TW200422371A - Circuit connection adhesive - Google Patents

Circuit connection adhesive Download PDF

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Publication number
TW200422371A
TW200422371A TW93112224A TW93112224A TW200422371A TW 200422371 A TW200422371 A TW 200422371A TW 93112224 A TW93112224 A TW 93112224A TW 93112224 A TW93112224 A TW 93112224A TW 200422371 A TW200422371 A TW 200422371A
Authority
TW
Taiwan
Prior art keywords
adhesive
circuit
connection
patent application
item
Prior art date
Application number
TW93112224A
Other languages
English (en)
Chinese (zh)
Other versions
TWI316532B (ja
Inventor
Yukihisa Hirozawa
Itsuo Watanabe
Yasushi Goto
Jun Taketazu
Katsuhiko Tomisaka
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to TW93112224A priority Critical patent/TW200422371A/zh
Publication of TW200422371A publication Critical patent/TW200422371A/zh
Application granted granted Critical
Publication of TWI316532B publication Critical patent/TWI316532B/zh

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Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
TW93112224A 2001-11-14 2001-11-14 Circuit connection adhesive TW200422371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93112224A TW200422371A (en) 2001-11-14 2001-11-14 Circuit connection adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93112224A TW200422371A (en) 2001-11-14 2001-11-14 Circuit connection adhesive

Publications (2)

Publication Number Publication Date
TW200422371A true TW200422371A (en) 2004-11-01
TWI316532B TWI316532B (ja) 2009-11-01

Family

ID=45073246

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93112224A TW200422371A (en) 2001-11-14 2001-11-14 Circuit connection adhesive

Country Status (1)

Country Link
TW (1) TW200422371A (ja)

Also Published As

Publication number Publication date
TWI316532B (ja) 2009-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees