200422622 玖、發明說明 (發明說明應敘明：發明所屬之技術領域、先前技術、內容、實施方式及圖式簡單說明） 【發明所屬之技術領域】 本發明係有關於一種以微機械技術製作的電容式固態加速儀，特別是 一種可同時感測三轴向或二軸向加速度之感測器。 【先前技術】 習知以微機械技術製作之三轴向固態加速儀，以美國專利第 6, 201，284號為例，其結構如第一圖所示，包含一個慣性質量塊32，數個 感測彈性樑42將質量塊32連接於包圍其外之質量塊31，使質量塊32只 能沿y軸向移動；固定電極塊52p及52η置於質量塊32平行於X轴之兩 側，與質量塊32之二側面形成兩個y轴向感測電容器c92p及c92n ;數個 感測彈性樑41將質量塊31連接於包圍其外之質量塊33，使質量塊31只 能沿X軸向移動；固定電極塊51p及51η置於質量塊31平行於y轴之兩 側，與質量塊31之二側面形成兩個X轴向感測電容器c91p及c91n;兩個 感測彈性樑43將質量塊33連接於固定錨60，固定錨60固定於平板71 及72，使質量塊33只能沿z轴向移動，平板71及72之表面、對應質量 塊33之二表面各含電極板93p及93η，與質量塊33之二表面形成兩個z 轴向感測電容器c93p及c93n。 當沿y轴向輸入一加速度，兩個y轴向感測電容器c92p及c92n因間 距改變而使其電容值改變故可感測y轴向加速度。 當沿X轴向輸入一加速度，兩個X軸向感測用電容器c9b及c91n因 200422622 間距改變而使其電容值改變，故可感測x軸向加速度。 當沿z轴向輸入一加速度，兩個z袖向感測用電谷器c93p及c93n因 間距改變而使其電容值改變，X轴向及y轴向感測用電容器不受影響，故 可感測Z轴向加速度。 【發明内容】 《所欲解決之問題》 上述之習用的多軸向固態加速儀在χ軸向及y軸向感測電容器製程 中，必須製作出兩面深且間距窄的垂直平面，此製程僅適合採用表面微細 加工法或乾式蝕刻法，且其所能達到的「深寬比」會隨深度加深而降低， 而導致靈敏度受到限制。因此，本發明基於習用多軸向固態加速儀所具有 之缺失進行發明。 (解決問題之技術手段> 本發明之主要舰在於：改變制電容器之架構，當平行於主平面 之加速度分量使質量塊位移時，係使電容器之面積改變，而非使電容器之 間距改變，故無需製作兩面深且間距f的垂直平面，無高「深寬比」之特 殊製程需求條件問題，製程簡單，適合多種加工法。 (相較於先前技術之功效》 綜前所述，本發明乃揭示：一種多軸向電容式固態加速儀，其製程 200422622 簡單無而，、㈤冰見比」之特殊製程需求條件，可提昇製程成功率、降 低製作成本。 再者，查醜案號(美國專利6,201 284，簡，職別:祖驗; H01L 21/00)之三轴向電容式固態加速，並未揭示本發明所述及之相同特 徵’故本鎌符合「新穎性」之專利要件。其次，本發明之製程簡單、無 需製作具高「深統」之垂直平行平面，可提昇製程成神、降低製程成 本，故本誠符合「產業_性」及「進步性」之專利要件，爰依專利法 之規定提出本項發明案之專利申請。 【實施方式】 首先，請參閱第二圖，本發明之第一可行實施例之三軸向電容式固 態加速儀，第二(a)圖為主結構上視圖，係由具導電性材料製成，包含三 慣性質#塊31、32、33，各以數彳喊測彈性樑41、42、43銜接於外框 架2或固疋錯60，外框架2或固定錯60並固定於平板71及72 ,其中感 測樑41、42、43之設計使質量塊31、32、33分別只能沿平行於平板表面 之第一、第二轴向、及垂直於平板表面之z軸向移動；質量塊31、犯之 表面分別含數個垂直於第一、第二軸向之長形凹槽31t、32t。 如第二(b)圖，平板71、72面對主結構之表面，對應長形凹槽3U 處，各含兩組相互交錯、各含數個平行於長形凹槽之長形薄膜電極板9ι& 及91b，並分別接至接線板91p及91η，各與質量塊31表面形成兩組第一 軸向感測電容器c91p及c91n;長形薄膜電極板91a及91b與長形凹样31t 200422622 々平仃於帛轴向之細位置如第二⑹圖所示，該圖係沿第二⑷圖及第 二⑹圖之A-A、線之橫截面圖；當質量塊& $第一轴向之加速度之影響而 產生/口第-轴向之位移時，第_軸向感測電容器咖及.因有效電容 器面積改變而使其電容值改變，兩者之改變值相反，故量測兩組感測電容 is c91p及c91n之電容值差值即可得知第一軸向加速度。此加速度感測信 號可經由回授電路(未顯示於第二圖）回授至第一轴向感測電容器c_及 c91n，使質量塊31維持在無位移處。 平板71、72面對主結構之表面，對應長形凹槽32t處，各含兩組 相互父錯、各含數個平行於長形凹槽之長形薄膜電極板92a及92b，並分 別接至接線板92p及92η，各與質量塊32表面形成兩組第二轴向感測電容 器c92p及c92n;當質量塊32受第二軸向之加速度之影響而產生沿第二轴 向之位移時，第二軸向感測電容器c92p&c92n因有效電容器面積改變而 使其電容值改變，兩者之改變值相反，故量測兩組感測電容器c92p&c92n 之電容值差值即可得知第二轴向加速度。此加速度感測信號可經由回授電 路(未顯示於第二圖）回授至第二轴向感測電容器c92p及c92n，使質量塊 32維持在無位移處。 平板71、72面對主結構之表面，對應質量塊33之表面處，亦各含 薄膜電極板93，各與質量塊33表面形成兩組z轴向感測電容器C93p及 c93n;當質量塊33受z轴向之加速度之影響而產生沿2轴向之位移時，z 轴向感測電容器c93p及c93n因其電容器平板間距改變而使電容值改變， 兩者之改變值相反向，故量測兩組感測電容器C93p及c93n之電容值差值 200422622 即可得知z轴向加速度。此加速度感測信號可經由回授電路(未顯示於第 二圖）回授至第三轴向感測電容器C93p及c93n，使質量塊33維持在無位 移處。 上述本發明之第一可行實施例之三軸向電容式固態加速儀，實際包 含三個各自獨立的加速儀，各自感測單一轴向的加速度，不受其他二軸向 加速度的影響。若只需感測二轴向加速度，只需將上述之結構簡化，刪掉 無需感測軸向之加速儀，保留所需二轴向的加速儀即可。 本發明之第二可行實施例之三軸向電容式固態加速儀，如第三圖所 示，其中第三(a)圖為主結構上視圖，係由具導電性材料製成，包含三個 慣性質量塊31、32、33，其中質量塊31、32連接在一起並圍繞於質量塊 33之外圍，形成質量塊312,質量塊33以數個感測彈性樑43銜接於質量 塊312，質量塊312以數個感測彈性樑41銜接於感測彈性樑42，感測標 42之兩端銜接於外框架2或固定錨60，外框架2或固定錨60固定於平板 71及72 ;感測樑43之設計使質量塊33只能沿垂直於平板表面之z轴向 移動；感測樑41、42之設計使質量塊312只能沿平行於平板表面之第一、 第二轴向移動。質量塊31、32之兩表面分別含數個垂直於第一、第二轴 向之長形凹槽31t、32t。 如第三(b)圖，平板71、72面對主結構之表面，對應長形凹槽3U 處，各含兩組相互交錯、各含數個平行於長形凹槽之長形薄膜電極板9ι& 及91b，並分別接至接線板91p及91n，各與質量塊31表面形成兩組第一 轴向感測電容器C91p及C91n;長形薄膜電極板91a及91b與長形凹槽31t 200422622 之相關位置如第三(c)圖，·當質量塊31、32、及33受第一轴向之加速度之 影響而同時產生沿第-轴向之位移時，第—軸向感測電容器c9ip及悉 因有效電容H面觀變而使其電她竣，兩者之改變值相反，故量測兩 組感測電容器c91gc91n之電容值差值即可得知第一轴向加速度。此加* 速度感測信號可麵喊電路(未顯示於第三圖）_至第—轴向劇電. 容器C91PAc91n，使質量塊31維持在無位移處。 平板71、72面對主結構之表面，對應長形凹槽32t處，各含兩組 相互父錯、各含數個平行於長形凹槽之長形薄膜電極板跑及娜，並分❿ 職至接線板92p及92η，各與質量塊32表面形成兩組第二轴向感測電容 器c92p及c92n ;當質量塊31、32、及33受第二轴向之加速度之影響而 同時產生沿第二轴向之位移時，第二軸向感測電容器獅及㈣因有效 電容器面積改變而使其電容值改變，兩者之改變值相反，故量測兩組感測 電容器c92p及c92n之電容值差值即可得知第二轴向加速度。此加速度感 測信號可經由回授電路（未顯示於第二圖）回授至第二轴向感測電容器 c92p及c92n，使質量塊維持在無位移處。 ® 平板71、72面對主結構之表面，對應質量塊33之表面處，亦各含 薄膜電極板93，各與質量塊33表面形成兩組z轴向感測電容器c93p及 c93n;當質量塊33受z轴向之加速度之影響而產生沿2轴向之位移時，z 轴向感測電容器c93p及c93n因其電容器間距改變而使電容值改變，兩者 之改變值相反，故量測兩組感測電容器C93p及c93n之電容值差值即可得 知z轴向加速度。此加速度感測信號可經由回授電路(未顯示於第三圖）回 π 200422622 授至第三轴向感測電容器c93p及c93n，使質量塊33維持在無位移處。 第一轴向之加速度雖使質量塊31、32、及33同時產生沿第一軸向 之位移，但只要長形薄膜電極板92a及92b之兩端不與長形凹槽32t之兩 端切齊，薄膜電極板93之各邊不與質量塊33之各邊切齊，則第二轴向感 測電容器c92p及c92n、z轴向感測電容器c93p及c93n之電容值將不受 影響。 同理，第二轴向之加速度雖使質量塊31、32、及33同時產生沿第 二軸向之位移，但只要長形薄膜電極板91a及91b之兩端不與長形凹槽31t # 之兩端切齊，薄膜電極板93之各邊不與質量塊33之各邊切齊，則第一軸 向感測電容器c91p及c91n、z轴向感測電容器c93p及c93n之電容值將 不受影響。 z轴向之加速度對質量塊31、32完全無影響，故第一軸向感測電容 器c91p及c91n、第二軸向感測電容器c92p及c92n之電容值不受影響。 若只需感測第一轴向及z轴向加速度，只需取消感測樑42並使感 測樑41銜接於外框架或固定錨2、及取消主結構表面垂直於第二轴向之長 修 形凹槽32t及平板71、72表面之長形薄膜電極板92a及92b、接線板92p 及 92η。 本發明之第三可行實施例之三轴向電容式固態加速儀，如第四圖之 主結構上視圖，係由具導電性材料製成，僅包含一個慣性質量塊3，質量 塊3以數個感測彈性樑41銜接至感測彈性樑42，感測樑42之另一端銜接 於外框架2或固定錨60，外框架2或固定錨60固定於平板71及72。