玫、發明說明 (發明說明應敘明：發明所覊之技術領域、先前技術、內容、會偷 鬥合貫施方 【發明所屬之技術領域】 本發明是有關一個發光二極體的封裝方法。由於發光 二極體為增加亮度所需的電流愈來愈大，所造成的熱散溢間題也 愈來愈嚴重。為了克服溫度上升晶片與導線架的熱_脹係數不合 的諸多間題，本案也揭示利用將磊晶完畢的晶粒，經由蒸錢兼具 有反射及增加粘著的銀鉬混合中間層，最終轉移至钼金屬上，形 成金屬基底複晶元件晶粒；使其散熱效果增加或熱膨脹係數匹配 效果更為良好’防止因過熱而造成元件晶粒與導線架之間的斷 裂。同時本案也揭示一種以玻璃作為封裝發光二極體之主要材 料，使目刚以祕知為發光^一極體封裝主體容易老化問題得以解決。 【先前技術】 發光一極體’由於亮度的增加以及效率的提高，在 將來極有可能取代傳統的照明設備。但也是因於亮度的提 升及功率的增大，所產生的熱，對封裝所造成的衝擊也愈 來愈嚴重。首先散熱間題；一般的鋁基座或銅基座導線架， 和半導體材料基底的熱膨脹係數有相當大的差異，在溫度 升高及降低的時候，造成熱應力，而使元件之間半導體材 料基底與導線架粘著處所容易剝落，致使元件失效0如何 避免元件因溫差剝落而造成元件失效，增加粘著是本研究 所要解決的第一個間題。 劃献3續頁 其次，發光二極體的光如果沒有加以適當向上反射的 話’亮度無法有效提昇，此外這些雜亂散射的光會產生熱， 使整個封裝的散熱間題變得更加嚴重。習知的技術是是將 反射金屬鍍在晶片下部的四周園，讓光向上反射。但是， 現有金屬膜和半導體間的黏著性不良，容易剝落。因此， 如何有效的蒸鍍一層金屬來造成光的反射，同時增加黏著 度疋本案所要專研的第二個間題0 最後，現有的發光二極體，一般都是用樹脂來封裝； 部分並將發光粉體放置在樹脂裡，以發出紅、藍、綠或是 混合形成白光，或以藍、黃等光混合形成白光。由於傳統 的LED會因長時間或大功率操作，而導致溫度上升，讓這 些透明樹脂受熱因而劣化，造成顏色逐漸變黃，使透光效 率愈來愈差；很不幸由於惡性循環，透光效率愈來愈差， 無法透過的光反而會被樹脂吸收又變成熱；在這種循環 下，發光一極體就會愈來愈劣化❹因此，如何避免有機樹 脂的劣化，是本案所欲解決的第一個問題。 【內容】 本發明的第一個目的是用來解決未來高功率發光二 極體的基板間題；如何將現有的吸收性基板轉移 良好的金屬基板上，讓它的發光效率更為提升，是目前;; 大廠家所努力的方向。 習知的^藝是將基板轉移到銅基板或其它基板上（如 砷化鎵基板錯系基板）’但它們的散熱性不佳，遠不如銅、 鋁、鉬等金屬。但基於熱膨脹係數之考量，可將LED轉移 到鉬的基板上，因鉬基板的膨脹係數較為優異，和半導體 200416975 的熱膨脹係數較為接近，在熱脹冷縮時較不易裂開ι但間 題並非如此簡單，我們發現若將鉬和發光元件的基板直接 以覆晶技術封裝在一起，則會使LED發出的光反射率降 低。但同時在另一方面，為了使光的反射率變好，可將銀 鍍在發光元件的基板上，但經多次實驗發現，銀的著力 不佳。 因此經過多方嘗試，發現如果將銀與鉬混合，以不同 比例，分成兩層或三層，分別鍍在發光元件的基板上，例 如在第一層鍍上百分之八十的銀百分之二十的鉬混合，第 二層鍍上百分之三十的銀與百分之七十的鉬，第三層則將 百分百鉬，並將鍍好之磊晶晶粒轉移到鉬的基底層上；再 經背面磨薄，做成的MS基底發光元件。不但具有低膨脹係 數差異的好處，還可以增加的附著力，同時可解決反射層 和熱膨脹的問題。 本發明的第二個目的是要解決封裝時，透明樹脂 (resin)在高功率時，因通過較大電流所成的零件劣化間 題，及增加發光二極體的使用壽命。 本人發現，如果在封裝時，採用玻璃取代傳統之樹 脂，並在玻璃中摻入一些無機的染料，其中之無機螢光粉 體包括（YityCdXeyMM!-2Ga2)5〇i2,其中 x+ySl，0Sx，y，z -1 或（Cd卜xCeOSGAhOu 或 SrB4〇7:Sm 或 SrGagScEu 或 BaMgzA1 : Eu等，利用這種玻璃來包覆封裝整個半導體元 件，讓它們分别發出紅光、綠光、藍光或白光，可以解決 因高溫所造成的樹脂劣化問題。或是將這些染料加入玻璃 中先做成玻璃透鏡，然後將玻璃透鏡嵌入封裝的上面，周 圍再用水玻璃加以密封，如此一來便無須用到樹脂；也可 以在密封中灌入惰性氣體來防止零件劣化，增加使用壽命。 200416975 義纖漏買 【實施例】 L~· 如圖1A所示，圖1A是本案所揭示的一個發光元件晶 粒’它的上面是半導體層11，12為含有銀鉬的反射中間 層’ 13為錮金屬層，以這種方式形成的發光二極體發光元 件’除了有12反射層中間層增加光的反射外，還兼具黏著 作用’使底下的鉬金屬層（和半導體熱膨脹係數比較接近） 基底能牢固’增進散熱的效果❹當然為將來便於交流電操 作’也可以將兩枚發光二極體反方向包裝成一個發光元件 晶粒如圖1B所示❹ 我們可以將圖1的元件元件直接應用在玻璃封裝的發 光元件上，如圖2A所示，它有一個玻璃封裝本體21，一 個導線架23，一個發光元件22，在發光本體21中間，因 在封裝時，採用玻璃取代傳統之樹脂，並在玻璃中掺入一 些無機的染料’其中之無機螢光粉體包括 (Yh5rC(LCey)3(AlhGa2)5〇i2，其中 x+ySl，〇$x，y，z$l 或 (Cdi^Cex)SC2Al3〇L2 或 SrB4〇7:Sm 或 SrGa2S4:Eu 或 BaMgsA i! 6〇47: Eu等，利用這種玻璃來包覆封裝整個半導體元 件，讓它們分別發出紅光、綠光、藍光或白光，可以解決 因高溫所造成的樹脂劣化間題u或是將發光本體做成一個 燈泡狀，如圖2B所示，它有一個燈泡外殼罩24，在燈泡 外殼罩上，可以有一螢光塗佈層25含有許多的螢光粉粒9 讓它們分別發出紅光、綠光、藍光或混成白光。在發光本 體的中間有一惰性氣體空間或是真空狀態，一個導線架 23，一個發光元件22❹ 或是將其做成表面黏著形的LED封裝，如圖3Α所示， 它有一個玻璃封裝本體31 , —個導線架33，一個發光元件 32,在發光本體31中間，，因在封裝時，採用玻璃取代傳 200416975 賣頁 統之樹脂，並在玻璃中摻入一些無機的染料，其中之無機 螢光粉體包括（Yl nC(LCey)3(AliiGa2)5〇i2，其中 x+ySl，0 Sx，y，zS 1 或（Cdi sCev)SC2Al3〇u 或 SrB4〇7:Sm 或 SrGagScEu 或BaMg2Ali6〇47:Eu等，利用這種玻璃來包覆封裝整個半導 體元件，讓它們分別發出紅光、綠光、藍光或白光，可以 解決因高溫所造成的樹脂劣化間題。或是將發光本體做成 一個燈泡狀，如圖3B所示，它有一個燈泡外殼罩34，在 燈泡外殼罩上，可有一螢光塗佈層35，可有許多的螢光粉 粒，讓它們分別發出紅光、綠光、藍光或白光。在發光本 體的中間有一惰性氣體空間，一個導線架33，一個發光元 件32 ◊ 或是將其做成金屬罐外加玻璃透鏡封裝，如圖4所示， 它有一個玻璃透鏡41，金屬或陶瓷外殼44，43為半導體 發光元件，42為導線架。同樣可以將螢光粉體加在玻璃透 鏡中或在燈泡外殼内側塗佈螢光粉體層45，可有許多的螢 光粉粒，讓它們分別發出紅光、綠光、藍光或白光。 或將其做成柱狀結構，如圖5所示，它有玻璃本體層 51 ;同樣可以將螢光粉體加在玻璃本體中，半導體發光元 件52，導線架53。也可做成中空燈泡型狀，它有一個燈泡 外殼罩55，在燈泡外殼罩上，可有一螢光塗佈層56，可有 許多的螢光粉粒，讓它們分別發出紅光、綠光、藍光或白 光。在發光本體的中間有一惰性氣體空間，一個導線架53, 一個發光元件52。 綜上所述，這些結構除了可以如圖1所揭示的具有反 射中間層與匹配金屬層這樣的單顆結構外，也可以把它兩 顆背對背來組成一顆元件，分別取代23、33、43或53中 的半導體發光元件，做為一個交流驅動型式發光裝置用。 200416975 發明說明續頁 【圖式簡單說明】 圖1A 含有銀鉬反射中間層發光晶粒 圖1B 兩枚發光二極體反方向包裝成一 個發光元件晶粒 圖2A 一般形狀玻璃封裝的LED封裝 圖2B 一般形燈泡狀的LED封裝 圖3A 表面黏著形的LED封裝 圖3B 表面黏著形玻璃燈泡外殻LED封裝 圖4 玻璃透鏡罐狀LED封裝 圖5 玻璃柱狀結構led封裝 圖號說明】 11 化合物半導體層 12 中間反射粘著層 13 鉬金屬層 21 玻璃封裝本體 23 導線架 22 發光元件 24 玻璃燈泡外殼罩 25 螢光塗佈層 31 玻璃封裝本體 33 導線架 32 發光元件 34 玻璃燈泡外殼罩 35 螢光塗佈層 41 玻璃透鏡 44 金屬或陶瓷外殻 200416975 42 43 51 52 53 55 56The description of the invention (the description of the invention should state: the technical field of the invention, the prior art, the content, and the coherent formula of the invention. [Technical field to which the invention belongs] The present invention relates to a method for packaging a light emitting diode. As the current required by the light-emitting diode to increase the brightness is increasing, the thermal dissipation problem is becoming more and more serious. In order to overcome the many problems that the thermal and expansion coefficients of the chip and the lead frame are not the same as the temperature rises, This case also reveals the use of the epitaxial grains through a silver-molybdenum mixed intermediate layer that has both reflection and increased adhesion, and is finally transferred to the molybdenum metal to form the metal-based polycrystalline element grains; making it cool. Increased or better thermal expansion coefficient matching effect 'prevents the breakage between the element crystal grains and the lead frame due to overheating. At the same time, this case also reveals a glass as the main material for packaging light-emitting diodes The problem of easy aging of the package body of the light emitting diode body has been solved. [Previous technology] Due to the increase in brightness and efficiency, the light emitting pole body will be extremely useful in the future. Can replace traditional lighting equipment. But also because of the increase in brightness and power, the heat generated by the package is becoming more and more serious. First of all, the heat dissipation problem; general aluminum base or copper base The thermal expansion coefficient of the lead frame and the semiconductor material substrate are quite different. When the temperature increases and decreases, thermal stress is caused, and the adhesion between the semiconductor material substrate and the lead frame is easily peeled between the components, causing the component to fail. 0How to avoid component failure due to peeling off due to temperature difference, increasing adhesion is the first problem to be solved in this research. Contribution 3 Continued Next, if the light of the light-emitting diode is not properly reflected upward, the brightness cannot be Effectively improve, in addition, these scattered and scattered light will generate heat, which makes the heat dissipation problem of the entire package more serious. The conventional technology is to plate reflective metal on the surrounding area of the lower part of the wafer to reflect the light upward. However, existing Poor adhesion between metal film and semiconductor, easy to peel off. Therefore, how to effectively vaporize a layer of metal to cause light reflection At the same time, increase the adhesion. The second question to be studied in this case 0 Finally, the existing light-emitting diodes are generally encapsulated with resin; part of the light-emitting powder is placed in the resin to emit red, blue, Green or mixed to form white light, or mixed with blue, yellow and other light to form white light. Because traditional LEDs will increase temperature due to long-term or high-power operation, these transparent resins will be heated and degraded, causing the color to gradually turn yellow. Make the light transmission efficiency worse and worse; unfortunately due to the vicious cycle, the light transmission efficiency is getting worse and worse, the impenetrable light will be absorbed by the resin and become heat; under this cycle, the light-emitting polar body will be more and more The worse the problem is, how to avoid the degradation of the organic resin is the first problem to be solved in this case. [Content] The first object of the present invention is to solve the problem between substrates of future high-power light-emitting diodes; how to Transferring the existing absorptive substrate to a good metal substrate to improve its luminous efficiency is the current direction of the major manufacturers. The conventional technique is to transfer the substrate to a copper substrate or other substrates (such as a gallium arsenide substrate). However, their heat dissipation is not good, and they are far inferior to metals such as copper, aluminum, and molybdenum. However, based on the consideration of the coefficient of thermal expansion, the LED can be transferred to a molybdenum substrate. The molybdenum substrate has a superior expansion coefficient, which is close to that of the semiconductor 200416975. It is less likely to crack during thermal expansion and contraction, but the problem is not So simple, we found that if molybdenum and the substrate of the light-emitting element are directly packaged together with flip-chip technology, the light reflectivity of the LED will be reduced. On the other hand, in order to improve the reflectivity of light, silver can be plated on the substrate of the light-emitting element. However, it has been found through many experiments that the force of silver is not good. Therefore, after many attempts, it is found that if silver is mixed with molybdenum, it is divided into two or three layers in different proportions and plated on the substrate of the light-emitting element, for example, the first layer is plated with 80% silver. Twenty molybdenum is mixed, the second layer is plated with 30% silver and 70% molybdenum, and the third layer is 100% molybdenum, and the plated epitaxial grains are transferred to the molybdenum On the base layer; and then thinned by the back surface to make the MS base light-emitting element. Not only does it have the benefit of a low expansion coefficient difference, it can also increase the adhesion, and at the same time can solve the problem of reflective layer and thermal expansion. The second object of the present invention is to solve the problem of component degradation caused by a large current when the transparent resin is at a high power during packaging, and to increase the service life of the light emitting diode. I found that if glass is used to replace traditional resins and some inorganic dyes are incorporated into the glass, the inorganic fluorescent powder includes (YityCdXeyMM! -2Ga2) 5〇i2, where x + ySl, 0Sx , Y, z -1 or (Cd Bu xCeOSGAhOu or SrB4〇7: Sm or SrGagScEu or BaMgzA1: Eu, etc.) This kind of glass is used to cover and package the entire semiconductor device, so that they emit red, green, blue or white light, respectively. Can solve the problem of resin degradation caused by high temperature. Or add these dyes to glass to make glass lens first, and then embed the glass lens on the top of the package, and then seal it with water glass, so there is no need to use resin. You can also fill in the inert gas in the seal to prevent parts from deteriorating and increase the service life. 200416975 Leakage fiber [Example] L ~ · As shown in Figure 1A, Figure 1A is a light-emitting element die disclosed in this case. Above it is the semiconductor layer 11, 12 is a reflective intermediate layer containing silver molybdenum '13 is a rhenium metal layer, a light-emitting diode light-emitting element formed in this way 'has 12 reflections In addition to increasing the reflection of light, the middle layer also serves as an adhesive. 'Make the underlying molybdenum metal layer (closer to the thermal expansion coefficient of the semiconductor). The substrate can be solid' improves the heat dissipation effect. Of course, for the convenience of AC operation in the future. ' The diode is packaged in the opposite direction to form a light-emitting element die as shown in FIG. 1B. We can directly apply the element of FIG. 1 to a glass-encapsulated light-emitting element. As shown in FIG. 2A, it has a glass package body 21, A lead frame 23 and a light-emitting element 22 are in the middle of the light-emitting body 21, because glass is used to replace the traditional resin during packaging, and some inorganic dyes are incorporated in the glass. Among them, the inorganic fluorescent powder includes (Yh5rC ( LCey) 3 (AlhGa2) 5〇i2, where x + ySl, 〇 $ x, y, z $ l or (Cdi ^ Cex) SC2Al30L2 or SrB4〇7: Sm or SrGa2S4: Eu or BaMgsA i! 6〇47 : Eu, etc., use this kind of glass to cover and encapsulate the entire semiconductor device, and let them emit red, green, blue, or white light, respectively. It can solve the problem of resin degradation caused by high temperature or make the light-emitting body into one. light bulb As shown in FIG. 2B, it has a bulb housing cover 24. On the bulb housing cover, there can be a fluorescent coating layer 25 containing a plurality of fluorescent powder particles 9 to make them emit red light, green light, blue light or Mixed into white light. There is an inert gas space or vacuum state in the middle of the light-emitting body, a lead frame 23, a light-emitting element 22❹, or an LED package with a surface-adhesive shape, as shown in Figure 3A, which has a glass package The body 31, a lead frame 33, a light-emitting element 32, in the middle of the light-emitting body 31, because the glass is used to replace the resin of 200416975, and some inorganic dyes are incorporated in the glass, among which Inorganic fluorescent powder includes (Yl nC (LCey) 3 (AliiGa2) 5〇i2, where x + ySl, 0 Sx, y, zS 1 or (Cdi sCev) SC2Al3〇u or SrB4 07: Sm or SrGagScEu or BaMg2Ali6 〇47: Eu and others, using this glass to encapsulate and encapsulate the entire semiconductor element, and let them emit red, green, blue or white light, respectively, can solve the problem of resin degradation caused by high temperature. Or, the light-emitting body is made into a light bulb shape, as shown in FIG. 3B, which has a light bulb housing cover 34. On the light bulb housing cover, there may be a fluorescent coating layer 35, and there may be many fluorescent powder particles. They emit red, green, blue or white light, respectively. There is an inert gas space in the middle of the light-emitting body, a lead frame 33, a light-emitting element 3232, or a metal can and a glass lens package, as shown in FIG. 4, which has a glass lens 41 and a metal or ceramic housing 44 and 43 are semiconductor light emitting elements, and 42 is a lead frame. It is also possible to add the fluorescent powder in a glass lens or to coat the fluorescent powder layer 45 on the inside of the bulb housing. There may be many fluorescent particles, which make them emit red light, green light, blue light or white light, respectively. Or it can be made into a columnar structure, as shown in FIG. 5, which has a glass body layer 51; fluorescent powder can also be added to the glass body, a semiconductor light emitting element 52, and a lead frame 53. It can also be made into a hollow bulb shape. It has a bulb housing cover 55. On the bulb housing cover, there can be a fluorescent coating layer 56. There can be many fluorescent powder particles that let them emit red and green light respectively. , Blue or white. There is an inert gas space in the middle of the light-emitting body, a lead frame 53, and a light-emitting element 52. In summary, in addition to the single structure with a reflective intermediate layer and a matching metal layer as shown in Figure 1, these structures can also be composed of two back-to-back components to replace 23, 33, 43 respectively. Or the semiconductor light emitting element in 53 is used as an AC driving type light emitting device. 200416975 Description of the invention continued [Simplified description of the drawing] Figure 1A Light-emitting die with silver-molybdenum reflective interlayer Figure 1B Two light-emitting diodes are packaged in the opposite direction to form a light-emitting element die Figure 2A LED package with general shape glass package 2B Figure 3A General-shaped bulb-shaped LED package Figure 3A Surface-adhesive LED package Figure 3B Surface-adhesive glass bulb housing LED package Figure 4 Glass lens can-shaped LED package Figure 5 Glass columnar structure LED package figure description] 11 Compound semiconductor layer 12 Intermediate reflective adhesive layer 13 Molybdenum metal layer 21 Glass package body 23 Lead frame 22 Light-emitting element 24 Glass bulb housing cover 25 Fluorescent coating layer 31 Glass package body 33 Lead frame 32 Light-emitting element 34 Glass bulb housing cover 35 Fluorescent coating Fabric layer 41 Glass lens 44 Metal or ceramic housing 200416975 42 43 51 52 53 55 56
導線架 發光元件 玻璃柱狀結構本體層 發光元件 導線架 中空柱狀結構燈泡型狀 螢光塗佈層Lead frame Light-emitting element Glass columnar structure body layer Light-emitting element Lead frame Hollow columnar structure Bulb shape Fluorescent coating layer