KR100765850B1 - FOUP opener for charge nitrogen gas of semicuctor manufacturing apparatus - Google Patents

FOUP opener for charge nitrogen gas of semicuctor manufacturing apparatus Download PDF

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KR100765850B1
KR100765850B1 KR1020060034866A KR20060034866A KR100765850B1 KR 100765850 B1 KR100765850 B1 KR 100765850B1 KR 1020060034866 A KR1020060034866 A KR 1020060034866A KR 20060034866 A KR20060034866 A KR 20060034866A KR 100765850 B1 KR100765850 B1 KR 100765850B1
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South Korea
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hoop
gas
opener
door
manufacturing apparatus
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KR1020060034866A
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Korean (ko)
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KR20070103134A (en
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이광준
성노영
김용표
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뉴영엠테크 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Abstract

개시된 내용은 반도체 제조장치의 N2가스충전용 후프오프너에 관한 것이다.The present disclosure relates to a hoop opener for N 2 gas filling of a semiconductor manufacturing apparatus.

이 장치는,This device,

오프너 프레임(100); 및 후프(300)의 후프도어(310)개방 순간 후프내부로 N2가스를 분출시켜 후프내 웨이퍼가 산소에 의하여 산회되는 것을 방지하기 위하여 상기 오프너 프레임에 후프도어 개방 순간 후프내부로 N2가스를 분사하도록 N2가스공급라인(210)로 부터 N2가스가 공급되는 다수의 분사노즐(220)을 그 내측연부를 따라 수직방향 다수 설치하고, 오프너프레임(100) 바닥측에는 회수라인(230)을 구성한 N2가스순환장치(200)를 포함하며, N2가스배기장치(200)는 상기 오프너 프레임(100)의 외측에서 N2가스공급라인(210)을 설치하고, 상기 분사노즐(220)들은 상기 오프너프레임(100)의 제1보조도어(110)로서 개방되는 개구연부(102)에 양측에 수직방향으로 다수 설치함과 아울러 오프너 프레임(100)의 바닥측에 회수라인(230)을 형성하여서 된다.Opener frame 100; And a hoop 300 of the FOUP door 310, the N 2 gas opening moment ejecting the N 2 gas to the hoop inner hoop in the wafer in the FOUP internal door opening moment hoop to the opener frame to prevent the oxidizer by oxygen A plurality of injection nozzles 220 supplied with N 2 gas from the N 2 gas supply line 210 to be sprayed are installed along the inner edge thereof in a vertical direction, and a recovery line 230 is provided at the bottom of the opener frame 100. The N 2 gas circulation device 200 is configured, and the N 2 gas exhaust device 200 installs the N 2 gas supply line 210 on the outside of the opener frame 100, and the injection nozzles 220 By installing a plurality of openings in the vertical direction on both sides in the opening edge portion 102 that is opened as the first auxiliary door 110 of the opener frame 100, and by forming a recovery line 230 on the bottom side of the opener frame 100 do.

후프,오프너,Hoop,

Description

반도체 제조장치의 질소가스충전용 후프오프너{FOUP opener for charge nitrogen gas of semicuctor manufacturing apparatus}FOUP opener for charge nitrogen gas of semicuctor manufacturing apparatus

도 1은 본 발명 반도체 제조방치의 후프오프너의 발췌 후면 사시도이고,1 is an excerpted rear perspective view of a hoop opener of a semiconductor manufacturing device according to the present invention;

도 2는 본 발명 반도체 제조장치의 후프오프너의 종단면도이고,2 is a longitudinal sectional view of the hoop opener of the semiconductor manufacturing apparatus of the present invention,

도 3은 본 발명 반도체 제조장치의 후프오프너의 횡단면도이고,3 is a cross-sectional view of the hoop opener of the semiconductor manufacturing apparatus of the present invention,

도 4는 본 발명 반도체 제조장치의 후프오프너의 요부 확대단면도이고,4 is an enlarged cross-sectional view of main parts of the hoop opener of the semiconductor manufacturing apparatus according to the present invention;

도 5a, 5b는 본 발명 반도체 제조장치의 후프오프너 작용단면도이다.5A and 5B are cross-sectional views of hoop openers in the semiconductor manufacturing apparatus of the present invention.