感200422622 发明 Description of the invention (The description of the invention should state: the technical field to which the invention belongs, the prior art, the content, the embodiments, and the drawings) [Technical field to which the invention belongs] The present invention relates to a micromechanical technology Capacitive solid-state accelerometer, especially a sensor that can simultaneously detect triaxial or biaxial acceleration. [Prior technology] It is known that a three-axis solid-state accelerometer made by micromechanical technology. Take US Patent No. 6,201,284 as an example. Its structure is shown in the first figure. It contains an inertial mass 32, several The sensing elastic beam 42 connects the mass 32 to the mass 31 surrounding it, so that the mass 32 can only move along the y-axis; the fixed electrode blocks 52p and 52η are placed on both sides of the mass 32 parallel to the X-axis, Two y-axis sensing capacitors c92p and c92n are formed with the two sides of the mass 32; several sensing elastic beams 41 connect the mass 31 to the mass 33 surrounding it, so that the mass 31 can only be along the X axis Moving; the fixed electrode blocks 51p and 51η are placed on both sides of the mass block 31 parallel to the y-axis, and two X-axis sensing capacitors c91p and c91n are formed with the two sides of the mass block 31; two sensing elastic beams 43 will The mass 33 is connected to the anchor 60, and the anchor 60 is fixed to the plates 71 and 72, so that the mass 33 can only move in the z-axis direction. The surfaces of the plates 71 and 72 and the two surfaces corresponding to the mass 33 include electrode plates 93p. And 93η, forming two z-axis sensing capacitors c93p and c93n with the two surfaces of the mass 33. When an acceleration is input along the y-axis, the capacitance values of the two y-axis sensing capacitors c92p and c92n change due to the change in the distance, so that the y-axis acceleration can be sensed. When an acceleration is input along the X axis, the capacitance values of the two X-axis sensing capacitors c9b and c91n change due to the change in the 200422622 pitch, so the x-axis acceleration can be sensed. When an acceleration is input along the z-axis, the capacitance values of the two c-valves c93p and c93n for the z-sleeve direction sensing change due to the change in the distance. The X-axis and y-axis sensing capacitors are not affected, so Sense Z-axis acceleration. [Summary of the Problem] "Problems to be Solved" In the above-mentioned conventional multi-axis solid-state accelerometer, in the process of the x-axis and y-axis sensing capacitors, a vertical plane with two sides deep and narrow spacing must be produced. This process is only It is suitable to use the surface microfabrication method or dry etching method, and the "aspect ratio" that can be achieved will decrease with the deepening, resulting in limited sensitivity. Therefore, the present invention is invented based on the shortcomings of the conventional multiaxial solid-state accelerometer. (Technical means to solve the problem) The main ship of the present invention is to change the structure of the capacitor. When the mass component is displaced by an acceleration component parallel to the main plane, the area of the capacitor is changed instead of the distance between the capacitors. Therefore, there is no need to make a vertical plane with two sides deep and a distance f, there is no special process requirement condition of high "aspect ratio", the process is simple, and it is suitable for a variety of processing methods. (Compared with the effect of the prior art) It is revealed that: a multi-axis capacitive solid-state accelerometer whose manufacturing process is 200422622 is simple and unparalleled, and the special process demand conditions are comparable, which can improve the success rate of the process and reduce the production cost. Furthermore, the number of the scandal case ( U.S. Patent 6,201,284, Jan, Title: Zu Yan; H01L 21/00) triaxial capacitive solid-state acceleration, which does not reveal the same features described in the present invention, so this sickle meets the patent requirements of "newness" Secondly, the process of the present invention is simple, and it is not necessary to make vertical parallel planes with high "deep uniformity", which can improve the process into god and reduce the process cost. And "progressive" patent requirements, the patent application for this invention is filed in accordance with the provisions of the Patent Law. [Embodiment] First, please refer to the second figure, the triaxial capacitive type of the first feasible embodiment of the present invention Solid-state accelerometer, the second (a) figure is the top view of the main structure, which is made of conductive material, including