 B is a view showing the structure shown in Figure 1 1 A as viewed from the side. ○ Figure 12 is an opener showing the order of reflection of the wafer. A schematic diagram of the state when viewed from the side, It shows the state when the preparation of the mapping is completed -43- (40) (40) 200426971. Fig. 13 is an opener showing the sequence of wafer mapping, A schematic diagram of the state when viewed from the side, It is a diagram showing the state when the action of mapping is completed. Fig. 14 is an opener showing the order of mapping of wafers, A schematic diagram of the state when viewed from the side, It is a diagram showing the state when the opening operation of the reflection and cover is fully completed. Fig. 15 is an overall side view showing a schematic configuration of a general semiconductor wafer processing apparatus to which the present invention and the prior art are applied. FIG. 16A is an enlargement of the structure of the prior art opener and its vicinity in the device shown in FIG. 15, A schematic diagram showing the state viewed from the side is shown. Fig. 16B is a schematic constitutional view showing a configuration not shown in Fig. 16A as viewed from the conveying chamber side. Fig. 17 shows an opener and the like showing a wafer erasing operation. A schematic diagram of the state when viewed from the side, It is a diagram that does not remove the state when preparation is completed. [Explanation of drawing number] 1 wafer 2 transfer box 3 opener 4 cover 5 frame -44- (41) 200426971 6 door 10 transfer room opening section 13a, 1 3 b rod-shaped body 2 1a, 2 1 b gas supply nozzle 50 crystal circle processing device 5 1 crystal loader 52 delivery chamber 11a, lib holding part 46 fixed structure 42 door arm 40 '44, 4 5 Pivot 3 1. 35 Cylinder 37, 38 par 12a, 12b frame arm 60 support member 47 lever 39 fixed member 4 1 fulcrum 56 movable portion 9a, 9b penetrating sensor 33 Μ j i \\ rod-type cylinder 55 partition plate 57 long hole 58 cover
-45- (42)200426971 59 限制器 61a、 61b 導件 7 感測監視器 12 凹凸部 8 透過感測器 12 凹凸部 62 第3透過感測器 64 限制器 53 台 22 管狀構件 22a 開口 -46--45- (42) 200426971 59 Limiter 61a, 61b Guide 7 Sensing monitor 12 Concave and convex portion 8 Transmissive sensor 12 Concave and convex portion 62 Third transmitting sensor 64 Limiter 53 Table 22 Tubular member 22a Opening -46 -