※ 도면의 주요 부분에 대한 부호의 설명※ Explanation of codes for main parts of drawing

100: 오프너 프레임(Opener frame), 102:개구연부, 110:제1보조도어, 100: opener frame, 102: opening edge, 110: first auxiliary door,

120:제2보조도어, 130:메인도어(Main door),120: second auxiliary door, 130: main door (main door),

131:트랜스퍼실린더(transfer cylinder), 132;엘엠가이드(LM guide), 131: transfer cylinder, 132; LM guide,

140:후프도어(FOUP door)개폐수단, 150:후프도어 흡착수단, 140: FOUP door opening and closing means, 150: hoop door adsorption means,

200:N2가스배기장치, 210:N2가스공급라인,220:분사노즐, 230:회수라인, 200: N2 gas exhaust unit, 210: N 2 gas supply line, 220: Injection nozzle, 230: recovery line,

300:후프, 310:후프도어(FOUP door), 300: hoop, 310: FOUP door,

본 발명은 반도체 제조장치의 N2충전(Charge)용 후프오프너(F.O.U.P Opener, 이하 후프오프너라함)에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a hoop opener for N 2 charge in a semiconductor manufacturing apparatus.

종래로 부터 반도체 제조장치에서는 단계마다 O2에 의한 산화방지를 위하여 N2가스 분위기를 유지하며, 여러가지 N2가스 충전시스템(로드락챔버)이 적용되고 있다.Conventionally, in the semiconductor manufacturing apparatus, in order to prevent oxidation by O 2 at each step, the N 2 gas atmosphere is maintained, and various N 2 gas filling systems (load lock chambers) have been applied.

예를 들면 종래 알려진 장치중 특히, 공개 특허 제10-2005-0015016으로 공개된 고온 공정용 반도체 제조장치의 경우를 살펴 보면 다음과 같은 문제점이 있다.For example, in the case of a semiconductor manufacturing apparatus for a high temperature process disclosed in the related art, in particular, Patent Publication No. 10-2005-0015016 has the following problems.

이 장치는 반도체 웨이퍼를 공정처리하기 위한 공정 공간을 제공하는 반응튜브와, 반응튜브 내에 수용되며 반도체 웨이퍼를 로딩할 수 있는 보트를 가진 적어도 두 개의 독립된 반응 리액터부와, 반응 리액터부와 인접하여 배치되고 반응 리액터부들과 각각 독립적으로 대응하여 반도체 웨이퍼를 보트에 독립적으로 로딩 및 언로딩하는 웨이퍼 로딩용 로봇을 가진 복수의 독립된 트랜스퍼 챔버들과, 트랜스퍼 챔버들과 연접하여 외부로부터 반도체 웨이퍼가 수용된 카세트를 로딩/언로딩할 수 있도록 마련된 개별의 웨이퍼 로딩용 챔버와, 웨이퍼 로딩용 챔버와 트랜스퍼 챔버들 사이에 배치되어 웨이퍼 로딩용 챔버에 로딩된 카세트를 트랜스퍼 챔버로 이동시킬 수 있는 카세트 이동용 로봇을 가진 카세트 이동부를 포함한다. The apparatus comprises a reaction tube providing a process space for processing a semiconductor wafer, at least two independent reaction reactor portions housed within the reaction tube and capable of loading the semiconductor wafer, and disposed adjacent to the reaction reactor portion. And a plurality of independent transfer chambers having a wafer loading robot that independently loads and unloads a semiconductor wafer into a boat in correspondence with the reaction reactor portions, respectively, and a cassette in which the semiconductor wafer is housed from the outside in contact with the transfer chambers. A cassette having a separate wafer loading chamber arranged for loading / unloading and a cassette moving robot arranged between the wafer loading chamber and the transfer chambers to move the cassette loaded in the wafer loading chamber to the transfer chamber It includes a moving unit.

이러한 고온 공정용 반도체 제조장치는 복수의 개별적인 반응리액터부와 이들 반응리액터부에 각각 독립적으로 대응하여 작동하도록 별도의 트랜스퍼 챔버를 마련함으로써 반도체 웨이퍼를 보트에 로딩하는 독립적인 공정이 가능해지도록 한 것이다.The semiconductor manufacturing apparatus for a high temperature process provides a plurality of individual reaction reactor parts and separate transfer chambers so as to operate independently corresponding to each of the reaction reactor parts, thereby enabling an independent process of loading a semiconductor wafer into a boat.

그러나 이와 같은 종래 고온 공정용 반도체 제조장치는 반응리액터부와 트랜스퍼챔버 및 카세트공급부의 구조마다 웨이퍼가 O2에 의하여 산화되는 것을 방지하는 로드락 챔버를 구성한다.However, such a conventional high temperature semiconductor manufacturing apparatus comprises a load lock chamber which prevents the wafer from being oxidized by O 2 for each of the reaction reactor portion, the transfer chamber, and the cassette supply portion.

로드락(Loadlock, N2가스분위기)에서 웨이퍼를 공급하기 위해서는 후프오프너에 N2가스를 충전시켜 후프오프너의 개구부를 여는 데 종래는 후프오프너의 N2가스 충전시간이 길어 공정타임을 증가시키는 단점이 있었고, 별도의 N2가스 충전용 버퍼를 설비함으로써 공간 및 비용 증가의 단점도 있었다. In order to supply wafers in a loadlock (N 2 gas atmosphere), the hoop opener is filled with N 2 gas to open the opening of the hoop opener. However, the conventional N 2 gas filling time of the hoop opener increases the process time. There was also a disadvantage of increased space and cost by installing a separate N 2 gas filling buffer.

또한, 상기 예시한 종래 로드락 시스템은 파티클방지용 세정가스가 단지 공간위에서 아래로 송풍하는 정도이므로 반응튜브 하부의 셔터부분, 후프오프너에서의 도어개폐시마다 발생하는 파티클에 대한 방지수단이 강구되지 않아 웨이퍼 불량의 원인이 되어 왔다.In addition, in the conventional load lock system as exemplified above, since the cleaning gas for preventing particles only blows down from the space, a means for preventing particles generated every time the door is opened and closed at the shutter portion of the reaction tube and the hoop opener is not found. It has been a cause of failure.

특히, 반응리액터부와 트랜스퍼챔버사이에서 웨이퍼를 공급하기 위하여 후프내의 웨이퍼를 오프너장치를 통하여 반응리액터부로 웨이퍼를 공급하는 경우 후프내에서 웨이퍼를 꺼내어 이송하는 순간 후프내부는 물론 N2가스분위기가 양측 챔버사이에 이루어지지 않아 웨이퍼 불량의 원인이 되어 왔고, 공정시간도 증가하였다.In particular, when a wafer is supplied to the reaction reactor portion through the opener device to supply the wafer between the reaction reactor portion and the transfer chamber, the N 2 gas atmosphere inside the hoop as well as both sides of the wafer is taken out at the moment when the wafer is removed from the hoop. It has not been made between chambers, causing wafer defects, and increased process time.

따라서 본 발명은 종래 이러한 반응 리액터부에의 웨이퍼 공급시 반응리액터부와 같은 N2가스 분위기로 후프내부를 맞추어지도록 하는 후프오프너를 제공하는 데에 그 목적이 있다.Accordingly, an object of the present invention is to provide a hoop opener which is adapted to align the inside of a hoop with an N 2 gas atmosphere such as a reaction reactor portion when supplying a wafer to such a reaction reactor portion.

상기한 목적을 달성하기 위한 본 발명 반도체 제조장치의 후프오프너는, The hoop opener of the semiconductor manufacturing apparatus of the present invention for achieving the above object,

오프너 프레임; 및 후프의 후프도어개방 순간 후프내부로 N2가스를 분출시켜 후프내를 N2가스로 충전하기 위하여 상기 오프너 프레임에 후프도어 개방 순간 후프내부로 N2가스를 분사하도록 N2가스공급라인로 부터 N2가스가 공급되는 다수의 분사노즐을 그 내측연부를 따라 수직방향 다수 설치하고, 오프너 프레임 바닥측에는 회수라인을 구성한 N2가스배기장치를 포함하여서 된다.Opener frame; And a hoop of the hoop door opening moment hoop ejecting the N 2 gas as a hoop inside from N 2 gas supply line so as to inject the N 2 gas into the FOUP door opening moment hoop to the opener frame to charge in a N 2 gas A plurality of injection nozzles supplied with N 2 gas may be provided in the vertical direction along the inner edge thereof, and the N 2 gas exhaust device including a recovery line may be included at the bottom of the opener frame.

상기 목적을 달성하기 위한 본 발명 반도체 제조장치의 후프오프너의 N2가스배기장치는 상기 오프너 프레임의 외측에서 N2가스공급라인을 설치하고, 상기 분사노즐들은 상기 오프너프레임의 제1보조도어로서 개방되는 개구연부에 양측에 수직방향으로 다수 설치함과 아울러 오프너 프레임의 바닥측에 회수라인을 형성함이 바람직하다.The N 2 gas exhaust device of the hoop opener of the semiconductor manufacturing apparatus of the present invention for achieving the above object is provided with an N 2 gas supply line on the outside of the opener frame, the injection nozzles are opened as the first auxiliary door of the opener frame. It is preferable to provide a plurality of recovery lines at the bottom side of the opener frame, as well as to install a plurality of opening edges in the vertical direction.

상기 목적을 달성하기 위한 본 발명 반도체 제조장치의 후프오프너의 상기 오프너 프레임에는 개구연부를 후방에서 개폐하는 메인도어를 설치하되 그 상,하방으로 엘엠가이드로서 좌,우 이송가능하게 함과 아울러 트랜스퍼 실린더로서 이동되게 하며, 이 메인도어내측에는 제2보조도어가 전,후진 가능하도록 그 상,하단에 가이드부재와 함께 전,후진실린더를 설치하여 소정거리(β)후진가능하게 하고, 다시 이 제2보조도어 내측에는 제1보조도어를 설치하되 전,후진실린더로서 소정거리(α)후진가능하게 하도록 하여서 되는 특징을 갖는다.The opener frame of the hoop opener of the semiconductor manufacturing apparatus according to the present invention for achieving the above object is provided with a main door for opening and closing the opening edge from the rear, and the left and right transfer as an L guide up and down, and also transfer cylinder Inside the main door so that the second auxiliary door can be moved forward and backward, and the forward and reverse cylinders are installed along with the guide member at the upper and lower ends thereof to allow the predetermined distance β to be reversed. The first auxiliary door is installed inside the auxiliary door, but the first and second doors can be retracted by a predetermined distance α as the forward and backward cylinders.

상기 목적을 달성하기 위한 본 발명 반도체 제조장치의 후프오프너는 후프도어 개폐수단,흡착수단을 더 구비함이 바람직하다.The hoop opener of the semiconductor manufacturing apparatus of the present invention for achieving the above object is preferably further provided with hoop door opening and closing means.

상기 목적을 달성하기 위한 본 발명 반도체 제조장치의 상기 후프오프너의 양측에는 후프을 밀착/유지하기 위하여 선단부에 롤러를 형성한 밀착간과, 이 밀착간을 전,후진 이동시키는 엘엠가이드로 이루어진 후프밀착장치를 더 구비함이 바람직하다.In order to achieve the above object, a hoop adhesion device comprising a lateral contact between the hoop opener of the semiconductor manufacturing apparatus of the present invention and a close contact formed with a roller at the front end to closely contact and maintain the hoop, and an LM guide for moving the contact between the close and the backward. It is preferable to further provide.

이하 본 발명의 바람직한 실시예를 첨부 도면에 의거 구체적으로 설명하면 다음과 같다.BEST MODE Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

첨부 도면중 도 1은 본 발명 반도체 제조방치의 후프오프너의 발췌 후면 사시도이고, 도 2는 본 발명 반도체 제조장치의 후프오프너의 종단면도이다.1 is an exploded perspective view of the hoop opener of the semiconductor manufacturing device according to the present invention, and FIG. 2 is a longitudinal sectional view of the hoop opener of the semiconductor manufacturing device according to the present invention.

상기 도면들에 따르는 본 발명 반도체 제조장치의 후프오프너는,The hoop opener of the semiconductor manufacturing apparatus according to the drawings,

크게 오프너 프레임(100)과, N2가스배기장치(200)로 이루어진다. It consists of the opener frame 100 and the N 2 gas exhaust device 200.

먼저, N2가스배기장치(200)는 후프(300)의 후프도어(310)개방 순간 후프내부로 N2가스를 분출시켜 후프내부가 N2가스로 충전되어 O2농도를 감소시키도록 상기 오프너 프레임에 후프도어 개방 순간 후프내부로 N2가스를 분사하도록 N2가스공급라인(210)로 부터 N2가스가 공급되는 다수의 분사노즐(220)을 그 내측연부를 따라 수평방향 다수 설치하고, 오프너프레임(100) 바닥측에는 회수라인(230)을 구성하여서 된다. First, the N 2 gas exhaust device 200 ejects N 2 gas into the hoop at the moment of opening the hoop door 310 of the hoop 300 to fill the hoop with N 2 gas to reduce the O 2 concentration. a plurality of injection nozzles 220 that hoop to frame a door opening time so as to inject the N 2 gas as a hoop inside from the N 2 gas supply line (210), N 2 gas is supplied along its inside edge, and a plurality installed horizontally, The recovery line 230 may be configured at the bottom of the opener frame 100.

한편,상기 후프오프너의 양측에서 후프를 밀착/유지하기 위하여 선단부에 롤러를 형성한 밀착간과, 이 밀착간을 전,후진 이동시키는 엘엠가이드로 이루어진 후프밀착장치를 더 구비할 수 있으며, 구체적인 도면과 설명은 생략한다.On the other hand, the hoop adhesion device made of a contact between the roller formed on the front end in order to contact / maintain the hoop on both sides of the hoop opener, and the LM guide for moving forward and backward between the contact between the hoop, the specific drawings and Description is omitted.

첨부 도면중 도 3은 본 발명 반도체 제조장치의 후프오프너의 횡단면도이고, 도 4는 본 발명 반도체 제조장치의 후프오프너의 요부 확대단면도이다. 3 is a cross sectional view of the hoop opener of the semiconductor manufacturing apparatus of the present invention, and FIG. 4 is an enlarged cross-sectional view of the main portion of the hoop opener of the semiconductor manufacturing apparatus of the present invention.

이 도면에서 도시하는 바와 같이 상기 N2가스배기장치(200)는 상기 오프너 프레임(100)의 외측에서 N2가스공급라인(210)을 설치하고, 상기 분사노즐(220)들은 상기 오프너프레임(100)의 제1보조도어(110)로서 개방되는 개구연부(102)에 양측에 수직방향으로 다수 설치함과 아울러 오프너 프레임(100)의 바닥측에 회수라인(230)을 형성하여서 된다.As shown in the figure, the N 2 gas exhaust device 200 installs the N 2 gas supply line 210 on the outside of the opener frame 100, and the injection nozzles 220 are the opener frame 100. A plurality of opening edges (102) opened as the first auxiliary door (110) in the vertical direction on both sides, and a recovery line 230 is formed on the bottom side of the opener frame (100).

상기 오프너 프레임(100)에는 개구연부(102)를 후방에서 개폐하는 메인도 어(130)을 설치하되 그 상,하방으로 엘엠가이드(132)로서 좌,우 이송가능하게 함과 아울러 트랜스퍼 실린더(131)로서 이동되게 한다.The opener frame 100 is provided with a main door 130 that opens and closes the opening edge 102 from the rear, and allows the left and right to be transported as the LM guide 132 up and down, and the transfer cylinder 131. To be moved).

상기 메인도어(130)내측에는 제2보조도어(120)가 전,후진 가능하도록 그 상,하단에 가이드부재(124)와 함께 전,후진실린더(122)를 설치하여 소정 거리(β)후진가능하게 하여서 된다.Inside the main door 130, the second auxiliary door 120 can be moved forward and backward by installing the forward and backward cylinders 122 together with the guide member 124 at the upper and lower ends thereof to be able to reverse the predetermined distance β. It is done.

다시 이 제2보조도어(120)내측에는 제1보조도어(110)를 설치하되 전,후진실린더(112)로서 소정거리(α)후진가능하게 하도록 하여서 된다.Again, the first auxiliary door 110 is installed inside the second auxiliary door 120, so that the rearward cylinder 112 can be retracted by a predetermined distance α.

한편, 상기 제1보조도어(110)에는 후프도어를 흡착하고 개폐하기 위한 개폐수단(140)과 흡착수단(150)을 더 구비하여서 된다.Meanwhile, the first auxiliary door 110 may further include opening and closing means 140 and an adsorption means 150 for adsorbing and opening and closing the hoop door.

도 3에서 도시하는 바와 같이 본 발명 반도체 제조장치의 후프오프너는 제1보조도어(110)의 후진으로 후프도어가 후진하는 순간 N2가스가 후프내부로 화살표 방향으로 따라 각층 웨이퍼 사이로 분출되어 파티클과 함께 바닥측의 회수라인(230)으로 회수되므로서 청정공간을 유지함과 동시에 후프내부를 N2가스로 충전하여 O2농도를 저하시키게 된다. As shown in FIG. 3, in the hoop opener of the semiconductor manufacturing apparatus of the present invention, the N 2 gas is ejected into each hoop between the wafers in the direction of the arrow in the direction of the arrow when the hoop door is retracted by the backward of the first auxiliary door 110. As it is recovered to the recovery line 230 on the bottom side, while maintaining a clean space, the inside of the hoop is filled with N 2 gas to reduce the O 2 concentration.

이후 후진된 제2보조도어(120)와 함께 메인도어(130)가 우측으로 이동되어 완전개방되는 것이다.After that, the main door 130 is moved to the right together with the second auxiliary door 120 which is retracted to be completely opened.

첨부 도면중 도 5a, 5b는 본 발명 반도체 제조장치의 후프오프너의 후프개방및 후프도어 개폐를 위한 호프오프너 프레임의 반응리액터부측 설치된 제1,제2보조도어(110)(120)들과 메인도어(130)의 작용단면도이다.5A and 5B illustrate the first and second auxiliary doors 110 and 120 and the main doors installed on the reaction reactor part side of the hoop opener frame for hoop opening and hoop door opening and closing of the hoop opener according to the present invention. An operation cross section of 130 is shown.

이 도면에서 도시하는 바와 같이 본 발명은 후프(300)이 오프너 받침대위에 놓여지면 후프도어(310)에 흡착수단(150)이 흡착 유지된 상태에서 후프도어의 잠금키를 개페수단(140)을 통하여 해제시킨다.As shown in the figure, the present invention, when the hoop 300 is placed on the opener pedestal through the opening means 140 through the locking key of the hoop door in the state that the adsorption means 150 is adsorbed and held on the hoop door 310. Release it.

