TW594016B - Z-axis solid state gyroscope and three-axis inertial measurement apparatus - Google Patents

Abstract

The present invention relates to a Z-axis micro solid state gyroscope whose sensing axis is perpendicular to the surface of structure (z-axis), and which can also function as an axial-direction accelerometer. It structure is made by conductive material, which comprises two sets of mass blocks and driver main body, and it is hung between two plates by elastic arm. Each surface of the driver main body and mass block has several long grooves perpendicular to the first axial direction and the second axial direction respectively, and forms the driving capacitor and sensing capacitor with the corresponding long electrode on the plate. The driver makes the two mass blocks vibrate oppositely direction along the first axial direction. If an angular velocity is inputted, then Coriolis force will make the two mass blocks vibrate oppositely along the second axial direction. If an acceleration is inputted along the second axial direction, the inertial force will move the two mass blocks in parallel along the second axial direction. Both cause the sensed capacitance to change. Both z-axis gyros and both axial-direction gyros on the plane can be fabricated on the same chip, so as to form a complete three-axial direction inertial measurement apparatus.

Description

594016 发明 Description of the invention (the description of the invention should state: the technical field, the prior art, the content, the embodiments, and the drawings of the invention briefly) [Technical field to which the invention belongs] The present invention relates to a solid state gyroscope and a three-axis Inertial measurement instrument, especially it adopts micro-mechanical technology, and can detect the angular velocity in the axial direction (defined as Z-axis) perpendicular to the structure surface, and it can also sense the axial acceleration parallel to the structure surface By. [Prior art]

Most of the solid-state gyroscopes manufactured by micro-mechanical technology have a large part of the angular velocity sensing axis parallel to the structure surface, such as US Patent Nos. 5,392,650, 5,016,072, and 5,757,103. Furthermore, if the angular velocity and acceleration of the three axes need to be measured at the same time, if the angular velocity sensing axis can be perpendicular to its structural surface, the gyroscope and accelerometer for measuring the three axes can be made on the same base. On-chip, while greatly reducing cost and volume. As a result, another type of solid-state gyroscope is produced, such as U.S. Patent Nos. 6,257,059 and 5,992,233. [Summary] (Problems to be solved >

The structure of the solid-state gyroscope of the above-mentioned conventional U.S. Patent No. 6,257,059 is shown in the first figure, and its sensing axis is perpendicular to the structure surface, including two inertial masses 3 and comb structures 31, 32. The mass 3 and the comb-like structures 31 and 32 are connected to the fixing anchor 60 with a plurality of elastic beams 6, 61 and 62, and the fixing anchor 60 is fixed to the glass substrate 71. The mass 3 includes a plurality of regularly arranged holes 3h, and the surface of the glass substrate 71 below it includes a plurality of long electrode pairs 91 and 92 parallel to the driving axis (y-axis), and is connected to the wiring boards 9p and 9n, respectively. The spacing between the small holes along the X axis is equal to the distance between the two elongated electrode pairs; the two sets of elongated electrodes 91, 92 and the surface of the mass 3 form a sensing capacitor. The materials of the mass 3, the comb-like structures 31, 32 and the elastic beams 6, 61, 62 may be metal, doped silicon crystal, silicon crystal, or polycrystalline silicon. The length, width, and thickness of the elastic beams 6, 61, and 62 are designed to be easier to bend in two axial directions parallel to the surface of the structure. The two outer comb drivers 31 are each driven by a DC bias voltage and a reverse AC voltage. The frequency of the drive AC voltage is a mechanical resonance frequency, which causes the two masses to vibrate in the reverse direction along the y-axis. The two inner comb drivers 32 are each driven by a DC bias voltage and a high-frequency reverse AC voltage, which are mainly used for driving amplitude measurement and feedback to control the driving amplitude. If an angular velocity is input along the z-axis, a Coriolis force will be generated to cause each of the two masses 3 to vibrate in the reverse direction along the X-axis, so that the capacitance of the sensing capacitor changes. The sensing capacitors are each driven by a DC bias voltage and a high-frequency reverse AC voltage, and the voltage applied by the sensing capacitors on the left and right sides is reversed. The sensing current at the output GN is proportional to the displacement difference of the two mass blocks 3. . In order to sense the amount of movement of the mass 3 along the X axis, there is another form of sensing capacitor, namely a comb capacitor (not shown in the first figure): When the mass 3 moves along the X axis, the capacitor As the distance changes, the capacitance value changes, so the displacement can also be sensed. Although the above-mentioned conventional second form of solid-state gyroscope can sense the angular velocity perpendicular to the surface of the structure, it is more difficult to make a practical comb-shaped capacitive electrostatic driver or comb-shaped sensing capacitor. Vertical planes with narrow pitches are only suitable for fabrication by wafer dissolution, surface microfabrication, and dry etching. The "aspect ratio" that can be achieved decreases with depth and sensitivity is limited. Large overall microfabrication methods are less suitable. <Technical means to solve the problem> The main feature of the present invention is that the driver and the sensor adopt an edge-shaped long-capacitor structure. The manufacturing process is simple, and there is no need to make a vertical plane that is deep on both sides and narrow in pitch. The problem of special process requirements is suitable for a variety of processing methods. <Compared to the previous technology> In summary, the present invention discloses: (1) a z-axis solid state gyroscope that can sense the angular velocity perpendicular to the structure surface and can sense one of the structures parallel to the structure surface Axial acceleration; (2) Design two z-axis solid-state gyroscopes and two solid-state gyroscopes whose sensing axis is parallel to the structure surface on the same chip, and complete three-axis gyroscopes and acceleration at the same time in one process Instrument, forming a fully functional planar inertial measurement instrument, which can greatly reduce its volume, manufacturing and assembly costs. Furthermore, check the similar case number (US Patent No. 6,257,059 Bl 73 / 504.02 and No. 5,992,233 11 / 1999,73 / 5〇4 〇2) 2 Fortunately, No. 2001, screw meter, did not disclose The present invention has the same characteristics as mentioned above, so this case should meet the two requirements. Secondly, the planar inertial measurement of the present invention: manufacturing = significantly reducing its volume, manufacturing and assembly costs, so this case should meet the "= flat" patent application for "stepping" patent requirements, in accordance with the provisions of the Patent Law This item is proposed: [Embodiment Mode] Li Tuo Er, please refer to the second diagram, the main structure of a miniature ... instrument of a feasible embodiment of the present invention. Its structure is axially fixed with a conductive material 5: 3 ^ frame 2 'and a fixed error 60; the outer frame 2 contains two rabbits' inner block 3 and the driver body 51, 52; each mass, 呷, and [Bei nature is connected to its two driver bodies 51, 52, and two drivers. = Between the bombs and connected by two connecting beams 5; each f 51, 52 56; each connected with several driving elastic markers 6-common joint placket: fixed with fixed beam 62 at fixed error 60, each Two = The theft body 51, 52 can also add another elastic beam 65,% hanging from the outer frame 2: Move the other two glass substrates 71, 72 on the front of the main structure respectively * Combine with the outer frame 2, and mosquito -From the above, make the rest of the above; ^ pieces suspended ^ between the two glass substrates 71, 72. The above-mentioned sense _ 4 makes the f gauge block 3 easier to follow in a specific direction (defined as the normal direction) parallel to the flat surface, and the driving beam 61, the common elastic beam 62, the elastic beam 65, 66, etc. make the mass block 3 and The actuator bodies 51 and 52 are relatively easy to move along the other (parallel axis) parallel to the surface of the flat plate; the two surfaces of the mass 3 each contain several elongated recesses 3t perpendicular to the χ axis, and the two surfaces of the actuator bodies 51 and 52 Each contains several long ^ slots 5t perpendicular to the y-axis. The glass sheets 71 and 72 face the surface of the Shi Xi wafer, corresponding to each of the driver bodies 51 and 594016. Two sets of long electrodes 81 and 82 interlaced with each other and parallel to the long groove 5t are formed on each side, and are respectively connected to the wiring board 81ρ. , 81η, as shown in the second (b) figure; the relative positions of the long grooves 5t on the surface of the driver body 51 and the corresponding long electrodes 81, 82 are shown in the cross-sectional view of the third figure, so the surface of each driver body 51 The corresponding long electrode plates 81 and 82 each form two sets of driving capacitors. Similarly, the surfaces of the glass sheets 71 and 72 facing the silicon wafer and corresponding to the surface of each driver body 52 contain two sets of long electrodes 81 and 82 that are interlaced and parallel to the long groove 5t, and are connected to the wiring board 82ρ, 82η, each forming another two sets of driving capacitors.

The surfaces of the glass plates 71 and 72 facing the silicon wafer and the long grooves 3t corresponding to the surfaces of the masses 3 also each include two sets of long electrodes 91 and 92 that are interlaced and parallel to the long grooves 3t, and are connected respectively. To the wiring boards 9p, 9n; each surface of the mass 3 and its corresponding elongated electrodes 91, 92 each form two sets of sensing capacitors. The two outer drive capacitors are each driven by a DC bias voltage and a reverse AC voltage. The frequency of the drive AC voltage is the mechanical resonance frequency, which causes the two masses to vibrate in the reverse direction along the y-axis. The two inner drive capacitors are each driven by a DC bias voltage and a high-frequency reverse AC voltage, which are mainly used for drive amplitude measurement and feedback to control the drive amplitude.