three inertial masses # 31, 32, 33, each measuring the elastic beam 41, 42, 43 It is connected to the outer frame 2 or fixed frame 60, and the outer frame 2 or fixed frame 60 is fixed to the flat plates 71 and 72. Among them, the design of the sensing beams 41, 42, 43 allows the masses 31, 32, and 33 to be parallel, respectively. The first and second axial directions on the surface of the flat plate and the z-axis moving perpendicular to the surface of the flat plate; the mass 31 and the surface of the culprit respectively include several elongated grooves 31t perpendicular to the first and second axial lines, 32t. As shown in the second figure (b), the surfaces of the flat plates 71, 72 facing the main structure, corresponding to 3U of the elongated grooves, each contain two groups of interlaced, each containing several elongated films parallel to the elongated grooves. The electrode plates 9ι & and 91b are respectively connected to the wiring plates 91p and 91η, each forming two sets of first axial directions with the surface of the mass 31 Capacitors c91p and c91n; long thin-film electrode plates 91a and 91b and long concave samples 31t 200422622 细 Flat 仃 The fine position on the 帛 axis is shown in the second figure, which is along the second figure and the second Figure AA, line cross-sectional view; when the mass & $ the first axis of the acceleration of the impact caused by the / mouth of the first-axial displacement, the first _ axial sensing capacitor and the effective capacitor The area changes its capacitance value, and the change values of the two are opposite. Therefore, the first axial acceleration can be obtained by measuring the difference between the capacitance values of the two sets of sensing capacitors is c91p and c91n. This acceleration sensing signal can be obtained via The feedback circuit (not shown in the second figure) feeds back to the first axial sensing capacitors c_ and c91n, so that the mass 31 is maintained at no displacement. The surfaces of the flat plates 71 and 72 facing the main structure correspond to the elongated grooves 32t, each of which contains two sets of mutually opposite fathers, each of which includes several elongated thin-film electrode plates 92a and 92b parallel to the elongated grooves, and are respectively connected To the connection plates 92p and 92η, each forming two sets of second axial sensing capacitors c92p and c92n with the surface of the mass 32; when the mass 32 is affected by the acceleration in the second axis and causes displacement along the second axis The capacitance value of the second axial sensing capacitor c92p & c92n changes due to the change in the effective capacitor area. The changes in the two are opposite. Therefore, the difference between the capacitance values of the two sets of sensing capacitors c92p & c92n can be obtained. Second axial acceleration. This acceleration sensing signal can be fed back to the second axial sensing capacitors c92p and c92n via a feedback circuit (not shown in the second figure), so that the mass 32 is maintained at a position without displacement. The surfaces of the flat plates 71, 72 facing the main structure, corresponding to the surface of the mass 33, each also include a thin-film electrode plate 93, each forming two sets of z-axis sensing capacitors C93p and c93n with the surface of the mass 33; when the mass 33 When the displacement in the 2 axis is caused by the acceleration in the z axis, the capacitance values of the capacitors c93p and c93n in the z axis are changed due to the change in the capacitor plate spacing. The changes in the two directions are opposite, so the measurement The difference in capacitance between two sets of sensing capacitors C93p and c93n 200422622 can be used to obtain the z-axis acceleration. This acceleration sensing signal can be fed back to the third axial sensing capacitors C93p and c93n via a feedback circuit (not shown in the second figure), so that the mass 33 is maintained at a position without displacement. The above-mentioned three-axis capacitive solid-state accelerometer of the first feasible embodiment of the present invention actually includes three independent accelerometers, each of which senses acceleration in a single axis and is not affected by acceleration in the other two axes. If you only need to sense the two-axis acceleration, you only need to simplify the structure described above, delete the accelerometer that does not need to sense the axial direction, and keep the required two-axis accelerometer. As shown in the third diagram, the third axial capacitive solid-state accelerometer of the second feasible embodiment of the present invention is the top view of the main structure, which is made of a conductive material and includes three Inertial masses 31, 32, 33, of which masses 31, 32 are connected together and surround the masses 33 to form masses 312. Masses 33 are connected to masses 312 with a plurality of sensing elastic beams 43. The block 312 is connected to the sensing elastic beam 42 by a plurality of sensing elastic beams 41. Both ends of the sensing target 42 are connected to the outer frame 2 or the fixed anchor 60, and the outer frame 2 or the fixed anchor 60 is fixed to the flat plates 71 and 72. The design of the measuring beam 43 allows the mass 33 to move only along the z-axis perpendicular to the flat surface; the design of the sensing beam 41 and 42 allows the mass 312 to move only in the first and second axial directions parallel to the flat surface . The two surfaces of the masses 31 and 32 respectively include a plurality of elongated grooves 31t and 32t perpendicular to the first and second axial directions. As shown in Figure 3 (b), the flat plates 71, 72 face the main structure, corresponding to 3U of the elongated grooves, each containing two groups of interlaced, each containing several elongated thin-film electrode plates parallel to the elongated grooves. 9ι & and 91b, and respectively connected to the wiring plates 91p and 91n, each forming two sets of first axial sensing capacitors C91p and C91n with the surface of the mass 31; the long thin-film electrode plates 91a and 91b and the long groove 31t 200422622 The relevant position is shown in the third (c) diagram. When the masses 31, 32, and 33 are affected by the acceleration in the first axis and the displacement along the first axis is generated at the same time, the first-axis sensing capacitor c9ip In addition, it is learned that the electric capacitance is changed due to the change in the effective capacitance H, and the changes of the two are opposite. Therefore, the first axial acceleration can be obtained by measuring the difference in capacitance between the two sets of sensing capacitors c91gc91n. This plus * speed sensing signal can be used to call the circuit (not shown in the third figure) _ to the first-axial electric power. The container C91PAc91n, so that the mass 31 is maintained at no displacement. The surfaces of the flat plates 71, 72 facing the main structure, corresponding to the long grooves 32t, each contain two sets of mutual faults, each containing several long thin film electrode plates running parallel to the long grooves, and divided Work to the terminal boards 92p and 92η, each forming two sets of second axial sensing capacitors c92p and c92n with the surface of the mass 32; when the masses 31, 32, and 33 are affected by the acceleration of the second axis, the edges are generated simultaneously. When the second axis is displaced, the capacitance values of the second axis sensing capacitors lion and ㈣ are changed due to the change in the effective capacitor area. The change values of the two are opposite, so the capacitances of the two sets of sensing capacitors c92p and c92n are measured. The value difference can be used to know the second axial acceleration. This acceleration sensing signal can be fed back to the second axial sensing capacitors c92p and c92n via a feedback circuit (not shown in the second figure), so that the mass is maintained at a position without displacement. The surfaces of the flat plates 71, 72 facing the main structure, corresponding to the surface of the mass 33, each also include a thin-film electrode plate 93, each forming two sets of z-axis sensing capacitors c93p and c93n with the surface of the mass 33; when the mass is 33 When the displacement in the 2 axis is caused by the acceleration in the z axis, the z axis sensing capacitors c93p and c93n change the capacitance value due to the change in the capacitor pitch. The change values of the two are opposite. The z-axis acceleration can be obtained by the difference between the capacitance values of the group sensing capacitors C93p and c93n. This acceleration sensing signal can be fed back to the third axial sensing capacitors c93p and c93n via a feedback circuit (not shown in the third figure) via π 200422622, so that the mass 33 is maintained at a position without displacement. Although the acceleration in the first axis causes displacement of the masses 31, 32, and 33 along the first axis at the same time, as long as both ends of the elongated thin-film electrode plates 92a and 92b are not cut with both ends of the