잠금이 풀린 후프도어(310)는 본 발명 후프오프너의 제1보조도어(110)에 흡착상태에서 α만큼 후진하므로서 후프내부가 개방된다. 후진은 상,하방에 각각 설치된 전,후진 실린더(112)들에 의하여 후진되며, 제1보조도어(110)의 후진과 동시에 오프너프레임(100)의 양측 개구연부(102)에 설치된 분사노즐(220)을 통하여 N2가스가 후프(300) 내부로 공급된다. 이렇게 후프내 다층 적재된 웨이퍼의 사이사이로 공급되는 N2가스는 오프너프레임(100) 바닥측의 회수라인(230)을 통하여 회수되며, 그에 따라 반응리액터부내 청정공간과 같이 청정상태에서 웨이퍼의 이송이 이루어지게 된다. The unlocked hoop door 310 is reversed by α in the adsorption state to the first auxiliary door 110 of the hoop opener of the present invention, and the hoop inside is opened. The reverse is reversed by the forward and backward cylinders 112 installed in the upper and lower, respectively, the injection nozzle 220 is installed on both side opening edges 102 of the opener frame 100 at the same time as the reverse of the first auxiliary door (110). N 2 gas is supplied into the hoop 300 through the. The N 2 gas supplied between the multi-layered wafers in the hoop is recovered through the recovery line 230 at the bottom of the opener frame 100, thereby transferring the wafer in a clean state such as a clean space in the reactor unit. Will be done.

또한, 이러한 후프오프너의 제1보조도어(110)의 후진 작동 순간 이루어진 N2가스를 충전하면서 O2농도를 확인한 후 제1보조도어(110)를 내장한 제2보조도어(120)는 다시 메인도어(130)내측으로 후진시킨다.In addition, after checking the O 2 concentration while filling the N 2 gas generated at the moment of the reverse operation of the first auxiliary door 110 of the hoop opener, the second auxiliary door 120 having the first auxiliary door 110 embedded therein is main again. The door 130 is moved backwards.

즉, 제2보조도어(120)는 메인도어(130)내측으로 "β"만큼의 후진 간격을 두고 있으므로 메인도어(130)내 이송실린더(121)의 작동으로 후진하게 되며, 이에 따라 메인도어(130)를 하부의 트랜스퍼 실린더(131)로서 우측으로 이동시켜 반응리액터부와 완전하게 연통하게 한다.That is, since the second auxiliary door 120 is spaced backward by "β" inside the main door 130, the second auxiliary door 120 is moved backward by the operation of the transfer cylinder 121 in the main door 130, and thus the main door ( 130 is moved to the right as the lower transfer cylinder 131 so as to be in complete communication with the reactor portion.

즉, 오프너 프레임(100)을 차단하고 있는 메인도어(130)는 그 상,하방에 설치된 엘엠가이드(132)와 트랜스퍼 실린더(131)로서 우측 이동된다.That is, the main door 130 blocking the opener frame 100 is moved to the right as the L guide 132 and the transfer cylinder 131 installed above and below.

한편, 상기 후프오프너의 개구연부 양측에는 후프를 밀착 지지하기 위하여 후프밀착장치를 턴온하여 후프의 양측면 테두리 위를 밀착 지지할 수 있으나, 구체적인 설명은 생략한다.On the other hand, the both sides of the opening edge of the hoop opener to turn on the hoop contactor in order to closely support the hoop can be closely supported on both side edges of the hoop, a detailed description thereof will be omitted.

이와 같이 본 발명 후프오프너는 종래 트랜스퍼 챔버와 반응리액터부 사이에설치되어 있으면서 후프내부에 N2가스를 충전하여 O2농도를 짧은 시간내에 감소시키는 효과를 갖는다.As described above, the hoop opener of the present invention has an effect of reducing the O 2 concentration in a short time by filling N 2 gas into the hoop while being installed between the transfer chamber and the reactor portion.

Claims (5)