If an angular velocity is input along the z axis, a Coriolis force will be generated to cause the two masses 3 to vibrate in the X axis. If an acceleration is also input along the X axis, the inertial force will also cause the two masses 3 to generate. Displace in the same direction along the X-axis; as the area of the elongated capacitor changes, both can change the capacitance of the sensing capacitor. The sensing capacitors are each driven by a DC bias voltage and a high-frequency reverse AC voltage. The voltage applied by the sensing capacitors on the left and right sides is reversed, and the sensing current at the output terminal GN is proportional to the displacement difference of the two masses 3. The signal generated by the angular velocity is an AC signal, and the signal generated by the acceleration is a low-frequency or DC signal. The z-axis angular velocity and X-axis acceleration signals can be separated by signal processing technology. The long electrodes 91 and 92 of the sensing capacitor can also be partially divided, such as the feedback electrode 9f in the second (b) figure, for use as a gyroscope counterbalance feedback driver. The mass 3 and the driver body 51, 52 may have many other different forms. As shown in the fourth and fifth figures, the other components are to undertake the various embodiments described above. "The surface of the mass 3 or the driver body ^ The original long grooves 3t, 5t, deep holes 3h, 5h, or even etched through them to reduce the drive performance of the driver. Also in the fourth figure, the connecting beam 5 is cancelled and the beam is directly sensed. 4 Connect the two driver bodies 51, 52; the fifth figure removes the connection beam $ and the sensor 4; the mass 3 and the driver body 51, 52 are directly connected together, and the function of the sensor beam 4 is changed to a common connection Beam 61. The structure can be formed by wafer dissolution method, surface microfabrication method, dry type engraving method, and X-ray profound precision in the electroforming mold (German:

Abfonmmg (abbreviation: LIGA), integral microfabrication, etc., without the need to produce vertical planes with deep sides and small spacing on both sides, without the special process requirements of "aspect ratio". If this structure is manufactured by the (110) silicon wafer 11 using the overall microfabrication method, its structure is as shown in the sixth figure, and its components are to undertake the aforementioned various embodiments, and cooperate with the (110) silicon wafer wet anisotropic etching characteristics, Its shape and components are parallelograms, and the angle between any two sides is 109 · 48. Or 70.52. . Except that the appearance is different from the fourth figure, the other required functions and components are not different. The fabrication of (11〇) silicon wafers has an advantage. Because of its vertical deep etching characteristics and automatic etching stop function, it is relatively simple to make driving beams and sensing beams, which can accurately control the width of the driving beams and sensing beams. Accurately control driving and sensing resonance frequency to improve process success rate and sensing performance. However, since the driving target 6 and the sensing target 4 are not orthogonal, they are 109.48. Or 70.52 °, so the effective Coriolis force is reduced to the original sin (109.48.) Times or sin (70.52.) Times, that is, 0.94 times, that is, the sensitivity is reduced by 0.94 times. Define a new coordinate system (x ', y, ζ)' as the rotation of the original coordinate system (x, y, z) around the ζ car by a 0 (19 · 48) angle. 'The right drive beam is parallel to the X axis, Then the sensing beam is parallel to the y, axis. Therefore, the driving direction is the y-axis, and the sensing capacitor can sense the z-axis angular velocity Wz. The seventh diagram shows the structure of an X-axis solid-state gyroscope whose sensing axis is parallel to the structure surface required by the present invention for forming a planar triaxial inertial measurement instrument: The seventh (a) diagram is mainly The top view of the structure, the seventh (b) is a schematic diagram of the long electrode plate of the driving capacitor 594016 on the surface of the glass substrate and the electrode plate of the sensing capacitor. The structure of the X-axis solid state gyroscope in Figure 7 is similar to the structure of the Z-axis solid state gyroscope in Figure 2. The main differences are two: (l) The sensing beam 4 of the x-axis solid state gyroscope makes the mass 3 more comparable. It is easy to move along the z-axis, and the sensing beam 4 of the z-axis solid-state gyroscope in the second figure makes the mass 3 easier to move along the x-axis; (2) The sensing electrode plate of the x-axis solid-state gyroscope corresponds to Each surface of each mass 3 is a single electrode plate 9, and the sensing electrode plate of the z-axis solid state gyroscope corresponds to each surface of each mass 3 as two sets of elongated electrode plates 91 and 92.