elongated groove 32t If the sides of the thin-film electrode plate 93 are not aligned with the sides of the mass block 33, the capacitance values of the second axial sensing capacitors c92p and c92n and the z axial sensing capacitors c93p and c93n will not be affected. Similarly, although the acceleration in the second axis causes the masses 31, 32, and 33 to move along the second axis at the same time, as long as the two ends of the elongated thin-film electrode plates 91a and 91b are not in contact with the elongated groove 31t # The two ends are aligned, and the sides of the thin-film electrode plate 93 are not aligned with the sides of the mass block 33. The capacitance values of the first axial sensing capacitors c91p and c91n, and the z axial sensing capacitors c93p and c93n will not Affected. The acceleration in the z-axis direction has no effect on the masses 31 and 32, so the capacitance values of the first axial sensing capacitors c91p and c91n and the second axial sensing capacitors c92p and c92n are not affected. If only the first axial and z-axis acceleration needs to be sensed, it is only necessary to cancel the sensing beam 42 and connect the sensing beam 41 to the outer frame or the fixed anchor 2, and cancel the length of the main structure surface perpendicular to the second axis. The modified grooves 32t and the elongated thin-film electrode plates 92a and 92b and the wiring plates 92p and 92η on the surfaces of the flat plates 71 and 72. The three-axis capacitive solid-state accelerometer of the third feasible embodiment of the present invention, as shown in the top view of the main structure of the fourth figure, is made of a conductive material and contains only one inertial mass 3, which is a number Each sensing elastic beam 41 is connected to the sensing elastic beam 42, and the other end of the sensing beam 42 is connected to the outer frame 2 or the fixed anchor 60, and the outer frame 2 or the fixed anchor 60 is fixed to the flat plates 71 and 72. sense
L iL 12 200422622 測樑41與感洌樑42形成兩段式“L-型，，感測彈性樑，其設計使質量塊3 可沿平行於平板表面之第-、第二轴向雜及沿垂直於平板表面之2軸向 移動。質^塊3之兩表面含數個垂直於第一、第二軸向之長形凹槽31t、 32t ’及無長形凹槽之區域。 平板71、72面對主結構之表面之薄膜電極板與上述本發明第二可 行實施例之薄膜電極板相似，如第三(b)圖，各轴向感測原理同上述。 只要長形薄膜電極板91a及91b、92a及92b之兩端分別不與長形 凹槽31t、32t之兩端切齊，且薄膜電極板93之範圍小於質量塊3表面無 長形凹槽處’則第一軸向之加速度對第二轴向感測電容器c92p及c92n、z 軸向感測電容器C93p及C93n之電容值均無影響；同理第二轴向之加速度 對第一轴向感測電容器c91p及C91n、z轴向感測電容器c93p及c93n之 電容值亦均無影響。z軸向之加速度雖對第一轴向感測電容器c91p&c91n 產生影響’使主結構同一面之感測電容器c91p&c91n之電容值同時變大 或變小’但因檢取第一軸向感測信號時是量測兩組感測電容器c91p及 c91n之電容值差值，故可互相抵銷；若採用制衡迴路，2轴向之加速度對 第一轴向感測電容器C9lp及C91n更無影響。同理z轴向之加速度對第二 轴向之加速度之感測亦無影響。 若只需感測第一轴向及z轴向加速度，只需取消感測樑42並使感 測樑41銜接於外框架2或固定錨60，取消主結構表面垂直於第二轴向之 長形凹槽32t，及取消平板7卜72表面之長形薄膜電極板92a及92b、接 線板92p及92η。 200422622 上述本發明之第三可行實施例之三軸向電容式固態加速儀之另一 型式如第五®所示，質量塊3之兩表面只含數健直於第―、第二軸向之 長形凹槽31t、32t;同時，平板71、72面對主結構之表面之薄膜電極板(未 顯示於第五圖）只包含第一轴向感測電容器c91p&c91n，及第二轴向感測 電容器c92p及c92n。 第一軸向及第二軸向之加速度感測如上述之討論。z轴向加速度之 感測則需利用第一轴向感測電容器C91p及C91n及第二轴向感測電容器 c92p及c92n之輸出信號：定義主結構正面之C91p、C91n、c92p及c92n 之總合為z軸向感測電容器c93p，主結構反面之c91p、c91n、c92p及c92n 之總合為z軸向感測電容器C93n。當質量塊3受z軸向之加速度之影響而 產生沿z轴向之位移時，z轴向感測電容器c93p及c93n因其電容器間距 改變而使電容值改變，兩者之改變值相反，故量測兩組感測電容器c93p 及c93n之電容值差值即可得知z轴向加速度。此加速度感測信號可經由 回授電路回授至z轴向感測電容器c93p及c93n，使質量塊3維持在無位 移處。 第一轴向之加速度使第一轴向感測電容器c91p、c91n之電容值改 變，兩者之改變值相反，其總合不變；同理第二轴向之加速度使第二軸向 感測電容器c92p、c92n之電容值改變，兩者之改變值相反，其總合不變。 故第一軸向及第二轴向之加速度對z轴向感測電容Sc93p&c93n無影響。 z轴向之加速度對第一轴向及第二軸向之加速度之感測亦無影響’ 如上述。 14 200422622 若只需感測第一軸向及z軸向加速度，只需重新設計感測樑41、 - 42，使質量塊3可沿平行於平板表面之第一轴向移動及沿垂直於平板表面 之z軸向移動，及取消主結構表面垂直於第二轴向之長形凹槽32t及平板L iL 12 200422622 The measuring beam 41 and the sensing beam 42 form a two-segment "L-shaped", sensing elastic beam, which is designed so that the mass 3 can be mixed along the first and second axial directions parallel to the flat surface. 2 axes moving perpendicular to the surface of the flat plate. The two surfaces of the mass 3 contain several elongated grooves 31t, 32t 'perpendicular to the first and second axial directions and areas without long grooves. The thin-film electrode plate on the surface facing the main structure is similar to the thin-film electrode plate of the second feasible embodiment of the present invention. As shown in FIG. 3 (b), the principle of each axial sensing is the same as above. As long as the long thin-film electrode plate 91a And 91b, 92a, and 92b are not aligned with the two ends of the elongated grooves 31t and 32t, respectively, and the range of the thin-film electrode plate 93 is smaller than that of the surface of the mass 3 without the elongated grooves. The acceleration has no effect on the capacitance values of the second axial sensing capacitors c92p, c92n, and z. The same applies to the capacitance values of the second axial sensing capacitors c93p, and C93n. Similarly, the acceleration of the second axial sensing capacitors has no effect on the first axial sensing capacitors c91p, C91n, and z. The capacitance values of the axial sensing capacitors c93p and c93n also have no effect. Although the acceleration in the z-axis direction senses in the first axial direction The container c91p & c91n has an effect 'make the capacitance value of the sensing capacitor c91p & c91n on the same side of the main structure larger or smaller at the same time', but when the first axial sensing signal is detected, two sets of sensing capacitors c91p are measured And the difference in capacitance of c91n, so they can offset each other. If a check-and-balance circuit is used, the acceleration in the two axes will have no effect on the first axis sensing capacitors C9lp and C91n. Similarly, the acceleration in the z axis will affect the second axis. There is no effect on the acceleration detection. If only the first and z-axis accelerations need to be sensed, it is only necessary to cancel the sensing beam 42 and connect the sensing beam 41 to the outer frame 2 or the fixed anchor 60, and cancel the main The long groove 32t whose structure surface is perpendicular to the second axial direction, and the long thin film electrode plates 92a and 92b and the wiring plates 92p and 92η on the surface of the flat plate 7 and 72 are eliminated. 200422622 The third of the third feasible embodiment of the present invention described above Another type of axial capacitive solid-state accelerometer is shown in Fifth®. The two surfaces of mass 3 contain only long grooves 31t and 32t that are straight in the first and second axial directions. At the same time, flat plates 71, 72 thin-film electrode plate on the surface facing the main structure (not shown in the fifth figure) Only the first axial sensing capacitors c91p & c91n and the second axial sensing capacitors c92p and c92n are included. The acceleration sensing of the first and second axial directions is as discussed above. The sensing of the z-axis acceleration You need to use the output signals of the first axial sensing capacitors C91p and C91n and the second axial sensing capacitors c92p and c92n: define the sum of C91p, C91n, c92p, and c92n on the front side of the main structure as the z axial sensing capacitor c93p, the sum of c91p, c91n, c92p, and c92n on the reverse side of the main structure is the z-axis sensing capacitor C93n. When the mass 3 is displaced along the z-axis by the acceleration in the z-axis, the z-axis sensing capacitors c93p and c93n change the capacitance value due to the change in the capacitor pitch. The change values of the two are opposite, so The z-axis acceleration can be obtained by measuring the difference in capacitance between two sets of sensing capacitors c93p and c93n. This acceleration sensing signal can be fed back to the z-axis sensing capacitors c93p and c93n via a feedback circuit, so that the mass 3 is maintained at a position without displacement. The acceleration in the first axis changes the capacitance values of the first axis sensing capacitors c91p and c91n, and the change values of the two are opposite, and the total is unchanged; similarly, the acceleration in the second axis makes the second axis sense The capacitance values of the capacitors c92p and c92n are changed. The change values of the two capacitors are opposite to each other, and the sum of them is unchanged. Therefore, the accelerations in the first and second axes have no effect on the z-axis sensing capacitance Sc93p & c93n. The acceleration in the z-axis has no effect on the acceleration in the first and second axes, as described above. 14 200422622 If only the first axial and z-axis accelerations need to be sensed, only the sensing beams 41,-42 need to be redesigned so that the mass 3 can move along the first axis parallel to the surface of the plate and perpendicular to the plate Z-axis movement of the surface, and cancel the long groove 32t of the main structure surface perpendicular to the second axis and the flat plate