삭제delete 반도체 제조장치의N2가스충전용 후프오프너에 있어서,In the hoop opener for N2 gas filling of a semiconductor manufacturing apparatus, 오프너 프레임(100); 및Opener frame 100; And 후프(300)의 후프도어(310)개방 순간 후프내부로 N2가스를 분출시켜 후프내부가 N2가스로 충전되도록 상기 오프너 프레임(100)의 외측에 N2가스공급라인(210)을 설치하고, 이 N2가스공급라인(210)을 통하여 N2가스가 분사되도록 제1보조도어(110)로서 개방되는 개구연부(102) 양측에 수평방향으로 다수의 분사노즐(220)을 그 내측연부를 따라 수평방향 다수 설치하고, 오프너프레임(100) 바닥측에는 회수라인(230)을 형성한 N2가스배기장치(200)를 포함하여서 되는 반도체 장치의 N2가스충전용 후프오프너.The N 2 gas supply line 210 is installed on the outside of the opener frame 100 so that the inside of the hoop is filled with N 2 gas by ejecting N 2 gas into the hoop at the moment of opening the hoop door 310 of the hoop 300, Through the N 2 gas supply line 210, a plurality of injection nozzles 220 are horizontally disposed on both sides of the opening edge portion 102 opened as the first auxiliary door 110 to inject N 2 gas along the inner edge thereof. horizontal multiple installation, the opener frame (100), N2 gas filling FOUP opener for a semiconductor device which comprises a hayeoseo N 2 gas exhaust unit 200 to form a return line 230, the bottom side. 반도체 제조장치의N2가스충전용 후프오프너에 있어서,In the hoop opener for N2 gas filling of a semiconductor manufacturing apparatus, 개구연부(102)를 후방에서 개폐하는 메인도어(130)을 설치하되 그 상,하방으로 엘엠가이드(132)로서 좌,우 이송가능하게 함과 아울러 트랜스퍼 실린더(131)로서 이동되게 하며, 이 메인도어(130)내측에는 제2보조도어(120)가 전,후진 가능하도록 그 상,하단에 가이드부재(124)와 함께 전,후진실린더(122)를 설치하여 소정 거리(β)후진가능하게 하고, 다시 이 제2보조도어(120)내측에는 제1보조도어(110)를 설치하되 전,후진실린더(112)로서 소정거리(α)후진가능하게 하도록 하여서 되는 오프너 프레임(100); 및The main door 130 is installed to open and close the opening edge 102 from the rear side, and the left and right transfers are possible as the L guide 132 up and down, and the main cylinder 130 is moved as the transfer cylinder 131. Inside the door 130, the second auxiliary door 120 is provided with a forward and backward cylinder 122 together with the guide member 124 at the upper and lower ends thereof so that the second auxiliary door 120 can be moved forward and backward. In addition, the second auxiliary door (120) inside the first auxiliary door (110) is installed, but the opener frame (100) to be able to reverse the predetermined distance (α) as the reverse cylinder 112; And 후프(300)의 후프도어(310)개방 순간 후프내부로 N2가스를 분출시켜 후프내부가 N2가스로 충전되도록 N2가스공급라인(210)에서 N2가스가 분사되는 다수의 분사노즐(220)을 그 내측연부를 따라 수평방향 다수 설치하고, 오프너프레임(100) 바닥측에는 회수라인(230)을 형성한 N2가스배기장치(200)를 포함하는 반도체 제조장치의 N2가스충전용 후프오프너.The FOUP door 310 is opened the moment a large number of spray nozzles to spray the N 2 gas to the FOUP internal hoop interior of which the N 2 gas in N 2 gas supply line 210 to be filled with N2 gas injection (220 of the hoop 300 ) N2 gas filling hoop opener of the semiconductor manufacturing apparatus comprising a plurality of horizontally installed along the inner edge thereof, the N2 gas exhaust device 200 formed on the bottom side of the opener frame 100, the recovery line 230. 제3항에 있어서,The method of claim 3, 상기 제1보조도어(110)에는 후프 도어를 열고 이동하기 위한 후프도어 개폐수단(140)과, 후프 도어를 흡착 이동하기 위한 흡착수단(150)을 더 구비하는 것을 특징으로 하는 반도체 제조장치의 N2가스충전용 후프오프너.The first auxiliary door 110 further includes hoop door opening and closing means 140 for opening and moving the hoop door, and adsorption means 150 for sucking and moving the hoop door. Gas-filled hoop opener. 삭제delete
KR1020060034866A 2006-04-18 2006-04-18 FOUP opener for charge nitrogen gas of semicuctor manufacturing apparatus KR100765850B1 (en)

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