TW200416976A - Electromagnetic-wave absorptive heat-conduction sheet - Google Patents

Electromagnetic-wave absorptive heat-conduction sheet Download PDF

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Publication number
TW200416976A
TW200416976A TW092136240A TW92136240A TW200416976A TW 200416976 A TW200416976 A TW 200416976A TW 092136240 A TW092136240 A TW 092136240A TW 92136240 A TW92136240 A TW 92136240A TW 200416976 A TW200416976 A TW 200416976A
Authority
TW
Taiwan
Prior art keywords
electromagnetic wave
thermally conductive
sheet
heat
layer
Prior art date
Application number
TW092136240A
Other languages
English (en)
Chinese (zh)
Other versions
TWI330400B (ko
Inventor
Ikuo Sakurai
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200416976A publication Critical patent/TW200416976A/zh
Application granted granted Critical
Publication of TWI330400B publication Critical patent/TWI330400B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Hard Magnetic Materials (AREA)
  • Soft Magnetic Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW092136240A 2002-12-20 2003-12-19 Electromagnetic-wave absorptive heat-conduction sheet TW200416976A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002369225A JP2004200534A (ja) 2002-12-20 2002-12-20 電磁波吸収性熱伝導性シート

Publications (2)

Publication Number Publication Date
TW200416976A true TW200416976A (en) 2004-09-01
TWI330400B TWI330400B (ko) 2010-09-11

Family

ID=32765502

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092136240A TW200416976A (en) 2002-12-20 2003-12-19 Electromagnetic-wave absorptive heat-conduction sheet

Country Status (3)

Country Link
JP (1) JP2004200534A (ko)
KR (1) KR100615009B1 (ko)
TW (1) TW200416976A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112352476A (zh) * 2018-07-12 2021-02-09 迪睿合株式会社 拾取装置、安装装置、拾取方法、安装方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007027520A (ja) * 2005-07-20 2007-02-01 Nec Access Technica Ltd 放熱装置
KR100842659B1 (ko) * 2006-02-23 2008-06-30 주식회사 엘지화학 디스플레이장치, 디스플레이장치용 열전도 점착시트 및이의 제조방법
JP4731431B2 (ja) * 2006-09-05 2011-07-27 アキレス株式会社 アクリル系樹脂積層シート状成形体
KR100830945B1 (ko) 2006-10-24 2008-05-20 (주) 아모센스 나노 복합체 탄소섬유를 이용한 전자기파 차폐기능을 갖는방열시트의 제조방법
JP4798629B2 (ja) * 2006-11-13 2011-10-19 北川工業株式会社 熱伝導性電磁波シールドシート及び電磁波シールド構造
JP5533787B2 (ja) * 2011-06-09 2014-06-25 株式会社豊田自動織機 放熱装置
KR101266390B1 (ko) 2012-10-05 2013-05-22 주식회사 엘엠에스 열전도 조성물 및 시트
EP2897164B1 (en) * 2014-01-17 2020-01-01 Henkel IP & Holding GmbH Thermally-conductive interface pad for EMI-suppression
JP2014239236A (ja) * 2014-07-11 2014-12-18 デクセリアルズ株式会社 熱伝導性シート
KR101792755B1 (ko) 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
JP6366627B2 (ja) * 2016-03-25 2018-08-01 デクセリアルズ株式会社 電磁波吸収熱伝導シート、電磁波吸収熱伝導シートの製造方法及び半導体装置
CN109256255B (zh) * 2018-11-19 2023-12-12 宴晶科技(北京)有限公司 一种复合金属软磁片及无线充电装置
JP2020158633A (ja) * 2019-03-26 2020-10-01 積水化学工業株式会社 架橋発泡体シート
KR102065952B1 (ko) * 2019-07-04 2020-01-14 정상희 방열과 전자파 흡수용 복합 패드
KR102261248B1 (ko) * 2020-12-29 2021-06-07 대진첨단소재 주식회사 전자파 흡수 열 전도성 방열 시트 제조 장치
CN118202018A (zh) * 2021-11-10 2024-06-14 电化株式会社 散热片
KR102644508B1 (ko) * 2022-04-13 2024-03-08 (주)트러스 열전도 및 전자파 흡수 특성을 갖는 복합시트 및 이의 제조방법
JP7551685B2 (ja) 2022-04-27 2024-09-17 日本特殊陶業株式会社 ミリ波吸収体および積層体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112352476A (zh) * 2018-07-12 2021-02-09 迪睿合株式会社 拾取装置、安装装置、拾取方法、安装方法

Also Published As

Publication number Publication date
JP2004200534A (ja) 2004-07-15
KR20040055678A (ko) 2004-06-26
TWI330400B (ko) 2010-09-11
KR100615009B1 (ko) 2006-08-25

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