I 71、72表面之長形薄膜電極板92a及92b、接線板92p及92η。 若只需感測第一軸向及第二轴向加速度，則只需重新設計感測樑 41、42，使質量塊3只可沿平行於平板表面之第一轴向及第二軸向移動。 上述本發明各可行實施例中之長形凹槽，可有不同的變化設計，例 如長形凹槽内可包含數個較深之凹槽甚或穿透孔3lh、32h，或長形凹槽以籲 數個長形孔取代，如第六圖。 第二、第三可行實施例中之二段式“L-型，，感測彈性樑，可有不同 的變化設計，例如第四圖〜第七圖之“L—型，，感測彈性樑係以不同的方式 連接質量塊與外框架。 第-可行實施例中之“L一型”感測彈性樑亦可與另一感測彈性樑 交換’即將“L-型，，感聊性樑置於兩㈣量塊之間，而將另—感測彈性 樑連接外質量塊與外框架或固定錯，使内質量塊只能沿平行於平板表面之籲 第-、第二軸向移動，外f量塊只能沿垂直於平板表面之z轴向移動；此 時内質量塊之兩表面分別含數個垂直於第一、第二轴向之長形凹槽犯、 32t ’而外質量塊之兩表面不含長形凹槽；玻璃平板上之電極板設計亦需 同時改變。 上述轉明之柯行實補〇㈣電容如態加賴之主結構 可利用表面微細加工法、嫌刻法、⑽、整體微細加工法等製成，無 15 200422622 需製作兩面深邱距窄的垂直平面，無高「深寬比」之製程需賴題。 上述本發明之各可行實施例若以（11〇)石夕晶片利用整體微細加工法 製作則配合(11G)_晶>；濕式非等向侧特性，其外觀及各組成元件均 為-平行四邊形，任二邊之夾角皆為職48。或7〇·52。。以本發明之第· -可仃實施例之三軸向電容式固態加速儀為例，其結構如第八圖，除外形 與第二圖不同外，其餘所需各項功能及組成元件並無不同。以（⑽石夕晶 片製作具有-優點’即因其具垂直深侧特性、自動侧停止功能，故製 作感測樑、長形凹槽等較簡單，可精確控制感測樑之寬度，提昇製程成功 _ 率及產品品質之一致性。但由於感測樑41及42之間並非正交，故第一感 測軸向與第二感測轴向並非正交，系統應用時必須將其轉換至一正交之座 標系統： 定義一新座標系統(X’，y’，ζ)，為由原座標系統(x，y，z)繞ζ軸 旋轉一 0(19· 48。）角度而成，若感測樑41、42分別平行於y，軸及χ轴， 如第八圖之一座標系統關係圖，則第一感測轴向平行於χ’軸，第二咸測 軸向平行於y軸，故感測加速度分量分別為Αχ，及妨。因χ軸與y，軸、· X’軸與y轴非正交，（Ax’，Ay)需轉換至一正交的座標系統：（x,y，z)或 (X’，y’，Ζ)，設系統之工作座標為(x，y，Z)座標，則由第八圖之二座標系 統關係圖，即可將(Ax’，Ay)轉換為(Ax, Ay)。 9 雖然本發明已以一具體實施例揭露如上，然其並非用以限定本發 明，任何熟悉此技藝者，在不脫離本發明之精神和範圍内，當可作各種之 更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為 準。 Μ 16 200422622 【圖式簡單說明】 為期此對本發明之目的、功效及構造特徵妓詳盡明確的瞭解， 兹舉可行實糊她合赋制如後^ · 第圖所不係習知三轴向電容式固態加速儀之結構示意圖，且其令⑷圖為· 主結構之上棚；（_為_©示意圖。 第二圖所示係本發明第_可行實施例之三軸向電容式固態加速儀之結構示 思圖’且其中（a)圖為主結構之上視圖；⑹圖為玻璃平板表面之感_ 測電容器之長形電極板示意圖；⑹圖為橫截面示意圖。 第一圖所tf係本發明第二可行實施例之三轴向電容式嶋加速儀之結構示 意圖，且其中(a)圖為主結構之上視圖；⑹圖為玻璃平板表面之感 測電容器之長形電極板示意圖；（c)圖為橫截面示意圖。 第四圖、第五圖所示係本發明兩種不同形式之第三可行實施例三軸向電容 式固態加速儀之主結構示意圖。 第六圖、第七圖所示係本發明不同形式之第二、第三可行實施例之三轴向_ 電容式固態加速儀之結構示意圖。 第八圖所示係本發明以⑽)石夕晶片經整體微細加工法製作之第二可行實 施例之三轴向電容式固態加速儀之結構示意圖。 【元件符號說明】 2 :外框架The thin film electrode plates 92a and 92b and the wiring plates 92p and 92η on the surfaces of I 71 and 72. If only the first and second axial accelerations need to be sensed, the sensing beams 41 and 42 need only be redesigned so that the mass 3 can only move along the first and second axial directions parallel to the flat surface . The above-mentioned elongated grooves in the various feasible embodiments of the present invention may have different design variations. For example, the elongated grooves may include several deeper grooves or even through holes 3lh, 32h, or the elongated grooves. Call for several long holes to replace, as shown in Figure 6. In the second and third feasible embodiments, the two-stage type "L-type," which senses elastic beams, can be designed in different variations, such as the "L-type," which senses elastic beams in the fourth to seventh figures. The system connects the mass and the outer frame in different ways. The "L-type" sensing elastic beam in the first-feasible embodiment can also be exchanged with another sensing elastic beam. That is, "L-type", the sensing beam is placed between two measuring blocks, and another —The sensing elastic beam connects the outer mass with the outer frame or is fixed wrong, so that the inner mass can only move along the first and second axes parallel to the flat surface, and the outer f gauge can only move along the perpendicular to the flat surface. z axial movement; at this time, the two surfaces of the inner mass have several long grooves perpendicular to the first and second axial directions, respectively, and the two surfaces of the outer mass have no long grooves; glass The design of the electrode plate on the plate also needs to be changed at the same time. The above-mentioned main structure of the capacitor can be made using surface microfabrication, engraving, engraving, and overall microfabrication. 15 200422622 It is necessary to make two vertical planes with a narrow pitch and a narrow pitch. The process without high "aspect ratio" depends on the problem. If each of the above-mentioned feasible embodiments of the present invention is manufactured by using the (11〇) Shi Xi wafer by the overall microfabrication method, it is matched with the (11G) _crystal > wet-type non-isotropic side characteristic, and its appearance and components are- Parallelograms, with any angle between the two sides serving 48. Or 7〇 · 52. . Taking the tri-axial capacitive solid-state accelerometer of the first-possible embodiment of the present invention as an example, its structure is shown in the eighth figure, except that the shape is different from the second figure, and the remaining functions and components are not required. different. (The production of the vermiculite chip has-advantages' that is because it has vertical deep side characteristics and automatic side stop function, so it is simpler to make sensing beams, long grooves, etc., which can precisely control the width of the sensing beam and improve the manufacturing process. Success_ The consistency of the rate and product quality. However, because the sensing beams 41 and 42 are not orthogonal, the first sensing axis and the second sensing axis are not orthogonal. When the system is applied, it must be converted to An orthogonal coordinate system: Define a new coordinate system (X ', y', ζ), which is formed by rotating