An embodiment is provided below to form an inertial measurement instrument with a three-axis gyroscope and a three-axis accelerometer, which are arranged on the same through the two z-axis gyroscopes and two planar axial gyroscopes. On the wafer. In order to form a planar three-axis inertial measurement instrument, a y-axis solid-state gyroscope is required. Its structure is the same as that of the X-axis solid-state gyroscope, except that it is rotated 90 ° around the z-axis. When the driving axis and the sensing axis are orthogonal, the four solid-state gyroscopes needed to form a planar triaxial inertial measurement instrument, the driving axis of each axial gyroscope, the sensing axis, and its angular velocity input The arrangement of the axial and acceleration inputs is summarized in Table (1): Table (1): The axial arrangement of each gyroscope when the drive shaft and the sensing shaft are orthogonal The drive shaft senses the shaft angular velocity input and the shaft acceleration input Axis G1 Dy Dz Wx Az G2 Dx Dz Wy Az G3 Dy Dx Wz Ax G4 Dx Dy Wz Ay

As can be seen from Table (1), there are two sets of output signals available for the gyroscope degree and acceleration in the z-axis. If a z-axis gyroscope and two in-plane axial gyroscopes are used to form a planar three-axis inertial measurement device, the z-axis acceleration component Az still has two sets of signals, but one in-plane axial will be missing. The signal of the acceleration component, for example, if the G3 arrangement is used, it will lack an Ay acceleration component; if the G4 arrangement is used, it will have one π 594016 Aχ acceleration components less. In order to make up for the lack of Ax or Ay acceleration component signals, an additional Ax or Ay accelerometer can be added. The eighth (a) diagram is a schematic diagram of the main structure of a planar three-axis inertial measurement instrument composed of four solid-state gyroscopes according to the present invention, in which Gl, G2, G3, and G4 drive axial, The arrangement of the sensing axis, its angular velocity input axis, and acceleration input axis are the same as those in Table (1), and other components are undertaking various implementation methods described above. If a triaxial planar inertial measuring instrument is manufactured by using the (110) silicon wafer with the overall microfabrication method, the arrangement of the driving axis and the sensing axis of each axial gyroscope, and the angular velocity input axis and acceleration The input axis is shown in Table (2): Table (2): The axial arrangement of each gyroscope when the drive axis and the sensing axis are non-orthogonal. The drive axis senses the axis angular velocity, the axis acceleration, and the axis G1 Dy. Dz Wx Az G2 Dx 'Dz Wy, Az G3 Dy Dx' Wz Ax, G4 Dx? Dy Wz Ay

The eighth (b) diagram is a schematic diagram of the main structure of a planar three-axis inertial measurement instrument made of (110) silicon wafers by the overall microfabrication method and composed of four solid-state gyroscopes, in which Gl, G2 The arrangement of the driving axis, sensing axis, and angular velocity input axis and acceleration input axis of each solid-state gyroscope of G3, G4, and G4 are the same as those in Table (2). If a triaxial planar inertial measurement instrument is manufactured by using the (110) silicon wafer with the overall microfabrication method, the final signals obtained are: three angular velocity components of Wx, Wy ', Wz, and three of Ax', Ay, Az Acceleration components. Because the X axis is not orthogonal to the y 'axis and the X' axis is not orthogonal to the y axis, (Wx, Wy ') and (Ax', Ay) need to be converted to an orthogonal coordinate system ... (x, y, z) Or (x ', y', z). Let the working coordinates of the system be (x, y, z) coordinates, then from the eighth (b) diagram of the second coordinate system diagram, we can get: 12 (1) 594016-Isin ⑼ + cos (^) (2)

Ax, ^ Ay sin ((9) cos⑹) The above-mentioned full-featured planar tri-axial inertial measurement instrument of the present invention, its output signal contains three axial angular velocity components and three axial acceleration components; Function, you only need to simplify its structure appropriately.

Although the present invention has been disclosed as above with a specific embodiment, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and decorations without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application. [Brief description of the drawings] In order to have a more detailed and clear understanding of the purpose, effect and structural features of the present invention, the feasible embodiments are illustrated in conjunction with the illustrations as follows: The first picture shows that the sensing can be perpendicular to Schematic diagram of the structure of the solid-state gyroscope with angular velocity on the structure surface.

The second figure shows the structure of a Z-axis solid state gyroscope according to a feasible embodiment of the present invention: (a) the top view of the main structure; (b) the length of the driving capacitor and the sensing capacitor on the surface of the glass substrate Shaped electrode plate. The third figure shows a schematic cross-sectional view of the structure of a long capacitor for a driving capacitor or a sensing capacitor. The fourth and fifth figures are structural schematic diagrams of a z-axis solid state gyroscope according to another feasible embodiment of the present invention: The sixth figure is a z-axis solid state produced by the entire microfabrication method of a (110) silicon wafer of the present invention Schematic diagram of the gyroscope structure: (a) The top view of the main structure; (b) The schematic diagram of the long electrode plate of the driving capacitor and the sensing capacitor on the surface of the glass substrate. The seventh diagram shows the structure of an X-axis solid-state gyroscope whose sensing axis is parallel to the structure surface required by the present invention for forming a planar triaxial inertial measurement instrument. 13 594016 Picture: (a) Picture shows Top view of the main structure; (b) The figure is a schematic diagram of a long electrode plate for a driving capacitor and an electrode plate for a sensing capacitor on the surface of a glass substrate. The eighth figure is a schematic diagram of the main structure of the planar triaxial inertial measuring instrument of the present invention, which is composed of four solid-state gyroscopes: (a) The figure shows a rectangular or square structure; (b) The figure shows ( 110) A parallelogram structure made of a silicon wafer by the overall microfabrication method. [Description of component symbols] 11: (110) Silicon wafer 2: Outer frame 3: Inertial mass block 31, 32: Inner and outer comb drives 3t: Mass groove 3 Surface of the long groove perpendicular to the sensing axis 3h: Mass Deep groove or penetrating hole in the long groove on the surface of the block 3 4: Sensitive elastic beam 5: Connecting beams 51, 52: Driver body 5t: Long grooves on the surface of the driver body 51, 52 perpendicular to the drive shaft 5h : Deep groove or penetration hole in the long groove on the surface of the driver body 51, 52 6: Driving elastic beam 6 0 · Fixed tin 61, 62: Common connection beam, common elastic beam 65, 66: Elastic beam 71, 72 : Glass substrates 81, 82: Long electrode plates for drivers on glass substrates 81ρ, 81η: Terminal plates for long electrode groups for outside drivers on glass substrates 82ρ, 82η: Terminal plates for long electrode groups for inside drivers on glass substrates 91, 92: Long electrode plates for sensors on glass substrates 9ρ, 9η: Terminal plates for long electrode groups of sensors on glass substrates 14 594016 9f, 9fb · Feedback electrode plates on glass substrates, and Its terminal board GN ... The electrode board in contact with the silicon chip, and its terminal board

Gl, G2, G3, G4 · Four gyroscopes required to form a planar triaxial inertial measurement instrument

Continued pages (Notes and use of continuation pages when the invention description page is insufficient) 15

Claims (1)

Patent application circle 1. A z-direction solid energy and an elastic plum meter, which is mainly made of a conductive material, between the plate and the plate, you and the general mass and The two actuator bodies are respectively suspended from the two aforementioned one driving kines moving along the first and second axial directions parallel to the surface of the flat plate; the grooves, and each flat body surface forms several elongated shapes perpendicular to the first axial direction. Each of the driving electrodes is recessed. Each driving body surface forms two sets of driving electrode groups. The two sets of elongated electrodes are electrically formed into several elongated electrodes perpendicular to the first-axis direction, so that the capacitors are opposite to each other and formed with the surface of the driving body. Two sets of tables driving each of the aforementioned mass blocks, each flat plate corresponds to each "Guangdi-axial long groove, measuring electrode group; forming two sets of sensing electrode group, each sensing capacitor, staggered, and with the mass Two sets of sensing are formed on the surface of the block. /, The electric valley value will move along the second axis along with the mass block. The silver driving capacitors are each of the quality blocks described by the -DC bias and the mechanical exchange rate. Displacement or vibration t The amount of change in the capacitance value of the container is known; "The wheel produced by the angular velocity and acceleration of each mass block described in Shiying's sensing electronics is the parent current signal and the DC signal, so it can be processed by the signal. Respective degree and acceleration signals. K and separate angular velocity = the first in the scope of patent application! The z-axis solid-state gyro described in item: several deeper ones are formed in the elongated grooves of the device body and the mass; respectively; or the z-axis solid-state gyro beam described in item i of the patent application range The set includes: the instrument, wherein the bullet connects the connecting beams of the two driver bodies corresponding to each mass, and connects the mass to its corresponding two driving bodies, and the blocks can move in the second axial direction; The mass 16 594016 two common connecting beams, which are installed on both sides of the two masses; a first elastic beam group connecting the mass and the driver body to the common connecting beam; and connecting the common connecting beam to a The second elastic beam group of the anchor is fixed to the two flat plates. 4. The z-axis solid state gyroscope according to item 1 of the scope of patent application, wherein the elastic beam group includes: a sensing beam connecting each mass to its corresponding two actuator bodies, so that the mass can be Move along the second axis; two common connecting beams, which are installed on both sides of the two masses; A first elastic beam connecting the mass and the driver body to the common connecting beam; and a second elastic beam connecting the common connecting beam to a fixed anchor, and the fixed anchor is fixed to two flat plates. 5. The z-axis solid state gyroscope according to item 1 of the scope of patent application, wherein each mass is directly connected to its two actuator bodies, and the elastic beam group includes two common connecting beams, which are Installed on both sides of the two masses; a first elastic beam connecting the mass and the driver body to the common connecting beam; and a second elastic beam connecting the common connecting beam to a fixed anchor, and the fixed anchor is fixed to Two tablets. 6. The z-axis solid state gyroscope according to item 3 or 4 or 5 of the scope of the patent application, wherein the elastic beam is assembled with third and fourth links connecting the mass and the driver body group to the outer frame. An elastic beam, and the outer frame is fixed to two flat plates. 7. The z-axis solid state gyroscope according to item 1 of the scope of patent application, the elastic beam group of which comprises: a connecting beam connecting two masses of the driver corresponding to each mass; and a sensing connection connecting the mass to the mass of the driver A beam, so that the mass can move along the second axis; and a driving elastic beam connecting the mass and the driver body group to the outer frame, and the outer frame is fixed to two flat plates. 8. The z-axis solid state gyroscope according to item 1 of the scope of patent application, wherein the driving capacitors of the two driver bodies corresponding to the masses of the aforementioned 17 594016 are divided into two parts: the first part The driving capacitor is driven by a DC bias and an AC voltage, so that the mass is vibrated along the first axis; and the driving capacitor of the second part is driven by a DC bias and a high-frequency AC voltage, The amplitude signal of vibration of the mass along the first axis is detected and fed back to the driving capacitor of the first part to control the amplitude of vibration of the mass along the first axis. 9. The z-axis solid-state gyroscope according to item 1 of the scope of patent application, wherein the sensing capacitors of the aforementioned masses are divided into two parts: The sensing capacitors of the first part are obtained by a DC bias and high frequency AC voltage drive to detect the angular velocity signal in the z-axis and the acceleration signal along the second axis; and the sensing capacitor of the second part obtains the feedback of the angular velocity signal, And offset the mass displacement along the second axis caused by Coriolis force. 10. The z-axis solid state gyroscope according to item 1 of the scope of the patent application, the main structure of which is made of (110) silicon wafer using the overall microfabrication method. 11. A solid-state gyroscope, which is mainly made of a conductive material, and suspends two inertial masses and two actuator bodies between two flat plates through an elastic beam group, so that the mass block It can move along the first axis parallel to the surface of the flat plate, and can move along the Z axis perpendicular to the surface of the flat plate; each of the aforementioned drive body surfaces forms a plurality of long grooves perpendicular to the first axis, and each flat plate Two sets of driving electrode groups are formed corresponding to the surface of each driver body, and each driving electrode group forms a plurality of elongated electrodes perpendicular to the first axis, so that the two sets of elongated electrodes are interlaced with each other, forming two sets of drivers with the surface of the driver body. Capacitors; each plate corresponds to the surface of each mass to form a sensing electrode plate, and a sensing capacitor is formed with the surface of the mass, so that its capacitance value will change as the mass moves along the z-axis; each of the aforementioned drive capacitors Driven by a DC bias voltage and an AC 18 voltage at the mechanical resonance frequency; when each of the aforementioned masses is displaced or vibrated, It can be known by measuring the change of the capacitance value of the corresponding sensing capacitor; the output signals generated by the angular velocity and acceleration of each mass block are AC signals and DC signals, so they can be separated by signal processing technology. Out angular velocity and acceleration signals. 12. The solid-state gyroscope according to item 11 of the scope of patent application, wherein a plurality of deep grooves or penetrating holes are formed in the long grooves in each driver body and the mass. 13. The solid-state gyroscope according to item 11 of the scope of patent application, wherein the elastic beam group comprises: a connecting beam group connecting two driver bodies corresponding to each mass; and a mass connecting the mass to its corresponding driver body. Sensing the beam, so that the mass can move along the z-axis; two common connecting beams, which are installed on both sides of the two masses; connecting the mass and the driver body to the first of the common connecting beams An elastic beam group; and a second elastic beam group connecting the common connecting beam to a fixed anchor, and the fixed anchor is fixed to two flat plates. 14. The solid-state gyroscope according to item 11 of the scope of patent application, wherein the elastic beam group includes: a sensing beam connecting each mass to its corresponding two driver bodies, so that the mass can be along the z-axis Direction movement; two common connecting beams, which are installed on both sides of the two masses; a first elastic beam connecting the mass and the driver body to the common connecting beam; and connecting the common connecting beam to a fixed anchor The second elastic beam, and the fixing anchor is fixed on the two flat plates. 15. The solid-state gyroscope according to item 11 of the scope of patent application, wherein each mass is directly connected to its two driver bodies, and the elastic beam group includes: two common connecting beams, which are installed here Two sides of the two masses; a first elastic beam connecting the mass and the driver body to the common connecting beam; and 19 594016 connecting the common connecting beam to a second elastic beam of a fixed anchor, which is fixed to the two flat plates . 16. The solid-state gyroscope according to item 13, 14, or 15 of the scope of the patent application, wherein the elastic beam is assembled with third and fourth elastic beams connecting the mass and the driver body group to the outer frame, and The outer frame is fixed on two flat plates. 17. The solid-state gyroscope according to item 11 of the scope of patent application, the elastic beam group of which comprises: a connecting beam connecting two masses of the driver corresponding to each mass; a mass connecting the mass to the sensing beam of the mass of the driver; So that the mass can move along the z-axis; and a driving elastic beam connecting the mass and the driver body group to the outer frame, and the outer frame is fixed on two flat plates. 18. The solid-state gyroscope according to item 11 of the scope of patent application, wherein the driving capacitors of the two driver bodies corresponding to the foregoing masses are divided into two parts: The driving capacitors of the first part are borrowed Driven by a DC bias and AC voltage so that the mass is vibrated along the first axis; and the driving capacitor of the second part is driven by a DC bias and high frequency AC voltage to detect the mass The amplitude signal of the block vibration along the first axis is fed back to the driving capacitor of the first part to control the vibration amplitude of the mass block along the first axis. 19. The solid-state gyroscope according to item 11 of the scope of patent application, wherein the sensing capacitors of the aforementioned masses are divided into two parts: The sensing capacitors of the first part are biased by a DC And high-frequency AC voltage drive to detect the angular velocity signal of the second axis and the acceleration signal of the z axis; and the sensing capacitor of the second part obtains the feedback of the angular velocity signal and offsets the cause The displacement of the mass in the second axis caused by Coriolis force. 20. The solid-state gyroscope according to item 11 of the scope of the patent application, the main structure of which is made of (110) silicon wafer using the overall microfabrication method. 21. —A planar solid-state triaxial inertial measurement instrument, which is mainly made of a conductive material, and an array solid-state gyroscope is installed between two flat plates, including: the first solid-state The gyroscope has an angular velocity sensing axis parallel to the X 20 594016 axis of the flat surface. Its structure includes: first and second inertial masses, first and second actuator bodies, a first elastic beam group, and A first sensor group; wherein the first and second mass blocks and the driver body group are suspended between two flat plates by the first elastic beam group, so that the first and second mass blocks And the driver body can move along the y-axis parallel to the surface of the flat plate, and the first and second masses can move along the Z-axis perpendicular to the flat surface; the first and second drives are used to drive the first The first and second masses and the driver body group are vibrated in the y-axis direction; the first sensor group can sense the reverse vibration and the same displacement of the first and second masses in the z-axis direction, that is, χ Axial angular velocity and Z-axis acceleration; 苐 A solid-state gyroscope Its angular velocity sensing axis is parallel to the y of the flat surface, and its axis includes a third and fourth inertial mass, a third and fourth driver body group, a second elastic beam group, and a second sensor. The third and fourth masses and the driver body group are suspended between the two flat plates by the second elastic beam group, respectively, so that the third and fourth masses and the driver body group are suspended. It can move along the X ′ axis parallel to the flat surface, and the third and fourth masses can move along the z axis; the second and fourth drivers make the third and fourth masses and the driver body group along X, Axial reverse vibration; the second sensor group can sense the reverse vibration and the same displacement of the third and fourth masses along the Z axis, that is, the y 'axial angular velocity and the z axial acceleration; The X ', y', and Z axes are orthogonal to each other; the second Gyro Gyroscope, whose angular velocity sensing axis is perpendicular to the Z axis of the flat surface, and its structure includes: fifth and sixth inertia Mass, fifth and sixth driver body groups, a third elastic beam group, and a third sense The fifth and sixth masses and the driver body group are suspended between two flat plates by the third elastic beam group, so that the fifth and sixth masses and the driver body group can be along the The y-axis moves parallel to the surface of the flat plate, and the fifth and sixth masses can move along the χ and axial directions; the fifth and sixth drivers reverse the fifth and sixth masses and the driver body group along the y-axis. Directional vibration; the third sensor group can sense the reverse vibration and in-phase displacement of the fifth and sixth masses along the χ, axial direction, that is, the ζ axial angular velocity and χ, axial acceleration; the fourth solid-state gyro Instrument, its angular velocity sensing axis is perpendicular to the z-axis 21 594016 or y-axis accelerometer of the flat surface, and its structure includes: seventh and eighth inertial masses, seventh and eighth driver body groups, a fourth An elastic beam group and a fourth sensor group; wherein the seventh and eighth masses and the driver body group are suspended between two flat plates by the fourth elastic beam group, so that the seventh and eighth masses The eight-mass block and driver body set can be along the X parallel to the flat surface The seventh and eighth masses can move along the y-axis in the axial movement; the seventh and eighth actuators vibrate the seventh and eighth masses and the driver body group in the X ′ axis in the reverse direction; the fourth sensing The device can sense the reverse vibration and the same displacement along the y-axis of the seventh and eighth masses, that is, the z-axis angular velocity and the y-axis acceleration; and the structure of the y-axis solid-state accelerometer includes: a first Nine inertial masses, a fifth elastic beam group, and a fifth sensor group; wherein the fifth elastic beam group suspends the mass between two flat plates so that it can be along the y-axis Move; the fifth sensor group can sense an acceleration signal along the y-axis. 22. The planar solid-state triaxial inertial measurement instrument according to item 21 of the scope of patent application, wherein each of the foregoing gyroscopes and the elastic beam group includes: two connecting beams connecting two driver bodies corresponding to each mass block ; The sensing beam connecting each mass to its corresponding driver body; two common connecting beams, which are installed on both sides of the two masses; the first elasticity connecting the mass and the driver body to the common connecting beam A beam group; and a second elastic beam group connecting the common connecting beam to a fixed anchor, and the fixed anchor is fixed to two flat plates. 23. The planar solid-state triaxial inertial measurement instrument according to item 21 of the scope of patent application, wherein each mass is directly connected to its two driver bodies, and the elastic beam group of each gyroscope includes: two The common connecting beam is installed on both sides of the two masses; the first elastic beam connecting the mass and the driver body to the common connecting beam; and the second elastic beam connecting the common connecting beam to a fixed anchor, and the The anchor is fixed on two flat plates. 24. The planar solid-state triaxial inertial measurement instrument as described in the scope of application for patents No. 22 or 23, wherein each elastic beam is assembled with a third mass connecting the mass block and the driver body 22 594016 to the third of the outer frame And a fourth elastic beam, and the outer frame is fixed to two flat plates. 25. The planar solid-state triaxial inertial measurement instrument as described in item 21 of the scope of patent application, wherein the structure of each group of actuators is composed of each actuator body and two plate surfaces corresponding to the electrode plates on each actuator body surface : The two surfaces of each driver body of the first, second, third, and fourth solid-state gyroscopes each include several perpendicular to the y-axis, X'-axis, y-axis, and X 'Axial long grooves or holes, each plate corresponding to the surface of each driver body, forming two sets of drive electrode groups, each containing several long electrodes parallel to its corresponding long grooves or holes Two sets of long electrodes are staggered with each other, forming two sets of driving capacitors with the surface of its driver body. 26. The planar solid-state triaxial inertial measurement instrument as described in item 21 of the scope of patent application, wherein the structures of the first and second sensor groups are respectively composed of the first and second masses and the third and fourth masses The surface of the inertial mass and the two plate surfaces correspond to the electrode plates on the surface of each mass. 27. The planar solid-state triaxial inertial measurement instrument as described in item 21 of the scope of patent application, wherein the structures of the third and fourth sensor groups are respectively composed of fifth, sixth masses and seventh The surface of the eighth mass and its corresponding two long flat electrode plates; the two surfaces of the fifth and sixth masses each include several elongated shapes perpendicular to the X ′ axis. Grooves or elongated holes; the two surfaces of the seventh and eighth masses each include a plurality of elongated grooves or elongated holes perpendicular to the y-axis; each plate corresponds to the surface of each mass and is formed separately Each of the two sets of sensing electrode groups includes a plurality of elongated electrodes parallel to the corresponding elongated grooves or elongated holes, so that the two sets of elongated electrodes are interlaced with each other, forming two sets of sensing capacitors with the surface of its mass. 28. The planar solid-state triaxial inertial measurement instrument according to item 21 of the scope of the patent application, wherein the (x ', y', z) coordinate system coincides with the (x, y, z) coordinate system. 29. The planar solid-state triaxial inertial measurement instrument as described in item 21 of the scope of patent application, wherein the (x ', y', z) coordinate system is formed by the (x, y, z) coordinate system around z The axis is rotated by a specific angle; the measured angular velocity components and acceleration component signals of the X 'and y' axes can be converted to the angular velocity components and acceleration component signals of the X and y axes through coordinates. 23 594016 30. The planar solid-state triaxial inertial measurement instrument as described in item 21 of the scope of the patent application, the main structure of which is made of (110) silicon wafer using the overall microfabrication method. twenty four