the original coordinate system (x, y, z) around the ζ axis by a 0 (19 · 48.) Angle, If the sensing beams 41 and 42 are parallel to the y, axis, and χ axes, respectively, as shown in the coordinate system diagram in Figure 8, the first sensing axis is parallel to the χ ′ axis, and the second sensing axis is parallel to y. Axis, the sensing acceleration components are Αχ and 妨. Since the χ axis and y, the axis, and the X 'axis are not orthogonal to the y axis, (Ax', Ay) needs to be converted to an orthogonal coordinate system: ( x, y, z) or (X ', y', Z), and set the working coordinate of the system to (x, y, Z) coordinate, then from the relationship diagram of the coordinate system of Figure 8 (2), (Ax , Ay) is converted into (Ax, Ay). 9 Although the present invention has been disclosed as above with a specific embodiment, it is not intended to limit the present invention. Anyone familiar with the art will not depart from the spirit and scope of the present invention. As various modifications and retouching can be made, the scope of protection of the present invention shall be determined by the scope of the attached patent application. M 16 200422622 [Simplified illustration of the figure] For this purpose, the purpose, effect and structural characteristics of the present invention Detailed and clear understanding, it is feasible to confuse her with the system as follows ^ · The diagram in the figure is not a schematic diagram of the conventional triaxial capacitive solid-state accelerometer, and its diagram is the upper structure of the main structure; ( _ 为 _ © schematic diagram. The second diagram shows the structure of the three-axis capacitive solid-state accelerometer of the _ feasible embodiment of the present invention, and (a) is the top view of the main structure; Sense of the surface of a glass flat plate_ Schematic diagram of a long electrode plate for a capacitor; ⑹ Figure is a schematic cross-sectional view. The figure tf in the first figure is a structural schematic diagram of a triaxial capacitive radon accelerometer according to the second feasible embodiment of the present invention. (a) Picture-based The top view of the structure; the figure is a schematic diagram of a long electrode plate of a sensing capacitor on the surface of a glass plate; (c) is a schematic diagram of a cross-section. The fourth and fifth figures show the third of two different forms of the present invention. Schematic diagram of the main structure of the three-axis capacitive solid-state accelerometer of the feasible embodiment. The sixth and seventh figures show the three-axis of the second and third feasible embodiments of the present invention. Schematic diagram of the structure. The eighth diagram is the schematic diagram of the tri-axial capacitive solid-state accelerometer of the second feasible embodiment of the present invention, which is made of the ⑽) Shi Xi wafer by the overall microfabrication method. frame
17 200422622 3、31、32、33、312·•慣性質量塊 31t、32t ·貝置塊表面之長形凹槽 31h、32h ··質量塊表面之長形凹槽内之深凹槽或穿透孔 41、42、43 ··感测彈性樑 51ρ、51η :第一軸向之固定電極塊 52ρ、52η ··第二軸向之固定電極塊 60 :固定錨 71、72 ··結構正、反面之平板 91a、91b ·平板上第一轴向感測器之長形電極板 92a、92b :平板上第二轴向感測器之長形電極板 91ρ、91η :平板上第一轴向之長形電極組之接線板 92ρ、92η :平板上第二轴向之長形電極組之接線板 93 :平板上第三轴向之電極板 c91p、c91n :第一轴向之感測電容器組 c92p、c92n :第二轴向之感測電容器組 c93p、c93n :第三轴向之感測電容器組 G:連接至主結構之接線板 D續次頁（發明說明頁不敷使用時’請註記並使用續頁） 申請專利範圍 1· 一種多軸向固態加速儀，其主結構係由具導電性松 可叶表成，包含兩個慣 1817 200422622 3, 31, 32, 33, 312 · • Inertia mass 31t, 32t · Long grooves on the surface of the block 31h, 32h ·· Deep grooves or penetrations in the long grooves on the surface of the mass Holes 41, 42, 43 ························································································································· Flat plates 91a, 91b · Long electrode plates 92a, 92b of the first axial sensor on the plate: Long electrode plates 91ρ, 91η of the second axial sensor on the plate: Length of the first axial direction on the plate Terminal plates 92ρ, 92η of the shape electrode group: Terminal plates of the long electrode group in the second axial direction on the plate 93: Electrode plates c91p, c91n of the third axial direction on the plate; sensing capacitor groups c92p in the first axial direction, c92n: Sensing capacitor bank in the second axis c93p, c93n: Sensing capacitor bank in the third axis G: Terminal board connected to the main structure D Continued page (when the invention description page is insufficient, please note and use (Continued) Patent application scope 1. A multi-axial solid-state accelerometer whose main structure is made of a conductive pine leaf, including two Individual 18